LED packaging device

Abstract

The utility model relates to the technical field of semiconductor light emitting, and discloses an LED packaging device, which comprises a support, an LED light emitting chip, a light-transmitting glue layer and a high-reflection glue layer. The LED light-emitting chip is arranged on the support. The light-transmitting glue layer at least covers part of the upper surface of the LED light-emitting chip. And light scattering particles are arranged in the light-transmitting glue layer. The high-reflection glue layer is arranged on the support and at least covers the side face of the light-transmitting glue layer. The contour line of the upper surface of the light-transmitting glue layer is a first contour line, and the contour line of the upper surface of the LED light-emitting chip is a second contour line. The first contour line is arranged on the inner side of the second contour line; or the first contour line is arranged on the outer side of the second contour line; or the first contour line and the second contour line are at least partially overlapped to form a light-emitting surface in any preset shape. The light scattering particles are arranged in the light-transmitting glue layer, so that the light-transmitting glue layer becomes a'scattering light source ', the high-reflection glue layer is filled, and the light-transmitting glue layer is preset to be in any shape, so that the conversion of the light-emitting surface in any shape can be realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to an LED packaging device. Background Art

[0002] The shapes of LED light-emitting chips on the current market are basically square, and after light distribution, they are generally rectangular, circular or elliptical light-emitting surfaces. In some application scenarios, special-shaped light fields with obvious cutoffs are required, and conventional rectangular light-emitting surfaces have great limitations.

[0003] Based on the above, the problem to be solved at present is: to provide an LED packaging device that can convert the rectangular light-emitting surface of an LED into a light-emitting surface of any shape. Utility Model Content

[0004] The utility model aims to provide an LED packaging device, aiming to solve the problem in the prior art that a conventional rectangular light-emitting surface cannot meet the requirements of a light field with a special shape and strong cutoff.

[0005] The utility model is implemented as follows: an LED packaging device comprises:

[0006] Bracket;

[0007] An LED light-emitting chip is arranged on the bracket;

[0008] A light-transmitting adhesive layer, wherein a plurality of light-scattering particles are arranged inside; the light-transmitting adhesive layer at least covers a portion of the upper surface of the LED light-emitting chip;

[0009] A highly reflective adhesive layer, which is disposed on the bracket, the highly reflective adhesive layer covers the light-transmitting adhesive layer and the side surface of the LED light-emitting chip or covers the side surface of the light-transmitting adhesive layer, the side surface of the LED light-emitting chip and a part of the upper surface;

[0010] The contour line of the upper surface of the light-transmitting adhesive layer is the first contour line, and the contour line of the upper surface of the LED light-emitting chip is the second contour line; the first contour line is arranged on the inner side of the second contour line; or the first contour line is arranged on the outer side of the second contour line; or the first contour line and the second contour line at least partially overlap, so as to form a light-emitting surface of any preset shape.

[0011] Furthermore, the first contour line is set to be a diamond, a circle or an ellipse.

[0012] Furthermore, the first contour line is set to be a diamond shape, the light-transmitting adhesive layer completely covers the upper surface of the LED light-emitting chip, and the four inner corners of the first contour line are set on the outside of the second contour line.

[0013] Furthermore, the first contour line is set to a diamond shape, a portion of the upper surface of the LED light-emitting chip is covered by the light-transmitting adhesive layer, and another portion of the upper surface of the LED light-emitting chip is covered by the high-reflective adhesive layer; the four inner corners of the first contour line are set on the second contour line or on the inner side of the second contour line.

[0014] Furthermore, the first contour line is set to be circular, the light-transmitting adhesive layer completely covers the upper surface of the LED light-emitting chip, and the first contour line is set outside the second contour line.

[0015] Furthermore, the first contour line is set to be circular, a portion of the upper surface of the LED light-emitting chip is covered by the light-transmitting adhesive layer, and another portion of the upper surface of the LED light-emitting chip is covered by the high-reflective adhesive layer; the first contour line is set on the inner side of the second contour line or the first contour line is set on the inner side of the second contour line and has an overlapping area.

[0016] Furthermore, the upper surface of the light-transmitting adhesive layer is a flat surface or a curved surface.

