Manipulator automatic numerical control equipment for chamfering quartz plate

Abstract

The utility model discloses mechanical arm automatic numerical control equipment for chamfering a quartz plate, which comprises a main body frame, the main body frame is provided with a manipulator device used for moving a crystal plate, a grinding wheel angle adjusting mechanism used for grinding the crystal plate, a crystal plate pouring table, a crystal plate turnover mechanism used for turning over the crystal plate, and a stock bin device used for conveying the unprocessed crystal plate and storing the processed crystal plate. The wafer beveling device can solve the technical problems of high rejection rate, high risk, high labor intensity and low labor efficiency caused by manual wafer beveling operation.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal processing, in particular to a manipulator automatic numerical control device for chamfering crystal wafers. Background Art

[0002] In the processing of crystal products, a crystal wafer chamfering machine is needed to precisely grind and chamfer the 8 edges of a crystal square wafer. The tolerance accuracy of the grinding process is usually required to be within ±0.1 mm. In the past, the grinding method used was semi-mechanized processing. The operator needed to pick up the crystal square wafer with both hands, push the crystal square wafer to the surface of the grinding wheel for grinding. Each of the 8 edges needed to be ground 8 times, and continuous repeated operations were required to chamfer multiple crystal square wafers. This method has high labor intensity, low efficiency, and low qualification rate. Summary of the Utility Model

[0003] To solve the above problems, the utility model provides a manipulator automatic numerical control device for chamfering crystal wafers, which can solve the technical problems of high scrap rate, high danger, high labor intensity, and low labor efficiency caused by manual operation of wafer chamfering.

[0004] The utility model is implemented by the following technical solutions. A manipulator automatic numerical control device for chamfering crystal wafers according to the utility model includes a main frame, on which a manipulator device for moving crystal wafers, a grinding wheel angle adjustment mechanism for grinding crystal wafers, a wafer unloading table for positioning crystal wafers, a wafer turning mechanism for flipping crystal wafers, and a bin device for storing crystal wafers are installed.

[0005] In one embodiment, the manipulator device includes a base, a four-axis industrial robot, and a vacuum gripper. The base is fixedly arranged on the tabletop of the main frame. The four-axis industrial robot is fixedly connected to the base, and the vacuum gripper is installed on the fourth axis of the four-axis industrial robot.

[0006] In one embodiment, the vacuum gripper includes a gripper suction cup, a telescopic rod, a protective sleeve, and a fixed flange. The fixed flange is fixedly connected to the fourth axis of the four-axis industrial robot. The telescopic rod is installed on the fixed flange. The protective sleeve is installed outside the telescopic rod, and the gripper suction cup is fixed at the end of the telescopic rod.

[0007] In one embodiment, the grinding wheel angle adjustment mechanism includes an electric spindle, an upper Y-axis substrate, a grinding wheel, a lower Y-axis substrate, a Y-axis guide rail, an electric spindle base, a main body bracket, a Z-axis guide rail, a front Z-axis substrate, a Z-axis adjustment knob, a rear Z-axis substrate, an R-axis rotating seat, a Y-axis adjustment knob, an R-axis adjustment knob I, and an R-axis adjustment knob II. An upper Y-axis substrate is installed above the main body bracket. A Y-axis guide rail is provided on the upper Y-axis substrate. The Y-axis guide rail is slidably connected to the lower Y-axis substrate. A Y-axis adjustment knob and a Y-axis driving mechanism are connected to each other on the lower Y-axis substrate, and an output end of the Y-axis driving mechanism is connected to the upper Y-axis substrate. An electric spindle base and an R-axis adjustment knob II are provided on the upper Y-axis substrate. An electric spindle is arranged on the electric spindle base, and the electric spindle base is rotatably arranged on the upper Y-axis substrate. The R-axis adjustment knob II is connected to the electric spindle base through a first rotating mechanism. A grinding wheel is provided on the electric spindle. An R-axis rotating seat is installed on a side surface of the main body bracket. The R-axis rotating seat is rotatably arranged on the front Z-axis substrate. A Z-axis guide rail is provided on the front Z-axis substrate. The Z-axis guide rail is slidably connected to the rear Z-axis substrate. A Z-axis adjustment knob and a Z-axis driving mechanism are connected to each other at a bottom of the rear Z-axis substrate. The rear Z-axis substrate is fixed inside the main body frame. An output shaft of the Z-axis driving mechanism is parallel to the Z-axis guide rail and an end thereof is fixed on the front Z-axis substrate. The R-axis rotating seat is fixedly connected to an output shaft of a second rotating mechanism fixed on the front Z-axis substrate. The second rotating mechanism is connected to the R-axis adjustment knob I214.

