Circuit board heat dissipation mechanism and air conditioning device

Abstract

The utility model provides a circuit board heat dissipation mechanism and an air conditioning device, and the circuit board heat dissipation mechanism comprises a pedestal which is provided with a circuit board, and one side of the circuit board is provided with an electronic element; the fixing shell is arranged on the base, an air inlet channel is formed between the fixing shell and the base, the circuit board forms a part of channel wall of the air inlet channel, and the side, provided with the electronic element, of the circuit board faces the interior of the air inlet channel; the first cooling fan is arranged on the circuit board; the second heat dissipation fan is arranged at one end of the air inlet channel so as to blow air into the air inlet channel or blow air in the air inlet channel out. According to the utility model, the defect that the performance of the circuit board is limited due to the poor heat dissipation effect of the circuit board of the air-conditioning device in the prior art is overcome, and the heat dissipation performance of the circuit board is optimized, so that the working efficiency of the air-conditioning device and the operation stability of an air-conditioning system are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of air conditioning, in particular to a circuit board heat dissipation mechanism and an air conditioning device. Background Art

[0002] In modern air-conditioning systems, circuit boards serve as core controllers and integrate a large number of sophisticated electronic components, such as microprocessors, power modules, semiconductor components, etc. However, as the intelligence of air conditioners continues to increase, the heat generated by circuit boards during operation also increases. If heat dissipation measures are not in place, the internal temperature may be too high.

[0003] The air conditioning units currently on the market have insufficiently optimized circuit board heat dissipation design, which makes it impossible for the heat generated during operation to be dissipated promptly and effectively, causing the overall temperature of the circuit board to rise. This not only affects the normal working life and stability of electronic components, but may also limit the full performance of the circuit board, such as reducing response speed, increasing energy consumption, and even causing system failures. Utility Model Content

[0004] The utility model provides a circuit board heat dissipation mechanism and an air-conditioning device, which are used to solve the defect in the prior art that the circuit board of the air-conditioning device has poor heat dissipation effect, which limits the performance of the circuit board, and optimize the heat dissipation performance of the circuit board, so as to improve the working efficiency of the air-conditioning device and the operating stability of the air-conditioning system.

[0005] The utility model provides a circuit board heat dissipation mechanism, comprising: a base, on which a circuit board is provided, and one side of the circuit board is provided with electronic components; a fixed shell, which is provided on the base, an air inlet channel is formed between the fixed shell and the base, the circuit board constitutes a part of the channel wall of the air inlet channel, and the side of the circuit board on which the electronic components are provided faces the air inlet channel; a first heat dissipation fan, which is provided on the circuit board; and a second heat dissipation fan, which is provided at one end of the air inlet channel to blow air into the air inlet channel, or blow the air in the air inlet channel outward.

[0006] According to a circuit board heat dissipation mechanism provided by the utility model, the first heat dissipation fan and / or the second heat dissipation fan is an axial flow fan.

[0007] According to a circuit board heat dissipation mechanism provided by the utility model, a heat dissipation hole is arranged on the circuit board, and the first heat dissipation fan is arranged concentrically with the heat dissipation hole to blow air from one side of the circuit board to the other side during operation.

[0008] According to a circuit board heat dissipation mechanism provided by the utility model, the first heat dissipation fan and the electronic component are respectively installed on two sides of the circuit board.

[0009] According to a circuit board heat dissipation mechanism provided by the utility model, the air inlet channel is provided with a first air duct opening, and the opening direction of the first air duct opening is perpendicular to the channel direction of the air inlet channel; the second heat dissipation fan is arranged at the first air duct opening, and an air guide structure for guiding the airflow to turn 90 degrees is arranged between the first air duct opening and the air inlet channel.

[0010] According to a circuit board heat dissipation mechanism provided by the utility model, the air guide structure includes a multi-layer arc-shaped air guide plate, and the arc-shaped air guide plate includes a straight portion parallel to the channel direction of the air inlet channel, and an arc-shaped portion bent from the straight portion toward the first air duct opening; the spacing between any adjacent straight portions is equal, and the spacing between any adjacent ends of the arc-shaped portions close to the first air duct opening is equal, so as to separate a plurality of arc-shaped air ducts between the first air duct opening and the air inlet channel.

[0011] According to a circuit board heat dissipation mechanism provided by the utility model, the air guide structure includes a middle partition; multiple layers of the arc-shaped air guide plates and multiple arc-shaped air ducts formed between the arc-shaped air guide plates are respectively arranged on both sides of the middle partition.

