Via hole, printed antenna, LDS antenna and terminal device

Abstract

The utility model provides a via hole printed antenna, an LDS antenna and a terminal device, the via hole is arranged on a carrier plate having a first surface and a second surface which are oppositely arranged, the via hole comprises a first through hole and a second through hole, and the first through hole and the second through hole are connected and communicated in a stepped manner; the first through hole comprises a first aperture, a second aperture and a first hole wall connected with the first aperture and the second aperture, and the first hole wall is gradually shrunk from the first aperture to the second aperture to form a trumpet shape; the second through hole comprises a third caliber, a fourth caliber and a second hole wall connected with the third caliber and the fourth caliber, and the bottom of the first through hole is in stepped connection with the second hole wall; the third aperture and the second aperture are located on the same plane, and the third aperture is smaller than the second aperture. According to the utility model, the two surfaces of the substrate structure or the carrier plate can be communicated and connected, the overall waterproof performance of the substrate structure or the carrier plate can be effectively improved, the overall quality of the substrate structure is improved, the attractive appearance of a product is effectively improved, the overall service life of the product is prolonged, and the safety performance of the product is improved.

Description

Technical Field

[0001] The utility model relates to the field of communication technologies, and particularly to a via hole, a printed antenna, an LDS antenna and a terminal device. Background Art

[0002] With the continuous development of 5G base station construction, the frequency bands supported by communication terminals are also continuously expanding. Nowadays, mobile phones and watches are common mobile terminal products for people. With the continuous development of technology, wearable devices are also inevitably using 5G communication technology. This requires an increase in the number of antennas in wearable devices. For example, the space of a watch is limited, and the bandwidth of the antenna is also limited by the space, so that the frequency bands covered by the antenna are limited, making it difficult to achieve the bandwidth radiation of the antenna. Printed antennas are mostly used on wearable devices. With the rapid development of wireless communication technology and the strengthening of people's safety awareness, wearable electronic products have become an indispensable part of daily work. Most conventional electronic products have a low waterproof level, which poses certain potential hazards to the service life and safety of electronic products. In addition, during the process of processing printed antennas, when opening holes on some relatively thick substrate carriers, due to the small size of the hole-opening mold, it may not be possible to successfully open the mold at one time. Or on some relatively thin substrate carriers, there may be a situation where the hole-opening mold is not suitable, resulting in poor hole-opening quality and affecting the appearance of the product.

[0003] In view of this, it is indeed necessary for the utility model to provide a new type of via hole to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a via hole, which can not only connect the two sides of a connecting substrate structure or a carrier board, but also effectively improve the overall waterproof performance of the substrate structure or the carrier board, improve the overall quality of the substrate structure, effectively improve the appearance beauty of the product, and improve the overall service life and safety performance of the product.

[0005] To solve the above technical problems, the utility model provides a via hole, which is opened on a carrier board having a first surface and a second surface arranged opposite to each other. The via hole includes an integrally formed first through hole and a second through hole, and the first through hole and the second through hole are connected in a stepped manner and communicate with each other;

[0006] The first through hole includes a first diameter, a second diameter, and a first hole wall connecting the first diameter and the second diameter, and the first hole wall gradually contracts from the first diameter to the second diameter;

[0007] The second through hole includes a third diameter, a fourth diameter, and a second hole wall connecting the third diameter and the fourth diameter, and the bottom of the first through hole is connected to the second hole wall in a stepped manner;

[0008] The third diameter and the second diameter are both located on the same plane, and the third diameter is smaller than the second diameter.

[0009] As a further improvement of the present utility model, the first diameter, the second diameter, the third diameter, and the fourth diameter are all circular.

[0010] As a further improvement of the present utility model, the ratio of the diameter of the second diameter to the diameter of the third diameter is [3.1, 3.5].

[0011] As a further improvement of the present utility model, the stepped connection between the bottom of the first through hole and the second hole wall is configured as a smooth stepped connection part.

