Automatic supporting device for integrated circuit bonding process
By designing an integrated circuit adhesive crystal process automation support device, and using the cooperation of the sliding plate and the fixed sheet, the position of the code reader is quickly adjusted, solving the problem of frequent adjustment of the reader position in the adhesive crystal production, reducing production time and improving efficiency.
Patent Information
- Application Number
- CN202420832213.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-22
- Publication Date
- 2025-05-20
- Estimated Expiration
- 2034-04-22
AI Technical Summary
During the process of viscous crystal production, the position of the code reader needs to be frequently adjusted to adapt to the changes in the position of the vehicle barcode, resulting in an increase in production time.
An integrated circuit adhesive crystal process automation support device is designed, including a support mechanism and an adjustment mechanism. Through the cooperation of the sliding plate and the fixing plate, the code reader can be quickly adjusted by using hexagonal bolts.
This device enables the position of the code reader to be adjusted quickly and conveniently, reduces production time, improves production efficiency, and ensures stable load-bearing and processing quality of the integrated circuit chip.
Smart Images
Figure CN222887857U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of die bonding processing and manufacturing, and particularly to an automatic support device for integrated circuit die bonding process. Background Art
[0002] In the process of die bonding material production, to promote the automatic logistics and production process tracking in the semiconductor packaging workshop, it is required to bind the production strip and the carrier in real time and accurately read the current carrier barcode. Therefore, during the die bonding production process, a barcode reader is usually an important device, which can be used to read information such as identification codes, barcodes or two-dimensional codes on integrated circuit chips for subsequent processing and management, and the mounting bracket of the barcode reader for reading the label of the cartridge at the machine outlet.
[0003] However, during the die bonding production process of common mounting brackets, since the Die Bond machine changes the operation product, the position of the carrier barcode carrying the product changes, and it is necessary to synchronously adjust the position of the barcode reader at the outlet to accurately read the carrier barcode information. Due to the inconvenient and rapid position adjustment, the production time is increased. Therefore, in view of this situation, we propose a more convenient and practical support device to meet the use requirements. Summary of the Utility Model
[0004] The purpose of the utility model is to provide an automatic support device for integrated circuit die bonding process to solve the problems raised in the above background art.
[0005] To achieve the above purpose, the utility model provides the following technical solution: an automatic support device for integrated circuit die bonding process, including a support mechanism, the support mechanism includes a support plate, one side of the support plate is fixedly connected with a fixing plate, an adjusting mechanism is arranged on one side of the support mechanism, the adjusting mechanism includes a fixing piece, a sliding plate is arranged on one side of the fixing piece, the sliding plate and the fixing piece are arranged in parallel and have a gap, and a second hexagon socket head bolt is installed between the gaps.
[0006] Furthermore, a through hole is opened on one side of the fixing plate, and a first hexagon socket head cap screw is installed in the through hole, and one end of the first hexagon socket head cap screw is rotatably connected with one side of the support plate.
[0007] Furthermore, a support rod is fixedly connected to the side of the fixing plate away from the first hexagon socket head cap screw, a adjusting plate is slidably connected to one side of the top of the support rod, and sliding grooves are opened on both sides of the adjusting plate, and a first hexagon socket head bolt is slidably connected in the grooves.
[0008] Furthermore, a first connecting rod is fixedly connected to the center of one side of the sliding plate, a first sliding block is fixedly slidably connected to the outer wall of the first connecting rod, and a through hole is opened on one side of the first sliding block, and a second hexagon socket head cap screw is installed in the through hole.
[0009] Furthermore, a through hole is provided on the side of the first sliding block away from the second hexagon socket head cap screw. A second connecting rod is slidably connected in the through hole. One end of the second connecting rod is slidably connected with a second sliding block, and a third hexagon socket head cap screw is installed on one side of the second sliding block.
[0010] Furthermore, an installation plate is installed on one side of the second sliding block. Notch openings are provided on both sides of the installation plate. A third hexagon socket head bolt is slidably connected in the notch openings, and a code reader is installed at one end of the installation plate.
