Punching die with dismounting and mounting structure
By designing a punching mold with a disassembly and assembly structure, including a chip removal mechanism and a collection frame, the problem of low chip cleaning efficiency in the prior art is solved, and rapid automatic chip removal and automatic collection during the punching process is realized, which improves the working efficiency and practicality of the equipment.
Patent Information
- Application Number
- CN202421125337.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-05-22
AI Technical Summary
After processing, existing punching molds require manual cleaning of residual chips, which is inefficient and increasing the cleaning mechanism will take up space and increase manufacturing costs, making it difficult to achieve rapid chip removal.
A punching mold with a disassembly and assembly structure is designed, including an upper die, a lower die, a stamping die and a collection frame. The lower die is equipped with a chip removal mechanism, which consists of a chip removal part and an anti-blocking component, and can quickly discharge chips during the punching process and automatically collect them through the collection frame.
It realizes rapid and automatic chip discharge during the punching process, improves work efficiency, reduces manual operation, and has a compact structure and suitable for conventional punching molds, which has good promotion and practicality.
Smart Images

Figure CN222919445U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of punching dies, and particularly relates to a punching die with a disassembly and assembly structure. Background Technique
[0002] A die refers to various dies and tools used in industrial production for injection molding, blow molding, extrusion, die casting, forging, smelting, stamping, etc. to obtain the required products. In machining production, it is often necessary to open holes or slots in metal parts, so punching die blanking processing is adopted to improve production efficiency.
[0003] At present, after the metal parts are processed by a punching die, the remaining chips will fall on the lower die. In order to ensure normal punching in the follow-up, manual cleaning is required, or a special cleaning mechanism is added to complete the cleaning. However, the manual cleaning work efficiency is low, and adding a special cleaning mechanism will increase the occupied space and manufacturing cost of the entire punching die. A punching die is disclosed in the publication number CN105344803B. This patent only uses the upper die structure to achieve the function of rapid chip removal, but there are great limitations in application. Therefore, how to achieve rapid chip removal on a punching die with upper and lower dies is a problem that needs to be solved urgently at present. Content of the Utility Model
[0004] The purpose of the utility model is to provide a punching die with a disassembly and assembly structure to solve the problem that the existing punching die cannot achieve simple and rapid chip removal proposed in the above background technique.
[0005] To achieve the above purpose, the utility model provides the following technical solutions: A punching die with a disassembly and assembly structure includes
[0006] An upper die, with a punching knife installed in the middle of the bottom end face, serving as the punching moving part of the punching die;
[0007] A lower die, with a chip removal mechanism arranged inside, and the chip removal mechanism is composed of a chip removal part and an anti-blocking component, where:
[0008] The top end of the chip removal part is directly below the punching knife, and the bottom end extends obliquely towards one side of the lower die and penetrates to the outside of the lower die. The top end is used to receive chips, and the bottom end is used to discharge chips;
[0009] The anti-blocking component is composed of an anti-blocking part and a pushing part. The anti-blocking part is opened on the bottom end face of the lower die and is located in the vertical projection area of the chip removal part, while the pushing part is arranged inside the chip removal part and is arranged in a dislocation manner with the top end of the chip removal part;
[0010] The stamping die is installed on the top surface of the lower die. There is a hole on the top surface of the stamping die. During processing, the punching knife will penetrate through the hole to punch the workpiece, and the chips in the hole will be discharged from the chip removal part. The hole, the punching knife, and the chip removal part are on the same vertical line;
[0011] The collection box is provided with a disassembly and assembly part. The disassembly and assembly part is spliced on one side of the lower die and is used to collect the discharged chips.
[0012] Preferably, the chip removal part includes a blanking groove opened in the middle of the top surface of the lower die, and a discharge groove opened inside the lower die, with its top connected to the blanking groove and its bottom extending obliquely towards one side of the lower die. The dropped chips will gradually slide from the discharge groove, thereby achieving the purpose of discharge.
[0013] Preferably, one side of the top of the discharge groove extends towards the other side of the lower die, the pushing part is a pushing block arranged inside one side of the top of the discharge groove, the anti-blocking part is an adjustment groove opened in the middle of the bottom surface of the lower die, and a magnetic block is magnetically attracted in the adjustment groove. The magnetic block is magnetically connected to the pushing block.