[0008] In one embodiment, the wafer tipping table includes a chamfering table base, a tipping table water baffle, and a reference knife. The chamfering table base is fixedly arranged on a table surface of the main body frame. The reference knife is fixedly arranged on a side surface of the chamfering table base. The tipping table water baffle surrounds the chamfering table base.

[0009] In one embodiment, the wafer turning-over mechanism includes a moving turning-over seat, a rotating arm, a water receiving tray, a turning-over fixing seat, a rotating cylinder, and a fixing frame. The fixing frame and the water receiving tray are fixedly arranged on the table surface of the main body frame. The rotating cylinder is fixedly arranged on the fixing frame. The rotating arm is installed on the rotating cylinder. The moving turning-over seat is installed on the rotating arm. The turning-over fixing seat is installed inside the water receiving tray. Groove holes are provided inside both the moving turning-over seat and the turning-over fixing seat, and the groove holes are communicated with a vacuum generator.

[0010] In one embodiment, the bin device includes a feeding bin, a receiving bin, an upper fixing plate, a bin base, a receiving bin ejector rod for moving the crystal wafers in the receiving bin, a lower fixing plate, a feeding bin ejector rod for moving the crystal wafers in the feeding bin, a bin buckle, a feeding bin photoelectric sensor, a receiving bin photoelectric sensor, a feeding servo motor for driving the feeding bin ejector rod, and a receiving servo motor for driving the receiving bin ejector rod. The bin base is fixedly arranged on the front side of the main frame through the upper fixing plate and the lower fixing plate. The feeding bin and the receiving bin are connected to the bin base through the bin buckle. The feeding bin photoelectric sensor and the receiving bin photoelectric sensor are installed on the tabletop of the main frame.

[0011] In one embodiment, the numerical control device further includes a cooling circulating water device, which is used to spray cooling water onto the crystal wafer and the wafer tipping table where the crystal wafer is located and recover the cooling water.

[0012] In one embodiment, the quantification device includes a quantification base fixedly arranged on the tabletop of the main frame, a horizontal micrometer fixedly arranged in the top slot of the quantification base, and a vertical micrometer fixedly arranged in the side slot of the quantification base.

[0013] The automatic numerical control device for chamfering crystal wafers of the present utility model can obtain the following advantages:

[0014] (1) Instead of manual automated processing and production, the operator can set various processing parameters through the control system, and the gripper suction cup can grab the wafers from the feeding bin and send them to the wafer tipping table.

[0015] (2) The processing by the automatic numerical control device can avoid errors, reduce the rejection rate, no longer requires manual grinding of chamfers and dressing of grinding wheels, greatly reduces the labor intensity, and improves the processing efficiency at the same time.

[0016] (3) Due to the accuracy of the operation of the manipulator device and the data provided by the quantification device, the size chamfer grinding values are all controlled within the tolerance range. Therefore, unqualified products caused by the operator's operation errors are avoided, and the size grinding accuracy can be fully controlled within the tolerance range.

[0017] The above description is only an overview of the technical solution of the present utility model. In order to understand the technical means of the present utility model more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present utility model more obvious and understandable, the following preferred embodiments are specifically given and described in detail in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of an automatic numerical control device for chamfering crystal wafers of the present utility model;

[0019] Figure 2It is a schematic structural diagram of the vacuum gripper in the present utility model;

[0020] Figure 3 It is a schematic structural diagram of the grinding wheel angle adjustment mechanism in the present utility model;

[0021] Figure 4 It is a schematic structural diagram of the wafer tipping table in the present utility model;

[0022] Figure 5 It is a schematic structural diagram of the wafer turning mechanism in the present utility model;

[0023] Figure 6 It is a schematic structural diagram of the magazine device in the present utility model;

[0024] Figure 7 It is a schematic structural diagram of the quantization device in the present utility model.

