Wire welding machine with automatic winding function

Abstract

A wire welding machine with an automatic wire winding function relates to the technical field of semiconductor sealing testing and is used for welding a workpiece, the workpiece comprises a support bonding pad and a device bonding pad, the wire welding machine comprises a wire welding machine body, a wire welding mechanism and a control panel, the left side and the right side of the wire welding machine body are respectively provided with a feeding mechanism and a discharging mechanism, and the control panel is connected with the feeding mechanism and the discharging mechanism. A conveying channel is communicated between the feeding mechanism and the discharging mechanism, a welding plate used for bearing workpieces is arranged on the conveying channel, and the wire welding mechanism comprises a machine body, a ceramic nozzle, a welding wire, a driving piece used for driving the ceramic nozzle to conduct winding motion relative to a device welding disc and an ignition box used for melting the welding wire at the tail end of the ceramic nozzle into a metal ball. By adopting the technical scheme, the welding between the three-dimensional vertical device bonding pad such as a cylinder and the bracket bonding pad can be realized, the welding quality between the device bonding pad and the bracket bonding pad is improved, and the performance and the reliability of the semiconductor device are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging and testing, and particularly relates to a wire bonding machine with an automatic wire winding function. Background Art

[0002] In the field of chip packaging, wire bonding is a process that uses fine metal wires and utilizes heat, pressure, and ultrasonic energy to tightly bond the metal leads to the substrate pads, achieving electrical interconnection between the chip and the substrate and information communication between chips. Under ideal control conditions, electron sharing or atomic interdiffusion occurs between the lead and the substrate, enabling atomic-level bonding between the two metals.

[0003] In the related art, the process of wire bonding is as follows: The chip is first fixed on a bracket, and then the fine metal wire is sequentially bonded to the test pads of the chip and the bracket pads of the bracket by the wire bonding process. There are two wire bonding processes, namely, ball bonding and wedge bonding. Among them, in the ball bonding process, the metal wire passes through the ceramic nozzle of the wire bonding machine. The ultrasonic heating mechanism or the electric spark heating mechanism inside the ceramic nozzle melts the metal wire into a liquid state, and a spherical end is formed due to surface tension. At this time, under the close control of the vision system and the motion mechanism of the wire bonding machine, the ceramic nozzle descends so that the spherical end of the metal wire is combined with the bracket pad. The combined pressure and heating energy cause the spherical end to form a first point bond with the bracket pad. Then, the ceramic nozzle is driven to rise, releasing a wire arc and moving to the test pad of the chip. The ceramic nozzle presses down to form a second point bond of the metal wire on the test pad. The ceramic nozzle rises to a certain position, and the lead is clamped by a fixture and continues to rise. The metal wire is broken at the thinnest part, and a new spherical end is formed at the end of the metal wire, preparing for the next bonding process.

[0004] However, the above-mentioned ball bonding process can only be used for welding when both the test pads of the chip and the bracket pads are horizontal. When the test pads of the chip are in a three-dimensional vertical shape such as a cylinder, the welding quality between the test pads of the chip and the bracket pads is poor, resulting in lead breakage or de-bonding, affecting the performance and reliability of semiconductor devices, and even causing the semiconductor devices to completely fail.

[0005] Therefore, the present application provides a wire bonding machine with an automatic wire winding function to solve the problem that the existing wire bonding machine is difficult to weld test pads with a vertical shape such as a cylinder. Summary of the Utility Model

[0006] The purpose of the present invention is to provide a wire bonding machine with an automatic winding function, in view of the fact that the wire bonding machine in the prior art can usually only perform welding with a wire bonding process when the test pads of the chip and the bracket pads are both horizontal. When the test pads of the chip are in a three-dimensional vertical shape such as a cylinder, the welding quality between the test pads of the chip and the bracket pads is poor, resulting in wire breakage or debonding, affecting the performance and reliability of the semiconductor device, and even causing the semiconductor device to fail completely.

