Charging equipment

Abstract

The embodiment of the utility model provides charging equipment, the charging equipment comprises a shell, an electronic assembly and a heat dissipation layer, the shell comprises a main shell and a heat insulation layer, and the heat insulation layer is arranged on the inner wall surface of the main shell; the electronic assembly comprises a circuit board and a power element installed on the circuit board. The heat dissipation layer covers the electronic component. In the application, the shell comprises the heat insulation layer, so that the shell has a heat insulation function, and the heat dissipation layer is arranged corresponding to the power element, so that the heat generated by the power element is dispersed to the heat dissipation layer, and the situation that the shell generates an overheated area due to concentrated heating of the power element is avoided, so that the shell is matched with the electronic component provided with the heat dissipation layer; heat generated by the power element is greatly prevented from being transmitted to the main shell, the surface temperature of the main shell can be reduced, a large-thickness main shell does not need to be arranged for preventing scalding, and the thickness of the charging equipment can be further reduced when the structure is applied to the charging equipment of a flat structure.

Description

Technical Field

[0001] The present application relates to the field of electronic technologies, and particularly to a charging device. Background Art

[0002] In a charging device, various power components such as a processor, a battery, and a power amplifier generate a large amount of heat during efficient operation. In related technologies, a heat dissipation structure is usually configured in the charging device to ensure the normal operation of the power components. At the same time, the surface temperature of the housing of the charging device also needs to be strictly controlled to ensure the use safety.

[0003] With the development trend of miniaturization and lightness and thinness, the structure of the charging device becomes more and more compact. However, in the charging device, the unreasonable design of the heat dissipation structure occupies the internal space of the charging device. These structures for dissipating heat from the power components greatly limit the lightness and thinness design of the charging device. Therefore, there is an urgent need for a charging device with a reasonable structure to meet the requirements of miniaturization and lightness and thinness. Summary of the Utility Model

[0004] An embodiment of the present application provides a charging device, which can solve the problem that the overall size of the charging device is limited due to improper design of the heat dissipation structure of the power components.

[0005] An embodiment of the present application provides a charging device. The charging device includes a housing, an electronic component, and a heat dissipation layer. The housing includes a main housing and a heat insulation layer, and the heat insulation layer is provided on the inner wall surface of the main housing. The electronic component includes a circuit board and a power component mounted on the circuit board. The heat dissipation layer covers the electronic component. Wherein, the heat dissipation layer and the electronic component are encapsulated together in the internal space of the housing. The heat dissipation layer is arranged corresponding to the power component to disperse the heat generated by the power component to an area outside the power component. The heat insulation layer is arranged on a side of the heat dissipation layer away from the power component to block the heat generated by the power component from being transmitted to the main housing through the heat dissipation layer.

[0006] Based on the charging device in the embodiments of the present application, a heat insulation layer is provided on the inner wall surface of the main housing in the housing, so that the housing has a certain heat insulation function. A heat dissipation layer is provided for the power element corresponding to the electronic component to disperse the heat generated by the power element to the heat dissipation layer, reduce the heat transfer towards the direction close to the housing, make the heat distribution in the internal space of the housing more uniform, and avoid the generation of overheated areas on the housing due to concentrated heat generation of the power element. In this way, the combination of the heat insulation structure of the housing and the heat dissipation structure of the electronic component effectively prevents the heat generated by the power element from being transferred to the main housing, reduces the influence of the heat generation of the power element on the surface temperature of the main housing, and there is no need to set a main housing with a large thickness to prevent the surface temperature of the main housing from being too high. Under the ultra-thin charging solution with a flattened structure, it provides an operable space for reducing the thickness of the main housing. In the present application, the heat dissipation layer is used as the heat dissipation structure of the power element, which has high heat dissipation efficiency and small occupied space, and is beneficial to the thin and light design of the charging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0008] Figure 1 is the front view schematic diagram of a charging device according to an embodiment of the present application;

[0009] Figure 2 is the cross-sectional view schematic diagram of a charging device according to an embodiment of the present application;

