Type-C test system and device

Abstract

The utility model relates to a Type-C test system and device, the Type-C test system comprises an MCU, an interface protocol module, a key switching module and a display module, the MCU is connected with the interface protocol module, the key switching module and the display module; the interface protocol module is used for being connected with an external Type-C interface device, and when the interface protocol module is connected with the Type-C interface device, the MCU displays a Type-C signal and power of the Type-C interface device through the display module based on signals of the key switching module and the interface protocol module. Through the key switching module, the user can easily select the Type-C signal and power to be tested, so that the test operation is simplified, and the test complexity is reduced. The test result can be displayed on the display module in real time, so that a user can know the test condition in time, the test accuracy and reliability are improved, the test efficiency is improved, and the test cost is reduced.

Description

Technical Field

[0001] This application relates to the technical field of data interface testing. Specifically, it relates to a Type-C testing system and device. Background Art

[0002] Type-C interfaces are now widely used in electronic devices such as mobile phones and laptops, and their application scope is still expanding. The interfaces of household small appliances, smart wearables, etc. are gradually replaced with Type-C interfaces. Then, what functions are supported by Type-C interface devices has become an urgent problem and topic to be solved.

[0003] Currently, to test the power of a Type-C interface, a voltage and current meter is needed for testing, and for testing signals, electronic products such as computers and mobile phones are required. Detecting a TYPE-C function is cumbersome, with many measuring tools and inconvenient. It is costly and time-consuming. For example, manually replacing external devices takes a lot of time. Especially in large-scale testing, the operation process is relatively cumbersome and time-consuming, which limits the testing efficiency and the number of tests. Summary of the Utility Model

[0004] The purpose of this application is to provide a Type-C testing system and device to solve the problems of cumbersome operation and low efficiency in the existing Type-C interface testing method.

[0005] To solve the above problems, this application adopts the following technical solutions to achieve:

[0006] The first aspect of this application provides a Type-C testing system. The Type-C testing system includes: an MCU, an interface protocol module, a key switching module, and a display module. The MCU is respectively connected to the interface protocol module, the key switching module, and the display module; the interface protocol module is used to connect to an external Type-C interface device. Among them, when the interface protocol module is connected to the Type-C interface device, the MCU, based on the signals of the key switching module and the interface protocol module, displays the Type-C signal and power of the Type-C interface device through the display module.

[0007] Through the key switching module, users can easily select the Type-C signal and power to be tested, simplify the testing operation, and reduce the complexity of testing. The test results can be displayed on the display module in real time, facilitating users to timely understand the testing situation, improving the accuracy and reliability of testing, enhancing the testing efficiency, and reducing the testing cost.

[0008] Further, the Type-C test system includes a first capacitive reactance circuit, the interface protocol module includes an interface chip, and the first capacitive reactance circuit is connected to the interface chip.

[0009] The first capacitive reactance circuit can perform impedance matching on the test signal, effectively suppress signal interference, ensure the stability of the test results, integrate the first capacitive reactance circuit with the interface chip, simplify the circuit design, and reduce the system complexity.

[0010] Further, the interface protocol module includes a first crystal oscillator circuit, and the first crystal oscillator circuit is connected to the interface chip.

[0011] The first crystal oscillator circuit can provide a reliable clock signal for the circuit to ensure the accuracy of the test results.

[0012] Further, the interface protocol module includes a first impedance circuit, one end of the first impedance circuit is connected to the power supply terminal, and the other end of the first impedance circuit is connected to the interface chip.

[0013] One end of the first impedance circuit is connected to the power supply terminal, which can provide a stable and reliable power supply for the interface chip to ensure the normal operation of the interface chip. The design of the first impedance circuit enables the system to adapt to different working environments and maintain good test performance even in an environment with poor power quality.

[0014] Further, the MCU includes a control chip and an electrostatic suppressor. The control chip is respectively connected to the interface chip, the button switching module, and the display module. One end of the electrostatic suppressor is connected to the control chip, and the other end of the electrostatic suppressor is grounded.

[0015] One end of the electrostatic suppressor is connected to the control chip and the other end is grounded, which can effectively suppress electrostatic interference, improve the stability of the entire test system, and ensure the accuracy of the test results.