[0007] The technical solution adopted by a wire bonding machine with an automatic winding function provided by the present invention is: a wire bonding machine with an automatic winding function, which is used to weld a workpiece, the workpiece includes a bracket pad and a device pad arranged on the bracket pad, the device pad protrudes from the surface of the bracket pad, and includes:

[0008] The wire bonding machine body has a feeding mechanism and a discharging mechanism respectively disposed on its left and right sides, a conveying channel is connected between the feeding mechanism and the discharging mechanism, and a welding plate for carrying a workpiece is disposed on the conveying channel; and

[0009] A wire welding mechanism, which is arranged on the wire welding machine body and is used to weld the workpiece to be welded on the welding plate, comprises a machine body, a porcelain nozzle, a welding wire inserted in the porcelain nozzle, a driving member for driving the porcelain nozzle to make a winding motion relative to the device pad, and a ignition box for melting the welding wire at the tail end of the porcelain nozzle into a metal ball. The porcelain nozzle can be vertically lifted and lowered relative to the welding plate. The machine body is provided with a feeding member for continuously supplying welding wire into the porcelain nozzle and a clamping member for clamping the welding wire so that the welding wire can be broken after welding is completed. The lead of the ignition box extends to the tail end of the porcelain nozzle; and

[0010] A control panel, which is arranged on the wire bonding machine body and is electrically connected to the feeding mechanism, the discharging mechanism and the wire bonding mechanism, and is used to control the actions of the feeding mechanism, the discharging mechanism and the wire bonding mechanism;

[0011] During welding, the workpiece is conveyed to the welding plate through the conveying channel, the ignition box discharges to melt the welding wire at the tail end of the porcelain nozzle into a metal ball, the porcelain nozzle is driven to be pressed down, the porcelain nozzle is made close to the welding plate and the welding wire is welded to the bracket pad to form a first point bond, the porcelain nozzle is driven to rise and the welding wire is pulled out a wire arc, and the porcelain nozzle is driven by the driving member to make a winding movement around the device pad. After the winding is completed, the porcelain nozzle is driven close to the welding plate and the welding wire is welded to the bracket pad to form a second point bond. After the welding is completed, the porcelain nozzle is driven to rise to a set height, the welding wire is clamped by the clamping member, and then the porcelain nozzle is driven to rise to break the welding wire.

[0012] Preferably, a first welding point and a second welding point are provided at the position of the bracket pad corresponding to the device pad. The first welding point and the second welding point are symmetrically arranged. During welding, the capillary forms a first point bonding of the bonding wire with the bracket pad at the first welding point, and the capillary forms a second point bonding of the bonding wire with the bracket pad at the second welding point.

[0013] Preferably, an optical vision system electrically connected to the control panel is further provided on the machine body. The optical vision system is used to identify the positions of the bracket pad and the device pad. After the optical vision system identifies the positions of the frame pad and the device pad, the control panel controls the wire bonding mechanism to perform welding.

[0014] Preferably, the driving member includes an XY-axis moving platform slidably disposed on the wire bonding machine body. The XY-axis moving platform is electrically connected to the control panel. The XY-axis moving platform can slide relative to the wire bonding machine body in the X-axis and Y-axis directions. The machine body is fixedly disposed on the XY-axis moving platform to drive the machine body to slide relative to the wire bonding machine body in the X-axis and Y-axis directions through the XY-axis moving platform, so that the capillary can perform a winding movement around the device pad.

[0015] Preferably, the wire bonding mechanism further includes an ultrasonic generating device. The ultrasonic generating device is fixedly disposed on the machine body, and the transducer of the ultrasonic generating device is communicated with the capillary.

[0016] Preferably, a clamping and conveying member for conveying workpieces is provided on the wire bonding machine body. The clamping and conveying member is electrically connected to the control panel. The number of the clamping and conveying members is two. The two clamping and conveying members are respectively slidably disposed between the feeding mechanism and the welding plate and between the welding plate and the discharging mechanism. During welding, the clamping and conveying member located between the feeding mechanism and the welding plate conveys the workpiece to be welded from the feeding mechanism to the welding plate for welding. After welding, the clamping and conveying member located between the welding plate and the discharging mechanism conveys the welded workpiece to the discharging mechanism.

[0017] Preferably, a heating mechanism for heating the welding plate is provided on the wire bonding machine body. The heating mechanism is disposed on the bottom side of the welding plate, and the heating mechanism is electrically connected to the control panel.

[0018] Preferably, a blowing mechanism is further provided on the wire bonding machine body. The blowing mechanism is electrically connected to the control panel. The blowing mechanism is used to blow away the hot air on the welding plate so that the optical vision system can accurately identify the positions of the bracket pad and the device pad.

[0019] Preferably, a microscope is rotatably provided on the wire bonding machine body. The microscope is disposed at the front end of the wire bonding machine body, and the microscope can rotate in a direction close to or away from the welding plate.