[0010] Figure 3 is the exploded structure schematic diagram of a charging device according to an embodiment of the present application;

[0011] Figure 4 is the structure schematic diagram of a heat insulation layer according to an embodiment of the present application;

[0012] Figure 5 is another structure schematic diagram of a heat insulation layer according to an embodiment of the present application;

[0013] Figure 6 is the structure schematic diagram of a heat dissipation layer according to an embodiment of the present application;

[0014] Reference numerals:

[0015] 1. Charging device; 10. Housing; 20. Electronic components; 30. Heat dissipation layer; 40. Pin assembly; 11. Main housing; 12. Heat insulation layer; 21. Circuit board; 22. Power element; 31. First heat dissipation layer; 32. Second heat dissipation layer; 33. Insulation layer; 101. First main wall; 111. First housing; 112. Second housing; 121. First heat insulation layer; 122. Second heat insulation layer; 123. Third heat insulation layer; 124. Fourth heat insulation layer; 125. Fifth heat insulation layer. Detailed implementation manner

[0016] In order to make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0017] With the increasing richness of the functions of portable consumer electronic products such as smart phones, their power consumption generally increases, the usage scenarios in daily life are more extensive, and the usage time is significantly extended, resulting in an increase in the charging frequency of users. Users pursue a portable and efficient charging experience, and this trend has greatly promoted the development of the supporting charging device market. For portable consumer electronic products, relevant manufacturers are committed to researching and developing thin and high-power charging solutions. Taking smart phones as an example, products such as ultra-thin gallium nitride chargers take into account both high power and a flat structure, and thus have attracted much attention.

[0018] Although high-power charging devices have greatly improved the charging efficiency, various power elements inside them (such as processors, batteries, and power amplifiers, etc.) will generate significant heat during efficient operation, exacerbating the heat generation problem of the charging device. The heat generation problem is particularly prominent in the flat structure. The thickness of the charging device is reduced, and the heat is more likely to be conducted to the surface of the charging device, resulting in too high a surface temperature, which in turn poses a potential threat to user safety in a household environment. Traditional designs require a thicker housing to prevent the surface temperature of the charging device from being too high. This design limits the thickness of the housing and deviates from the thin and light target. In addition, the heat dissipation structure of the power element occupies the internal space, which is also not conducive to the thin and light design.

[0019] In view of the above problems in the related art, the present application proposes a charging device. A heat dissipation layer is provided corresponding to the power element to evenly disperse the heat generated by the power element, rather than being limited to accumulating towards the housing direction, so as to avoid the formation of a hot spot area on the housing due to local overheating of the power element. Further, a heat insulation layer is provided on the inner wall surface of the main housing to effectively block the heat conduction path of the heat generated by the power element to the main housing. The use of a heat insulation layer with a low thermal conductivity greatly weakens the influence of the power element on the surface temperature of the main housing. In this way, compared with heat dissipation methods such as metal fins, the heat dissipation layer occupies less space, and the structural design combining the heat dissipation layer and the heat insulation layer in the housing provides a greater optimization space for the thickness dimension of the main housing, promoting the development of the charging device towards a thinner, lighter and more compact direction.

[0020] The charging device 1 of the present application is adapted to portable consumer electronic products, which include but are not limited to smart phones, projection devices, cleaners, laptop computers, pen input computers, mobile computers, e-book players, portable phones, etc. It should be noted that the charging device in the embodiments of the present application is not applicable to ultra-high power charging scenarios and does not include ultra-high power devices such as electric vehicle charging piles and energy storage chargers.