[0016] Further, the MCU includes a second capacitive reactance circuit, one end of the second capacitive reactance circuit is connected to the power supply terminal, and the other end of the second capacitive reactance circuit is connected to the control chip.

[0017] One end of the second capacitive reactance circuit is connected to the power supply terminal, which can filter and stabilize the power signal, provide a more stable and clean power supply for the control chip, and protect the control chip from power noise and voltage fluctuations by connecting the second capacitive reactance circuit to the power supply terminal and the control chip.

[0018] Further, the MCU includes a second crystal oscillator circuit, and the second crystal oscillator circuit is connected to the MCU.

[0019] Further, the button switching module is provided with an LED lamp indication circuit and a button unit, and the button unit is respectively connected to the LED lamp indication circuit and the MCU.

[0020] By setting the LED lamp indication circuit and the button unit, accurate detection and response to button operations can be achieved, providing a smoother and more sensitive operation experience for users. At the same time, through the accurate detection of the button state by the LED lamp indication circuit, the possibility of misoperation can be effectively reduced, ensuring the accuracy of the test.

[0021] Further, the button switching module is provided with a plurality of LED lamp indication circuits, and the plurality of LED lamp indication circuits are arranged in parallel.

[0022] The plurality of LED lamp indication circuits are arranged in parallel. Even if one of the sensors fails, the other sensors can still work normally, ensuring the reliability of the system. The parallel connection of multiple sensors can improve the detection accuracy of the button state and enhance the detection sensitivity.

[0023] The present application also provides a Type-C test device, and the Type-C test device includes the Type-C test system described in any one of the above.

[0024] Compared with the prior art, the beneficial effect of the present application is that when the interface protocol module is connected to the Type-C interface device, the MCU displays the Type-C signal and power of the Type-C interface device through the display module based on the signals of the button switching module and the interface protocol module. Through the button switching module, users can easily select the Type-C signal and power to be tested, simplifying the test operation and reducing the complexity of the test. At the same time, the test results can be displayed on the display module in real time, facilitating users to timely understand the test situation and improving the accuracy and reliability of the test. Description of the Drawings

[0025] Figure 1 It is a system diagram of a Type-C test system provided by an embodiment of the present application;

[0026] Figure 2 It is a schematic diagram of an interface protocol module provided by an embodiment of the present application;

[0027] Figure 3 It is a schematic diagram of an MCU provided by an embodiment of the present application;

[0028] Figure 4 It is a schematic diagram of a first capacitive reactance circuit provided by an embodiment of the present application; and

[0029] Figure 5Schematic diagram of a key switching module provided by an embodiment of the present application.

[0030] Description of the reference numerals in the drawings:

[0031] 100, MCU; 200, interface protocol module; 210, interface chip; 220, first crystal oscillator circuit; 230, first impedance circuit; 300, key switching module; 400, display module; 500, Type-C interface device; 600, first capacitance reactance circuit; 110, control chip; 120, electrostatic suppressor; 130, second capacitance reactance circuit; 140, second crystal oscillator circuit; 301, LED lamp indication circuit; 302, key unit. Detailed implementation manners

[0032] The following describes in detail the specific implementation manners of the present application with reference to the drawings.

[0033] It should be noted that, without conflict, the embodiments in the present application and the technical features in the embodiments can be combined with each other. The detailed description in the specific implementation manners should be understood as an explanatory illustration of the purpose of the present application and should not be regarded as an improper limitation to the present application.

[0034] It should be understood that the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings. These orientation terms are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0035] Figure 1 System diagram of a Type-C test system provided by an embodiment of the present application, Figure 2 Schematic diagram of an interface protocol module provided by an embodiment of the present application, Figure 3 Schematic diagram of an MCU provided by an embodiment of the present application, Figure 4 Schematic diagram of a first capacitance reactance circuit provided by an embodiment of the present application, Figure 5 Schematic diagram of a key switching module provided by an embodiment of the present application. As Figures 1 to 5As shown in the figure, an embodiment of the present application provides a Type-C test system, including: an MCU 100, an interface protocol module 200, a button switching module 300, and a display module 400. The MCU 100 is respectively connected to the interface protocol module 200, the button switching module 300, and the display module 400. The interface protocol module 200 is used to connect to an external Type-C interface device 500. When the interface protocol module 200 is connected to the Type-C interface device 500, the MCU 100 displays the Type-C signal and power of the Type-C interface device 500 through the display module 400 based on the signals between the button switching module 300 and the interface protocol module 200.