[0020] After adopting the above technical solution, the beneficial effects of the present invention are as follows:

[0021] When welding the pads of vertical devices such as cylinders in this application, the bonding wire at the end of the ceramic nozzle is melted into a metal ball by discharging through the ignition box. At this time, the ceramic nozzle is driven to press down, so that the ceramic nozzle approaches the welding plate and the bonding wire is welded to the bracket pad to form the first point bonding. By driving the ceramic nozzle to rise and pulling out a relatively long wire arc from the bonding wire, at this time, the ceramic nozzle is driven by the driving member to perform a winding movement around the device pad as the center, so that the bonding wire is wound around the device pad one by one. When the number of winding turns and the number of winding layers reach the set values, the ceramic nozzle is driven to approach the welding plate and the bonding wire forms the second bonding with the bracket pad. After the second point bonding, the ceramic nozzle is driven to rise to the set height, the bonding wire is clamped by the clamping member, and then the ceramic nozzle is driven to rise, so that the bonding wire is broken, thereby completing the welding of the device pad and the bracket pad, solving the problem that the existing wire bonder can only weld the horizontal device pads and bracket pads. The welding process is simple and reliable, the degree of automation is relatively high, the production cost is reduced, the welding quality between the device pad and the bracket pad is improved, and the performance and reliability of the semiconductor device are ensured. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 is the overall structural schematic diagram of this embodiment;

[0024] Figure 2 is the schematic diagram showing the cooperation relationship between the wire bonder body and the conveying channel;

[0025] Figure 3 is Figure 2 the enlarged view of part A in

[0026] Figure 4 is the display diagram when the ceramic nozzle welds the device pad and the bracket pad;

[0027] Figure 5 is the display diagram when performing the first point bonding in step S4;

[0028] Figure 6 is the display diagram when the ceramic nozzle rises after completing the first point bonding in step S5 but does not perform the winding movement relative to the device pad;

[0029] Figure 7It is a display diagram after the capillary has completed the wire winding operation relative to the device pad in step S5;

[0030] Figure 8 It is a display diagram when performing the second point bonding in step S6;

[0031] Figure 9 It is a display diagram of the device pad and the bracket pad after welding is completed.

[0032] Explanation of reference numerals: 10, workpiece; 11, bracket pad; 111, first welding point; 112, second welding point; 12, device pad; 20, wire bonder body; 201, cover plate; 202, feeder; 21, feeding mechanism; 22, discharging mechanism; 23, conveying channel; 24, clamping and conveying member; 25, heating mechanism; 26, blowing mechanism; 27, microscope; 30, wire bonding mechanism; 31, body; 311, optical vision system; 32, capillary; 321, bonding wire; 33, driving member; 34, spark box; 35, ultrasonic generating device; 40, control panel. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the attached Figures 1-9 , obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0034] It should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "back", "side", "circumferential", etc. of the present utility model indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model. In addition, the terms such as the first and the second are only used to distinguish multiple components or structures with the same or similar structures, and do not represent a special limitation on the setting order or connection relationship.

[0035] This embodiment relates to a wire bonder with an automatic wire winding function. Refer to Figures 1 to 9, which is used to weld a workpiece 10, the workpiece 10 includes a bracket pad 11 and a device pad 12 arranged on the bracket pad 11. In the present embodiment, the bracket pad 11 is arranged in a rectangular plate shape, the number of the device pads 12 is multiple, the multiple device pads 12 are all arranged in a cylindrical shape, the multiple device pads 12 are arranged in an array on the bracket pad 11, and the multiple device pads 12 are all protruding from the surface of the bracket pad 11.

[0036] Specifically, the wire bonding machine provided in this embodiment includes a wire bonding machine body 20, a wire bonding mechanism 30 arranged on the wire bonding machine body 20, and a control panel 40, wherein a feeding mechanism 21 and a discharging mechanism 22 are respectively arranged on the left and right sides of the wire bonding machine body 20, a conveying channel 23 is arranged between the feeding mechanism 21 and the discharging mechanism 22, and a welding plate for carrying a workpiece 10 is arranged on the conveying channel 23. In addition, a cover plate 201 for covering the conveying channel 23 is also arranged on the wire bonding machine body 20. The feeding mechanism 21 is used to provide the workpiece 10 to be welded to the conveying channel 23, and the discharging mechanism 22 is used to collect the welded workpiece 10. Since the feeding mechanism 21 and the discharging mechanism 22 are both well-known technical means in the art, they are not described in detail here.