[0021] Please refer to Figure 1 - Figure 2 , Figure 1 which is a front view schematic diagram of a charging device 1 according to an embodiment of the present application, Figure 2 and which is a cross-sectional view schematic diagram of a charging device 1 according to an embodiment of the present application. The charging device 1 includes a housing 10, an electronic component 20 and a heat dissipation layer 30. The heat dissipation layer 30 is installed on the electronic component 20 and is encapsulated together with the electronic component 20 in the internal space of the housing 10. Among them, the electronic component 20 includes a circuit board 21 and a power element 22. The power element 22 is installed on the circuit board 21. It can be understood that in the charging device 1 with a flattened structure, the power elements 22 are arranged at intervals on the board surface of the circuit board 21. Since the thickness of the charging device 1 is small, the gap between each power element 22 and the housing 10 is small, the heat transfer path is short, and the heat generated by the power element 22 is easily transferred to the housing 10. In the embodiment of the present application, the housing 10 includes a main housing 11 and a heat insulation layer 12. The heat insulation layer 12 is provided on the inner wall surface of the main housing 11, and the heat dissipation layer 30 is provided corresponding to the power element 22. In this way, the heat dissipation layer 30 effectively evacuates the heat near the power element 22. The heat dissipation layer 30 disperses the heat generated by the power element 22 to areas outside the power element 22 to avoid heat accumulation. The heat insulation layer 12 is provided on the side of the heat dissipation layer 30 away from the power element 22 to block the heat generated by the power element 22 from being transferred to the main housing 11, achieving a heat insulation effect and ensuring the stability and controllability of the surface temperature of the main housing 11, providing a greater optimization space for the thickness dimension of the main housing 11.

[0022] Please refer to Figure 3 ,Figure 3 Exploded structural schematic diagram of a charging device 1 according to an embodiment of the present application. In the embodiment of the present application, the housing 10 includes two heat insulation layers 12, and the main housing 11 includes two first main walls 101. The two first main walls 101 are arranged opposite to each other in the first direction A. Wherein, the two heat insulation layers 12 are respectively arranged on the inner wall surfaces of the two first main walls 101, and the first direction A is perpendicular to the board surface of the circuit board 21. It should be noted that the wall surface with a larger area in the main housing 11 is more likely to be contacted by the user. Therefore, the level of its surface temperature has a direct impact on user safety. In addition, the heat insulation effect of the heat insulation layer 12 is proportional to the area it covers. In the embodiment of the present application, the first main wall 101 is the wall surface with the largest area in the main housing 11, and the first direction A is the thickness direction of the charging device 1. Thus, setting the heat insulation layer 12 on the first main wall 101 can make full use of the performance of the heat insulation material and improve the heat insulation effect.

[0023] In the embodiment of the present application, the main housing 11 includes a first housing 111 and a second housing 112. The circuit board 21 is installed in the first housing 111, and the second housing 112 is covered on one side of the first housing 111 along a preset direction. Continuing to refer to Figure 3 , the preset direction is perpendicular to the first direction A, and the two side walls of the first housing 111 arranged opposite to each other in the first direction A form two first main walls 101. Optionally, in some other embodiments, the preset direction may also be the same as the first direction A, that is, the second housing 112 is covered on the first housing 111 along the first direction A. The first housing 111 includes one first main wall 101, and the second housing 112 includes another first main wall 101.

[0024] In the embodiment of the present application, the heat insulation layer 12 includes a plurality of sub - heat insulation layers connected in a stacked manner. The sub - heat insulation layer is a porous vacuum silicon layer or an aerogel heat insulation layer. The multi - layer design of the heat insulation layer 12 can increase the paths and interfaces of heat transfer, so that heat needs to overcome more resistance during the transfer process. Each layer of heat insulation material can slow down the heat transfer to a certain extent. Porous vacuum silicon is a new heat insulation material in the form of cross - linked sheets composed of polymer matrix and nano - porous vacuum silica, with high heat insulation performance. It contains a large number of tiny pores inside, and these pores are filled with vacuum or a state close to vacuum, thus greatly reducing the possibility of heat conduction and heat convection. Aerogel reduces the heat conduction efficiency through its porous structure and achieves high - efficiency heat insulation by suppressing convective heat transfer and radiative heat transfer.

