Heat dissipation and cooling structure of potting type transformer or reactor
By installing device water-cooling plate and bottom bus plate components in the casing of the potted transformer or reactor, the heat dissipation problem of high-frequency high-voltage transformer or reactor is solved, and efficient cooling effect and simplified maintenance process is achieved.
Patent Information
- Application Number
- CN202421850541.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-01
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-08-01
AI Technical Summary
The existing technology is difficult to effectively solve the heat dissipation problem of potted high-frequency high-voltage transformers or reactors, especially in the field of rail transit and power grids. The existing structure is large in size, complex in structure, limited in heat dissipation performance, and water-cooled pipe maintenance is difficult.
A heat dissipation and cooling structure of a potted transformer or reactor is designed. By setting a water-cooled plate in the shell, the water-cooled plate passes through the shell and extends to the outside of the shell, connecting the water-cooled pipe, the water-cooled pipe is located outside the shell, and a bottom bus plate assembly is arranged at the lower end of the shell to improve cooling efficiency.
It achieves a cooling effect of simple structure, small size and good heat dissipation performance, reduces the temperature rise of transformers or reactors, is suitable for high-frequency and high-voltage rail transit and power grid fields, and simplifies the maintenance process of water-cooled pipes.
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Figure CN222927289U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of transformers or reactors, and specifically provides a heat dissipation and cooling structure for potted transformers or reactors. Background Technique
[0002] With the rapid development of converter technology, the power density of converter equipment is getting higher and higher, and the volume is getting smaller and smaller. As the core electromagnetic components and main heat sources in the converter system, the heat generation problems of transformers and reactors are becoming more and more serious. Especially in high-frequency high-voltage transformers, reactors, and transformer integrated reactor structures, the heat dissipation problems of transformers and reactors are becoming increasingly prominent. The main heat generation parts of transformers or reactors are coils and iron cores. It is particularly important to solve the heat dissipation problems of coils and iron cores. In the prior art, the following patents are related to the heat dissipation and cooling of transformers or reactors:
[0003] 1. A utility model patent with the patent number "202021241492.0" and the patent name "Transformer with dual cooling functions", including: iron core, primary winding, secondary winding, diode assembly and output terminal, water cooling circulation assembly, diode water cooling plate, cooling medium liquid, heat sink, first fan. This solution uses a dual cooling method of air cooling and water cooling for temperature reduction, which can ensure the safe use of the transformer under high-frequency usage or in a high-temperature environment.
[0004] 2. An invention patent application with the patent number "202111445114.3" and the patent name "A high-frequency high-voltage high-power rectifier transformer", including a bearing box body, a transformer body, a heat dissipation component, multiple groups of heat dissipation fins, a water cooling mechanism, an air cooling mechanism, a first cooling water pipe, a second cooling water pipe, etc. This solution can export the heat inside the transformer body through the heat dissipation fins to achieve preliminary heat dissipation, cool the heat dissipation fins and the transformer body through the cooling water pipe, and blow air towards the direction of the heat dissipation fins to accelerate the air flow rate.
[0005] As can be seen from the above, in Comparative Document 1, a combination of a water cooling plate, a heat sink and a cooling fan is used to cool and dissipate heat from a high-frequency transformer. In Comparative Document 2, a water cooling mechanism and an air cooling mechanism are used together to cool and dissipate heat from the transformer. The heat dissipation structures in Comparative Document 1 and Comparative Document 2 can reduce the temperature rise of the transformer, but they are relatively large in volume, complex in structure, and limited in heat dissipation performance. At the same time, the solutions in Comparative Document 1 and Comparative Document 2 cannot be applied to the transformers made by the widely used potted process at present. After retrieval, the following Comparative Document 3 in the prior art is related to the cooling and heat dissipation of potted process transformers:
[0006] 3. A utility model patent with the patent number "202023025870.4" and the patent name "A fully potted water-cooled transformer" includes a transformer body, cooling pipes, a water inlet tank, a water outlet tank, a cover, a water inlet connector, a water outlet connector, a heat dissipation fin group, heat dissipation fins, a fan box, and a heat dissipation fan. This fully potted water-cooled transformer is cooled by both water cooling and air cooling, which can improve the cooling efficiency and has low energy consumption.
[0007] The solution in Comparative Document 3 is for the heat dissipation and cooling of a transformer made by a potting process. It uses a dual cooling method of water cooling and air cooling. However, no water cooling pipes are provided inside the transformer body. The water cooling structure is mainly concentrated on the outside of the transformer body, and the structure is relatively complex. The heat dissipation performance is limited, making it difficult to meet the heat dissipation requirements of transformers in the high-frequency and high-voltage rail transit field and power grid field. There is also a problem of great difficulty in maintaining the water cooling pipes.