[0037] The wire welding mechanism 30 is used to weld the workpiece 10 to be welded on the welding plate, and includes a machine body 31, a porcelain nozzle 32, a welding wire 321 inserted into the porcelain nozzle 32, a driving member 33 for driving the porcelain nozzle 32 to make a winding motion relative to the device pad 12, and a ignition box 34 for melting the welding wire 321 at the tail end of the porcelain nozzle 32 into a metal ball. Among them, the porcelain nozzle 32 can be vertically lifted and lowered relative to the welding plate, and there is a feeding member 202 on the wire welding machine body 20 for continuously providing the welding wire 321 to the porcelain nozzle 32. The feeding member 202 is arranged above the wire welding mechanism 30. The feeding member 202 is a welding wire reel, and the welding wire 321 is wound on the welding wire reel. One end of the welding wire 321 is fixedly connected to the welding wire reel, and the other end of the welding wire 321 extends downward to penetrate into the porcelain nozzle 32 and protrudes from the tail end of the porcelain nozzle 32. The body 31 is also provided with a clamping piece for clamping the welding wire 321 so that the welding wire 321 can be pulled off after welding is completed. The clamping piece is arranged on the feeding path of the welding wire 321 to the porcelain nozzle 32 or arranged inside the porcelain nozzle 32. The lead of the ignition box 34 extends to the tail end of the porcelain nozzle 32 so that the welding wire 321 at the tail end of the porcelain nozzle 32 can be melted into a metal ball after the ignition box 34 is discharged. It should be noted that the clamping piece, the feeding piece 202 and the ignition box 34 are all well-known technical means in the art, and their specific setting positions can be adjusted according to actual conditions, and no further details are given here.

[0038] The control panel 40 is disposed on the wire bonding machine body 20 , and is electrically connected to the feeding mechanism 21 , the discharging mechanism 22 , and the wire bonding mechanism 30 , and is used to control the actions of the feeding mechanism 21 , the discharging mechanism 22 , and the wire bonding mechanism 30 .

[0039] During welding, the feeding mechanism 21 supplies the workpiece 10 to be welded to the conveying channel 23. When the workpiece 10 to be welded is conveyed onto the welding plate, the ignition box 34 is driven to discharge through the control panel 40, melting the welding wire 321 at the tail end of the ceramic nozzle 32 into a metal ball. At this time, by driving the ceramic nozzle 32 to press down, the ceramic nozzle 32 is brought close to the welding plate and the welding wire 321 is welded to the support pad 11 to form the first point bonding. After the first point bonding is completed, the ceramic nozzle 32 is driven to rise and the welding wire 321 is pulled out to form a relatively long wire arc. At this time, the ceramic nozzle 32 is driven to act by the driving member 33, and the ceramic nozzle 32 makes a winding movement around the device pad 12 as the center, so that the welding wire 321 is wound around the device pad 12 one by one (parameters such as the winding pitch, winding direction, winding layer number, and winding coil number can all be controlled through the control panel 40). After the number of winding turns and the number of winding layers reach the set values, the ceramic nozzle 32 is driven to move in the direction close to the support pad 11 and the welding wire 321 is welded to the support pad 11 to form the second point bonding. After the second point bonding is completed, the ceramic nozzle 32 is driven to rise to the set height, the welding wire 321 is clamped by the clamping member, and then the ceramic nozzle 32 is driven to rise to break the welding wire 321, thus completing the welding between the support pad 11 and the device pad 12.

[0040] In some embodiments, a first welding point 111 and a second welding point 112 are provided at the position of the support pad 11 corresponding to the device pad 12. The first welding point 111 and the second welding point 112 are symmetrically arranged. During welding, the ceramic nozzle 32 forms the first point bonding with the support pad 11 at the first welding point 111 with the welding wire 321, and the ceramic nozzle 32 forms the second point bonding with the welding wire 321 at the second welding point 112.

[0041] Through the settings of the first welding point 111 and the second welding point 112, the precise control of the positions of the first point bonding and the second point bonding is realized. Gaskets can be set in advance at the first welding point 111 and the second welding point 112 during welding, thus avoiding the occurrence of the situation of welding through the support pad 11 and ensuring the welding quality.