[0012] As a further improvement of the present utility model, the roughness of both the first hole wall and the second hole wall is 0.6μm to 1.3μm.

[0013] As a further improvement of the present utility model, the ratio of the height of the first through hole to the height of the second through hole is [4.1, 4.5].

[0014] The purpose of the present utility model is to provide a printed antenna to better apply the above-mentioned vias.

[0015] To solve the above technical problems, the present utility model provides a printed antenna, which includes a substrate structure, a conductive silver paste layer, and the aforementioned vias. The vias are opened on the substrate structure, the conductive silver paste is laid on the opposite two side surfaces of the substrate structure, and part of the conductive silver paste is poured into the vias to electrically connect the two side surfaces of the substrate structure.

[0016] The purpose of the present utility model is to provide an LDS antenna to better apply the above-mentioned vias.

[0017] To solve the above technical problems, the present utility model provides an LDS antenna, which includes a carrier board, a conductive layer, and the aforementioned vias. The vias are opened on the carrier board, and the conductive layer is laser-engraved and plated on the surface of the carrier board and the hole walls of the vias.

[0018] As a further improvement of the present utility model, the LDS antenna further includes a sealant, and the sealant is poured into the vias.

[0019] The purpose of the present utility model is to provide a terminal device to better apply the above-mentioned vias.

[0020] To solve the above technical problems, the present utility model provides a terminal device, and the terminal device includes the aforementioned vias.

[0021] The present utility model provides a via hole. The via hole is formed in a carrier board having a first surface and a second surface disposed opposite to each other. The via hole includes a first through hole and a second through hole, and the first through hole and the second through hole are connected in a stepped manner and communicate with each other. The first through hole includes a first diameter, a second diameter, and a first hole wall connecting the first diameter and the second diameter. The first hole wall gradually contracts from the first diameter to the second diameter to form a flared shape. The second through hole includes a third diameter, a fourth diameter, and a second hole wall connecting the third diameter and the fourth diameter. The bottom of the first through hole is connected to the second hole wall in a stepped manner. The third diameter and the second diameter are both located in the same plane, and the third diameter is smaller than the second diameter. The present utility model can not only connect the two sides of the connection substrate structure or the carrier board, but also effectively improve the overall waterproof performance of the substrate structure or the carrier board, improve the overall quality of the substrate structure, effectively improve the appearance beauty of the product, and improve the overall service life and safety performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 FIG. is a schematic structural view of the substrate structure / carrier board of the present utility model.

[0023] Figure 2 is Figure 1 FIG. is a schematic structural view of the via hole in detail A in.

[0024] Figure 3 FIG. is a schematic structural view of another embodiment of the substrate structure / carrier board of the present utility model.

[0025] Among them, the descriptions of the respective reference numerals are as follows:

[0026] The first surface 1, the second surface 3, the via hole 2, the substrate structure / carrier board 4, the first through hole 21, and the second through hole 22. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following further elaborates on the via hole 2 proposed by the present utility model in conjunction with the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise scales, only for conveniently and clearly assisting in explaining the purpose of the embodiments of the present utility model. In addition, the structures shown in the accompanying drawings are often a part of the actual structure. In particular, the accompanying drawings need to show different focuses and sometimes use different scales.

[0028] The present utility model provides a via hole 2, and the via hole 2 can be applied to mobile terminal devices, such as watches in wearable devices.

[0029] The present utility model provides a via hole 2, which is formed in a carrier board having a first surface 1 and a second surface 3 arranged opposite to each other. The via hole 2 includes an integrally formed first through hole 21 and a second through hole 22, and the first through hole 21 and the second through hole 22 are connected in a stepped manner and communicate with each other; the first through hole 21 includes a first diameter, a second diameter, and a first hole wall connecting the first diameter and the second diameter, and the first hole wall gradually contracts from the first diameter to the second diameter to form a trumpet shape; the second through hole 22 includes a third diameter, a fourth diameter, and a second hole wall connecting the third diameter and the fourth diameter, and the bottom of the first through hole 21 is connected to the second hole wall in a stepped manner; the third diameter and the second diameter are both located in the same plane, and the third diameter is smaller than the second diameter.