[0036] Specifically, the MCU 100, the interface protocol module 200, the button switching module 300, and the display module 400 are connected through circuit connections to form a compact test platform and connected to an external Type-C interface device 500. For example, it is realized through physical connection lines to connect the Type-C interface device 500 to the test system.

[0037] After the interface protocol module 200 is connected to the Type-C interface device 500, the MCU 100 processes the Type-C signal and power data of the Type-C interface device 500 based on the signals provided by the button switching module 300 and the interface protocol module 200. The processed data will be displayed through the display module 400 so that the operator can intuitively read and understand the test results. Among them, the button switching module 300 allows the operator to select and execute different test functions through simple button operations. The MCU 100 can be programmed to implement an automated test process, reducing manual operations and improving test efficiency.

[0038] Through the button switching module 300, the user can easily select the Type-C signal and power to be tested, simplifying the test operation and reducing the complexity of the test. The test results can be displayed on the display module 400 in real time, facilitating the user to timely understand the test situation, improving the accuracy and reliability of the test, increasing the test efficiency, and reducing the test cost.

[0039] It should be noted that the Type-C test system according to the embodiments of the present application can replace test equipment such as voltage and current meters, mobile phones, and computers. The device is simple and low-cost, easy and fast to use. It can digitalize the function data supported by the TYPE-C interface device and display it through the LCD screen (display module). That is to say, it can be used to view the TYPE-C interface function parameters and also to test whether the device interface function is normal. The operation is simple and fast, and the test function parameters are clear at a glance. For example, by pressing the button to switch different modes and protocols, the signal and power are digitalized and then displayed on the LCD screen. After the external Type-C interface device communicates with the interface protocol module 200, the induced electricity information is notified to the MCU100, and after pressing the button to switch different modes and notifying the MCU100, the corresponding information is displayed on the LCD screen.

[0040] In some embodiments, the Type-C test system includes a first capacitive reactance circuit 600. The interface protocol module 200 includes an interface chip 210, and the first capacitive reactance circuit 600 is connected to the interface chip 210.

[0041] Specifically, the first capacitive reactance circuit 600 is used to test and compensate the capacitance and inductance components in the Type-C interface device to ensure the stable transmission of signals. The interface protocol module 200 includes an interface chip 210, which is responsible for processing the communication protocol and signal conversion with the Type-C interface device 500. For example, the first capacitive reactance circuit 600 is connected to the interface chip 210 through a circuit. The interface protocol module 200 is connected to the Type-C interface device 500 through a physical connection line. The interface chip 210 receives signals from the Type-C interface device 500 and converts them into a format that can be processed by the test system.

[0042] The first capacitive reactance circuit 600 can perform impedance matching on the test signal, effectively suppress signal interference, and ensure the stability of the test results. Integrating the first capacitive reactance circuit 600 with the interface chip 210 simplifies the circuit design and reduces the system complexity.

[0043] In some embodiments, the interface protocol module 200 includes a first crystal oscillator circuit 220, and the first crystal oscillator circuit 220 is connected to the interface chip 210.

[0044] Specifically, the interface protocol module 200 internally includes a first crystal oscillator circuit 220, which is used to provide a reliable clock signal to ensure the clarity and accuracy of the signal. The first crystal oscillator circuit 220 is connected to the interface chip 210 through a circuit, and the first crystal oscillator circuit 220 is also connected to the first capacitive reactance circuit 600 through a circuit. The interface chip 210 receives signals from the Type-C interface device 500 and converts them into a format that can be processed by the test system. The first crystal oscillator circuit 220 is used to provide a reliable clock signal, and the first capacitive reactance circuit 600 is used to compensate for the capacitive reactance component in the signal.

[0045] The first crystal oscillator circuit 220 can provide a reliable clock signal, thus ensuring the accuracy of the test results.

[0046] In some embodiments, the interface protocol module 200 includes a first impedance circuit 230. One end of the first impedance circuit 230 is connected to the power supply terminal, and the other end of the first impedance circuit 230 is connected to the interface chip 210.