[0014] Preferably, a material pushing groove is opened on the front surface of the stamping die, and the material pushing groove is communicated with the hole on the stamping die. During the punching process of the workpiece, the workpiece is inserted into the material pushing groove, and then the punching of the workpiece is completed by the punching knife penetrating through the hole.
[0015] Preferably, the disassembly and assembly part is a connecting column fixed at one end of the collection box facing the lower die, and a through hole for the connecting column to be inserted is opened on one side of the lower die. The installation of the collection box is realized through this disassembly and assembly structure method, and the discharged chips are collected.
[0016] Preferably, the thickness of the collection box is between the bottom surface of the lower die and the discharge groove, so as to ensure that the chips can be discharged normally, and the thickness of the collection box is less than the thickness of the lower die.
[0017] Preferably, guide columns are symmetrically fixed on both sides of the top of the lower die, and the guide columns movably penetrate into the upper die to realize the sliding connection between the two.
[0018] Compared with the prior art, the beneficial effects of the present utility model are:
[0019] Through the designed chip removal mechanism, the chips can be quickly discharged when the punching is completed, ensuring the normal progress of subsequent punching operations. The entire chip removal process does not require manual operation, greatly improving work efficiency. At the same time, the chip removal mechanism is compact and small, facilitating processing and production, and can be applied to conventional punching dies with upper and lower dies, having good popularization and practicability, and improving the deficiencies existing in the use of existing punching dies. Description of the Drawings
[0020] Figure 1 is a schematic structural view of the present utility model;
[0021] Figure 2 is a sectional view of the present utility model;
[0022] Figure 3 of the present utility model Figure 2 is an enlarged schematic view of area A in the present utility model
[0023] Figure 4 is a top view of the present utility model;
[0024] Figure 5 of the present utility model Figure 3 is an enlarged schematic view of area A in the present utility model.
[0025] In the figure:
[0026] 100. Upper die; 101. Punching knife;
[0027] 200. Lower die; 200a. Blanking groove; 200b. Discharge chute; 200c. Adjusting groove; 200d. Through hole; 201. Guide post; 202. Magnet block; 203. Pushing block;
[0028] 300. Stamping die; 300a. Pushing chute;
[0029] 400. Collection frame; 401. Connecting column. Specific embodiments
[0030] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0031] Please refer to Figures 1 to 5 , the present utility model provides a technical solution: a punching die with a disassembly and assembly structure, including
[0032] An upper die 100, with a punching knife 101 installed in the middle of the bottom end surface, serving as the punching moving part of the punching die;
[0033] A lower die 200, with a chip removal mechanism arranged inside, and the chip removal mechanism is composed of a chip removal part and an anti-blocking component, where:
[0034] The top end of the chip removal part is directly below the punching knife 101, and the bottom end extends obliquely towards one side of the lower die 200 and penetrates to the outside of the lower die 200. The top end is used to receive the chips, and the bottom end is used to discharge the chips;
[0035] The anti-blocking component consists of an anti-blocking part and a pushing part. The anti-blocking part is opened on the bottom end surface of the lower die 200 and is located in the vertical projection area of the chip removal part. The pushing part is arranged in the chip removal part and is offset from the top end of the chip removal part. In the normal state, the pushing part will not affect the normal chip removal of the chip removal part. When the inside of the chip removal part is blocked, the pushing part can be used to achieve the dredging operation;
[0036] The stamping die 300 is installed on the top end surface of the lower die 200. A hole is opened on the top end surface of the stamping die 300. During processing, the punching knife 101 will penetrate through the hole to punch the workpiece, and the chips in the hole will be discharged from the chip removal part. The hole, the punching knife 101, and the chip removal part are on the same vertical line;
[0037] The collection box 400 is provided with a disassembly and assembly part. The disassembly and assembly part is spliced on one side of the lower die 200 and is used to collect the discharged chips.
[0038] In this embodiment, preferably, the chip removal part includes a blanking groove 200a opened in the middle of the top end surface of the lower die 200, and a discharge groove 200b opened inside the lower die 200, the top end of which is connected to the blanking groove 200a, and the bottom end extends obliquely towards one side of the lower die 200. The dropped chips will gradually slide down from the discharge groove 200b, so as to achieve the purpose of discharging.