[0030] This via hole 2 can be applied to a printed antenna. The printed antenna includes a substrate structure 4, a conductive silver paste layer, and the via hole 2. The via hole 2 is formed in the substrate structure 4, and the conductive silver paste is laid on opposite side surfaces of the substrate structure 4. Part of the conductive silver paste is poured into the via hole 2 to electrically connect the two side surfaces of the substrate structure 4.

[0031] This via hole 2 can also be applied to an LDS antenna. The LDS antenna includes a carrier board, a conductive layer, and the via hole 2. The via hole 2 is formed in the carrier board, and the conductive layer is laser engraved and plated on the surface of the carrier board and the hole wall of the via hole 2.

[0032] With such a setting, the substrate structure 4 or the carrier board of the present utility model can not only effectively improve the overall waterproof performance of the product, but also improve the overall quality of the substrate structure 4 or the carrier board, effectively improve the appearance beauty of the product, and improve the overall service life and safety performance of the product.

[0033] Further, the first diameter, the second diameter, the third diameter, and the fourth diameter are all circular. The ratio range of the diameter of the second diameter to the diameter of the third diameter is [3.1, 3.5]; specifically, the diameter range of the second diameter is 0.5 mm - 0.7 mm, and the diameter range of the third diameter is 0.1 mm - 0.3 mm. The stepped connection between the bottom of the first through hole 21 and the second hole wall is configured as a smooth stepped connection part, that is, the bottom of the first through hole 21 and the second hole wall are stepped and connected to form a right angle. This can effectively prevent the filling liquid, such as conductive silver paste or sealant, from accumulating at the bottom of the first through hole when filling the via hole. The roughness of both the first hole wall and the second hole wall is Ra(0.6 μm - 1.3 μm). This can evenly control the infusion flow rate of the filling liquid in the via hole, so that the speed is not too fast to adhere to the hole wall, or too slow to fill and lay the via hole, resulting in uneven filling of the filling liquid. The ratio of the height of the first through hole to the height of the second through hole is [4.1, 4.5]. Specifically, the height range of the second through hole 22 is 0.2 mm - 0.3 mm. The ratio of the height of the first through hole to the height of the second through hole can be adjusted according to the opening die. Preferably, in this embodiment, the opening die and laser drilling are used. The ratio of the height of the first through hole to the height of the second through hole is [4.1, 4.5]. Considering the thickness limitation of laser drilling, of course, an opening die with a different size model can also be used for one-time opening, as long as the connection position between the integrally formed and connected second through hole and the first through hole is stepped, so as to achieve waterproofing and quality protection of the carrier board or substrate structure.

[0034] That is to say, the substrate structure 4 of the present invention is mainly applied to the printed antenna or LDS antenna of the terminal device. Below, the substrate structure 4 with a via hole 2 provided in the printed antenna will be mainly taken as an example. The substrate structure 4 includes a first surface 1 and a second surface 3. A via hole 2 is provided in the substrate structure 4, and the via hole 2 connects the first surface 1 and the second surface 3; the via hole 2 includes an integrally formed and interconnected first through hole 21 and a second through hole 22. The first through hole 21 shrinks from the first surface 1 or the second surface 3 towards the second through hole 22, and one end of the second through hole 22 is stepped and connected and communicated with one end of the first through hole 21.

[0035] With such a setting, the substrate structure 4 of the present invention can not only effectively improve the overall waterproof performance of the product, but also improve the overall quality of the substrate structure 4, effectively improve the appearance beauty of the product, and improve the overall service life and safety performance of the product.

