Memory bank radiator suitable for DDR5 memory bank

Abstract

The utility model belongs to the technical field of memory banks, and particularly relates to a memory bank radiator suitable for a DDR5 memory bank, which comprises a radiator, radiating holes are arranged in the radiator, the lower end of the radiator is fixedly connected with elastic clamping blocks, radiating grooves are arranged in the elastic clamping blocks, and the radiating holes are communicated with the radiating grooves. A memory bank is slidably connected to the interior of the radiator, the elastic clamping blocks are connected with the memory bank in a clamping mode, a limiting plate is slidably connected to the interior of the radiator, the limiting plate makes contact with the memory bank, and a threaded rod is rotatably connected to the interior of the radiator. By arranging the elastic clamping blocks, the heat dissipation holes, the heat dissipation grooves and the like, the heat dissipation holes are designed to be square holes, convection is formed on the left side and the right side, an effective heat dissipation air channel is generated, heat generated by the memory bank can be effectively taken away, and the problem that the stability and the performance of a system are affected due to the fact that the memory bank cannot be effectively dissipated is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of memory modules, and specifically relates to a memory module radiator applicable to DDR5 memory modules. Background Art

[0002] With the development of computer technology, the operating frequency and power consumption required during the operation of memory modules are continuously increasing, and the resulting heat dissipation problem is becoming more and more serious. Traditional memory module heat dissipation solutions are difficult to meet the current heat dissipation requirements of high-performance memory modules. Especially during high-intensity operations (such as running large application programs or games), the temperature of the memory module may rise significantly, thereby affecting the stability and performance of the system. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a memory module radiator applicable to DDR5 memory modules, which solves the problem that the memory module cannot be effectively cooled, thereby affecting the stability and performance of the system.

[0004] To achieve the above purpose, the utility model provides the following technical solution: A memory module radiator applicable to DDR5 memory modules includes a radiator. Heat dissipation holes are provided inside the radiator. An elastic clamping block is fixedly connected to the lower end of the radiator. Heat dissipation grooves are provided inside the elastic clamping block. A memory module is slidably connected inside the radiator. The elastic clamping block is clamped and connected to the memory module. A limiting plate is slidably connected inside the radiator. The limiting plate contacts the memory module. A threaded rod is rotatably connected inside the radiator. The threaded rod is threadedly connected to the limiting plate.

[0005] Preferably, the number of the heat dissipation holes is multiple, and the multiple heat dissipation holes are evenly distributed on the radiator. Through the design of the heat dissipation holes, the radiator can better dissipate heat from the memory module.

[0006] Preferably, the number of the elastic clamping blocks is two, and the two elastic clamping blocks are symmetrically distributed on the radiator. Through the design of the elastic clamping blocks, the heat generated by the memory module can be conducted out.

[0007] Preferably, a guide rod is fixedly connected inside the radiator. The guide rod is slidably connected to the limiting plate. Through the design of the guide rod, the guide rod can play a guiding role for the limiting plate.

[0008] Preferably, a baffle is fixedly connected to the outer side of the threaded rod. The baffle contacts the radiator. Through the design of the baffle, the baffle can play a limiting role for the threaded rod.

[0009] Preferably, a knob is fixedly connected to the end of the threaded rod away from the radiator. The knob contacts the radiator. Through the design of the knob, the threaded rod can be conveniently rotated.

[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0011] 1. By providing components such as elastic clamping blocks, heat dissipation holes, and heat dissipation grooves, the present utility model designs the heat dissipation holes as square holes, forming a convection on the left and right sides, generating an effective heat dissipation air duct, which can effectively take away the heat generated by the memory module, solving the problem that the memory module cannot be effectively cooled, thereby affecting the stability and performance of the system.

[0012] 2. By providing components such as a limiting plate and a threaded rod, the present utility model can rotate the threaded rod to make the threaded rod perform a threaded movement with the limiting plate, thereby adjusting the position of the limiting plate, and then adjusting the distance between the limiting plates according to the specifications of the memory module, so that the limiting plate limits the memory module, and the radiator remains stable after being installed on the memory module. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a three-dimensional view of the overall structure of the present utility model Figure 1 ;

[0014] Figure 2 is a three-dimensional view of the overall structure of the present utility model Figure 2 ;

[0015] Figure 3 is the front elevation sectional view of the Figure 1 of the present utility model;

[0016] Figure 4 is the enlarged view of the structure of part A in the Figure 2 of the present utility model.

[0017] In the figure: 1. Radiator; 11. Heat dissipation hole; 2. Elastic clamping block; 21. Heat dissipation groove; 3. Memory module; 4. Limiting plate; 41. Guide rod; 42. Threaded rod; 43. Baffle; 44. Knob. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0019] Please refer to Figures 1-4A memory stick heat sink suitable for a DDR5 memory stick includes a heat sink 1, a heat sink 1 having a plurality of heat dissipation holes 11 disposed therein, the plurality of heat dissipation holes 11 being evenly distributed on the heat sink 1. Through the design of the heat dissipation holes 11, the heat sink 1 can better dissipate heat for the memory stick 3, and an elastic clamp 2 is fixedly connected to the lower end of the heat sink 1.