[0012] According to a circuit board heat dissipation mechanism provided by the utility model, the fixing shell and the base form a second air duct opening of the air inlet channel.

[0013] According to a circuit board heat dissipation mechanism provided by the utility model, a plurality of straight air guide plates are arranged in the second air duct opening, and the plurality of straight air guide plates are distributed in parallel and at intervals to divide the second air duct opening into a plurality of vents.

[0014] According to a circuit board heat dissipation mechanism provided by the utility model, the fixed shell includes a shell top plate and a shell side plate supported between the shell top plate and the base, the shell top plate has a frame-shaped notch, and the circuit board is located in the frame-shaped notch.

[0015] The utility model also provides an air conditioning device, comprising the circuit board heat dissipation mechanism described in any one of the above embodiments.

[0016] The circuit board heat dissipation mechanism and air conditioning device provided by the utility model are equipped with a first heat dissipation fan directly attached to the circuit board through the heat dissipation mechanism, which accurately dissipates heat for local hot spots; the second heat dissipation fan is located at one end of the air inlet channel, and adjusts the air in and out of the channel as needed to enhance the heat dissipation efficiency. The two heat dissipation fans can be controlled independently and flexibly deployed according to the heating conditions of the circuit board. In practical applications, the heat dissipation mechanism can adapt to different heat dissipation needs. When the heat is slightly high, only the first heat dissipation fan is used. When the load increases, the second heat dissipation fan is started. Under high temperature conditions, the two fans are linked to take into account local heat dissipation and overall efficiency, ensuring that the circuit board of the air conditioning device maintains a suitable temperature under any operating state, and ensuring the stability of the circuit board performance and service life. The air conditioning device adopts the circuit board heat dissipation mechanism, which can optimize the heat dissipation performance of the circuit board to improve the work efficiency and the operating stability of the air conditioning system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 It is a structural schematic diagram of the circuit board heat dissipation mechanism provided by the utility model;

[0019] Figure 2 It is a cross-sectional structural schematic diagram of the circuit board heat dissipation mechanism provided by the utility model;

[0020] Figure 3 It is a schematic diagram of the exploded structure of the circuit board heat dissipation mechanism provided by the utility model;

[0021] Reference numerals:

[0022] 10. Base; 20. Fixed shell; 21. Shell top plate; 22. Shell side plate; 30. Air inlet channel; 31. First air duct opening; 32. Curved air guide plate; 33. Curved air duct; 34. Middle partition; 35. Second air duct opening; 36. Straight air guide plate; 40. First cooling fan; 41. Cooling air holes; 50. Second cooling fan. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described clearly and completely in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. It should also be noted that in the description of the present utility model, unless otherwise clearly specified and limited, the terms "set", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.

[0025] Combine the following Figure 1-Figure 3 The specific implementation of the circuit board heat dissipation mechanism of the utility model is described.

[0026] like Figure 1 , Figure 2 and Figure 3 As shown, the utility model provides a circuit board heat dissipation mechanism, including: a base 10, provided with a circuit board, and electronic components are provided on one side of the circuit board; a fixed shell 20, provided on the base 10, an air inlet channel 30 is formed between the fixed shell 20 and the base 10, the circuit board constitutes a part of the channel wall of the air inlet channel 30, and the side of the circuit board provided with the electronic components faces the air inlet channel 30; a first heat dissipation fan 40, provided on the circuit board; a second heat dissipation fan 50, provided at one end of the air inlet channel 30, so as to blow air into the air inlet channel 30, or blow the air in the air inlet channel 30 outward.

[0027] Specifically, the utility model relates to a circuit board heat dissipation mechanism designed to optimize the heat dissipation performance of the circuit board of the air conditioning device. The basic structure of the mechanism includes two major parts: a base 10 and a fixed shell 20. First, the circuit board is firmly mounted on the base 10, one side of which is covered with various electronic components that are prone to generate heat. Among them, an air inlet channel 30 is formed between the fixed shell 20 and the base 10, and the circuit board itself constitutes part of the wall surface of the channel, so that the circuit board, especially the side carrying the electronic components, faces the inside of the air inlet channel 30, which is convenient for air to flow through for heat dissipation.