[0025] As Figure 3 - Figure 4 shown, Figure 4The figure is a schematic structural diagram of a heat insulation layer 12 according to an embodiment of the present application. In an embodiment of the present application, the multiple sub heat insulation layers include a first heat insulation layer 121 and a second heat insulation layer 122. The first heat insulation layer 12 is connected to the inner wall surface of the main housing 11, and the second heat insulation layer 122 is stacked and connected to the side of the first heat insulation layer 12 away from the inner wall of the main housing 11. Optionally, the first heat insulation layer 121 may adopt a porous vacuum silicon heat insulation layer, and the second heat insulation layer 122 may adopt an aerogel heat insulation layer. Among them, the thermal conductivity of the porous vacuum silicon heat insulation layer is lower than that of the aerogel heat insulation layer. Placing the porous vacuum silicon heat insulation layer closer to the inner wall of the main housing 11 can more effectively prevent heat from being transferred to the main housing 11.

[0026] As Figure 5 shown, Figure 5 The figure is a schematic structural diagram of another heat insulation layer 12 according to an embodiment of the present application. In another embodiment of the present application, the heat insulation layer 12 includes a third heat insulation layer 123, a fourth heat insulation layer 124, and a fifth heat insulation layer 125. The third heat insulation layer 123 is connected to the inner wall surface of the main housing 11, the fourth heat insulation layer 124 is stacked and connected to the side of the third heat insulation layer 123 away from the inner wall of the main housing 11, and the fifth heat insulation layer 125 is stacked and connected to the side of the fourth heat insulation layer 124 away from the third heat insulation layer 123. When there is sufficient internal space in the housing 10, the three-layer stacked sub heat insulation layers can significantly increase the heat insulation effect. Among them, the fourth heat insulation layer 124 is at least one of an aerogel heat insulation layer, a porous vacuum silicon heat insulation layer, and an asbestos heat insulation layer.

[0027] Optionally, the first heat insulation layer 12 adopts a porous vacuum silicon heat insulation layer, the second heat insulation layer 122 adopts an aerogel heat insulation layer, and the third heat insulation layer 123 adopts a porous vacuum silicon heat insulation layer. Using the porous vacuum silicon heat insulation layer as the first and third heat insulation layers 123 can more effectively block the transfer of heat, and the aerogel heat insulation layer serves as an intermediate layer to further enhance the overall heat insulation effect.

[0028] In some other embodiments, when there is sufficient internal space in the housing 10, the heat insulation effect of the heat insulation layer 12 can also be improved by increasing the thickness of each sub heat insulation layer.

[0029] To prevent relative movement inside the heat insulation layer 12 or between the heat insulation layer 12 and the main housing 11, in the embodiment of the present application, the multiple sub heat insulation layers are integrally provided. The housing 10 further includes an adhesive layer, and the heat insulation layer 12 is connected to the inner wall surface of the main housing 11 through the adhesive layer. Optionally, the adhesive layer may adopt an adhesive, for example, epoxy resin glue, acrylate adhesive. In a specific implementation, when the materials of the sub heat insulation layers are different, a hot pressing process can be used to press and form an integrally provided heat insulation layer 12. When the materials of the sub heat insulation layers are the same, a hot pressing or bonding process can be used to form an integrally provided heat insulation layer 12.

[0030] The electronic component 20 includes a plurality of power components 22, such as transformers, rectifier diodes, inductors, etc. In an embodiment of the present application, the plurality of power components 22 are arranged in one-to-one correspondence with the plurality of heat dissipation layers 30. To avoid short circuits between the power components 22, adjacent two heat dissipation layers 30 are arranged at intervals. Among them, the heat insulation layer 12 located on one side of the circuit board 21 covers the plurality of heat dissipation layers 30 to fully block the heat transferred from the power components 22.

[0031] Optionally, in another embodiment of the present application, the charging device 1 includes one heat dissipation layer 30 covering the plurality of power components 22, and the heat insulation layer 12 covers the heat dissipation layer 30 on the side away from the plurality of power components 22. In a specific implementation, the sizes of the plurality of power components 22 are inconsistent, resulting in different heights of them relative to the circuit board 21. One heat dissipation layer 30 cannot be connected to the plurality of power components 22 at the same time. Therefore, one heat dissipation layer 30 is connected to the power component 22 with the largest power. For example, in the charging device 1, the heat dissipation layer 30 can be arranged corresponding to the main transformer.

