Chip conveying device
By designing a chip conveyor device with adjustable width and/or height, the problem that the prior art cannot meet the delivery needs of multiple chips of different sizes is solved, and flexible delivery of chips of different sizes is achieved.
Patent Information
- Application Number
- CN202421837835.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-07-31
AI Technical Summary
The prior art cannot meet the delivery needs of multiple chips of different sizes, because each chip size requires a corresponding specific conveyor device.
A chip conveying device is designed, including a receiving groove with adjustable width and/or height, to achieve adaptability of the receiving groove by the first track and the second track close to or away from each other and the up and down movement of the cover plate.
The device can be flexibly adjusted to accommodate chips of different sizes, expanding the application range of chip delivery.
Smart Images
Figure CN222922479U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of chip transportation, and particularly to a chip transportation device. Background Art
[0002] As a precision and critical intelligent component, in order to ensure its high performance, during the production process of a chip, multiple detections are required, and thus the chip needs to be transported to a preset detection position, which requires a chip transportation device.
[0003] In the prior art, the sizes of chips are not the same, and each size requires a corresponding transportation device adapted to its size, which cannot meet the transportation of chips of multiple different sizes.
[0004] The above problems have become urgent problems to be solved. Summary of the Utility Model
[0005] This application provides a chip transportation device that can be flexibly adjusted to meet the transportation of chips of different sizes.
[0006] This application provides a chip transportation device, including a first track and a second track. The first track and the second track are arranged side by side and extend in the same direction; a receiving groove for placing chips is provided between the first track and the second track; air cavities are provided in both the first track and the second track, and the air cavities are communicated with the receiving groove for driving the chips in the receiving groove to move along the length direction of the receiving groove; the width and / or height of the receiving groove can be adjusted to be applicable to chips of different sizes.
[0007] In an optional embodiment, the first track and the second track can approach or move away from each other and can be fixed at a preset position so that the width dimension of the receiving groove can be adjusted.
[0008] In an optional embodiment, pin grooves for receiving chip pins are provided on both sides of the receiving groove.
[0009] In an optional embodiment, the chip transportation device further includes an adjusting bottom plate, and the adjusting bottom plate is arranged at the bottom of the first track and the second track; the first track and the second track are slidably connected to the adjusting bottom plate.
[0010] In an optional embodiment, the chip transportation device further includes a first bottom locking member and a second bottom locking member. The first track and the adjusting bottom plate are connected by the first bottom locking member, and the second track and the adjusting bottom plate are connected by the second bottom locking member. That is, after the first track runs to a preset position relative to the adjusting bottom plate, it is fixedly connected by the first bottom locking member, and after the second track runs to a preset position relative to the adjusting bottom plate, it is fixedly connected by the second bottom locking member.
[0011] In an alternative embodiment, the chip conveying device further includes two cover plates disposed opposite to each other; the receiving groove is disposed at the top of the first track and the second track, and the two cover plates are respectively disposed at the top of the first track and the second track, covering the upper part of the receiving groove.
[0012] In an alternative embodiment, both of the two cover plates can move up and down relative to the receiving groove and can be fixed at a preset position so that the height dimension of the receiving groove can be adjusted.
[0013] In an alternative embodiment, the chip conveying device further includes two fixing plates; the two fixing plates are respectively disposed outside the first track and the second track; the tops of the two fixing plates are respectively fixedly connected to the two cover plates; vertical strip-shaped holes are provided on both of the two fixing plates, and side wall locking members are disposed in the vertical strip-shaped holes, and the fixing plates are fixed to the corresponding tracks by the side wall locking members.
[0014] In an alternative embodiment, bosses are disposed on the outer sides of the two fixing plates, adjusting bolts are disposed on the bosses, the adjusting bolts penetrate through the bosses, and the bottoms of the adjusting bolts abut against an adjusting bottom plate.
[0015] In an alternative embodiment, the chip conveying device further includes a gasket disposed between the first track and the second track.
[0016] In an alternative embodiment, the chip conveying device further includes track fixing screws that penetrate through the first track and the second track; and fix the relative positions of the first track and the second track.