[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0012] For this automatic supporting device for integrated circuit die bonding process, through the settings of the supporting mechanism and the adjusting mechanism, during use, first, the fixing piece and the sliding plate slide on the adjusting plate through the second hexagon socket head cap screw. At the same time, the first sliding block slides to a specified position through the first connecting rod and is fixed by the second hexagon socket head cap screw. At the same time, the second sliding block slides to a specified position through the second connecting rod, and the installation plate is fixed by the third hexagon socket head cap screw. At the same time, the third hexagon socket head bolt can adjust the angle of the code reader through the installation plate. The simple operation method of this device enables the user to complete the adjustment quickly and conveniently, reduces the production time, has strong practicability, and is suitable for popularization.
[0013] At the same time, the supporting mechanism adopts the structural design of the fixing plate, enabling the supporting plate to stably carry the integrated circuit chip, avoiding shaking or deformation during the process, and ensuring the processing quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the overall mechanism structure of the present utility model;
[0015] Figure 2 It is a schematic diagram of the supporting mechanism structure of the present utility model;
[0016] Figure 3 It is a schematic diagram of the adjusting mechanism structure of the present utility model.
[0017] In the figure: 1. Supporting mechanism; 101. Supporting plate; 102. Fixing plate; 103. First hexagon socket head cap screw; 104. Support rod; 105. Adjusting plate; 106. First hexagon socket head bolt; 2. Adjusting mechanism; 201. Fixing piece; 202. Sliding plate; 203. Second hexagon socket head cap screw; 204. First connecting rod; 205. First sliding block; 206. Second hexagon socket head cap screw; 207. Second connecting rod; 208. Second sliding block; 209. Third hexagon socket head cap screw; 210. Installation plate; 211. Third hexagon socket head bolt; 212. Code reader. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0019] During the production process of die bonding materials, support equipment is required. The support equipment provided by the present utility model is specifically used for the support operation of the barcode reader 212 during the production process of die bonding materials. Before using this equipment, it should be noted that before each use, it is necessary to check whether all components of the equipment are in good condition, and ensure that the connections between the fixing plate 102, the support mechanism 1, and the adjustment mechanism 2 are firm and reliable. At the same time, regularly clean and maintain the equipment to keep all components in good condition. During the operation process, ensure the safety of the working environment to avoid accidents.
[0020] As Figure 1 - Figure 3 shown, the present utility model provides a technical solution: an automatic support device for integrated circuit die bonding process, including a support mechanism 1. The support mechanism 1 includes a support plate 101, and a fixing plate 102 is fixedly connected to one side of the support plate 101. An adjustment mechanism 2 is arranged on one side of the support mechanism 1. The adjustment mechanism 2 includes a fixing piece 201, a sliding plate 202 is arranged on one side of the fixing piece 201. The sliding plate 202 and the fixing piece 201 are arranged in parallel and have a gap, and a second external hexagon bolt 203 is installed between the gaps.
[0021] As Figure 2 shown, a through hole is opened on one side of the fixing plate 102, and a first internal hexagon bolt 103 is installed in the through hole. One end of the first internal hexagon bolt 103 is rotatably connected to one side of the support plate 101. A support rod 104 is fixedly connected to the side of the fixing plate 102 away from the first internal hexagon bolt 103. One side of the top of the support rod 104 is slidably connected to an adjustment plate 105. Chute openings are opened on both sides of the adjustment plate 105, and a first external hexagon bolt 106 is slidably connected in the chute openings.
[0022] It should be noted that during the use process, first fix the support plate 101 and the fixing plate 102 through the first internal hexagon bolt 103, then slide the adjustment plate 105 to a suitable position through the first external hexagon bolt 106, and finally slide the fixing piece 201 and the sliding plate 202 to a suitable position on the adjustment plate 105 through the second external hexagon bolt 203 and fix them. The support mechanism 1 enables the support plate 101 to stably carry the integrated circuit chip, avoiding shaking or deformation during the process and ensuring the processing quality.
[0023] As Figure 3As shown, a first connecting rod 204 is fixedly connected to the center of one side of the sliding plate 202. A first sliding block 205 is fixedly slidably connected to the outer wall of the first connecting rod 204. A through hole is formed in one side of the first sliding block 205, and a second inner hexagon bolt 206 is installed in the through hole. A through hole is formed in the side of the first sliding block 205 away from the second inner hexagon bolt 206, and a second connecting rod 207 is slidably connected in the through hole. One end of the second connecting rod 207 is slidably connected to a second sliding block 208. A third inner hexagon bolt 209 is installed on one side of the second sliding block 208. An installation plate 210 is installed on one side of the second sliding block 208. Notch openings are formed on both sides of the installation plate 210, and a third outer hexagon bolt 211 is slidably connected in the notch openings. A code reader 212 is installed at one end of the installation plate 210.