[0032] As Figure 6 shown, Figure 6 is a schematic structural diagram of a heat dissipation layer 30 according to an embodiment of the present application. In the embodiment of the present application, the heat dissipation layer 30 includes a first heat dissipation layer 31 and a second heat dissipation layer 32. The first heat dissipation layer 31 is arranged corresponding to the power component 22, and the second heat dissipation layer 32 is stacked and connected to the side of the first heat dissipation layer 31 away from the power component 22. Among them, the thermal conductivity of the second heat dissipation layer 32 is greater than that of the first heat dissipation layer 31. The first heat dissipation layer 31 can quickly absorb and disperse the heat generated by the power component 22. The power component 22 is the main source of heat generation. The layout of the first heat dissipation layer 31 arranged corresponding to the power component 22 ensures that the heat can be effectively processed in the first time. The second heat dissipation layer 32 and the first heat dissipation layer 31 form a gradient heat dissipation structure. After the heat is initially dispersed by the first heat dissipation layer 31, it is quickly transferred to the second heat dissipation layer 32 with a higher thermal conductivity, further accelerating the dissipation of the heat. This gradient heat dissipation method improves the overall heat dissipation efficiency. It can be understood that in the embodiment of the present application, in the direction perpendicular to the board surface of the circuit board 21, the projected area of the power component 22 is M1, the projected area of the first heat dissipation layer 31 is M2, and the projected area of the second heat dissipation layer 32 is M3. M1, M2, and M3 satisfy: M3≥M2>M1. In this way, by further increasing the heat dissipation area, the heat dissipation efficiency is improved without increasing too much volume.

[0033] Optionally, the first heat dissipation layer 31 includes at least one of a copper foil heat dissipation layer, an aluminum foil heat dissipation layer, and an alloy heat dissipation layer, and the second heat dissipation layer 32 includes at least one of a graphene heat dissipation layer, a graphene polymer composite insulation layer, and a graphene-based metal composite heat dissipation layer. The first heat dissipation layer 31 and the second heat dissipation layer 32 are integrally provided. Preferably, the first heat dissipation layer 31 is a copper foil heat dissipation layer, and the second heat dissipation layer 32 is a graphene heat dissipation layer.

[0034] In an embodiment of the present application, the heat dissipation layer 30 further includes an insulation layer 33. The insulation layer 33 is bonded to the wall surface of the power element 22, and the first heat dissipation layer 31 is connected to the surface of the insulation layer 33 facing away from the power element 22. Among them, by providing the insulation layer 33, the first heat dissipation layer 31 is prevented from being short-circuited with the power element 22. Exemplarily, the material of the insulation layer 33 includes at least one of an epoxy resin material, a polyimide material, and a glass fiber cloth and resin composite material.

[0035] In an embodiment of the present application, in the compact charging device 1, the heat dissipation layer 30 and the heat insulation layer 12 are attached to each other. The side of the heat dissipation layer 30 away from the electronic component 20 is connected to the heat insulation layer 12. In this way, the housing 10, the heat dissipation layer 30, and the electronic component 20 are tightly connected, and the thickness of the charging device 1 is small.

[0036] In another embodiment of the present application, the heat dissipation layer 30 and the heat insulation layer 12 are spaced apart. The charging device 1 further includes a filling layer, and a part of the filling layer fills the gap between the heat dissipation layer 30 and the heat insulation layer 12. In Figure 1 - Figure 3 In the encapsulation of the shown charging device 1, two heat insulation layers 12 are respectively bonded to the two first main walls 101 of the first housing 111 through an adhesive layer. The heat dissipation layer 30 is connected to the electronic component 20 and is loaded into the first housing 111 together with the electronic component 20. Then, the heat dissipation layer 30 and the electronic component 20 are encapsulated in the internal space of the first housing 111 through the filling layer. Among them, the filling layer is a potting adhesive. Finally, the second housing 112 is covered on the first housing 111 to complete the encapsulation of the charging device 1. In a specific implementation, the potting adhesive can firmly fix the heat dissipation layer 30, the electronic component 20, and the heat insulation layer 12 together, and form a tight encapsulation with the first housing 111 to prevent the intrusion of external substances such as dust and moisture. At the same time, the potting adhesive can also absorb and disperse vibration energy, and play a role in shock absorption and protection for the heat dissipation layer 30, the electronic component 20, and the heat insulation layer 12 encapsulated therein.

