Silicon wafer detection line
By designing a silicon wafer detection line including fill light components and a collapse detection camera, the problem of difficulty in detecting side defects of the silicon wafer in the prior art is solved, and higher detection accuracy and productivity are achieved.
Patent Information
- Application Number
- CN202421658510.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-07-12
AI Technical Summary
The prior art is difficult to detect whether there are defects on the sides of the silicon wafer, causing some defective products to flow into the production line, affecting the production yield.
A silicon wafer detection line is designed, including a first conveyor belt and a first side edge detection assembly, which is composed of a first side edge detection camera and a first fill light assembly. The first fill light assembly performs fill light on one side of the silicon wafer, and the first collapse detection camera performs photo detection on the illuminated side.
Through side photography inspection, the accuracy of detection of side defects of silicon wafers is significantly improved, the inflow of defects is reduced, and the yield is improved.
Smart Images
Figure CN222896102U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of detection, in particular to a silicon wafer detection line. Background Art
[0002] During the production process, silicon wafers need to be inspected to see if they are qualified products. Generally, a detection camera is installed on the top of the conveyor belt to take photos of the silicon wafers. The current top-mounted photo inspection method generally cannot detect whether there are defects on the side of the silicon wafer, which causes some defective products to flow into the production line, which is not conducive to improving the production yield.
[0003] In view of this, it is necessary to design a silicon wafer inspection line to further improve the inspection accuracy and increase the production yield of silicon wafers.
[0004] The above information is presented as background information only to assist with understanding the present disclosure and no determination or admission is made as to whether any of the above may be used as prior art with respect to the present disclosure. Utility Model Content
[0005] The utility model provides a silicon wafer detection line to further improve detection accuracy and increase the production yield of silicon wafers.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] A silicon wafer testing line, comprising:
[0008] A first conveyor belt, used for conveying silicon wafers;
[0009] A first side edge chipping detection component includes a first edge chipping detection camera and a first fill light component; the first edge chipping detection camera and the first fill light component are arranged on the same side of the first conveyor belt, and the center line of the first edge chipping detection camera and the center line of the first fill light component are both parallel to the conveying surface of the first conveyor belt;
[0010] The illumination area of the first fill light component overlaps with the detection area of the first edge chipping detection camera.
[0011] Optionally, the first fill light component is a line laser.
[0012] Optionally, the first side edge collapse detection components are provided with two groups;
[0013] The two groups of the first side edge collapse detection components are symmetrically arranged about the first conveyor belt.
[0014] Optionally, a dirt detection component is also included;
[0015] The dirt detection component is arranged on the top side of the first conveyor belt, and includes a dirt detection camera for detecting the dirty area on the top surface of the silicon wafer, and the dirt detection component and the first side edge collapse detection component are arranged in sequence along the conveying direction of the first conveyor belt.
[0016] Optionally, it further comprises a corner edge collapse detection component arranged beside the first conveyor belt; the corner edge collapse detection component comprises four corner detection cameras;
[0017] When the silicon wafer is conveyed along the first conveyor belt to the set corner edge chipping detection station, the four corner detection cameras are respectively aimed at a corner of the silicon wafer.
[0018] Optionally, a second side edge collapse detection component is also included;
[0019] The second side edge chipping detection assembly includes an end edge chipping detection camera and an arched light source, wherein the arched light source includes a housing and a lamp bead installed in the housing;
[0020] The shell has an arc surface and a detection window. The light emitted by the lamp bead is reflected by the arc surface to illuminate the silicon wafer at the bottom. The end edge collapse detection camera is used to take pictures of the front and rear edges of the silicon wafer through the detection window.
[0021] Optionally, it also includes a scratch detection component; the scratch detection component includes a first tilt detection camera and a second tilt detection camera; the center line of the first tilt detection camera is tilted relative to the conveying surface of the first conveyor belt, the center line of the second tilt detection camera is tilted relative to the conveying surface of the first conveyor belt, and the detection area of the first tilt detection camera and the detection area of the second tilt detection camera at least partially overlap.
[0022] Optionally, it further includes a second conveyor belt and a loading robot, wherein the loading robot is used to transfer the silicon wafers on the second conveyor belt to the first conveyor belt.