[0017] In summary, the chip conveying device provided in the present application has at least the following technical effects:
[0018] The chip conveying device provided in the present application includes a first track and a second track, the first track and the second track are arranged side by side and extend in the same direction; a receiving groove for placing chips is disposed between the first track and the second track; air cavities are disposed on both the first track and the second track, and the air cavities are communicated with the receiving groove for driving the chips in the receiving groove to extend along the length direction of the receiving groove; the width and / or height of the receiving groove can be adjusted to be applicable to chips of different sizes. When it is necessary to convey chips of different widths or heights, by adjusting the width and / or height of the receiving groove, it is possible to effectively convey chips of different width sizes, and the application range is wide.
[0019] Advantages of additional aspects of the present application will be partially given in the following description, partially become apparent from the following description, or be learned through practice of the present application. Description of the Drawings
[0020] The above and other objects, features, and advantages of the embodiments of the present application will become more readily understood from the following detailed description with reference to the accompanying drawings. In the drawings, multiple embodiments of the present application will be illustrated by way of example and not limitation, where:
[0021] Figure 1 FIG. 4 is a schematic diagram of the overall structure of the chip conveying device provided by an embodiment of the present application from a first perspective;
[0022] Figure 2 FIG. 5 is a schematic diagram of the overall structure of the chip conveying device provided by an embodiment of the present application from a second perspective;
[0023] Figure 3 FIG. 6 is a schematic diagram of the overall structure of the chip conveying device provided by an embodiment of the present application from a third perspective;
[0024] Figure 4 FIG. 7 is a schematic diagram of the overall structure of the chip conveying device provided by an embodiment of the present application from a fourth perspective.
[0025] Description of reference numerals:
[0026] 10. Chip conveying device; 11. First track; 111. First height adjusting member; 112. Track fixing screw; 12. Accommodating groove; 121. Pin groove; 122. Groove; 123. Air nozzle joint; 13. Second track; 131. Second height adjusting member; 14. First cover plate; 141. First positioning pin; 15. Second cover plate; 151. Second positioning pin; 16. First fixing plate; 161. Strip-shaped hole; 162. Side wall locking member; 17. Second fixing plate; 18. Adjusting bottom plate; 181. First bottom locking member; 182. Second bottom locking member; 19. Spacer; 20. Chip. Detailed implementation manners
[0027] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application and should not be construed as limiting the present application.
[0028] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.
[0029] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0030] In the present application, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0031] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0032] As a precision and critical intelligent component, in order to ensure its high performance, during the production process, a chip needs to undergo multiple inspections, which requires the chip to be transported to a preset inspection position, thus necessitating a chip conveying device. In the prior art, the sizes of chips are not the same, and each size requires a corresponding conveying device adapted to its size, which cannot meet the conveying of chips of multiple different sizes. The chip conveying device provided in this application can be flexibly adjusted to meet the requirement of conveying chips of different sizes.
[0033] In view of this, the chip conveying device provided in this application includes a first track and a second track. The first track and the second track are arranged side by side and extend in the same direction; a receiving groove for placing a chip is provided between the first track and the second track; both the first track and the second track are provided with air cavities, and the air cavities are communicated with the receiving groove for driving the chip in the receiving groove to extend along the length direction of the receiving groove; the width and / or height of the receiving groove can be adjusted to be suitable for chips of different sizes. When it is necessary to convey chips of different widths or heights, by adjusting the width and / or height of the receiving groove, it is effectively possible to convey chips of different width sizes, and the application range is wide.
[0034] Please refer to Figures 1 to 4 , the chip conveying device 10 provided in the embodiment of this application includes a first track 11 and a second track 13. The first track 11 and the second track 13 are arranged side by side (parallel arrangement) and extend in the same direction; a receiving groove 12 for placing a chip is provided between the first track 11 and the second track 13; both the first track 11 and the second track 13 are provided with air cavities, and the air cavities are communicated with the receiving groove 12 for driving the chip in the receiving groove 12 to move along the length direction of the receiving groove 12; the width and / or height of the receiving groove 12 can be adjusted to be suitable for chips of different sizes.