[0037] Optionally, in a case where better heat insulation performance is required, a heat barrier is formed between the heat dissipation layer 30 and the heat insulation layer 12 by selecting a filling layer with a low thermal conductivity to prevent heat from directly transferring from the heat dissipation layer to the heat insulation layer, thereby improving the heat insulation performance.

[0038] If the charging device 1 needs efficient heat dissipation, the filling layer has thermal conductivity, and a part of the filling layer is filled in the gap between the electronic component 20 and the main housing 11. Among them, the filling layer is potting glue, which can further dissipate the heat transferred by the heat dissipation layer 30. The potting glue is connected to other side walls of the housing 10 that are connected to the first main wall 101, so that the heat generated by the power element 22 can be transferred from other side walls to the external space through the heat dissipation layer 30 and the potting glue, thereby avoiding excessive heat accumulation inside the charging device 1 and damaging the electronic component 20 and the service life of the charging device 1. Exemplarily, the potting glue can be epoxy resin type potting glue, silicone type potting glue or other potting glue with a thermal conductivity that meets the heat dissipation requirements.

[0039] It should be noted that the above Figure 1 - Figure 3 charging device 1 takes the structure of a charger as an example to exemplarily describe the structure of the charging device 1. It can be seen that the charger further includes a plug component 40. The plug component 40 is connected to the second housing 112, and part of it is received in the internal space of the main housing 11 and is electrically connected to the electronic component 20. Part of it penetrates the second housing 112 and extends outwards from the second housing 112 for electrically connecting to an external power supply. In this way, the electronic component 20 can be connected to the external power supply through the plug component 40.

[0040] In some embodiments, the first direction A is the thickness direction of the charging device 1. The two first main walls 101 of the main housing 11 are arranged opposite to each other in the thickness direction of the charging device 1. The main housing 11 further includes two first side walls arranged opposite to each other in the width direction of the charging device 1 and two second side walls arranged opposite to each other in the length direction of the charging device 1. The length direction, width direction and thickness direction of the charging device 1 are perpendicular to each other in pairs. The first main wall 101 and the second side walls are both flat plates, and the first side walls are flat plates or arc-shaped convex plates. One of the second side walls has a plug opening, and the plug of the plug component 40 penetrates the plug opening and extends out of the second side wall.

[0041] The circuit board 21 has a first surface and a second surface that are oppositely arranged in the thickness direction of the charging device 1. A plurality of power components 22 are provided on the first surface of the circuit board 21, so that the plurality of power components 22 are distributed in the same plane perpendicular to the thickness direction of the charging device 1, so that the charging device 1 has a smaller dimension in the thickness direction of the charging device 1 and a larger dimension in the plane perpendicular to the thickness direction of the charging device 1, and thus the entire charging device 1 is in a flat shape. In some embodiments, the outer contour of the main housing has a length a, a width b, and a thickness c, where c:a:b = 1:5-10:3-5. In this dimension range, the distance between the power component 22 and the first main wall 101 is small, and the heat generated by the power component 22 is easily conducted to the first main wall 101, which in turn causes the problem of heat generation of the first main wall 101. In the embodiment of the present application, by providing a heat dissipation layer 30, the heat generated by the power component 22 is dispersed to an area outside the power component 22, and a heat insulation layer 12 is provided on the side of the heat dissipation layer 30 facing away from the power component 22 to block the heat generated by the power component 22, and thus block the heat transferred to the main housing 11 through the heat dissipation layer 30, so as to solve the problem of heat generation of the main housing 11 of the charging device 1.