[0028] In addition, in order to enhance the heat dissipation effect, the heat dissipation mechanism is equipped with two heat dissipation fans. On the one hand, a first heat dissipation fan 40 is directly arranged on the circuit board to dissipate the heat of the circuit board in a targeted and efficient manner; on the other hand, a second heat dissipation fan 50 is installed at one end of the air inlet channel 30, and can deliver or extract air into the channel as needed to promote air circulation and further improve the heat dissipation efficiency.

[0029] Furthermore, the circuit board heat dissipation mechanism integrates a dual cooling fan strategy. Preferably, both can be independently controlled so as to flexibly respond to the actual heating conditions of the circuit board. Specifically, the first cooling fan 40 is carefully arranged near the heating element of the circuit board. Thanks to its compact and efficient characteristics, it can effectively dissipate heat directly from the local hot spots of the circuit board even with a small air volume design. At the same time, the second cooling fan 50 is installed in the base 10 structure and connected to the formed air inlet channel 30. In view of its location with a larger heat dissipation space, the design tends to select a fan type that can generate a larger air volume, so as to better promote the flow of air in the channel, thereby achieving a more comprehensive heat dissipation purpose for the entire circuit board.

[0030] In actual use, the advantage of the heat dissipation mechanism is that it can be intelligently adjusted according to different heat dissipation requirements. In a mildly heated state, only starting the first heat dissipation fan 40 is sufficient to maintain the appropriate temperature of the circuit board; as the load of the circuit board increases and the temperature gradually rises, the second heat dissipation fan 50 is turned on in a timely manner to guide or discharge the hot air in the air inlet channel 30 to enhance the heat dissipation performance of the circuit board as a whole; and when the circuit board encounters a high load and high heat situation, the first heat dissipation fan 40 and the second heat dissipation fan 50 work in conjunction, relying on their respective advantages to cooperate with each other, ensuring that the local high temperature area can be quickly reduced and the heat dissipation efficiency can be comprehensively improved. The ultimate goal is to ensure that the air conditioning device circuit board can maintain an ideal temperature range under various operating conditions, thereby ensuring the stable performance of the circuit board and extending its service life.

[0031] According to a circuit board heat dissipation mechanism provided by the utility model, the first heat dissipation fan 40 and / or the second heat dissipation fan 50 are preferably axial flow fans. Axial flow fans have the characteristic of occupying less space in the axial direction (i.e. the direction of the fan rotation axis), which is conducive to reasonable layout in a compact circuit board heat dissipation structure.

[0032] like Figure 3 As shown, according to a circuit board heat dissipation mechanism provided by the utility model, a heat dissipation hole 41 is provided on the circuit board, and a first heat dissipation fan 40 is arranged concentrically with the heat dissipation hole 41 to blow air from one side of the circuit board to the other side during operation, thereby enhancing the flow of air on both sides of the circuit board, thereby improving the heat dissipation effect. When the heat dissipation fan is in operation, the external or internal air can be directly guided to pass through the heat dissipation hole 41, and flow from one side of the circuit board to the other side, forming effective air convection to take away the heat on the circuit board.

[0033] The heat dissipation holes 41 are preferably arranged near the center of the circuit board, so as to maximize the uniform distribution and flow of air on the entire circuit board. The electronic components are arranged around the heat dissipation holes 41, and the airflow generated by the heat dissipation fan can act more directly on the electronic components that generate serious heat, thereby improving the heat dissipation efficiency and ensuring that the electronic components can work stably in a good temperature environment, thereby ensuring the overall performance and life of the air conditioning device.

[0034] like Figure 2 As shown, according to a circuit board heat dissipation mechanism provided by the utility model, the first heat dissipation fan 40 and the electronic components are preferably installed on both sides of the circuit board respectively, which not only realizes the effective heat dissipation of the electronic components, but also avoids the interference and safety hazards that may be caused by the heat dissipation fan and the heating element being too close, which helps to improve the heat dissipation efficiency and the stability of the system.

[0035] like Figure 2 and Figure 3 As shown, according to a circuit board heat dissipation mechanism provided by the utility model, the air inlet channel 30 is provided with a first air duct opening 31, and the opening direction of the first air duct opening 31 is perpendicular to the channel direction of the air inlet channel 30 (the extension direction of the air inlet channel 30 itself); the second heat dissipation fan 50 is provided at the first air duct opening 31, and an air guide structure for guiding the airflow to turn 90 degrees is provided between the first air duct opening 31 and the air inlet channel 30. The air guide structure can guide the air originally flowing along the axial direction of the second heat dissipation fan 50 to turn 90 degrees, so that it can smoothly enter the air inlet channel 30, or directly discharge the hot air in the air inlet channel 30 from the first air duct opening 31.