[0047] Specifically, a first impedance circuit 230 is provided in the interface protocol module 200. The first impedance circuit 230 is used to match and adjust the impedance between the power supply terminal and the interface chip 210 to ensure the stable transmission of the signal. One end of the first impedance circuit 230 is connected to the power supply terminal to provide the required voltage for the circuit. The other end of the first impedance circuit 230 is connected to the interface chip 210. The first impedance circuit 230 is used to adjust the impedance component of the signal to improve the stability and accuracy of the signal.

[0048] One end of the first impedance circuit 230 is connected to the power supply terminal, which can provide a stable and reliable power supply for the interface chip 210 to ensure the normal operation of the interface chip 210. The design of the first impedance circuit enables the system to adapt to different working environments and maintain good test performance even in an environment with poor power quality.

[0049] In some embodiments, the MCU 100 includes a control chip 110 and an electrostatic suppressor 120. The control chip 110 is respectively connected to the interface chip 210, the button switching module 300, and the display module 400. One end of the electrostatic suppressor 120 is connected to the control chip 110, and the other end of the electrostatic suppressor 120 is grounded.

[0050] Specifically, a control chip 110 and an electrostatic suppressor 120 are provided inside the MCU 100. The control chip 110 is responsible for processing signals from the interface chip 210, the button switching module 300, and the display module 400, and executing corresponding control logics. The control chip 110 is connected to the interface chip 210, the button switching module 300, and the display module 400 through circuits. Its connection method can be achieved through the traces on a printed circuit board (PCB) to ensure the stability of the circuit and the clear transmission of signals. One end of the electrostatic suppressor 120 is connected to the control chip 110, and the other end is grounded. The interface chip 210 receives signals from the Type-C interface device 500 and converts them into a format that the test system can process. The button switching module 300 allows operators to select and execute different test functions through button operations, and the display module 400 is used to display the test results processed by the control chip 110.

[0051] One end of the electrostatic suppressor 120 is connected to the control chip 110, and the other end is grounded, which can effectively suppress electrostatic interference, improve the stability of the entire test system, and ensure the accuracy of test results.

[0052] In some embodiments, the MCU 100 includes a second capacitive reactance circuit 130. One end of the second capacitive reactance circuit 130 is connected to the power supply terminal, and the other end of the second capacitive reactance circuit 130 is connected to the control chip 110.

[0053] Specifically, the second capacitive reactance circuit 130 inside the MCU 100 is used to test and compensate for the capacitance and inductance components in the Type-C interface device to ensure the stable transmission of signals. One end of the second capacitive reactance circuit 130 is connected to the power supply terminal to provide the required voltage for the circuit, and the other end of the second capacitive reactance circuit 130 is connected to the control chip 110. This connection can be achieved through the traces on a printed circuit board (PCB) to ensure the stability of the circuit and the clear transmission of signals. The control chip 110 receives signals from the interface chip 210 and converts them into a format that the test system can process. The second capacitive reactance circuit 130 is used to compensate for the capacitive reactance components in the signals to improve the stability and accuracy of the signals. Integrating the second capacitive reactance circuit 130 and the control chip 110 in the same test system can quickly respond and execute tests, reducing the test time.

[0054] One end of the second capacitive reactance circuit 130 is connected to the power supply terminal, which can filter and stabilize the power supply signals, providing a more stable and clean power supply for the control chip. Connecting the power supply terminal and the control chip 110 through the second capacitive reactance circuit 130 can protect the control chip 110 from being damaged by power supply noise and voltage fluctuations.

[0055] In some embodiments, the MCU 100 includes a second crystal oscillator circuit 140, and the second crystal oscillator circuit 140 is connected to the MCU. Specifically, the second crystal oscillator circuit 140 of the MCU 100 is used to provide the required clock signal to ensure the stable transmission of signals. For example, one end of the second crystal oscillator circuit 140 is connected to the power supply terminal to provide the required clock signal for the circuit. The other end of the second crystal oscillator circuit 140 is connected to the control chip 110. The control chip 110 receives the signal from the interface chip 210 and converts it into a format that can be processed by the test system. The second crystal oscillator circuit 140 is used to provide the required clock signal to improve the stability and accuracy of the signal.

[0056] The second crystal oscillator circuit 140 provides the required clock signal, improves the operating stability of the control chip 110, and provides a more stable and clean clock signal for the control chip 110.

[0057] In some embodiments, the key switching module 300 is provided with an LED lamp indication circuit 301 and a key unit 302, and the key unit 302 is connected to the LED lamp indication circuit 301 and the MCU 100 respectively.