[0035] When it is necessary to convey chips of different widths or heights, by adjusting the width and / or height of the receiving groove 12, it is effectively possible to convey chips of different width sizes, and the application range is wide.
[0036] Exemplarily, a receiving cavity is provided on the first track 11, and another receiving cavity is provided on the second track 13. The two receiving cavities together constitute the receiving space for the chip body, that is, the receiving groove 12.
[0037] Exemplarily, pin grooves 121 for placing pins are further provided on both sides of the receiving groove 12. The two pin grooves 121 are respectively located on the first track 11 and the second track 13.
[0038] In an optionally exemplary embodiment, the first track 11 and the second track 13 can approach or move away from each other and can be fixed at a preset position so that the width dimension of the receiving groove 12 can be adjusted. With such a setting, the first track 11 and the second track 13 can approach or move away from each other, thereby adjusting the width dimension of the receiving groove 12 to accommodate chips of different widths.
[0039] In an optionally exemplary embodiment, the chip conveying device 10 further includes an adjusting bottom plate 18, and the adjusting bottom plate 18 is arranged at the bottom of the first track 11 and the second track 13; the first track 11 and the second track 13 are slidably connected to the adjusting bottom plate 18.
[0040] It should be noted that specifically, in this embodiment, the adjusting bottom plate 18 is provided, and the first track 11 and the second track 13 are slidably connected to the adjusting bottom plate 18, and the adjusting bottom plate 18 is used to support the first track 11 and the second track 13.
[0041] In an optionally exemplary embodiment, the chip conveying device 10 further includes a first bottom locking member 181 and a second bottom locking member 182. The first track 11 and the adjusting bottom plate 18 are connected by the first bottom locking member 181, and the second track 13 and the adjusting bottom plate 18 are connected by the second bottom locking member 182; after the first track 11 runs to a preset position relative to the adjusting bottom plate 18, it is fixedly connected by the first bottom locking member 181, and after the second track 13 runs to a preset position relative to the adjusting bottom plate 18, it is fixedly connected by the second bottom locking member 182.
[0042] It should be noted that specifically, in this embodiment, the first bottom locking member 181 and the second bottom locking member 182 are provided. After the first track 11 runs to a preset position relative to the adjusting bottom plate 18, it is fixedly connected by the first bottom locking member 181, and after the second track 13 runs to a preset position relative to the adjusting bottom plate 18, it is fixedly connected by the second bottom locking member 182, thereby ensuring that after the first track 11 and the second track 13 are adjusted to the preset position, their positions relative to the adjusting bottom plate 18 are fixed.
[0043] In an optionally exemplary embodiment, the chip conveying device 10 further includes two cover plates arranged opposite to each other; the receiving groove is arranged at the top of the first track 11 and the second track 13, and the two cover plates are respectively arranged at the top of the first track 11 and the second track 13 and cover the upper part of the receiving groove 12.
[0044] In an optionally exemplary embodiment, both of the two cover plates can move up and down relative to the receiving groove 12 and can be fixed at a preset position so that the height dimension of the receiving groove 12 can be adjusted.
[0045] In an optionally exemplary embodiment, the chip conveying device 10 further includes two fixing plates; the two fixing plates are respectively arranged outside the first track 11 and the second track 13; the tops of the two fixing plates are respectively fixedly connected to the two cover plates; vertical strip-shaped holes are provided on both fixing plates, and side wall locking members are arranged in the vertical strip-shaped holes, and the fixing plates are fixed to the corresponding tracks by the side wall locking members.