[0039] In this embodiment, preferably, one side of the top end of the discharge groove 200b extends towards the other side of the lower die 200, and the pushing part is a pushing block 203 arranged inside one side of the top end of the discharge groove 200b. The anti-blocking part is an adjustment groove 200c opened in the middle of the bottom end surface of the lower die 200. A magnetic block 202 is magnetically attracted in the adjustment groove 200c. The magnetic block 202 is magnetically connected to the pushing block 203. Therefore, the magnetic block 202 can drive the pushing block 203 to move. At the same time, referring to Figure 3 , due to the positions of the magnetic block 202 and the pushing block 203, during non-use, it will not affect the falling chips.
[0040] In this embodiment, preferably, a material pushing groove 300a is opened on the front surface of the stamping die 300. The material pushing groove 300a is connected to the hole on the stamping die 300. During the punching process of the workpiece, the workpiece is inserted into the material pushing groove 300a, and then the punching knife 101 penetrates through the hole to complete the punching process of the workpiece.
[0041] In this embodiment, preferably, the disassembly and assembly part is a connecting column 401 fixed at one end of the collection box 400 facing the lower die 200, and a through hole 200d for the connecting column 401 to be inserted into is opened on one side of the lower die 200. The installation of the collection box 400 is realized through this disassembly and assembly structure method, and the discharged chips are collected.
[0042] In this embodiment, preferably, the thickness of the collection box 400 is between the bottom end surface of the lower die 200 and the discharge groove 200b, so as to ensure the normal discharge of chips, and the thickness of the collection box 400 is less than the thickness of the lower die 200.
[0043] In this embodiment, preferably, guide posts 201 are symmetrically fixed on both sides of the top of the lower die 200, and the guide posts 201 movably penetrate into the upper die 100 to realize the sliding connection between the two.
[0044] Although the embodiments of the present invention have been shown and described (see the above detailed description), those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A punching die with a disassembly structure, characterized in that: include The upper die (100) has a punch (101) installed in the middle of the bottom end surface; The lower die (200) is provided with a chip removal mechanism inside, which is composed of a chip removal part and an anti-blocking component, wherein: The top of the chip removal portion is located directly below the punch (101), and the bottom extends obliquely toward one side of the lower die (200) and penetrates to the outside of the lower die (200); The anti-blocking component is composed of an anti-blocking part and a pushing part, wherein the anti-blocking part is arranged on the bottom end surface of the lower mold (200) and is located in the vertical projection area of the chip removal part, and the pushing part is arranged in the chip removal part and is staggered with the top end of the chip removal part; A punching die (300) is installed on the top surface of the lower die (200), and a hole is opened on the top surface of the punching die (300). The hole, the punching knife (101), and the chip removal part are on the same vertical line; The collecting frame (400) is provided with a disassembly component, and the disassembly component is spliced on one side of the lower mold (200).
2. The punching die with a disassembly structure according to claim 1, characterized in that: The chip removal portion comprises a material discharge groove (200a) provided in the middle of the top end surface of the lower die (200), and a material discharge groove (200b) provided inside the lower die (200), the top end of which is connected to the material discharge groove (200a) and the bottom of which is inclined and extends toward one side of the lower die (200).
3. The punching die with a disassembly structure according to claim 2, characterized in that: One side of the top end of the discharge groove (200b) extends toward the other side of the lower mold (200), and the pushing portion is a pushing block (203) arranged inside one side of the top end of the discharge groove (200b), and the anti-blocking portion is an adjustment groove (200c) opened in the middle of the bottom end surface of the lower mold (200), and a magnetic block (202) is magnetically attracted in the adjustment groove (200c), and the magnetic block (202) is magnetically connected to the pushing block (203).
4. The punching die with a disassembly structure according to claim 1, characterized in that: A material pushing groove (300a) is provided on the front surface of the punching die (300), and the material pushing groove (300a) is communicated with a hole on the punching die (300).
5. The punching die with a disassembly structure according to claim 3, characterized in that: The disassembly component is a connecting column (401) fixed at one end of the collecting frame (400) facing the lower mold (200), and a through hole (200d) for the connecting column (401) to be inserted is provided on one side of the lower mold (200).
6. The punching die with a disassembly structure according to claim 5, characterized in that: The thickness of the collecting frame (400) is between the bottom end surface of the lower mold (200) and the discharge groove (200b), and the thickness of the collecting frame (400) is less than the thickness of the lower mold (200).
7. The punching die with a disassembly structure according to claim 5, characterized in that: Guide pillars (201) are symmetrically fixed on both sides of the top of the lower mold (200), and the guide pillars (201) are movably inserted into the upper mold (100).
Citation Information
Patent Citations
A punching die
CN105344803B