[0058] Specifically, the key switching module 300 is used to allow the operator to select and execute different test functions through key operations. The key switching module 300 internally has an LED lamp indication circuit 301 and a key unit 302. The LED lamp indication circuit 301 is used to detect the state of the key unit 302, such as whether it is pressed. The key unit 302 is connected to the LED lamp indication circuit 301 through a circuit, and the other end of the key unit 302 is connected to the MCU 100. When the operator presses the key unit 302, the LED lamp indication circuit 301 detects the change in the key state and sends the signal to the MCU 100. The MCU 100 then performs corresponding operations, such as selecting different test modes or executing specific test commands.

[0059] By setting the LED lamp indication circuit 301 and the key unit, accurate detection and response to key operations can be achieved, providing a smoother and more sensitive operation experience for users. At the same time, through the accurate detection of the key state by the LED lamp indication circuit 301, the possibility of misoperation can be effectively reduced, ensuring the accuracy of the test.

[0060] In some embodiments, the key switching module 300 is provided with a plurality of LED lamp indication circuits 301, and the plurality of LED lamp indication circuits 301 are arranged in parallel.

[0061] Specifically, multiple LED indicator circuits inside the button switching module 300 are connected in parallel. This means that each LED indicator circuit 301 is directly connected to the MCU 100, rather than being connected in series or in parallel with each other. The other end of the button unit 302 is connected to the MCU 100. When an operator presses the button unit 302, the corresponding LED indicator circuit 301 detects the change in the button state and sends this signal to the MCU 100. The MCU 100 then performs corresponding operations, such as selecting different test modes or executing specific test commands.

[0062] The multiple LED indicator circuits 301 are connected in parallel. Even if one of them fails, the others can still work normally, ensuring the reliability of the system, improving the detection accuracy of the button state, and enhancing the detection sensitivity.

[0063] The embodiment of the present application also provides a Type-C test device. The Type-C test device includes the Type-C test system of any one of the above.

[0064] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions required to be protected by the present application.

Claims

1. A Type-C test system, characterized in that: The Type-C test system includes: an MCU, an interface protocol module, a key switching module and a display module, wherein the MCU is respectively connected to the interface protocol module, the key switching module and the display module; the interface protocol module is used to connect to an external Type-C interface device, wherein when the interface protocol module is connected to the Type-C interface device, the MCU displays the Type-C signal and power of the Type-C interface device through the display module based on the signals of the key switching module and the interface protocol module.

2. A Type-C test system according to claim 1, characterized in that: The Type-C test system includes a first capacitive reactance circuit, the interface protocol module includes an interface chip, and the first capacitive reactance circuit is connected to the interface chip.

3. A Type-C test system according to claim 2, characterized in that: The interface protocol module includes a first crystal oscillator circuit, and the first crystal oscillator circuit is connected to the interface chip.

4. A Type-C test system according to claim 2, characterized in that: The interface protocol module includes a first impedance circuit, one end of the first impedance circuit is connected to a power supply end, and the other end of the first impedance circuit is connected to the interface chip.

5. A Type-C test system according to claim 4, characterized in that: The MCU comprises a control chip and an electrostatic suppressor, wherein the control chip is respectively connected to the interface chip, the key switching module and the display module, one end of the electrostatic suppressor is connected to the control chip, and the other end of the electrostatic suppressor is grounded.

6. A Type-C test system according to claim 5, characterized in that: The MCU includes a second capacitive reactance circuit, one end of the second capacitive reactance circuit is connected to the power supply end, and the other end of the second capacitive reactance circuit is connected to the control chip.

7. A Type-C test system according to claim 5, characterized in that: The MCU includes a second crystal oscillator circuit, and the second crystal oscillator circuit is connected to the MCU.

8. A Type-C test system according to claim 1, characterized in that: The key switch module is provided with an LED light indication circuit and a key unit, and the key unit is connected to the LED light indication circuit and the MCU respectively.

9. A Type-C test system according to claim 8, characterized in that: The key switch module is provided with a plurality of LED light indication circuits, and the plurality of LED light indication circuits are arranged in parallel.

10. A Type-C testing device, characterized in that: The Type-C test device comprises the Type-C test system according to any one of claims 1 to 9.

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