[0017] Compared with the prior art, the LED packaging device provided by the utility model has the following beneficial effects:

[0018] Light scattering particles 31 are arranged inside the light-transmitting adhesive layer 3, and the light emitted by the LED light-emitting chip 2 changes its route after passing through the scattering particles 31, and is scattered in all directions. The light-transmitting adhesive layer 3 becomes a "scattering light source body" and has a light-emitting property. According to the needs of the application scenario, the area of ​​the upper surface of the light-transmitting adhesive layer 3 can be set to be greater than, equal to, or less than the area of ​​the upper surface of the LED light-emitting chip 2, so as to form a light-emitting surface of any shape. The shape of the light-transmitting adhesive layer 3 can be preset into any shape through a mold, which is extremely flexible and reduces the difficulty of optical design. In addition, the conventional rectangular light-emitting surface is designed into a light-emitting surface of various shapes, and the required lens volume and focal length are also large. The utility model changes the shape of the light-emitting surface by setting the light-transmitting adhesive layer 3, does not rely on secondary light distribution, reduces the product size, and is easier for optical design.

[0019] The side of the light-transmitting adhesive layer 3 is filled with a high-reflective adhesive layer 4, which is used to cut off the light from the side of the light-transmitting adhesive layer 3, so that the light from all directions can only be emitted from the upper surface of the light-transmitting adhesive layer 3 with a preset shape, thereby changing the shape of the original light-emitting surface of the light source. At the same time, the setting of the high-reflective adhesive layer 4 can make full use of the light from the side and improve the utilization rate of light energy. In addition, the high-reflective adhesive layer 4 can also cover part of the upper surface of the LED light-emitting chip 2 and limit the original light-emitting surface so as to form a preset light-emitting surface shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the cross-sectional structure of the LED packaging device provided by the utility model;

[0021] Figure 2 is a schematic cross-sectional structure diagram of another LED packaging device provided by the present utility model;

[0022] Figure 3 is a top view of the LED packaging device of Embodiment 1 provided by the present utility model;

[0023] Figure 4 is a top view of the LED packaging device of Embodiment 2 provided by the present utility model;

[0024] Figure 5 is a top view of the LED packaging device of Embodiment 3 provided by the present utility model;

[0025] Figure 6 is a top view of the LED packaging device of Embodiment 4 provided by the present utility model;

[0026] In the figure: 1 - bracket; 2 - LED light-emitting chip; 21 - second contour line; 3 - light-transmitting glue layer; 31 - light-scattering particles; 32 - first contour line; 4 - high-reflection glue layer. Specific embodiments

[0027] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0028] The following describes the implementation of the present utility model in detail with specific embodiments.

[0029] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present utility model, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the accompanying drawings are only for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0030] Referring to Figure 1-6 as shown, it is a preferred embodiment provided by the present utility model.

[0031] An LED packaging device includes a bracket 1, an LED light-emitting chip 2, a light-transmitting glue layer 3 and a high-reflection glue layer 4. Referring to Figure 1-2. The LED light-emitting chip 2 is arranged on the bracket 1. The shape of the LED light-emitting chip 2 is usually rectangular. The light-transmitting adhesive layer 3 at least covers part of the upper surface of the LED light-emitting chip 2. A plurality of light-scattering particles 31 are arranged inside the light-transmitting adhesive layer 3. When light is incident on the light-scattering particles 31, it will deviate from the original incident direction and scatter in all directions. Each light-scattering particle 31 corresponds to a virtual light source that emits light in all directions, so that the light-transmitting adhesive layer 3 emits light more uniformly. The upper surface of the light-transmitting adhesive layer 3 is a plane or a curved surface.

[0032] According to the shape and area of ​​the required light-emitting surface, the light-transmitting adhesive layer 3 is arranged to cover the entire upper surface of the LED light-emitting chip 2 or only part of the upper surface of the LED light-emitting chip 2. The highly reflective adhesive layer 4 is arranged on the bracket 1 to at least cover the side of the light-transmitting adhesive layer 3. The highly reflective adhesive layer 4 can effectively cut off the light from the side of the light-transmitting adhesive layer 3. Specifically, the light incident on the interface between the light-transmitting adhesive layer 3 and the highly reflective adhesive layer 4 is emitted from the upper surface of the light-transmitting adhesive layer 3 after one or more reflections.