[0020] See also Figures 2-4 , there are two elastic clamps 2, and the two elastic clamps 2 are symmetrically distributed on the radiator 1. Through the design of the elastic clamps 2, the heat generated by the memory stick 3 can be exported. A heat dissipation groove 21 is provided inside the elastic clamps 2. The memory stick 3 is slidably connected to the inside of the radiator 1. The elastic clamps 2 are clamped and connected to the memory stick 3. The radiator 1 is slidably connected to the limit plate 4, and the limit plate 4 is in contact with the memory stick 3. The memory stick radiator provided by the present invention achieves efficient heat dissipation effect by optimizing the structural design and material selection. It was measured that under a room temperature of 28 degrees, an open rack, and an environment with two 6cm fans, after a one-hour TM5 baking test, the temperature of the memory stick 3 can be controlled at about 41 degrees (the temperature of the DDR5 memory stick without a heat dissipation vest is 51 degrees), which significantly improves the working stability and service life of the memory stick 3.

[0021] See also Figures 2-4 A guide rod 41 is fixedly connected inside the radiator 1, and the guide rod 41 is slidably connected to the limit plate 4. The design of the guide rod 41 can guide the limit plate 4. A threaded rod 42 is rotatably connected inside the radiator 1, and the threaded rod 42 is threadedly connected to the limit plate 4. A baffle 43 is fixedly connected to the outside of the threaded rod 42, and the baffle 43 is in contact with the radiator 1. The design of the baffle 43 can limit the threaded rod 42. A knob 44 is fixedly connected to the end of the threaded rod 42 away from the radiator 1, and the knob 44 is in contact with the radiator 1. The design of the knob 44 can facilitate the rotation of the threaded rod 42.

[0022] The specific implementation process of the utility model is as follows: when in use, the two elastic clamping blocks 2 are moved in a direction away from each other, and then the memory stick 3 is inserted into the heat sink 1 and placed between the two elastic clamping blocks 2. Then, the elastic clamping blocks 2 are released, so that the elastic clamping blocks 2 can clamp the memory stick 3. Then, the knob 44 is rotated to drive the threaded rod 42 to rotate, so that the threaded rod 42 and the limiting plate 4 can perform a threaded motion, so that the limiting plate 4 moves on the threaded rod 42, and the limiting plate 4 moves on the guide rod 41, so that the limiting plate 4 contacts the memory stick 3, so that the limiting plate 4 can limit the memory stick 3, so that the heat sink 1 can remain stable when installed on the memory stick 3; when the memory stick 3 generates heat, the elastic clamping blocks 2 will conduct the heat of the memory stick 3 and dissipate it through the heat dissipation holes 11 on the heat sink 1, thereby effectively dissipating the heat of the memory stick 3.

[0023] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A memory bar heat sink suitable for a DDR5 memory bar, comprising a heat sink (1), characterized in that: The heat sink (1) is provided with a heat dissipation hole (11) inside, the lower end of the heat sink (1) is fixedly connected with an elastic clamp block (2), the elastic clamp block (2) is provided with a heat dissipation groove (21) inside, the heat sink (1) is slidably connected with a memory bar (3), the elastic clamp block (2) is clamped and connected with the memory bar (3), the heat sink (1) is slidably connected with a limit plate (4), the limit plate (4) is in contact with the memory bar (3), the heat sink (1) is rotatably connected with a threaded rod (42), and the threaded rod (42) is connected to the limit plate (4) by threads.

2. A memory bar heat sink suitable for a DDR5 memory bar according to claim 1, characterized in that: The number of the heat dissipation holes (11) is multiple, and the multiple heat dissipation holes (11) are evenly distributed on the heat sink (1).

3. A memory bar heat sink suitable for a DDR5 memory bar according to claim 1, characterized in that: The number of the elastic clamping blocks (2) is two, and the two elastic clamping blocks (2) are symmetrically distributed on the heat sink (1).

4. The memory bar heat sink suitable for a DDR5 memory bar according to claim 1, characterized in that: A guide rod (41) is fixedly connected to the interior of the radiator (1), and the guide rod (41) is slidably connected to the limiting plate (4).

5. The memory bar heat sink suitable for DDR5 memory bar according to claim 1, characterized in that: A baffle (43) is fixedly connected to the outer side of the threaded rod (42), and the baffle (43) is in contact with the radiator (1).

6. The memory bar heat sink suitable for DDR5 memory bar according to claim 1, characterized in that: One end of the threaded rod (42) away from the radiator (1) is fixedly connected to a knob (44), and the knob (44) is in contact with the radiator (1).

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