[0042] In some embodiments, an optical vision system 311 connected to the control panel 40 is further provided on the machine body 31. The optical vision system 311 is used to identify the positions of the support pad 11 and the device pad 12. And when the optical vision system 311 identifies the positions of the frame pad and the device pad 12, the control panel 40 controls the wire welding mechanism 30 to perform welding.

[0043] The optical vision system 311 is mainly used to identify the positions of the first welding point 111 and the second welding point 112 on the support pad 11 and the position of the device pad 12, so that the control panel 40 can accurately control the pressing down and rising positions of the ceramic nozzle 32, ensuring the welding accuracy and the welding quality.

[0044] In some embodiments, the driving member 33 includes an XY-axis moving platform slidably disposed on the wire bonding machine body 20. The XY-axis moving platform is electrically connected to the control panel 40. The XY-axis moving platform can slide relative to the wire bonding machine body 20 in the X-axis and Y-axis directions. The body 31 is fixedly disposed on the XY-axis moving platform to drive the body 31 to move relative to the wire bonding machine body 20 in the X-axis and Y-axis directions through the XY-axis moving platform, so that the capillary 32 can perform a winding movement centered on the device pad 12. It should be noted that in this embodiment, the X-axis direction is the length direction of the wire bonding machine body 20, and the Y-axis direction is the width direction of the wire bonding machine body 20.

[0045] It can be understood that by driving the XY-axis moving platform to slide relative to the wire bonding machine body 20 in the X-axis and Y-axis directions through the control panel 40, the capillary 32 is driven to move relative to the wire bonding machine body 20 in the X-axis and Y-axis directions, so that the capillary 32 can perform a winding movement relative to the device pad 12 centered on the device pad 12, and then the wire 321 can be wound around the device pad 12 one by one.

[0046] In some embodiments, the wire bonding mechanism 30 further includes an ultrasonic generating device 35. The ultrasonic device is fixedly disposed on the body 31, and the transducer of the ultrasonic generating device 35 is communicated with the capillary 32. When the wire 321 performs the first point bonding and the second point bonding, through the setting of the ultrasonic generating device 35, the wire 321 can be stably welded to the bracket pad 11.

[0047] In some embodiments, a clamping and conveying member 24 for conveying the workpiece 10 is further disposed on the wire bonding machine body 20. The clamping and conveying member 24 is electrically connected to the control panel 40. The number of the clamping and conveying members 24 is two. The two clamping and conveying members 24 are respectively slidably disposed between the feeding mechanism 21 and the welding plate and between the welding plate and the discharging mechanism 22. During welding, the clamping and conveying member 24 located between the feeding mechanism 21 and the welding plate conveys the workpiece 10 to be welded from the feeding mechanism 21 to the welding plate for welding. After the workpiece 10 is welded, the clamping and conveying member 24 located between the welding plate and the discharging mechanism 22 conveys the welded workpiece 10 to the discharging mechanism 22.

[0048] It can be understood that through the setting of the two clamping and conveying members 24, a complete set of working processes of feeding, welding, and discharging is realized, with a high degree of automation and saving labor costs.

[0049] In some embodiments, a heating mechanism 25 for heating the soldering plate is further provided on the wire bonding machine body 20. The heating mechanism 25 is disposed on the bottom side of the soldering plate and is electrically connected to the control panel 40. Specifically, the heating mechanism 25 is a heating plate. During soldering, the soldering plate is heated by the heating mechanism so that the surface temperature of the soldering plate rises to a set temperature. The soldering quality is better when performing soldering work at this set temperature, thereby further improving the soldering quality.

[0050] In some embodiments, a blowing mechanism 26 is further provided on the wire bonding machine body 20. The blowing mechanism 26 is electrically connected to the control panel 40. The blowing mechanism 26 is used to blow away the hot air on the soldering plate so that the optical vision system 311 can accurately identify the positions of the bracket pads 11 and the device pads 12. Specifically, the blowing mechanism 26 is a blow pipe and a mounting bracket for fixing the blow pipe.

[0051] During soldering, the blowing mechanism 26 blows air onto the soldering plate to blow away the hot air generated by soldering, so that the optical vision system 311 can accurately identify the positions of the bracket pads 11 and the device pads 12, avoiding the situation that the optical vision system 311 is difficult to accurately identify the positions of the bracket pads 11 and the device pads 12 due to the hot air generated during the soldering process, and thus ensuring the soldering accuracy.