[0033] The contour line of the upper surface of the light-transmitting adhesive layer 3 is set as the first contour line 32, and the contour line of the upper surface of the LED light-emitting chip 2 is set as the second contour line 21. The area of ​​the upper surface of the light-transmitting adhesive layer 3 is equal to, smaller than, or larger than the area of ​​the upper surface of the LED light-emitting chip 2, that is, 1. The first contour line 32 can be set inside the second contour line 21 (refer to Figure 2 , Figure 4 ); 2. The first contour line 32 can be arranged outside the second contour line 21 (refer to Figure 1 , Figure 3 , Figure 5 ); 3. A portion of the first contour line 32 overlaps with the second contour line 21, and another portion of the first contour line 32 is arranged on the inner side of the second contour line 21; 4. A portion of the first contour line 32 overlaps with the second contour line 21, and another portion of the first contour line 32 is arranged on the outer side of the second contour line 21; 5. A portion of the first contour line 32 is arranged on the inner side of the second contour line 21, a portion of the first contour line 32 is arranged on the outer side of the second contour line 21, and there is an overlapping portion between the first contour line 32 and the second contour line 21.

[0034] Because a large number of light scattering particles 31 are dispersed in the light-transmitting adhesive layer 3, the upper surface (light-emitting surface) of the light-transmitting adhesive layer 3 emits light evenly, so the upper surface of the light-transmitting adhesive layer 3 can be set to any shape, and the contour line of the upper surface of the light-transmitting adhesive layer 3 can be set to a diamond, a circle, an ellipse, etc., to form a light-emitting surface of any shape to meet the needs of different application scenarios.

[0035] The high-reflective adhesive layer 4 covers the side of the LED light-emitting chip 2 or covers the side and part of the upper surface of the LED light-emitting chip 2, and is used to form a light-emitting surface of any preset shape. Specifically, when the light-transmitting adhesive layer 3 completely covers the upper surface of the LED light-emitting chip 2, the high-reflective adhesive layer 4 covers the side of the LED light-emitting chip 2 and the side of the light-transmitting adhesive layer 3. When the light-transmitting adhesive layer 3 covers part of the upper surface of the LED light-emitting chip 2, the high-reflective adhesive layer 4 covers the upper surface of the LED light-emitting chip 2 not covered by the light-transmitting adhesive layer 3, as well as the side of the LED light-emitting chip 2 and the light-transmitting adhesive layer 3. No light is emitted from the upper surface of the LED light-emitting chip 2 covered by the high-reflective adhesive layer 4, so that the preset light-emitting surface shape is effective.

[0036] For example, some application scenarios require a diamond-shaped light-emitting surface. The utility model can obtain a diamond-shaped light-emitting surface by using a conventional rectangular LED light-emitting chip 2, that is, the upper surface of the light-transmitting adhesive layer 3 is set to be a diamond shape. Specific embodiments are as follows:

[0037] Example 1: Reference Figure 3 The LED packaging device includes a bracket 1, an LED light-emitting chip 2, a light-transmitting adhesive layer 3 and a highly reflective adhesive layer 4. The LED light-emitting chip 2 is arranged on the bracket 1. The lower surface of the light-transmitting adhesive layer 3 completely covers the upper surface of the LED light-emitting chip 2. A plurality of light scattering particles 31 are arranged inside the light-transmitting adhesive layer 3. The contour line of the upper surface of the light-transmitting adhesive layer 3 - the first contour line 32 is in the shape of a rhombus. The first contour line 32 is arranged on the outer side of the contour line of the upper surface of the LED light-emitting chip 2 - the second contour line 21. The highly reflective adhesive layer 4 is arranged on the bracket 1 and tightly covers the sides of the LED light-emitting chip 2 and the light-transmitting adhesive layer 3. The four inner angles α of the first contour line 32 are arranged on the outer side of the second contour line 21.

[0038] Example 2: Reference Figure 4 The main difference from the first embodiment is that the first contour line 32 is arranged inside the second contour line 21, and the vertex of the first contour line 32 overlaps with the second contour line 21. The high-reflective adhesive layer 4 is arranged on the bracket 1 and tightly covers the side of the light-transmitting adhesive layer 3, part of the upper surface and side of the LED light-emitting chip 2. The four inner angles α of the first contour line 32 are arranged inside the second contour line 21. The other settings are the same as those of the first embodiment.