[0008] In summary, how to design a heat dissipation and cooling structure with a simple structure, small volume, reasonable arrangement of cooling components, good heat dissipation performance, simple maintenance of water cooling pipes, and capable of meeting the heat dissipation requirements of potted high-frequency and high-voltage transformers or reactors in the rail transit field and power grid field, so as to efficiently cool the transformers and reactors in a high-frequency and high-voltage high-power converter system, is an urgent problem to be solved at present. Summary of the Invention
[0009] To solve the above problems, the present invention provides a heat dissipation and cooling structure for a potted transformer or reactor, which can improve the performance of a potted water-cooled high-frequency transformer, has good heat dissipation ability, and can provide favorable conditions for the subsequent iteration of the product platform and market development.
[0010] A heat dissipation and cooling structure for a potted transformer or reactor provided by the present invention includes a plurality of device water-cooled plates arranged close to the heat source inside the housing; the device water-cooled plates pass through the housing and extend to the outside of the housing to form an extended section located outside the housing, and a water-cooled pipe is connected to the extended section and the water-cooled pipe is located outside the housing; device water-cooled plates can be arranged between the iron core and the winding, between each layer of windings, between multiple transformer bodies or multiple reactor bodies, and between a transformer body and a reactor body.
[0011] Further, the device water-cooled plates are arranged horizontally, or vertically, or laterally, or in a combination of horizontal, vertical and lateral arrangements at the heat source.
[0012] Further, the device water-cooled plates are arranged close to the side surface or the upper and lower ends of the heat source inside the housing, and a bottom busbar assembly is provided at the lower end of the housing.
[0013] Furthermore, the bottom busbar plate assembly is provided as a busbar water-cooling plate with an integral water-cooling plate structure. The busbar water-cooling plate is arranged in close contact with the heat source. The busbar water-cooling plate and the device water-cooling plate respectively include a bottom flow channel and an upper flow channel, and a plurality of upper flow channels are all communicated with the bottom flow channel and converge at the bottom flow channel.
[0014] Furthermore, the bottom flow channel is of a series-connected flow channel structure.
[0015] Furthermore, the busbar water-cooling plate is provided with a water inlet and a water outlet.
[0016] Furthermore, the water inlet and the water outlet are located on the same side of the busbar water-cooling plate.
[0017] Furthermore, a protective frame is arranged around the outer side of the water-cooling pipe, and the whole protective frame is located outside the housing.
[0018] Furthermore, when the housing includes a plurality of transformers, or includes a plurality of reactors, or includes an integrated transformer and reactor, a partition plate is arranged between each transformer, or between each reactor, or between the transformer and the reactor; the partition plate is in the form of a water-cooling plate or an insulating plate.
[0019] Furthermore, when a transformer and a reactor are integrated in the housing, the transformer and the reactor are respectively arranged in a transformer area and a reactor area; the water-cooling pipes on each transformer in the transformer area are connected in series and communicated with the bottom flow channel in the busbar water-cooling plate, and the water-cooling pipes on each reactor in the reactor area are connected in series and communicated with the bottom flow channel in the busbar water-cooling plate.
[0020] Compared with the prior art, the utility model can achieve the following beneficial effects:
[0021] 1. The cooling and heat dissipation structure of the transformer or reactor in the utility model can improve the performance of the water-cooled high-frequency transformer or reactor. The product is more competitive and can meet the requirements of high power density, miniaturization and light weight in the rail transit industry and the power grid industry. The product has a light weight, a small volume and a simple structure, and has obvious advantages in terms of weight and volume.
[0022] 2. The cooling and heat dissipation structure of the transformer or reactor in the utility model abandons the traditional heat dissipation method only through the four sides of the box body, and closely fits the conventional water-cooled heat dissipation cold plate with the product heat source, greatly improving the heat dissipation capacity, and having obvious advantages in the temperature rise performance of the product.
[0023] 3. In the transformer or reactor manufactured by the potting process, the joints and water pipes are integrally potted in the colloid, which is not convenient for maintenance and observation of water seepage. In case of water leakage, the whole product will be scrapped, resulting in a large loss. In the cooling and heat dissipation structure of the transformer or reactor in the present utility model, by lengthening the design of the water-cooled plate, the water joints are placed outside, and the water pipes are connected outside the product. On the one hand, the advantage of the water-cooled plate closely adhering to the internal heat source to improve the heat conduction density is fully utilized, and at the same time, the hidden danger of the internal placement of the joints and water pipes is avoided, the volume of the potting box body is reduced, and it is easier to observe and maintain. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 is the overall structural schematic diagram of the heat dissipation and cooling structure provided by the embodiment of the present utility model Figure 1 ;
[0025] Figure 2 is the overall structural schematic diagram of the heat dissipation and cooling structure provided by the embodiment of the present utility model Figure 2 (the protective frame is not shown);
[0026] Figure 3 is the overall structural schematic diagram of the heat dissipation and cooling structure provided by the embodiment of the present utility model Figure 3 (the protective frame and the housing are not shown);
[0027] Figure 4 is Figure 3 the top view schematic diagram of.
[0028] The reference numerals therein include: housing 1, device water-cooled plate 2, lengthening section 3, water-cooled pipe 4, confluent water-cooled plate 5, iron core 6, winding 7, water inlet 8, water outlet 9, bottom flow channel 10, protective frame 11, transformer body 12, reactor body 13, partition plate 14, transformer area 15, reactor area 16. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0029] In the following, embodiments of the present utility model will be described with reference to the attached Figures 1-4 drawings. In the following description, the same modules are denoted by the same reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, their detailed descriptions will not be repeated.