[0052] In addition, in other embodiments, the gas blown out by the blowing mechanism 26 can be a protective gas such as helium. By blowing helium onto the soldering plate, the situation of poor soldering quality caused by the oxidation of the bonding wire 321 during the soldering process can be effectively avoided, further improving the soldering quality.

[0053] In some embodiments, a microscope 27 is rotatably provided on the wire bonding machine body 20. The microscope 27 is disposed at the front end of the wire bonding machine body 20 and can rotate in a direction close to or away from the soldering plate.

[0054] It can be understood that during soldering, the microscope 27 can be driven to rotate in a direction close to the soldering plate, so that the soldering process of the ceramic nozzle 32 to the device pads 12 and the bracket pads 11 can be observed through the microscope 27, enabling the operator to clearly observe the entire soldering process. When defective products appear, the problems can be quickly detected without stopping the machine for inspection, which is simple and convenient to operate. Moreover, when adjusting parameters such as the winding pitch, winding direction, winding layer number, and winding coil number, the soldering details can be clearly observed through the microscope 27, so that the parameter adjustment can be quickly completed.

[0055] This embodiment also provides an automatic wire winding and soldering method, which is suitable for using the wire bonding machine with an automatic wire winding function as described above, and includes the following steps:

[0056] Step S1, feeding: Feed the workpiece 10 to be welded into the conveying channel 23 through the feeding mechanism 21, and use the clamping and conveying member 24 to convey the workpiece 10 to be welded onto the welding plate;

[0057] Step S2, heating: Control the heating mechanism 25 to heat the welding plate through the control panel 40, so that the welding plate is heated to a suitable temperature for welding;

[0058] Step S3, recognition: Identify the positions of the bracket pads 11 and the device pads 12 through the optical vision system 311;

[0059] Step S4, first point bonding: Control the discharge of the spark box 34 to melt the welding wire 321 at the end of the ceramic nozzle 32 into a metal ball, drive the ceramic nozzle 32 to press down, make the ceramic nozzle 32 close to the welding plate, and form a first point bond between the welding wire 321 and the bracket pad 11 at the first welding point 111;

[0060] Step S5, wire winding: Drive the ceramic nozzle 32 to rise relative to the welding plate, pull out a long wire arc from the welding wire 321 inside the ceramic nozzle 32, control the driving member 33 to act through the control panel 40, and make the ceramic nozzle 32 perform a wire winding movement centered on the device bracket under the drive of the driving member 33, so that the welding wire 321 is wound around the device bracket;

[0061] Step S6, second point bonding: After the number of wire winding turns and the number of wire winding layers reach the set values, drive the ceramic nozzle 32 to approach the welding plate and form a second point bond between the welding wire 321 and the bracket pad 11 at the second welding point 112;

[0062] Step S7, breaking: After completing Step S6, drive the ceramic nozzle 32 to rise to the set height, clamp the welding wire 321 through the clamping member, then drive the ceramic nozzle 32 to rise, break the welding wire 321, the welding is completed, and the ceramic nozzle 32 rises to wait for the next bonding;

[0063] Step S8, discharging: Convey the welded workpiece 10 to the discharging mechanism 22 through the clamping and conveying member 24 to achieve discharging.

[0064] It should be noted that in Step S5, parameters such as the wire winding pitch, wire winding direction, number of wire winding layers, and number of wire winding turns of the welding wire 321 wound on the device pad 12 can flexibly control the wire winding effect to achieve the best process welding effect.

[0065] The above is only used to illustrate the technical solution of the present invention rather than to limit it. Any other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solution of the present invention should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A wire bonding machine with an automatic winding function, which is used for welding a workpiece (10), wherein the workpiece (10) comprises a support pad (11) and a device pad (12) arranged on the support pad (11), wherein the device pad (12) protrudes from the surface of the support pad (11), and is characterized in that: include: A wire bonding machine body (20) is provided with a feeding mechanism (21) and a discharging mechanism (22) on its left and right sides respectively, a conveying channel (23) is connected between the feeding mechanism (21) and the discharging mechanism (22), and a welding plate for carrying a workpiece (10) is provided on the conveying channel (23); and A wire welding mechanism (30) is arranged on the wire welding machine body (20) and is used for welding a workpiece (10) to be welded on a welding plate. The mechanism comprises a machine body (31), a porcelain nozzle (32), a welding wire (321) inserted into the porcelain nozzle (32), a driving member (33) for driving the porcelain nozzle (32) to make a winding motion relative to the device pad (12), and a ignition box (34) for melting the welding wire (321) at the tail end of the porcelain nozzle (32) into a metal ball. The porcelain nozzle (32) can be vertically raised and lowered relative to the welding plate. The machine body (31) is provided with a feeding member (202) for continuously supplying the welding wire (321) into the porcelain nozzle (32) and a clamping member for clamping the welding wire (321) so that the welding wire (321) can be pulled apart after welding is completed. The lead of the ignition box (34) extends to the tail end of the porcelain nozzle (32). as well as A control panel (40) is arranged on the wire bonding machine body (20), is electrically connected to the feeding mechanism (21), the discharging mechanism (22) and the wire bonding mechanism (30), and is used to control the actions of the feeding mechanism (21), the discharging mechanism (22) and the wire bonding mechanism (30).