[0023] Optionally, a positioning camera for detecting the position of silicon wafers is provided on one side of the top of the second conveyor belt, and the positioning camera is electrically connected to the loading robot.
[0024] Optionally, a discharging robot is also provided, and the discharging robot is installed on one side of the tail end portion of the first conveyor belt.
[0025] Compared with the prior art, the utility model has the following beneficial effects:
[0026] The utility model provides a silicon wafer inspection line, when the silicon wafer is conveyed to a suitable position along the first conveyor belt, the first fill light device performs fill light on one side of the silicon wafer, and the first chipping detection camera takes a picture of the illuminated side of the silicon wafer, so as to detect whether there is a chipping defect on the side of the silicon wafer; because the center line of the first chipping detection camera and the center line of the first fill light component are parallel to the conveying surface of the first conveyor belt, and the irradiation area of the first fill light component and the detection area of the first chipping detection camera overlap, the defects on the side of the silicon wafer can be more clearly manifested, thereby improving the detection accuracy of the silicon wafer, and further facilitating the improvement of the production yield of the silicon wafer.
[0027] The present invention has other characteristics and advantages, which will be apparent from the accompanying drawings and subsequent specific embodiments incorporated herein, or will be described in detail in the accompanying drawings and subsequent specific embodiments incorporated herein, which together are used to explain the specific principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0029] Figure 1 It is a front view schematic diagram of a silicon wafer inspection line provided by an embodiment of the utility model;
[0030] Figure 2 It is a top view schematic diagram of a silicon wafer inspection line provided by an embodiment of the utility model;
[0031] Figure 3 It is a three-dimensional structural schematic diagram of a silicon wafer detection line provided by an embodiment of the utility model.
[0032] Figure numerals: 1. first conveyor belt; 2. first side edge chipping detection component; 21. first edge chipping detection camera; 22. first fill light component; 3. dirt detection component; 31. dirt detection camera; 4. corner edge chipping detection component; 41. corner detection camera; 5. second side edge chipping detection component; 51. end edge chipping detection camera; 52. arched light source; 6. scratch detection component; 61. first tilt detection camera; 62. second tilt detection camera; 7. second conveyor belt; 8. loading robot; 9. unloading robot. DETAILED DESCRIPTION
[0033] In order to explain in detail the possible application scenarios, technical principles, specific schemes that can be implemented, and the purposes and effects that can be achieved, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.
[0034] Reference to "embodiment" herein means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The term "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the various technical features mentioned in the embodiments can be combined in any way to form a corresponding implementable technical solution.
[0035] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit this application.
[0036] In the description of this application, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in an "or" logical relationship.
[0037] In the present application, terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.
[0038] Without further limitations, in this application, the words "include", "comprises", "has" or other similar expressions used in the sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.
[0039] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.
[0040] In the description of the embodiments of the present application, space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.
[0041] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms such as "install", "connect", "connect", "fix", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For technicians in the technical field to which the present application belongs, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0042] In view of the defects of the existing silicon wafer detection device, the applicant, based on many years of rich practical experience and professional knowledge in the design and manufacture of such products, and in conjunction with the application of theory, actively conducts research and innovation in the hope of creating a technology that can solve the defects in the existing technology and make the silicon wafer detection device more practical. After continuous research and design, and after repeated trial production and improvement, the present utility model with real practical value was finally created.
[0043] Please refer to Figures 1 to 3The embodiment of the utility model provides a silicon wafer inspection line, including: a first conveyor belt 1 for conveying silicon wafers; a first side edge chipping detection component 2, including a first edge chipping detection camera 21 and a first fill light component 22; the first edge chipping detection camera 21 and the first fill light component 22 are arranged on the same side of the first conveyor belt 1, and the center line of the first edge chipping detection camera 21 and the center line of the first fill light component 22 are both parallel to the conveying surface of the first conveyor belt 1; the irradiation area of the first fill light component 22 and the detection area of the first edge chipping detection camera 21 overlap. The first fill light component 22 can illuminate one side of the silicon wafer, so that the first edge chipping detection camera 21 can detect one side of the silicon wafer. The overlap in this paragraph means that the detection area of the first edge chipping detection camera 21 is in the irradiation area of the first fill light component 22.