[0025]

Reference Signs

[0026] 100 - Manipulator device, 101 - Base, 102 - Four-axis industrial robot, 103 - Vacuum gripper, 1031 - Gripper suction cup, 1032 - Telescopic rod, 1033 - Protective sleeve, 1034 - Fixed flange, 200 - Grinding wheel angle adjustment mechanism, 201 - Electric spindle, 202 - Y-axis upper substrate, 203 - Grinding wheel, 204 - Y-axis lower substrate, 205 - Y-axis guide rail, 206 - Electric spindle base, 207 - Main body bracket, 208 - Z-axis guide rail, 209 - Z-axis front substrate, 210 - Z-axis adjustment knob, 211 - Z-axis rear substrate, 212 - R-axis rotating seat, 213 - Y-axis adjustment knob, 214 - R-axis adjustment knob I, 215 - R-axis adjustment knob II, 300 - Wafer tipping table, 301 - Tipping table water baffle, 302 - Chamfering table base, 303 - Reference tool, 400 - Wafer turning mechanism, 401 - Moving turning seat, 402 - Rotating arm, 403 - Water receiving tray, 404 - Turning fixed seat, 405 - Rotary cylinder, 500 - Magazine device, 501 - Feeding magazine, 502 - Receiving magazine, 503 - Upper fixing plate, 504 - Magazine base, 505 - Receiving magazine ejector rod, 506 - Lower fixing plate, 507 - Feeding magazine ejector rod, 508 - Magazine buckle, 509 - Feeding magazine photoelectric sensor, 510 - Receiving magazine photoelectric sensor, 600 - Cooling circulating water device, 700 - Quantization device, 701 - Base, 702 - Vertical dial indicator, 703 - Horizontal dial indicator. Detailed Embodiments

[0027] In the following description, many technical details are presented for the reader to better understand the present application. However, those of ordinary skill in the art can understand that the technical solutions claimed in the present application can be implemented even without these technical details and various changes and modifications based on the following embodiments.

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the following will further describe the implementation manners of this application in detail with reference to the accompanying drawings.

[0029] Please refer to Figure 1 , this embodiment includes a main frame (the main frame includes components such as floor feet, a tabletop, and a cabinet body, and the connection relationships of each component are prior art and will not be elaborated here), and a control system. A manipulator device 100, a grinding wheel angle adjustment mechanism 200, a wafer tipping table 300, a wafer turning-over mechanism 400, and a magazine device 500 are installed on the main frame. The manipulator device 100 is used to move the crystal wafers. The grinding wheel angle adjustment mechanism 200 is used to adjust the angle of the grinding wheel and process the crystal wafers. The wafer tipping table 300 is used for chamfering the crystal wafers. The wafer turning-over mechanism 400 is used to turn over the crystal wafers. The magazine device 500 is used to convey unprocessed crystal wafers and store processed crystal wafers.

[0030] Specifically, the control system includes a manipulator controller, an inverter, an AC motor, a servo driver, a servo motor, a pneumatic control solenoid valve, a power supply, a vacuum generator, a gas source, etc. Electrical devices such as the manipulator controller are connected to the control panel through communication lines. A PLC or other control devices can be set in the control panel. The control panel includes a power switch, a touch screen, a program start switch, a water pump switch, an electric spindle switch, a cycle pause switch, a step pause switch, a loading and unloading switch, a grinding wheel replacement switch, an alarm, etc. provided on the front panel of the frame.

[0031] The manipulator device 100 includes a base 101, a four-axis industrial robot 102, and a vacuum gripper 103. The base 101 is fixedly arranged on the tabletop of the main frame. The four-axis industrial robot 102 is fixedly connected to the base 101. The vacuum gripper 103 is installed on the fourth axis of the four-axis industrial robot 102. The four-axis industrial robot 102 is electrically connected to the manipulator controller.