[0039] Of course, a circular light-emitting surface can also be obtained in the case of a conventional rectangular LED light-emitting chip 2, that is, the upper surface of the light-transmitting adhesive layer 3 is set to be circular. Specific embodiments three and four are as follows:

[0040] Example 3: Reference Figure 5The LED packaging device includes a bracket 1, an LED light-emitting chip 2, a light-transmitting adhesive layer 3 and a high-reflecting adhesive layer 4. The LED light-emitting chip 2 is arranged on the bracket 1. The lower surface of the light-transmitting adhesive layer 3 completely covers the upper surface of the LED light-emitting chip 2. A plurality of light-scattering particles 31 are arranged inside the light-transmitting adhesive layer 3. The contour line of the upper surface of the light-transmitting adhesive layer 3 - the shape of the first contour line 32 is circular. The high-reflecting adhesive layer 4 is arranged on the bracket 1 and tightly covers the side of the LED light-emitting chip 2 and the light-transmitting adhesive layer 3. The first contour line 32 is arranged outside the second contour line 21.

[0041] Example 4: Reference Figure 6 , the main difference from the third embodiment is that the first contour line 32 is arranged inside the second contour line 21, and the first contour line 32 is tangent to the second contour line 21. The high reflective adhesive layer 4 is arranged on the bracket 1 and tightly covers the side of the light-transmitting adhesive layer 3, part of the upper surface and side of the LED light-emitting chip 2. The other settings are the same as those of the third embodiment.

[0042] The utility model can also form other preset shaped luminous surfaces, which are not described in detail here. The utility model should not be limited to any modification, equivalent replacement and improvement made within the spirit and principle of the utility model, which should be included in the protection scope of the utility model.

Claims

1. An LED packaging device, characterized in that: include: Bracket (1); An LED light-emitting chip (2), which is arranged on the bracket (1); A light-transmitting adhesive layer (3) having a plurality of light-scattering particles (31) disposed therein; the light-transmitting adhesive layer (3) at least covers a portion of the upper surface of the LED light-emitting chip (2); A highly reflective adhesive layer (4) disposed on the support (1), the highly reflective adhesive layer (4) covering the light-transmitting adhesive layer (3) and the side surface of the LED light-emitting chip (2) or covering the side surface of the light-transmitting adhesive layer (3), the side surface of the LED light-emitting chip (2) and a part of the upper surface; The contour line of the upper surface of the light-transmitting adhesive layer (3) is a first contour line (32), and the contour line of the upper surface of the LED light-emitting chip (2) is a second contour line (21); the first contour line (32) is arranged on the inner side of the second contour line (21); or the first contour line (32) is arranged on the outer side of the second contour line (21); or the first contour line (32) and the second contour line (21) at least partially overlap, so as to form a light-emitting surface of any preset shape.

2. The LED package device according to claim 1, characterized in that: The first contour line (32) is configured to be a rhombus, a circle, or an ellipse.

3. The LED package device according to claim 2, characterized in that: The first contour line (32) is arranged in a rhombus shape, the light-transmitting adhesive layer (3) completely covers the upper surface of the LED light-emitting chip (2), and the four inner corners of the first contour line (32) are arranged outside the second contour line (21).

4. The LED package device according to claim 2, characterized in that: The first contour line (32) is arranged in a rhombus shape; a portion of the upper surface of the LED light-emitting chip (2) is covered by the light-transmitting adhesive layer (3); another portion of the upper surface of the LED light-emitting chip (2) is covered by the high-reflective adhesive layer (4); and the four inner corners of the first contour line (32) are arranged on the second contour line (21) or on the inner side of the second contour line (21).

5. The LED package device according to claim 2, characterized in that: The first contour line (32) is arranged in a circular shape, the light-transmitting adhesive layer (3) completely covers the upper surface of the LED light-emitting chip (2), and the first contour line (32) is arranged outside the second contour line (21).

6. The LED package device according to claim 2, characterized in that: The first contour line (32) is arranged in a circular shape; a portion of the upper surface of the LED light-emitting chip (2) is covered by the light-transmitting adhesive layer (3); another portion of the upper surface of the LED light-emitting chip (2) is covered by the high-reflective adhesive layer (4); the first contour line (32) is arranged on the inner side of the second contour line (21), or the first contour line (32) is arranged on the inner side of the second contour line (21) and has an overlapping area.

7. The LED package device according to claim 1, characterized in that: The upper surface of the light-transmitting adhesive layer (3) is a flat surface or a curved surface.

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