2. A wire bonding machine with automatic winding function according to claim 1, characterized in that: A first welding point (111) and a second welding point (112) are arranged at the support pad (11) corresponding to the device pad (12); the first welding point (111) and the second welding point (112) are arranged symmetrically; and during welding, the porcelain nozzle (32) forms a first point bonding between the welding wire (321) and the support pad (11) at the first welding point (111); and the porcelain nozzle (32) forms a second point bonding between the welding wire (321) and the support pad (11) at the second welding point (112).

3. The wire bonding machine with automatic winding function according to claim 1, characterized in that: The machine body (31) is also provided with an optical vision system (311) electrically connected to the control panel (40), and the optical vision system (311) is used to identify the positions of the support pads (11) and the device pads (12). When the optical vision system (311) identifies the positions of the support pads and the device pads (12), the control panel (40) controls the wire bonding mechanism (30) to perform welding.

4. The wire bonding machine with automatic winding function according to claim 1, characterized in that: The driving member (33) comprises an XY axis moving platform slidably arranged on the wire bonding machine body (20), the XY axis moving platform being electrically connected to the control panel (40), the XY axis moving platform being able to slide relative to the wire bonding machine body (20) along the X axis and the Y axis, the machine body (31) being fixedly arranged on the XY axis moving platform, so that the machine body (31) is driven by the XY axis moving platform to slide relative to the wire bonding machine body (20) along the X axis and the Y axis, so that the porcelain nozzle (32) can perform a winding movement around the device pad (12).

5. The wire bonding machine with automatic winding function according to claim 1, characterized in that: The wire welding mechanism (30) further comprises an ultrasonic generating device (35), wherein the ultrasonic generating device (35) is fixedly arranged on the machine body (31), and a transducer of the ultrasonic generating device (35) is connected to the porcelain nozzle (32).

6. The wire bonding machine with automatic winding function according to claim 1, characterized in that: The wire welding machine body (20) is provided with a clamping conveying member (24) for conveying a workpiece (10). The clamping conveying member (24) is electrically connected to a control panel (40). There are two clamping conveying members (24). The two clamping conveying members (24) are respectively slidably arranged between a feeding mechanism (21) and a welding plate and between a welding plate and a discharging mechanism (22). During welding, the clamping conveying member (24) located between the feeding mechanism (21) and the welding plate conveys the workpiece (10) to be welded from the feeding mechanism (21) to the welding plate for welding. After welding, the clamping conveying member (24) located between the welding plate and the discharging mechanism (22) conveys the welded workpiece (10) to the discharging mechanism (22).

7. The wire bonding machine with automatic winding function according to claim 1, characterized in that: The wire bonding machine body (20) is provided with a heating mechanism (25) for heating the welding plate. The heating mechanism (25) is arranged on the bottom side of the welding plate, and the heating mechanism (25) is electrically connected to the control panel (40).

8. The wire bonding machine with automatic winding function according to claim 3, characterized in that: The wire bonding machine body (20) is also provided with an air blowing mechanism (26), the air blowing mechanism (26) being electrically connected to the control panel (40), and the air blowing mechanism (26) being used to blow away the hot air on the bonding plate so that the optical vision system (311) can accurately identify the positions of the bracket pad (11) and the device pad (12).

9. The wire bonding machine with automatic winding function according to claim 1, characterized in that: A microscope (27) is also rotatably arranged on the wire bonding machine body (20); the microscope (27) is arranged at the front end of the wire bonding machine body (20), and the microscope (27) can rotate in a direction close to or away from the welding plate.

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