[0036] Specifically, the arrangement of the vias 2 on the substrate structure 4 can not only optimize the laying of the conductive silver paste for the printed antenna, but also improve the overall quality of the substrate structure 4 when the substrate structure 4 is perforated, effectively enhancing the appearance of the overall product of the printed antenna based on the substrate structure 4. Moreover, the arrangement where one end of the second via 22 is in a stepped connection and communication with one end of the first via 21 improves the overall waterproof performance of the product, thereby increasing the overall service life and safety performance of the product.

[0037] In addition, when laying the conductive silver paste layer on the first surface 1 and the second surface 3 of the substrate structure 4 of the printed antenna on the mobile terminal device, generally, the first surface 1 of the substrate structure 4 is printed first, then the second surface 3 of the substrate structure 4 is printed in reverse, and then the vias are filled with silver paste. In the actual operation process, there will inevitably be some excessive silver paste on the first surface 1 or the second surface 3 of the substrate structure 4 when laying the conductive silver paste. At this time, the vias can not only conduct the first surface 1 and the second surface 3 of the substrate structure 4, but also carry more silver paste on both sides, optimizing the flatness of the inner and outer surfaces.

[0038] Furthermore, the first via 21 is conical in shape, and the second via 22 is cylindrical in shape. The diameter of the first via 21 on the surface of the substrate structure 4 is circular, the hole wall of the first via 21 is curved, the hole wall of the first via 21 is centrosymmetric about the center of the diameter, and the hole wall of the first via 21 approaches and contracts towards the center of the circle in the horizontal direction; the cross-section of the hole wall of the second via 22 is rectangular.

[0039] With such an arrangement, when the conductive silver paste is poured into the first via 21, the contact area between the conductive silver paste and the via can be increased, and the phenomenon of silver paste breakage after drying will not occur; the hole wall of the first via 21 is curved, the hole wall of the first via 21 is centrosymmetric about the center of the diameter, and the hole wall of the first via 21 approaches and contracts towards the center of the circle in the horizontal direction. In this way, not only can the contact area between the via and the conductive silver paste be increased, but also the pouring speed of the conductive silver paste can be made uniform when the conductive silver paste is poured into the first via 21, avoiding the conductive silver paste from accelerating when poured into the via under the action of gravity, resulting in the silver paste being difficult to adhere to the hole wall of the first via 21 and depositing at the bottom of the via.

[0040] Furthermore, one end of the first via 21 close to the second via 22 is circular in shape, and the inner diameter of this port is the first diameter, that is, the diameter D1 of the second diameter; one end of the second via 22 close to the first via 21 is circular in shape, and the inner diameter of this port is the second diameter, that is, the diameter D2 of the third diameter. The second diameter is smaller than the first diameter, that is, the diameter of the second diameter is smaller than the diameter of the third diameter. Preferably, the diameter range D1 of the second diameter is 0.5 mm - 0.7 mm, and the diameter range D2 of the third diameter is 0.1 mm - 0.3 mm

[0041] In practical applications, according to the thickness of the substrate structure 4 and the size of the punching die, the height range of the second through hole 22 is 0.2 mm - 0.3 mm. In order to reduce the production process of the substrate structure 4 and simplify the complexity of opening through holes on the substrate structure 4, the first through hole 21 is opened on the substrate structure 4 at one time using a punching die. When using the punching die for punching, the die will cause wear on the surface of the substrate structure 4. Therefore, the height of the selected punching die is less than the height of the substrate structure 4, so as to avoid wear on the surface of the substrate structure 4.

[0042] Preferably, the second through hole 22 of the present utility model adopts the method of laser perforation. Laser perforation can make the second through hole 22 form a cylindrical shape and the diameter of the through hole is relatively small. The second through hole 22 is formed by laser perforation and is communicated with the first through hole 21. The height of the second through hole 22 being between 0.2 mm and 0.3 mm is the preferred thickness for laser perforation. In this way, one end of the second through hole 22 close to the first through hole 21 can also be circularly arranged. The inner diameter of this port is the second diameter, and the second diameter is smaller than the first diameter. In this way, one end of the second through hole 22 and one end of the first through hole 21 can be stepped and connected. That is to say, the connection position between the first through hole 21 and the second through hole 22 is stepped. Such a setting can not only make the appearance aperture size of one side of the substrate structure 4 relatively small, resulting in a good overall appearance effect, but also play a waterproof role.