[0036] Specifically, the second cooling fan 50 is installed at the first air duct opening 31, and its function is to promote the circulation of external air and the air in the air inlet channel 30. In order to solve the turning problem that may occur when the air enters the channel directly from the cooling fan, the heat dissipation mechanism adds an air guide structure between the first air duct opening 31 and the air inlet channel 30, which can guide the airflow to complete a 90-degree turn, thereby making the air flow smoother, reducing wind resistance, and improving heat dissipation efficiency. Based on the turning design, when selecting the specifications of the second cooling fan 50, a larger radial size can be considered to obtain a larger air volume and higher heat dissipation capacity.

[0037] Furthermore, the flow area of ​​the first air duct opening 31 is larger than the flow area of ​​the air inlet channel 30. The second heat dissipation fan 50 is arranged at the first air duct opening 31, and its function directly acts on the airflow entering the first air duct opening 31. When the second heat dissipation fan 50 is running, the air enters the relatively narrow air inlet channel 30 from the larger first air duct opening 31. Due to the sudden reduction of the cross-sectional area of ​​the channel, according to the Bernoulli principle of fluid mechanics, the air flow rate will be significantly increased. The high-speed airflow can take away the heat on the circuit board more quickly, which is conducive to enhancing the heat dissipation effect, thereby improving the working efficiency of the entire heat dissipation mechanism.

[0038] like Figure 2 and Figure 3 As shown, according to a circuit board heat dissipation mechanism provided by the utility model, the air guide structure includes a multi-layer arcuate air guide plate 32, the arcuate air guide plate 32 includes a straight portion parallel to the channel direction of the air inlet channel 30, and an arcuate portion bent from the straight portion to the first air duct opening 31; the spacing between any adjacent straight portions is equal, and the spacing between the ends of any adjacent arcuate portions close to the first air duct opening 31 is equal, so as to separate a plurality of arcuate air ducts 33 between the first air duct opening 31 and the air inlet channel 30.

[0039] Through the multi-layer arc-shaped air guide plate 32, a plurality of arc-shaped air ducts 33 with orderly intervals are formed between the first air duct opening 31 and the air inlet channel 30. When the second cooling fan 50 is running, when the air flows through these arc-shaped air ducts 33, it will be guided and constrained by the air guide plate, so that the airflow that originally moves in a straight line is forced to change direction when passing through the arc-shaped channel, and the airflow speed is changed at the same time with the change of the cross-sectional area of ​​the flow channel. This effect of changing the diameter and speed is conducive to reducing the resistance of the airflow during the turning process, increasing the airflow speed, and allowing the airflow to flow through the circuit board more evenly, thereby greatly improving the heat dissipation efficiency and ensuring that the heat on the circuit board can be quickly and effectively taken away.

[0040] Furthermore, if Figure 3As shown, according to a circuit board heat dissipation mechanism provided by the utility model, the air guide structure includes a middle partition 34; multiple layers of arc-shaped air guide plates 32 and multiple arc-shaped air ducts 33 formed between the arc-shaped air guide plates 32 are respectively arranged on both sides of the middle partition 34. The middle partition 34 plays a role of separation, and multiple layers of arc-shaped air guide plates 32 and multiple arc-shaped air ducts 33 are arranged on both sides.

[0041] When the second cooling fan 50 starts to operate, the air is guided to pass through the arc-shaped air ducts 33 formed by the middle partition 34 and the arc-shaped air guide plate 32 in sequence. Under this special design, the air flow path is effectively planned and guided, changing the original linear motion mode. Through the gradual change and turning of the arc-shaped channel, the wind resistance is effectively reduced, and the air flow speed and heat dissipation efficiency are improved. At the same time, this design also allows the airflow to be blown into the air inlet channel 30 more evenly and smoothly, ensuring that each area on the circuit board can be fully cooled, thereby greatly improving the overall heat dissipation performance and reliability.

[0042] like Figure 1 and Figure 3 As shown, according to a circuit board heat dissipation mechanism provided by the utility model, the fixed shell 20 and the base 10 form a second air duct opening 35 of the air inlet channel 30. The second air duct opening 35 and the first air duct opening 31 mentioned above are respectively located at two ends of the air inlet channel 30.