[0044] In this embodiment, by making the center line of the first fill light component 22 parallel to the conveying surface of the first conveyor belt 1, the first fill light component 22 can better illuminate one side of the silicon wafer, and the center line of the first chipped edge detection camera 21 is parallel to the conveying surface of the first conveyor belt 1, which can improve the accuracy of photo detection. Compared with the existing top photo method, the first chipped edge detection camera 21 adopts a side photo method, which has higher detection accuracy and is conducive to detecting defective silicon wafers and preventing defective silicon wafers from flowing into subsequent production processes.
[0045] Optionally, the first fill light component 22 is a line laser. During the conveying of the silicon wafer along the first conveyor belt 1, the first side edge collapse detection component 2 takes photos for detection multiple times, thereby detecting a complete side of the silicon wafer. In addition, the first fill light component 22 is a line laser, which can improve the lighting brightness and reduce the influence of external diffuse reflected light, which is conducive to further improving the accuracy of detection. Preferably, the spot shape of the first fill light component 22 is linear and parallel to the side of the first conveyor belt 1, thereby illuminating one side of the silicon wafer at one time.
[0046] Optionally, two groups of first side edge chipping detection components 2 are provided; the two groups of first side edge chipping detection components 2 are symmetrically arranged about the first conveyor belt 1, so as to detect two opposite sides of the silicon wafer.
[0047] Optionally, the silicon wafer inspection line also includes a dirt detection component 3; the dirt detection component 3 is arranged on the top side of the first conveyor belt 1, and includes a dirt detection camera 31 for detecting dirty areas on the top surface of the silicon wafer, and the dirt detection component 3 and the first side edge collapse detection component 2 are arranged in sequence along the conveying direction of the first conveyor belt 1.
[0048] The dirt detection component 3 is used to detect whether there is a dirty area on the top surface of the silicon wafer, so as to prevent the dirty silicon wafer from flowing into the subsequent production process, thereby improving the production yield.
[0049] Alternatively, if Figure 2The silicon wafer inspection line also includes a corner chipping detection component 4 arranged next to the first conveyor belt 1; the corner chipping detection component 4 includes four corner detection cameras 41; when the silicon wafer is conveyed along the first conveyor belt 1 to the set corner chipping detection station, the four corner detection cameras 41 are respectively aimed at a corner of the silicon wafer.
[0050] Specifically, when the silicon wafer enters the set corner edge collapse detection station, all corner detection cameras 41 work simultaneously to take pictures of the four corners of the silicon wafer to detect whether there are edge collapse defects at the corners of the silicon wafer. It should be supplemented that the edge collapse detection is to determine whether there are defects such as cracks, breaks, and damages in the corresponding area of the silicon wafer.
[0051] Optionally, the silicon wafer inspection line also includes a second side chipping detection component 5; the second side chipping detection component 5 includes an end chipping detection camera 51 and an arched light source 52, the arched light source 52 includes a shell and a lamp bead installed in the shell; the shell has an arcuate surface, and the shell is provided with a detection window, the light emitted by the lamp bead is reflected by the arcuate surface to illuminate the silicon wafer at the bottom; the end chipping detection camera 51 is used to take pictures of the front and rear side edges of the silicon wafer through the detection window.
[0052] Specifically, the first side edge chipping detection component 2 detects defects on the left or right side edge, and the second side edge chipping detection component 5 detects defects on the front and rear ends of the edge.
[0053] Optionally, the silicon wafer inspection line also includes a scratch detection component 6; the scratch detection component 6 includes a first tilted detection camera 61 and a second tilted detection camera 62; the center line of the first tilted detection camera 61 is tilted relative to the conveying surface of the first conveyor belt 1, and the center line of the second tilted detection camera 62 is tilted relative to the conveying surface of the first conveyor belt 1, and the detection area of the first tilted detection camera 61 and the detection area of the second tilted detection camera 62 at least partially overlap.
[0054] Specifically, by detecting the surface of the silicon wafer with the first tilt detection camera 61 and the second tilt detection camera 62 tilted to each other, scratches can be detected from more angles, reducing the possibility of missing scratches and further improving the detection accuracy of scratches.