[0032] Please refer to Figure 2 , the vacuum gripper 103 includes a gripper suction cup 1031, a telescopic rod 1032, a protective sleeve 1033, and a fixed flange 1034. The fixed flange 1034 is fixedly connected to the fourth axis of the four-axis industrial robot 102. The telescopic rod 1032 is installed on the fixed flange 1034. The protective sleeve 1033 is installed outside the telescopic rod 1032. The gripper suction cup 1031 is arranged at the end of the telescopic rod 1032. The telescopic rod 1032 can be an electrically driven telescopic rod, or a hydraulically or pneumatically driven telescopic rod. In this embodiment, the output shaft of a pneumatic cylinder can be used as the telescopic rod, and the pneumatic cylinder is connected to the pneumatic control solenoid valve and the gas source through an air pipe.

[0033] Specifically, the gripper suction cup 1031 is connected to a vacuum generator, which generates negative pressure to adsorb the crystal wafer on the gripper suction cup 1031.

[0034] Please refer to Figure 3, the grinding wheel angle adjustment mechanism 200 includes an electric spindle 201, a Y-axis upper substrate 202, a grinding wheel 203, a Y-axis lower substrate 204, a Y-axis guide rail 205, an electric spindle base 206, a main body bracket 207, a Z-axis guide rail 208, a Z-axis front substrate 209, a Z-axis adjustment knob 210, a Z-axis rear substrate 211, an R-axis rotating seat 212, a Y-axis adjustment knob 213, an R-axis adjustment knob I 214, and an R-axis adjustment knob II 215. Above the main body bracket 207, a Y-axis lower substrate 204 is installed. The Y-axis lower substrate 204 is provided with a Y-axis guide rail 205, and the Y-axis guide rail 205 is slidably connected to the Y-axis upper substrate 202. The Y-axis lower substrate 204 is provided with a Y-axis adjustment knob 213 and a Y-axis driving mechanism (such as a motor, a cylinder, a lead screw, etc.) connected to each other, and the output end of the Y-axis driving mechanism is connected to the Y-axis upper substrate 202. By operating the Y-axis adjustment knob 213, the output shaft of the motor, cylinder or lead screw extends along the Y-axis guide rail 205, or the lead screw rotates to push the Y-axis upper substrate 202. The Y-axis upper substrate 202 is provided with an electric spindle base 206 and an R-axis adjustment knob II 215. An electric spindle 201 is arranged on the electric spindle base 206, and the electric spindle base 206 is rotatably arranged on the Y-axis upper substrate 202. The R-axis adjustment knob II 215 is connected to the electric spindle base 206 through a first rotation mechanism. The first rotation mechanism can be a motor. The R-axis adjustment knob II 215 is electrically connected to the first rotation mechanism, and the rotating shaft of the motor is fixedly connected to the electric spindle base 206. Or the first rotation mechanism is a worm and gear mechanism. The R-axis adjustment knob II 215 is fixedly connected to the worm. The electric spindle base 206 is disc-shaped, and teeth meshing with the worm are distributed on its outer circumference. Using the Y-axis adjustment knob 213 can drive the Y-axis upper substrate 202, the electric spindle base 206, the electric spindle 201, and the grinding wheel 203 on the electric spindle 201 to move back and forth. Using the R-axis adjustment knob I 214 can make the electric spindle base 206, the electric spindle 201, and the grinding wheel 203 on the electric spindle 201 rotate a certain angle on the horizontal plane. The grinding wheel 203 is arranged on the electric spindle. In this embodiment, the type of the grinding wheel is an electroplated diamond grinding wheel. The R-axis rotating seat 212 is installed on the side of the main body bracket 207. The R-axis rotating seat 212 is rotatably arranged on the Z-axis front substrate 209. The Z-axis front substrate 209 is provided with a Z-axis guide rail 208, and the Z-axis guide rail is slidably connected to the Z-axis rear substrate 211. At the bottom of the Z-axis rear substrate 211, a Z-axis adjustment knob 210 and a Z-axis driving mechanism are connected to each other. The Z-axis rear substrate 211 is fixed inside the main body frame. The output shaft of the Z-axis driving mechanism is parallel to the Z-axis guide rail and its end is fixed on the Z-axis front substrate 209. The Z-axis driving mechanism has the same structure as the Y-axis driving mechanism and will not be described in detail here. Using the Z-axis adjustment knob 210 can make the Z-axis front substrate 209, the R-axis rotating seat 212, the main body bracket 207 and all components thereon (including the grinding wheel 203) move up and down.The R-axis rotating seat 212 is fixedly connected to the output shaft of the second rotating mechanism fixed on the Z-axis front substrate 209, and the second rotating mechanism is electrically connected to the R-axis adjustment knob 1214. The second rotating mechanism can be a motor. The R-axis adjustment knob 1214 can be operated to rotate the R-axis rotating seat 212, the main support 207 and the components thereon (including the grinding wheel 203) in the vertical plane. The above structure can adjust the position and angle of the grinding wheel 203 in the horizontal plane and the position and angle of the vertical plane.