[0043] Preferably, in use, the air is first driven by the second heat dissipation fan 50, then enters through the first air duct opening 31, and then the air continues to flow through the air inlet channel 30 after being guided by the air guide structure, and finally flows out from the second air duct opening 35 surrounded by the fixed shell 20 and the base 10. The air flow path of the entire heat dissipation process is: the second heat dissipation fan 50, the first air duct opening 31, the air guide structure, the air inlet channel 30, and the second air duct opening 35. It can be understood that when the second heat dissipation fan 50 runs in the reverse direction, the air flow path of the heat dissipation process is opposite.

[0044] like Figure 1 and Figure 3As shown, according to a circuit board heat dissipation mechanism provided by the utility model, a plurality of straight air guide plates 36 are arranged in the second air duct opening 35, and the plurality of straight air guide plates 36 are arranged in parallel and spaced apart to divide the second air duct opening 35 into a plurality of vents, so as to improve the circulation state of air when it flows through the second air duct opening 35. Specifically, when the hot air after heat dissipation by the circuit board flows from the air inlet channel 30 to the second air duct opening 35 to be discharged, the presence of the plurality of straight air guide plates 36 can disperse and guide the airflow, so that the air can pass through each vent more evenly and smoothly, avoiding the concentration and disorder of the airflow caused by a single outlet, reducing the wind resistance, and improving the air circulation efficiency. In this way, not only can the heat be discharged from the heat dissipation mechanism more effectively, but also it helps to reduce noise, and further optimizes the heat dissipation performance of the air conditioning circuit board.

[0045] like Figure 1 and Figure 3 As shown, according to a circuit board heat dissipation mechanism provided by the utility model, the fixed shell 20 includes a shell top plate 21 and a shell side plate 22 supported between the shell top plate 21 and the base 10. The shell top plate 21 and the circuit board can be arranged horizontally adjacent to each other to form a top wall of the air inlet channel 30 by splicing, or in a preferred case, the shell top plate 21 has a frame-shaped notch, and the circuit board is located in the frame-shaped notch to improve the overall aesthetics and integration of the heat dissipation mechanism.

[0046] Furthermore, a certain gap may be reserved between the circuit board and the inner edge of the frame-shaped notch, so that air can also enter and exit the air inlet channel 30 through the gap, thereby improving the air circulation around the circuit board.

[0047] The air conditioning device provided by the present invention is described below. The air conditioning device described below and the circuit board heat dissipation mechanism described above can be referred to each other.

[0048] The utility model also provides an air conditioning device, comprising the circuit board heat dissipation mechanism of any one of the above implementation modes.

[0049] According to the preferred embodiment of the air conditioning device, the circuit board heat dissipation mechanism of the utility model is adopted to achieve efficient and stable heat dissipation effect. The core of the air conditioning device lies in the innovative structural layout of the circuit board heat dissipation mechanism: the circuit board is installed on the base 10, one side of which is covered with electronic components, and the other side is provided with a first heat dissipation fan 40, which directly acts on the heating area on the circuit board to ensure local efficient heat dissipation.

[0050] The heat dissipation mechanism also adopts the design of the air inlet channel 30, which is jointly constructed by the fixed shell 20 and the base 10, wherein the first air duct opening 31 is closely combined with the second heat dissipation fan 50, and the wind direction is changed and the wind speed is adjusted through a series of arc-shaped air guide plates 32, thereby optimizing the flow state of the airflow in the air inlet channel 30. The arc-shaped air guide plates 32 are designed to be multi-layered, and their spacing is uniform, forming multiple arc-shaped air ducts 33, so that the wind resistance can be reduced when the air flows through, and the heat dissipation efficiency is improved.

[0051] The housing top plate 21 and the circuit board are cleverly designed, and can be spliced ​​horizontally adjacent to each other to form the top wall of the air inlet channel 30, or preferably, the housing top plate 21 has a frame-shaped notch, in which the circuit board is embedded, which increases the aesthetics and integration of the overall structure. At the same time, an appropriate gap is reserved between the circuit board and the frame-shaped notch to ensure that air can freely enter and exit the air inlet channel 30 from multiple directions, further enhancing the air circulation around the circuit board and effectively improving the heat dissipation performance.