[0043] It should be noted that after the substrate structure 4 processes the second through hole 22, it is necessary to clean the plastic debris at the inner and outer connections to avoid affecting the printing of the conductive silver paste circuit.

[0044] Preferably, the substrate structure 4 is made of plastic material. The commonly used plastic grades are PC material, PA material or PA + glass fiber plastic particles, and it is formed by plastic processing. The minimum skin thickness of the PDS circuit printing surface needs to be guaranteed to be 0.8 mm. To avoid deformation of the substrate structure 4 during the baking process of printing PDS or LDS circuits, the deformation degree of the substrate structure 4 needs to be controlled within the range of 0.05 - 0.1 mm to avoid causing breakage of the circuit layer. In practical applications, the setting of the second through hole 22 can reduce the deformation degree of the substrate structure 4.

[0045] The first through hole 21 of the substrate structure 4 is opened by a punching die, and the second through hole 22 is formed by laser perforation or mechanical drilling process. The aperture of the second through hole 22, that is, the second diameter D2, is controlled within the range of 0.1 mm - 0.3 mm to avoid too large an aperture, which may easily cause appearance defects such as surface depression during the baking process after printing the conductive silver paste circuit layer.

[0046] Furthermore, the roughness of the inner wall of the first through-hole 21 should meet Ra (0.6μm - 1.30μm), where Ra is the general symbol for roughness. If the roughness is too low, it will affect the adhesion of the conductive silver paste circuit to the printed layer within the first through-hole 21, failing to meet the industry's conventional standard requirement of greater than 4B. Meanwhile, the stepped connection between the second through-hole 22 and the first through-hole 21 is a smooth stepped connection part. That is, after the second through-hole 22 is formed, it is necessary to remove the plastic burrs at the stepped connection part to avoid the fracture of the printed circuit layer.

[0047] In the application of the LDS antenna, a conductive layer is formed on the inner wall of the via-hole 2 and the surface of the carrier board using the laser engraving plating process. At this time, the via-hole 2 electrically conducts the two side surfaces of the carrier board. Then, a sealing glue is filled into the via-hole 2. The second through-hole 22 can not only effectively improve the overall waterproof performance of the product, but also enhance the overall quality of the substrate structure 4, effectively improve the appearance beauty of the product, and improve the overall service life and safety performance of the product.

[0048] Of course, in the present utility model, the second through-hole 22 can also be arranged in other shapes, as long as it is ensured that the second diameter is smaller than the first diameter. In this way, it can also avoid problems such as surface depression and other appearance defects that are likely to occur during the baking process after the conductive silver paste printed circuit is faulted due to a larger aperture, and can also reduce the damage to the surface of the substrate structure 4 by the opening die.

[0049] When the thickness of the substrate structure 4 of the present utility model is too large, a double-cone structure design can be adopted, that is, the first through-holes 21 with the same structure are opened on both the first surface 1 and the second surface 3 of the substrate structure 4 using an opening die to form a double-cone structure. The sizes of the two first through-holes 21 are determined according to the thickness of the substrate structure 4. The second through-hole 22 is opened between the two first through-holes 21, and the inner diameter of the second through-hole 22, that is, the second diameter, is smaller than the inner diameter of one end of the first through-hole 21, that is, the first diameter. In this way, it can reduce the damage to the substrate structure 4 caused by the opening impact during the opening process. Secondly, the second through-hole 22 can also effectively improve the overall waterproof performance of the product, that is, effectively improve the appearance beauty of the product, and also improve the overall service life and safety performance of the product.

