Casing and electronic device

Abstract

The utility model discloses a casing and an electronic device. The casing comprises a shell and a shielding structure. The housing has an inner surface. The shielding structure comprises an insulating part and a conductive part. The insulating part protrudes out of the inner surface of the shell and is integrally formed with the shell. The conductive part is arranged on one side of the insulating part away from the housing.

Description

Technical Field

[0001] The utility model relates to a casing and an electronic device, in particular to a casing and an electronic device comprising a shielding structure. Background Art

[0002] In electronic devices such as laptop computers, electronic components such as processors and memory can generate electromagnetic interference (EMI) and radio frequency interference (RFI), which in turn affects the performance of antennas. Therefore, traditionally, a metal shielding cover is provided in the electronic device to shield the electronic components and reduce the interference to the antenna.

[0003] However, in order to set a metal shield in an electronic device, not only does it require the development of a dedicated mold for the metal shield, but it also requires additional manpower and time costs when assembling the electronic device. In other words, the traditional method of setting an additional metal shield in an electronic device will greatly increase the overall manufacturing cost of the electronic device. Utility Model Content

[0004] The utility model aims to provide a casing, in which the insulating part of the shielding structure is integrally formed with the outer shell, so as to reduce the overall manufacturing cost of the casing.

[0005] The housing disclosed in one embodiment of the utility model comprises a shell and a shielding structure. The shell has an inner surface. The shielding structure comprises an insulating portion and a conductive portion. The insulating portion protrudes from the inner surface of the shell and is integrally formed with the shell. The conductive portion is arranged on a side of the insulating portion away from the shell.

[0006] According to one embodiment of the utility model, the insulating portion includes an annular side wall, which protrudes from the inner surface of the outer shell and surrounds an accommodating space. The inner surface has a shielding area within the range surrounded by the annular side wall, and the conductive portion is arranged on a side of the annular side wall away from the outer shell and the shielding area.

[0007] According to one embodiment of the present invention, the shielding structure further includes an electromagnetic wave absorption sheet, and the electromagnetic wave absorption sheet is disposed on the conductive portion in the accommodating space.

[0008] According to one embodiment of the utility model, the insulating part further includes a plurality of structural ribs, the plurality of structural ribs protrude from the shielding area and are located in the accommodating space, the conductive part is arranged on a side of the plurality of structural ribs away from the shielding area, and the electromagnetic wave absorption sheet is arranged on a side of the conductive part away from the plurality of structural ribs.

[0009] According to one embodiment of the present invention, a plurality of the structural ribs are arranged in a matrix form to form a plurality of hollow grooves together with the shielding area.

[0010] According to one embodiment of the utility model, the insulating part also includes a plurality of support ribs, the plurality of support ribs protrude from the shielding area and are located in the accommodating space, the plurality of support ribs are respectively located at a plurality of corners of the annular side wall, and the conductive part is arranged on a side of the plurality of support ribs away from the shielding area.

[0011] According to one embodiment of the present invention, the annular side wall has at least one groove on a side away from the housing, and the conductive part is disposed in the at least one groove of the annular side wall.

[0012] According to one embodiment of the present invention, the insulating portion further includes a reinforcement structure, the reinforcement structure surrounds the annular side wall and connects the annular side wall and the housing, and the conductive portion is disposed on the reinforcement structure.

[0013] The electronic device disclosed in another embodiment of the utility model includes a housing and a circuit board assembly. The housing includes a shell and a shielding structure. The shell has an inner surface. The shielding structure includes an insulating portion and a conductive portion. The insulating portion protrudes from the inner surface of the shell and is integrally formed with the shell. The conductive portion is arranged on the side of the insulating portion away from the shell. The circuit board assembly includes a circuit board and at least one interference source. The inner surface faces the circuit board. At least one interference source is arranged on the circuit board and is at least partially shielded by the shielding structure. According to the housing and electronic device disclosed in the above embodiments, the insulating portion of the shielding structure protrudes from the inner surface of the shell and is integrally formed with the shell. Therefore, the insulating portion and the shell can not only be manufactured by one mold, but also save the manpower and time cost of installing the insulating portion to the shell. In addition, the conductive portion arranged on the side of the insulating portion away from the shell will still effectively shield the electromagnetic waves emitted by the interference source, which enables the utility model to reduce the overall manufacturing cost of the housing while ensuring that the electromagnetic waves can be effectively shielded by the shielding structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a partially enlarged perspective view of an electronic device according to an embodiment of the present invention.