[0035] Specifically, the electric spindle 201 is cooled by an external oil cooler.

[0036] See also Figure 4 The chip flipping table 300 includes a chamfering base 302, a chamfering base water shield 301, and a reference knife 303. The chamfering base 302 is fixed on the table of the main frame, and the reference knife 303 is fixed on the side of the chamfering base 302. The function of the reference knife 303 is to locate the initial position and angle of the crystal piece and ensure that the crystal piece maintains an accurate position and angle during the entire processing process. The chamfering base water shield 301 is surrounded by the chamfering base 302 to prevent cooling water from splashing onto the table. After the crystal piece is contacted and positioned with the reference knife 303, the suction cup on the chip flipping table 300 is used to fix the crystal piece and chamfer it.

[0037] See also Figure 5 The wafer flipping mechanism 400 includes a movable flipping seat 401, a rotating arm 402, a water tray 403, a flipping fixed seat 404, a rotating cylinder 405, and a fixed frame 406. The fixed frame 406 and the water tray 403 are fixedly arranged on the table of the main frame, the rotating cylinder 405 is fixedly arranged on the fixed frame 406, the rotating arm 402 is installed on the output shaft of the rotating cylinder 405, the movable flipping seat 401 is installed on the rotating arm 402, and the flipping fixed seat 404 is installed in the water tray 403. The rotating cylinder 405 is connected to the corresponding air-controlled solenoid valve and the air source through an air pipe.

[0038] Specifically, both the movable flip seat 401 and the flip fixed seat 404 are provided with slots, and the slots are connected to the vacuum generator. Negative pressure is generated by the vacuum generator, thereby adsorbing the crystal sheet on the surface of the movable flip seat and the flip fixed seat; the water receiving tray can store a part of the splashed cooling water to prevent the table from being contaminated.

[0039] See also Figure 6, the bin device 500 includes a feeding bin 501, a receiving bin 502, an upper fixing plate 503, a bin base 504, a receiving bin ejector rod 505, a lower fixing plate 506, a feeding bin ejector rod 507, a bin buckle 508, a feeding bin photoelectric sensor 509, a receiving bin photoelectric sensor 510, a feeding servo motor for driving the feeding bin ejector rod 507, and a receiving servo motor for driving the receiving bin ejector rod 505 (the servo motors are not shown in the figure). The bin base 504 is fixed to the front side of the main frame through the upper fixing plate 503 and the lower fixing plate 506. The feeding bin 501 and the receiving bin 502 are connected to the bin base 504 through the bin buckle 508, and the bin buckle 508 can be opened or closed to realize feeding of the feeding bin 501 and receiving of the receiving bin 502. The feeding bin photoelectric sensor 509 and the receiving bin photoelectric sensor 510 are installed on the tabletop of the main frame, and the sensors are used to detect the crystal wafers in the corresponding feeding bin 501 and receiving bin 502.

[0040] Specifically, the cavities of the feeding bin 501 and the receiving bin 502 extend vertically and are slightly larger than the size of the crystal wafer. Also, since the feeding bin needs to output the crystal wafer, a wafer separator is further provided at the top of the feeding bin. The feeding bin photoelectric sensor and the receiving bin photoelectric sensor are equipped with corresponding pedestals and installed on the tabletop. The receiving bin ejector rod 505 can extend into the cavity of the receiving bin, and the feeding bin ejector rod 507 can extend into the cavity of the feeding bin. The position of the corresponding crystal wafer in the feeding bin and the receiving bin can be changed through the ejector rod.

[0041] The numerical control device further includes a cooling circulating water device 600, which is used to spray cooling water onto the crystal wafer and the wafer tipping table 300 where the crystal wafer is located, and recover, filter, and recycle the cooling water.