[0024] It should be noted that during use, first, the fixing piece 201 and the sliding plate 202 are slid on the adjusting plate 105 through the second outer hexagon bolt 203. At the same time, the first sliding block 205 slides to a specified position through the first connecting rod 204 and is fixed by the second inner hexagon bolt 206. At the same time, the second sliding block 208 slides to a specified position through the second connecting rod 207, and the installation plate 210 is fixed by the third inner hexagon bolt 209. At the same time, the third outer hexagon bolt 211 can adjust the angle of the code reader 212 through the installation plate 210. The adjusting mechanism 2 has a large adjusting range and can adapt to integrated circuit chips of different sizes and thicknesses.
[0025] During use, first, the support plate 101 and the fixing plate 102 are fixed through the first inner hexagon bolt 103. Then, the adjusting plate 105 is slid to a suitable position through the first outer hexagon bolt 106. The fixing piece 201 and the sliding plate 202 are slid on the adjusting plate 105 through the second outer hexagon bolt 203. At the same time, the first sliding block 205 slides to a specified position through the first connecting rod 204 and is fixed by the second inner hexagon bolt 206. At the same time, the second sliding block 208 slides to a specified position through the second connecting rod 207, and the installation plate 210 is fixed by the third inner hexagon bolt 209. At the same time, the third outer hexagon bolt 211 can adjust the angle of the code reader 212 through the installation plate 210. The simple operation method of this device enables the user to complete the adjustment quickly and conveniently, reducing the production time.
[0026] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended embodiments and their equivalents.
Claims
1. An integrated circuit die bonding process automation support device, characterized in that: The invention comprises a support mechanism (1), wherein the support mechanism (1) comprises a support plate (101), one side of the support plate (101) is fixedly connected to a fixing plate (102), one side of the support mechanism (1) is provided with an adjustment mechanism (2), the adjustment mechanism (2) comprises a fixing plate (201), one side of the fixing plate (201) is provided with a sliding plate (202), the sliding plate (202) and the fixing plate (201) are arranged in parallel and have a gap, and a second external hexagonal bolt (203) is installed between the gaps.
2. The integrated circuit die bonding process automation support device according to claim 1, characterized in that: A through hole is provided on one side of the fixing plate (102), a first hexagon socket bolt (103) is installed in the through hole, and one end of the first hexagon socket bolt (103) is rotatably connected to one side of the supporting plate (101).
3. The integrated circuit die bonding process automation support device according to claim 1, characterized in that: The fixing plate (102) is fixedly connected to a support rod (104) on one side away from the first internal hexagonal bolt (103), and an adjustment plate (105) is slidably connected to the top side of the support rod (104). Sliding grooves are provided on both sides of the adjustment plate (105), and a first external hexagonal bolt (106) is slidably connected in the grooves.
4. The integrated circuit die bonding process automation support device according to claim 1, characterized in that: A first connecting rod (204) is fixedly connected to the center of one side of the sliding plate (202), and a first sliding block (205) is fixedly and slidably connected to the outer wall of the first connecting rod (204). A through hole is opened on one side of the first sliding block (205), and a second hexagon socket bolt (206) is installed in the through hole.
5. The integrated circuit die bonding process automation support device according to claim 4, characterized in that: A through hole is provided on the side of the first sliding block (205) away from the second hexagon socket bolt (206), and a second connecting rod (207) is slidably connected in the through hole. One end of the second connecting rod (207) is slidably connected to a second sliding block (208), and a third hexagon socket bolt (209) is installed on one side of the second sliding block (208).
6. The integrated circuit die bonding process automation support device according to claim 5, characterized in that: A mounting plate (210) is installed on one side of the second sliding block (208), and slots are provided on both sides of the mounting plate (210), and a third hexagonal bolt (211) is slidably connected in the slots, and a code reader (212) is installed on one end of the mounting plate (210).