[0015] Figure 2 for Figure 1 Exploded view of the electronics in the .

[0016] Figure 3 for Figure 1 An exploded view of the electronic device in another perspective.

[0017] Figure 4 for Figure 1 A top view of a housing of an electronic device in FIG.

[0018] Figure 5 for Figure 4 A schematic cross-sectional view of the casing along the cutting line 5-5 is shown.

[0019] Figure 6 FIG. 4 is a top view of a casing according to another embodiment of the present invention.

[0020] Figure 7 for Figure 6 A schematic cross-sectional view of the casing along the cutting line 7-7 is shown.

[0021] The reference numerals are as follows:

[0022] 10: Electronic devices

[0023] 100,100a: Chassis

[0024] 110: Shell

[0025] 120: Cover

[0026] 130,130a: Shielding structure

[0027] 140,140a: Insulation

[0028] 141: Annular side wall

[0029] 142: Groove

[0030] 144:Structural ribs

[0031] 145: hollow groove

[0032] 147:Support rib

[0033] 149a: Reinforcement structure

[0034] 150,150a: conductive part

[0035] 160:Electromagnetic wave adsorption sheet

[0036] 200: Circuit board assembly

[0037] 210: Circuit board

[0038] 220: Interference source

[0039] 230: Ground bump

[0040] S: Accommodation space

[0041] A: Shielded area DETAILED DESCRIPTION

[0042] The detailed features and advantages of the embodiments of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable those skilled in the art to understand the technical contents of the embodiments of the present invention and implement them accordingly. According to the contents disclosed in this specification, the claims and the drawings, those skilled in the art can easily understand the relevant purposes and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any way.

[0043] See also Figure 1 and Figure 2 . Figure 1 It is a partially enlarged perspective view of an electronic device according to an embodiment of the present invention. Figure 2 for Figure 1 Exploded view of the electronics in the . Figure 3 for Figure 1 In the present embodiment, the electronic device 10 is, for example, a notebook computer, and includes a housing 100 and a circuit board assembly 200 .

[0044] In this embodiment, the casing 100 includes a shell 110, a cover 120 and a shielding structure 130. The shell 110 has an inner surface 111. The cover 120 is disposed on one side of the shell 110. For example, the cover 120 is, for example, a so-called C part, and the shell 110 is, for example, a so-called D part. A keyboard module 121 may be disposed on the cover 120, for example. It should be noted that the present invention is not limited to the form of an electronic device. In other embodiments, the electronic device may also be a desktop computer or a server. In addition, in other embodiments, the casing may also be adjusted to include the cover 120 according to the form of the electronic device. The detailed structure of the shielding structure 130 will be described later.

[0045] In this embodiment, the circuit board assembly 200 includes a circuit board 210, a plurality of interference sources 220, and a plurality of grounding bumps 230. The inner surface 111 faces the circuit board 210. The interference source 220 is, for example, an electronic component that emits electromagnetic waves, such as a memory or a processor. The interference source 220 is disposed and electrically connected to the circuit board 210. The grounding bump 230 protrudes from a side of the circuit board 210 close to the housing 110.

[0046] See also Figures 3 to 5 . Figure 4 for Figure 1 A top view of a housing of an electronic device in FIG. Figure 5 for Figure 4 5-5 is a cross-sectional view of the housing in FIG. 1. Specifically, in this embodiment, the shielding structure 130 includes an insulating portion 140, a conductive portion 150 and an electromagnetic wave absorption sheet 160. It should be noted that in order to clearly present the shielding structure 130, Figure 4The cover plate 120 and the electromagnetic wave absorption sheet 160 are omitted. Figure 5 The cover plate 120 is omitted and only shown in FIG. Figure 5 The conductive portion 150 is shown in FIG.