[0046] Specifically, the chip conveying device 10 further includes two relatively arranged first cover plates 14, second cover plates 15, first fixing plates 16 and second fixing plates 17. The first cover plates 14 and the second cover plates 15 are respectively arranged on the tops of the two tracks; the first fixing plate 16 is arranged on the side wall of the first track 11 away from the second track 13, and the second fixing plate 17 is arranged on the side wall of the second track 13 away from the first track 11; the top of the first fixing plate 16 is fixedly connected to the first cover plate 14, and the top of the second fixing plate 17 is fixedly connected to the second cover plate 15; corresponding grooves 122 are provided at the positions of the first cover plate 14 and the second cover plate 15 corresponding to the accommodating groove 12; the first fixing plate 16 can move up or down relative to the first track 11, and the second fixing plate 17 can move up or down relative to the second track 13, so that the first cover plate 14 and the second cover plate 15 are far from or close to the tops of the first track 11 and the second track 13, so as to increase or decrease the thickness dimension of the accommodating groove 12.
[0047] It should be noted that specifically, in this embodiment, by sliding the first fixing plate 16 up and down relative to the first track 11, the first cover plate 14 is driven to be far from or close to the top of the first track 11; similarly, by sliding the second fixing plate 17 up and down relative to the second track 13, the second cover plate 15 is driven to be far from or close to the top of the second track 13, so that the first cover plate 14 and the second cover plate 15 are far from or close to the tops of the first track 11 and the second track 13, so as to increase or decrease the thickness dimension of the accommodating groove 12. By setting like this, the accommodating groove 12 can accommodate chips of different thicknesses.
[0048] Specifically, strip-shaped holes 161 and side wall locking members 162 matching the strip-shaped holes 161 are provided on the side walls of the first fixing plate 16 and the second fixing plate 17.
[0049] It should be noted that specifically, in this embodiment, strip-shaped holes 161 and side wall locking members 162 matching the strip-shaped holes 161 are provided on the side walls of the first fixing plate 16 and the second fixing plate 17. By providing the side wall locking members 162, when the thickness dimension of the accommodating groove 12 is a preset dimension, that is, when the first fixing plate 16 slides to a preset position relative to the first track 11 and the second fixing plate 17 slides to a preset position relative to the second track 13, it can be locked by the side wall locking members 162, so as to realize the stability of the thickness dimension of the accommodating groove 12.
[0050] Specifically, in this embodiment, the side wall locking member 162 can be a locking nut.
[0051] In an alternative exemplary embodiment, a first positioning pin 141 is correspondingly provided on the first cover plate 14 and the first track 11; a second positioning pin 151 is correspondingly provided on the second cover plate 15 and the second track 13.
[0052] It should be noted that specifically, in this embodiment, a first positioning pin 141 is correspondingly provided on the first cover plate 14 and the first track 11; a second positioning pin 151 is correspondingly provided on the second cover plate 15 and the second track 13. The setting of the first positioning pin 141 and the second positioning pin 151 facilitates the positioning of the corresponding cover plate and the track.
[0053] In an alternative exemplary embodiment, bosses are provided on the outer sides of the two fixing plates, and adjusting bolts are provided on the bosses. The adjusting bolts penetrate through the bosses, and the bottoms of the adjusting bolts are in contact with the adjusting bottom plate 18.
[0054] Specifically, the chip conveying device 10 further includes a first height adjusting member 111 and a second height adjusting member 131; the first height adjusting member 111 includes a first boss and a first adjusting bolt. The first boss is provided on the side wall of the first fixing plate 16, and the first adjusting bolt penetrates through the first boss and abuts against the adjusting bottom plate 18; the second height adjusting member 131 includes a second boss and a second adjusting bolt. The second boss is provided on the side wall of the second fixing plate 17, and the second adjusting bolt penetrates through the second boss and abuts against the adjusting bottom plate 18.
[0055] It should be noted that specifically, in this embodiment, the heights of the two fixing plates can be adjusted. Please refer to Figure 4 , first set the two fixing plates to appropriate heights, and then fix them through the two adjusting bolts and fasteners. For example, by the way that the fasteners abut against the adjusting bolts from the side.
[0056] In an alternative exemplary embodiment, the chip conveying device 10 further includes a gasket 19, and the gasket 19 is provided between the first track 11 and the second track 13.
[0057] It should be noted that specifically, in this embodiment, by setting gaskets 19 with different thickness dimensions between the first track 11 and the second track 13, the distance between the first track 11 and the second track 13 can be changed, and further the first track 11 and the second track 13 can be moved closer to or farther away from each other, so as to change the width dimension of the receiving groove 12, and the chip conveying device 10 can be made compatible with chips of various width dimensions.