[0042] Specifically, the cooling circulating water device 600 includes a circulating cooling water tank, a water pump, an upper water pipe, a lower water pipe, a water distributor, and a water volume regulating valve. The water pump drives the cooling water to flow along the upper water pipe from the circulating cooling water tank, and sprays the cooling water onto the crystal wafer and the grinding wheel to cool the crystal wafer and the grinding wheel, and the cooling water is recovered through the lower water pipe.

[0043] Please refer to Figure 7 , the quantization device 700 includes a quantization base 701 fixed on the tabletop of the main frame, a horizontal micrometer 703 fixed in the top slot of the quantization base, and a vertical micrometer 702 fixed in the side slot of the quantization base. The micrometers in the quantization device can provide certain data support when the grinding wheel is adjusted relative to the reference tool 303.

[0044] Working principle: The crystal wafer processed this time is a square crystal wafer. Driven by the feeding servo motor, the ejector rod 507 of the feeding bin will move the square crystal wafer upward. After the square crystal wafer reaches the top, it will be detected by the photoelectric sensor 509 of the feeding bin, and the feeding servo motor will stop running. The gripper suction cup 1031 of the manipulator device 100 places and fixes the square crystal wafer on the chamfering pedestal 302, and grinds the edge of the crystal wafer through the grinding wheel 203, so as to achieve chamfering processing. After the gripper suction cup 1031 chamfers one side of the crystal wafer with the grinding wheel 203, the gripper suction cup 1031 drives the crystal wafer to rotate 90 degrees until the four sides of the crystal wafer are processed. After that, the crystal wafer is sent to the moving turning seat 401. Under the action of the rotating cylinder 405, the rotating arm 402 rotates, and the crystal wafer is sent to the turning and fixing seat 404. The gripper suction cup 1031 then moves the crystal wafer to the chamfering pedestal 302 to chamfer the other four sides of the crystal wafer. After the processing is completed, it is sent to the top of the receiving bin 502. After the crystal wafer reaches the top, it will be detected by the photoelectric sensor 510 of the receiving bin. The receiving bin servo motor drives the ejector rod 505 of the receiving bin to drive the crystal wafer to move downward. The crystal wafer moves downward to a certain position, and this process is continuously cycled until the receiving bin is full or all the crystal wafers in the feeding bin are processed.

[0045] Of course, the specific shape of the crystal edge is not limited by the present utility model, and other polygonal crystal wafers can also be processed by the present utility model.

[0046] The above is only a preferred embodiment of the present utility model. Any person skilled in the art, without departing from the scope of the technical solution of the present utility model, any simple modification, equivalent change and modification made to the above embodiment according to the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. A manipulator automated numerical control device for crystal plate chamfering, characterized in that: The invention comprises a main frame, on which a manipulator device for moving a crystal piece, a grinding wheel angle adjustment mechanism for grinding the crystal piece, a crystal flipping table for positioning the crystal piece, a crystal flipping mechanism for turning over the crystal piece, and a silo device for storing the crystal piece are installed.

2. The robot automatic numerical control equipment for crystal plate chamfering according to claim 1, characterized in that: The manipulator device comprises a base, a four-axis industrial robot and a vacuum gripper. The base is fixed on the table of the main frame, the four-axis industrial robot is fixedly connected to the base, and the vacuum gripper is installed on the fourth axis of the four-axis industrial robot.

3. The robot automatic numerical control equipment for crystal plate chamfering according to claim 2, characterized in that: The vacuum gripper includes a gripper suction cup, a telescopic rod, a protective cover, and a fixed flange. The fixed flange is fixedly connected to the fourth axis of the four-axis industrial robot, the telescopic rod is installed on the fixed flange, the protective cover is installed outside the telescopic rod, and the gripper suction cup is fixed to the end of the telescopic rod.