[0047] The insulating portion 140 protrudes from the inner surface 111 of the housing 110 and is integrally formed with the housing 110. For example, the insulating portion 140 and the housing 110 can be formed into an integral structure by plastic molding. In this embodiment, the insulating portion 140 includes an annular side wall 141, a plurality of structural ribs 144 and a plurality of supporting ribs 147.

[0048] The annular sidewall 141 protrudes from the inner surface 111 of the housing 110 and surrounds an accommodating space S. The interference source 220 is located in the accommodating space S and is at least partially shielded by the shielding structure 130. In addition, the inner surface 111 has a shielding area A within the range surrounded by the annular sidewall 141. The annular sidewall 141 has a plurality of grooves 142 on one side away from the housing 110.

[0049] The structural ribs 144 protrude from the shielding area A and are located in the accommodating space S. In this embodiment, the structural ribs 144 are arranged in a matrix form and together with the shielding area A form a plurality of hollow grooves 145. In this way, the overall structural strength of the insulating portion 140 can be improved, while saving materials for making the shielding structure 130 and further reducing costs. However, the present invention is not limited to the arrangement of the structural ribs 144. In other embodiments, the arrangement of the structural ribs can also be adjusted according to the shape of the interference source to more effectively shield the interference source.

[0050] The support ribs 147 protrude from the shielding area A and are located in the accommodating space S. The support ribs 147 are respectively located at a plurality of corners of the annular sidewall 141 to enhance the overall structural strength of the insulating portion 140 .

[0051] like Figure 5 As shown, the conductive portion 150 is, for example, a metal layer, and is disposed on the side of the annular sidewall 141 away from the housing 110, in the groove 142 of the annular sidewall 141, the shielding area A, the side of the structural rib 144 away from the shielding area A, and the side of the supporting rib 147 away from the shielding area A, for example, by sputtering. Figure 3 and Figure 5 As shown, the grounding bumps 230 are respectively located in the grooves 142 and contact the conductive part 150 to ground the conductive part 150. In other embodiments, the number of the grounding bumps and the grooves can also be one. In still other embodiments, the annular sidewall may not need to have a groove, and the grounding bumps can be directly contacted with the conductive part disposed on the side of the annular sidewall away from the housing to be grounded.

[0052] The electromagnetic wave absorption sheet 160 is, for example, an electromagnetic wave absorbing material (EMI Noise Absorber), and is made of, for example, a magnetic conductive material such as tin foil, aluminum foil, copper foil, etc. The electromagnetic wave absorption sheet 160 is disposed in the accommodation space S on a side of the conductive portion 150 away from the structural rib 144. In other words, the structural rib 144 raises the electromagnetic wave absorption sheet 160 so that the electromagnetic wave absorption sheet 160 is closer to the interference source 220. It should be noted that in other embodiments, the shielding structure may not need to include an electromagnetic wave absorption sheet.

[0053] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the previous embodiments, and the following embodiments will not be repeated.

[0054] Figure 6 FIG. 4 is a top view of a casing according to another embodiment of the present invention. Figure 7 for Figure 6 The difference between the housing 10a of this embodiment and the housing of the first embodiment is that the insulating portion 140a of the shielding structure 130a of the housing 100a of this embodiment further includes a reinforcement structure 149a. It should be noted that in order to clearly present the shielding structure 130a, Figure 6 The cover plate 120 and the electromagnetic wave absorption sheet 160 are omitted. Figure 7 The cover plate 120 is omitted and only shown in FIG. Figure 7 The conductive portion 150a is shown in the figure. The reinforcement structure 149a surrounds the annular side wall 141 and connects the annular side wall 141 and the housing 110. The conductive portion 150a is disposed on the reinforcement structure 149a. By disposing the reinforcement structure 149a, the shielding effect of the shielding structure 130a can be further improved. The boundary line between the reinforcement structure 149a and the annular side wall 141 is shown only for the convenience of explanation. In fact, the reinforcement structure 149a and the annular side wall 141 can be an integrated structure without a boundary between each other.