[0055] Optionally, the silicon wafer inspection line also includes a second conveyor belt 7 and a loading robot 8. The loading robot 8 is used to transfer the silicon wafers on the second conveyor belt 7 to the first conveyor belt 1, thereby improving the smoothness of production and facilitating improving production efficiency.
[0056] Optionally, a positioning camera for detecting the position of the silicon wafer is provided on one side of the top of the second conveyor belt 7, and the positioning camera is electrically connected to the loading robot 8. The loading robot 8 picks up the silicon wafer on the second conveyor belt 7 and transfers it to the first conveyor belt 1 according to the position of the silicon wafer detected by the positioning camera.
[0057] Optionally, the silicon wafer inspection line is further provided with a discharging robot 9 , which is installed at one side of the tail end portion of the first conveyor belt 1 .
[0058] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concept of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.
Claims
1. A silicon wafer inspection line, characterized in that: include: A first conveyor belt (1) for conveying silicon wafers; A first side edge chipping detection component (2) comprises a first side edge chipping detection camera (21) and a first fill light component (22); the first side edge chipping detection camera (21) and the first fill light component (22) are arranged on the same side of the first conveyor belt (1), and the center line of the first side edge chipping detection camera (21) and the center line of the first fill light component (22) are both parallel to the conveying surface of the first conveyor belt (1); The illumination area of the first fill light component (22) overlaps with the detection area of the first chipping detection camera (21).
2. The silicon wafer inspection line according to claim 1, characterized in that: The first fill light component (22) is a line laser.
3. The silicon wafer inspection line according to claim 1, characterized in that: The first side edge collapse detection components (2) are provided with two groups; The two groups of the first side edge collapse detection components (2) are symmetrically arranged with respect to the first conveyor belt (1).
4. The silicon wafer inspection line according to claim 1, characterized in that: Also includes a dirt detection component (3); The dirt detection component (3) is arranged on the top side of the first conveyor belt (1), and comprises a dirt detection camera (31) for detecting a dirty area on the top surface of a silicon wafer, and the dirt detection component (3) and the first side edge collapse detection component (2) are arranged in sequence along the conveying direction of the first conveyor belt (1).
5. The silicon wafer inspection line according to claim 1, characterized in that: It also includes a corner edge collapse detection component (4) arranged beside the first conveyor belt (1); the corner edge collapse detection component (4) includes four corner detection cameras (41); When the silicon wafer is conveyed along the first conveyor belt (1) to a set corner edge chipping detection station, the four corner detection cameras (41) are respectively aimed at a corner of the silicon wafer.
6. The silicon wafer inspection line according to claim 1, characterized in that: It also includes a second side edge collapse detection component (5); The second side edge chipping detection component (5) comprises an end edge chipping detection camera (51) and an arch light source (52), wherein the arch light source (52) comprises a shell and a lamp bead installed in the shell; The shell has an arc surface and a detection window. The light emitted by the lamp bead is reflected by the arc surface to illuminate the silicon wafer at the bottom. The end edge collapse detection camera (51) is used to take pictures of the front side edge and the rear side edge of the silicon wafer through the detection window.
7. The silicon wafer inspection line according to claim 1, characterized in that: It also includes a scratch detection component (6); the scratch detection component (6) includes a first tilt detection camera (61) and a second tilt detection camera (62); the center line of the first tilt detection camera (61) is tilted relative to the conveying surface of the first conveyor belt (1), and the center line of the second tilt detection camera (62) is tilted relative to the conveying surface of the first conveyor belt (1), and the detection area of the first tilt detection camera (61) and the detection area of the second tilt detection camera (62) at least partially overlap.
8. The silicon wafer inspection line according to claim 1, characterized in that: It also comprises a second conveyor belt (7) and a loading robot (8), wherein the loading robot (8) is used to transfer the silicon wafers on the second conveyor belt (7) to the first conveyor belt (1).
9. The silicon wafer inspection line according to claim 8, characterized in that: A positioning camera for detecting the position of the silicon wafer is arranged on one side of the top of the second conveyor belt (7), and the positioning camera is electrically connected to the loading robot (8).
10. The silicon wafer inspection line according to claim 1, characterized in that: A discharging robot (9) is also provided, and the discharging robot (9) is installed on one side of the tail end portion of the first conveyor belt (1).