4. The robot automated numerical control device for crystal plate chamfering according to claim 1, characterized in that: The grinding wheel angle adjustment mechanism comprises an electric spindle, an upper substrate of a Y-axis, a grinding wheel, a lower substrate of a Y-axis, a Y-axis guide rail, an electric spindle base, a main body bracket, a Z-axis guide rail, a front substrate of a Z-axis, a Z-axis adjustment knob, a rear substrate of a Z-axis, an R-axis rotating seat, a Y-axis adjustment knob, an R-axis adjustment knob I and an R-axis adjustment knob II. A lower substrate of a Y-axis is installed above the main body bracket, a Y-axis guide rail is arranged on the lower substrate of the Y-axis, the Y-axis guide rail is slidably connected with the upper substrate of the Y-axis, a Y-axis adjustment knob and a Y-axis driving mechanism which are interconnected are arranged on the lower substrate of the Y-axis, and an output end of the Y-axis driving mechanism is connected with the upper substrate of the Y-axis, an electric spindle base and an R-axis adjustment knob II are arranged on the upper substrate of the Y-axis, an electric spindle is arranged on the electric spindle base and the electric spindle base The seat is rotatably arranged on the Y-axis upper substrate, the R-axis adjustment knob II is connected to the electric spindle base through the first rotating mechanism, the electric spindle is provided with a grinding wheel, the side of the main body bracket is installed with an R-axis rotating seat, the R-axis rotating seat is rotatably arranged on the Z-axis front substrate, the Z-axis front substrate is provided with a Z-axis guide rail, the Z-axis guide rail is slidably connected with the Z-axis rear substrate, the bottom of the Z-axis rear substrate is provided with mutually connected Z-axis adjustment knobs and a Z-axis driving mechanism, the Z-axis rear substrate is fixed inside the main frame, the output shaft of the Z-axis driving mechanism is parallel to the Z-axis guide rail and its end is fixed on the Z-axis front substrate, the R-axis rotating seat is fixedly connected to the output shaft of the second rotating mechanism fixed on the Z-axis front substrate, and the second rotating mechanism is connected to the R-axis adjustment knob I.

5. The robot automated numerical control equipment for crystal plate chamfering according to claim 1, characterized in that: The chip flipping table includes a chamfering base, a chamfering base water shield, and a reference knife. The chamfering base is fixed on the table surface of the main frame, the reference knife is fixed on the side of the chamfering base, and the chamfering base water shield is surrounded by the chamfering base.

6. The robot automated numerical control equipment for crystal plate chamfering according to claim 1, characterized in that: The wafer flipping mechanism comprises a movable flipping seat, a rotating arm, a water receiving tray, a flipping fixed seat, a rotating cylinder and a fixed frame. The fixed frame and the water receiving tray are fixedly arranged on the table top of the main frame, the rotating cylinder is fixedly arranged on the fixed frame, the rotating arm is installed on the rotating cylinder, the movable flipping seat is installed on the rotating arm, and the flipping fixed seat is installed in the water receiving tray; slots are provided in the movable flipping seat and the flipping fixed seat, and the slots are connected to the vacuum generator.

7. The robot automated numerical control device for crystal plate chamfering according to claim 1, characterized in that: The silo device includes a feeding silo, a receiving silo, an upper fixed plate, a silo base, a receiving silo top rod for moving the crystal pieces in the receiving silo, a lower fixed plate, a feeding silo top rod for moving the crystal pieces in the feeding silo, a silo buckle, a feeding silo photoelectric sensor, a receiving silo photoelectric sensor, a feeding servo motor for driving the feeding silo top rod, and a receiving servo motor for driving the receiving silo top rod. The silo base is fixed to the front side of the main frame through the upper fixed plate and the lower fixed plate, the feeding silo and the receiving silo are connected to the silo base through the silo buckle, and the feeding silo photoelectric sensor and the receiving silo photoelectric sensor are installed on the table of the main frame.

8. The robot automated numerical control device for crystal plate chamfering according to claim 1, characterized in that: The numerical control equipment also includes a cooling circulating water device, which is used to spray cooling water onto the crystal sheet and the crystal sheet inverting table where the crystal sheet is located and to recover the cooling water.

9. The robot automated numerical control equipment for crystal plate chamfering according to claim 1, characterized in that: The main frame is provided with a quantifying device, which comprises a quantifying base fixed on the table of the main frame, a transverse micrometer fixed in the slot hole at the top of the quantifying base, and a vertical micrometer fixed in the slot hole at the side of the quantifying base.

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