[0055] According to the housing and electronic device disclosed in the above embodiments, the insulating portion of the shielding structure protrudes from the inner surface of the housing and is formed integrally with the housing. Therefore, the insulating portion and the housing can not only be manufactured by one mold, but also save the manpower and time cost of installing the insulating portion to the housing. In addition, the conductive portion arranged on the side of the insulating portion away from the housing can still effectively shield the electromagnetic waves emitted by the interference source, which enables the utility model to reduce the overall manufacturing cost of the housing while ensuring that the electromagnetic waves can be effectively shielded by the shielding structure.

[0056] Furthermore, taking the 2.4GHz Wi-Fi throughput rate test as an example, the antenna throughput rate is greater than 50Mbps, which meets the specification. Although the traditional metal shielding can achieve a throughput rate of 141.3Mbps, it will greatly increase the manufacturing cost. The shielding structure of the utility model can make the antenna throughput rate reach 86.6Mbps, which enables the utility model to reduce the overall manufacturing cost of the housing while ensuring that the electromagnetic waves can be effectively shielded by the shielding structure.

[0057] In addition, since the insulating part is formed integrally with the housing, the structure of the insulating part can be designed at a lower cost and in a more flexible manner, such as making the insulating part include a more complex structure such as structural ribs or support ribs.

[0058] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Those skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the claims attached to this specification.

Claims

1. A housing, characterized in that: Include: a housing having an inner surface; and A shielding structure includes an insulating part and a conductive part. The insulating part protrudes from the inner surface of the shell and is formed as a whole with the shell. The conductive part is arranged on a side of the insulating part away from the shell.

2. The housing according to claim 1, wherein: The insulating part includes an annular side wall, which protrudes from the inner surface of the shell and surrounds an accommodating space. The inner surface has a shielding area within the range surrounded by the annular side wall. The conductive part is arranged on a side of the annular side wall away from the shell and the shielding area.

3. The housing according to claim 2, wherein: The shielding structure further comprises an electromagnetic wave absorption sheet, and the electromagnetic wave absorption sheet is arranged on the conductive part in the accommodating space.

4. The housing according to claim 3, wherein: The insulating part also includes a plurality of structural ribs, which protrude from the shielding area and are located in the accommodating space. The conductive part is arranged on a side of the plurality of structural ribs away from the shielding area, and the electromagnetic wave absorption sheet is arranged on a side of the conductive part away from the plurality of structural ribs.

5. The housing according to claim 4, wherein: The plurality of structural ribs are arranged in a matrix form to form a plurality of hollow grooves together with the shielding area.

6. The housing according to claim 2, wherein: The insulating part also includes a plurality of supporting ribs, which protrude from the shielding area and are located in the accommodating space. The plurality of supporting ribs are respectively located at a plurality of corners of the annular side wall. The conductive part is arranged on a side of the plurality of supporting ribs away from the shielding area.

7. The housing according to claim 2, wherein: The side of the annular side wall away from the housing has at least one groove, and the conductive part is arranged in the at least one groove of the plurality of annular side walls.

8. The housing according to claim 2, wherein: The insulating part further comprises a reinforcing structure, which surrounds the annular side wall and connects the annular side wall and the shell, and the conductive part is arranged on the reinforcing structure.

9. An electronic device, characterized in that: Include: A housing, comprising: a housing having an inner surface; and a shielding structure, comprising an insulating portion and a conductive portion, wherein the insulating portion protrudes from the inner surface of the housing and is formed integrally with the housing, and the conductive portion is disposed on a side of the insulating portion away from the housing; and A circuit board assembly comprises a circuit board and at least one interference source. The inner surface faces the circuit board. The at least one interference source is arranged on the circuit board and is at least partially shielded by the shielding structure.

10. The electronic device according to claim 9, wherein: The insulating portion includes an annular side wall, which protrudes from the inner surface of the shell and surrounds an accommodating space. The at least one interference source is located in the accommodating space. The inner surface has a shielding area within the range surrounded by the annular side wall. The conductive portion is arranged on a side of the annular side wall away from the shell and the shielding area.

11. The electronic device according to claim 10, wherein: The side of the annular side wall away from the shell has at least one groove, and the conductive part is arranged in the at least one groove of the annular side wall. The circuit board assembly also includes at least one grounding bump, which protrudes from the side of the circuit board close to the shell, is located in the at least one groove and contacts the conductive part.

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