[0042] In the drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present application, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0043] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A charging device, characterized in that: include: A shell, comprising a main shell and a heat insulation layer, wherein the heat insulation layer is arranged on the inner wall surface of the main shell; An electronic assembly comprising a circuit board and a power component mounted on the circuit board; and A heat dissipation layer, covering the electronic component; The heat dissipation layer is encapsulated together with the electronic component in the internal space of the shell, and the heat dissipation layer is arranged corresponding to the power element to disperse the heat generated by the power element to the area outside the power element. The thermal insulation layer is arranged on the side of the heat dissipation layer away from the power element to prevent the heat generated by the power element from being transferred to the main shell through the heat dissipation layer.

2. The charging device according to claim 1, characterized in that: The housing has two first main walls arranged opposite to each other along a first direction, wherein the first direction is perpendicular to the surface of the circuit board; The shell includes two thermal insulation layers, and the two thermal insulation layers are arranged on the inner wall surfaces of the two first main walls in a one-to-one correspondence.

3. The charging device according to claim 2, characterized in that: The main housing comprises: a first housing, wherein the circuit board is mounted in the first housing; and A second shell, covering the first shell along a preset direction; The preset direction is perpendicular to the first direction, and two side walls of the first shell that are oppositely arranged along the first direction respectively form two first main walls; or, The preset direction is the same as the first direction, the first shell includes one first main wall, and the second shell includes another first main wall.

4. The charging device according to claim 1, characterized in that: The thermal insulation layer comprises a plurality of stacked and connected sub-insulation layers, and the sub-insulation layers are porous vacuum silicon layers or aerogel thermal insulation layers.

5. The charging device according to claim 4, characterized in that: A plurality of said sub-insulation layers are integrally arranged; The shell further includes an adhesive layer, and the heat insulation layer is bonded to the inner wall surface of the main shell through the adhesive layer.

6. The charging device according to claim 1, characterized in that: The heat dissipation layer comprises: A first heat dissipation layer is provided corresponding to the power element; The second heat dissipation layer is laminated and connected to a side of the first heat dissipation layer away from the power element, and the thermal conductivity of the second heat dissipation layer is greater than the thermal conductivity of the first heat dissipation layer.

7. The charging device according to claim 6, characterized in that: The heat dissipation layer further comprises an insulating layer, the insulating layer is bonded to the surface of the power element, and the first heat dissipation layer is connected to the surface of the insulating layer away from the power element; The first heat dissipation layer includes at least one of a copper foil heat dissipation layer, an aluminum foil heat dissipation layer, and an alloy heat dissipation layer; The second heat dissipation layer includes at least one of a graphene heat dissipation layer, a graphene polymer composite heat dissipation layer, and a graphene-based metal composite heat dissipation layer; The insulating layer, the first heat dissipation layer and the second heat dissipation layer are integrally arranged.

8. The charging device according to claim 1, characterized in that: The electronic assembly includes a plurality of power elements disposed on the circuit board; Wherein, the charging device comprises a plurality of heat dissipation layers corresponding one to one to the plurality of power elements, and the heat insulation layer located on one side of the circuit board covers the plurality of heat dissipation layers; or, The charging device includes a heat dissipation layer covering a plurality of the power components, and the heat insulation layer covers the heat dissipation layer on a side facing away from the plurality of the power components.

9. The charging device according to claim 1, characterized in that: The heat dissipation layer and the heat insulation layer are arranged in close contact; or, The heat dissipation layer and the heat insulation layer are spaced apart, and the charging device further comprises a filling layer, a part of which is filled in the gap between the heat dissipation layer and the heat insulation layer; or, A portion of the filling layer fills the gap between the electronic component and the main housing.

10. The charging device according to claim 1, characterized in that: The outer contour of the main shell is flat and has a length a, a width b and a thickness c; Among them, c:a:b=1:5~10:3~5.

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