[0052] A plurality of parallel and spaced straight air guide plates 36 are arranged inside the second air duct opening 35 of the heat dissipation mechanism to divide the second air duct opening 35 into a plurality of vents, thereby promoting a smooth outflow of air and reducing air flow resistance.

[0053] Since the circuit board heat dissipation mechanism can be intelligently adjusted according to different heat dissipation requirements, the air-conditioning device using the circuit board heat dissipation mechanism can flexibly switch the heat dissipation mode whether in daily light work or under high-intensity operating conditions, and always keep the circuit board temperature within the ideal range, thereby ensuring that the overall performance of the air-conditioning system is fully utilized, extending the service life of the air-conditioning device, and improving the comfort and safety of users.

[0054] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "mode", "specific mode", or "some modes" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or mode are included in at least one embodiment or mode of the utility model embodiment. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or mode. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or modes in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or modes described in this specification and the features of the different embodiments or modes, without contradiction.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A circuit board heat dissipation mechanism, characterized in that: include: A base (10) is provided with a circuit board, and electronic components are provided on one side of the circuit board; a fixed shell (20) disposed on the base (10), an air inlet channel (30) being formed between the fixed shell (20) and the base (10), the circuit board constituting a portion of a channel wall of the air inlet channel (30), and a side of the circuit board on which the electronic components are disposed faces the inside of the air inlet channel (30); A first heat dissipation fan (40) is arranged on the circuit board; The second heat dissipation fan (50) is arranged at one end of the air inlet channel (30) to blow air into the air inlet channel (30) or blow the air in the air inlet channel (30) outwards.

2. The circuit board heat dissipation mechanism according to claim 1, characterized in that: The first heat dissipation fan (40) and / or the second heat dissipation fan (50) are axial flow fans.

3. The circuit board heat dissipation mechanism according to claim 1, characterized in that: The circuit board is provided with a heat dissipation hole (41), and the first heat dissipation fan (40) is arranged concentrically with the heat dissipation hole (41) so as to blow air from one side of the circuit board to the other side during operation.

4. The circuit board heat dissipation mechanism according to claim 3, characterized in that: The first heat dissipation fan (40) and the electronic component are respectively mounted on two sides of the circuit board.

5. The circuit board heat dissipation mechanism according to claim 1, characterized in that: The air inlet channel (30) is provided with a first air duct opening (31), and the opening direction of the first air duct opening (31) is perpendicular to the channel direction of the air inlet channel (30); The second heat dissipation fan (50) is arranged at the first air duct opening (31), and an air guide structure for guiding the airflow to turn 90 degrees is arranged between the first air duct opening (31) and the air inlet channel (30).

6. The circuit board heat dissipation mechanism according to claim 5, characterized in that: The wind guide structure comprises a multi-layer arc-shaped wind guide plate (32), wherein the arc-shaped wind guide plate (32) comprises a straight portion parallel to the channel direction of the air inlet channel (30), and an arc-shaped portion bent from the straight portion toward the first air duct opening (31); The spacing between any adjacent straight portions is equal, and the spacing between any adjacent ends of the arcuate portions close to the first air duct opening (31) is equal, so as to separate a plurality of arcuate air ducts (33) between the first air duct opening (31) and the air inlet channel (30).

7. The circuit board heat dissipation mechanism according to claim 6, characterized in that: The wind guide structure comprises a middle partition (34); Multiple layers of the arc-shaped air guide plates (32) and a plurality of arc-shaped air ducts (33) formed between the arc-shaped air guide plates (32) are respectively arranged on both sides of the middle partition plate (34).

8. The circuit board heat dissipation mechanism according to claim 1, characterized in that: The fixed shell (20) and the base (10) enclose a second air duct opening (35) of the air inlet channel (30).

9. The circuit board heat dissipation mechanism according to claim 8, characterized in that: A plurality of straight air guide plates (36) are arranged in the second air duct opening (35), and the plurality of straight air guide plates (36) are arranged in parallel and spaced apart to divide the second air duct opening (35) into a plurality of ventilation openings.

10. The circuit board heat dissipation mechanism according to claim 1, characterized in that: The fixed shell (20) comprises a shell top plate (21) and a shell side plate (22) supported between the shell top plate (21) and the base (10); the shell top plate (21) has a frame-shaped notch, and the circuit board is located in the frame-shaped notch.

11. An air conditioning device, characterized in that: A circuit board heat dissipation mechanism comprising any one of claims 1-10.

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