[0058] In an alternative exemplary embodiment, the chip conveying device 10 further includes a track fixing screw 112, and the fixing screw penetrates through the first track 11 and the second track 13.
[0059] It should be noted that specifically, in this embodiment, an orbital fixing screw 112 is provided, and the fixing screw penetrates through the first track 11 and the second track 13 (when there is a gasket, it penetrates through the gasket). After the relative positions between the first track 11 and the second track 13 are fixed, the relative positions can be fixed by the orbital fixing screw 112, thereby ensuring the stability of the overall structure.
[0060] In an optional exemplary embodiment, the chip conveying device 10 further includes a nozzle joint 123, and the nozzle joint 123 leads to the receiving groove 12 to supply compressed air to the receiving groove 12.
[0061] It should be noted that specifically, in this embodiment, a nozzle joint 123 is provided, and the nozzle joint 123 leads to the receiving groove 12 to supply compressed air to the receiving groove 12. Specifically, a cavity for compressed air is designed inside the track. When the product enters the track, it blows the chip forward at a certain angle (such as 60°) from bottom to top, and the chip is in an air-floating state inside the track, ensuring high-speed transmission inside the track.
[0062] In summary, the chip conveying device 10 provided by the present application can accommodate chips of different widths and different thicknesses, and has a wide application range.
[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
[0064] In addition, it should be noted that all the specific technical features described in the above specific embodiments can be combined in any suitable way without conflict. To avoid unnecessary repetition, the present application does not separately describe various possible combination methods.
Claims
1. A chip conveying device, characterized in that: It comprises a first track and a second track, wherein the first track and the second track are arranged side by side and extend in the same direction; a receiving groove for placing a chip is arranged between the first track and the second track; The first track and the second track are both provided with an air cavity, and the air cavity is communicated with the receiving groove and is used to drive the chip in the receiving groove to move along the length direction of the receiving groove.
2. The chip conveying device according to claim 1, characterized in that: Pin grooves for accommodating chip pins are arranged on both sides of the accommodating groove.
3. The chip conveying device according to claim 2, characterized in that: It also includes an adjustment bottom plate, which is arranged at the bottom of the first track and the second track; the first track and the second track are slidably connected to the adjustment bottom plate.
4. The chip conveying device according to claim 3, characterized in that: It also includes a first bottom locking member and a second bottom locking member, wherein the first track is connected to the adjusting bottom plate by the first bottom locking member, and the second track is connected to the adjusting bottom plate by the second bottom locking member.
5. The chip conveying device according to claim 3, characterized in that: It also includes two cover plates arranged opposite to each other; the receiving groove is arranged on the top of the first track and the second track, and the two cover plates are respectively arranged on the top of the first track and the second track to cover the upper part of the receiving groove.
6. The chip conveying device according to claim 5, characterized in that: The two cover plates can both move up and down relative to the receiving groove and can be fixed at a preset position so that the height dimension of the receiving groove can be adjusted.
7. The chip conveying device according to claim 6, characterized in that: It also includes two fixing plates; the two fixing plates are respectively arranged on the outer sides of the first track and the second track; the tops of the two fixing plates are respectively fixedly connected to the two cover plates; the two fixing plates are each provided with a vertical strip hole, and the vertical strip holes are each provided with a side wall locking piece, and the side wall locking piece fixes the fixing plate to the corresponding track.
8. The chip conveying device according to claim 7, characterized in that: Bosses are arranged on the outer sides of the two fixing plates, and adjusting bolts are arranged on the bosses. The adjusting bolts penetrate through the bosses, and the bottoms of the adjusting bolts abut against the adjusting bottom plate.
9. The chip conveying device according to any one of claims 1 to 8, characterized in that: Also included is a gasket disposed between the first rail and the second rail.
10. The chip conveying device according to any one of claims 1 to 8, characterized in that: It also includes a track fixing screw, which passes through the first track and the second track and fixes the relative position of the first track and the second track.