[0050] Generally, if the thickness of the substrate structure 4 is within the range of 0.8mm - 1.2mm, a single-cone structure design can be adopted. If the thickness of the substrate structure 4 is greater than 1.2mm, a double-cone structure design can be adopted. Conductive silver paste is laid on both the first surface 1 and the second surface 3 of the substrate structure 4, and the thickness of the silver paste is controlled within 10um - 20um. A part of the excess conductive silver paste can enter the through-hole, and then the through-hole is filled with conductive silver paste, and then sent for baking.

[0051] The present utility model provides a substrate structure 4, which is applied to a printed antenna of a terminal device. The substrate structure 4 includes a first surface 1 and a second surface 3. A through hole is formed in the substrate structure 4, and the through hole connects the first surface 1 and the second surface 3. The through hole includes a first through hole 21 and a second through hole 22 that communicate with each other. The first through hole 21 contracts from the first surface 1 or the second surface 3 towards the second through hole 22. One end of the second through hole 22 is connected to and communicates with one end of the first through hole 21 in a stepped manner. The substrate structure 4 of the present utility model can not only effectively improve the overall waterproof performance of the product, but also improve the overall quality of the substrate structure 4, effectively improve the appearance beauty of the product, and improve the overall service life and safety performance of the product.

[0052] It should be noted that the various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other. In addition, the different parts among the various embodiments can also be combined and used with each other. The present utility model does not limit this.

[0053] The above description is only a description of the preferred embodiments of the present utility model, and does not limit the scope of the present utility model in any way. Any changes and modifications made by those of ordinary skill in the art of the present utility model based on the above disclosure are within the protection scope of the claims.

Claims

1. A via hole, applied to an antenna, characterized in that: The conducting hole is provided on a carrier plate having a first surface and a second surface arranged opposite to each other, the conducting hole comprises a first through hole and a second through hole formed in one piece, and the first through hole and the second through hole are connected and communicated in a stepped manner; The first through hole comprises a first aperture, a second aperture, and a first aperture wall connecting the first aperture and the second aperture, and the first aperture wall gradually shrinks from the first aperture to the second aperture; The second through hole comprises a third aperture, a fourth aperture and a second hole wall connecting the third aperture and the fourth aperture, and the bottom of the first through hole is connected with the second hole wall in a stepped manner; The third caliber and the second caliber are located on the same plane, and the third caliber is smaller than the second caliber.

2. The via hole according to claim 1, wherein: The first caliber, the second caliber, the third caliber and the fourth caliber are all arranged in a circular shape.

3. The via hole according to claim 2, wherein: The ratio of the diameter of the second caliber to the diameter of the third caliber is in the range of [3.1, 3.5].

4. The via hole according to claim 3, wherein: The stepped connection between the bottom of the first through hole and the second hole wall is configured as a smooth stepped connection portion.

5. The via hole according to claim 4, characterized in that: The roughness of the first hole wall and the second hole wall are both Ra (0.6 μm to 1.30 μm).

6. The via hole according to claim 5, characterized in that: The ratio of the height of the first through hole to the height of the second through hole is in the range of [4.1, 4.5].

7. A printed antenna, characterized in that: The printed antenna includes a substrate structure, a conductive silver paste layer and the via hole described in any one of claims 1 to 6, wherein the via hole is opened on the substrate structure, the conductive silver paste is laid on two opposite sides of the substrate structure, and a portion of the conductive silver paste is poured into the via hole to electrically connect the two side surfaces of the substrate structure.

8. An LDS antenna, characterized in that: The LDS antenna comprises a carrier plate, a conductive layer and the via hole described in any one of claims 1 to 6, wherein the via hole is opened on the carrier plate, and the conductive layer is laser plated on the surface of the carrier plate and the hole wall of the via hole.

9. The LDS antenna according to claim 8, characterized in that: The LDS antenna further includes a sealant, and the sealant is poured into the conducting hole.

10. A terminal device, characterized in that: The terminal device comprises the via hole as claimed in any one of claims 1-6.

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