[0030] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the following will further describe the present utility model in detail with reference to the attached Figures 1-4 drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model, rather than to limit the present utility model.
[0031] A heat dissipation and cooling structure for a potted transformer or reactor, as Figures 1-4As shown in the figure, it includes a plurality of device water-cooling plates 2 arranged close to the heat sources inside the housing 1. The heat sources include an iron core 6, a winding 7, etc. The device water-cooling plates 2 are arranged close to the heat sources. Between the iron core 6 and the winding 7, between each layer of the winding 7, between a plurality of transformer bodies 12 or a plurality of reactor bodies 13, and between the transformer body 12 and the reactor body 13, device water-cooling plates 2 can be arranged, which can reduce the temperature rise to the greatest extent, improve the heat dissipation and cooling performance, and are applicable to the heat dissipation of potted products.
[0032] The device water-cooling plates 2 are arranged horizontally, vertically, or laterally, or are arranged at the heat source in a combination of horizontal, vertical, and lateral arrangements. This solution can be used in scenarios where there is one, two, or more transformer bodies 12 in the housing 1, can be used in scenarios where there is one, two, or more reactor bodies 13 in the housing 1, and can be used in scenarios where the housing 1 includes an integration of a transformer body 12 and a reactor body 13. When there are multiple transformer bodies 12, or multiple reactor bodies 13, or an integrated transformer body 12 and reactor body 13 in the housing 1, a partition plate 14 is arranged between each transformer body 12, or between each reactor body 13, or between the transformer body 12 and the reactor body 13. The partition plate 14 is in the form of a water-cooling plate or an insulating plate. In this embodiment, the form of a water-cooling plate is preferably adopted, which can reduce the temperature rise to a greater extent.
[0033] In this embodiment, taking the scenario where the housing 1 includes an integration of a transformer body 12 and a reactor body 13 as an example for elaboration, there are multiple transformer bodies 12 in the housing 1, and a partition plate 14 is arranged between each transformer body 12. There is a reactor body 13 in the housing 1, and the inside of the housing 1 is divided into a transformer area 15 and a reactor area 16. The transformer body 12 is placed in the transformer area 15, and the reactor body 13 is placed in the reactor area 16. As Figure 4 shown, a partition plate 14 is also arranged between the transformer area 15 and the reactor area 16, and the partition plate 14 is also of a water-cooling plate structure to improve the heat dissipation performance. At the same time, those skilled in the art can also set the partition plate 14 in a non-water-cooling plate form according to actual heat dissipation requirements.
[0034] A connection through-hole is opened on the housing 1, and the device water-cooling plate 2 passes through the connection through-hole. The device water-cooling plate 2 passes through the housing 1 and extends to the outside of the housing 1 to form an extended section 3 located outside the housing 1. A water-cooling pipe 4 is connected to the extended section 3. The water-cooling pipe 4 is located outside the housing 1. The water-cooling pipe 4 is a metal pipe or a plastic pipe. A protective frame 11 is arranged around the outside of the water-cooling pipe 4. The protective frame 11 is entirely located outside the housing 1, and the water-cooling pipe 4 and the device water-cooling plate 2 are protected through the protective frame 11.
[0035] When the water-cooling pipe 4 is placed inside the housing 1, in actual application, the water-cooling pipe 4 often leaks water, and it is often difficult for the staff to detect it or to repair it even if it is detected, which often leads to the overall scrapping of the product. In order to avoid this problem, the water-cooling pipe 4 is arranged outside the housing 1. When the water-cooling pipe 1 leaks water, it can be detected and repaired in time. Only the water-cooling pipe 4 needs to be replaced or repaired, which can reduce costs and improve efficiency.
[0036] Especially for potted products, when the water-cooling pipe 4 is installed inside the housing 1, the manufacturing process is to arrange the water-cooling pipe 4 properly and overhaul it first, and then carry out potting. After the water-cooling pipe 4 is overhauled, there are still multiple processes. During this period, the risk of damage to the water-cooling pipe 4 is difficult to be detected. However, in this embodiment, the water-cooling pipe 4 is externally placed, that is, the water-cooling pipe 4 is installed outside the housing 1 after potting, which can effectively avoid the occurrence of the above problems.
[0037] As Figure 3 shown, the device water-cooling plate 2 is attached to the side or the upper and lower ends of the heat source inside the housing 1. A bottom busbar assembly is attached to the bottom end of the heat source at the lower end of the housing 1. The housing 1 and the busbar assembly can be connected by assembly or welding to form a potted cavity. The bottom busbar assembly can be selected as a water-cooling plate structure to facilitate further cooling of the bottom of the heat source, and can also be used for water path confluence; at the same time, the bottom busbar assembly can also be selected as other structural parts, and then the busbar and the water nozzle are fixed separately to form the bottom busbar assembly together; in this embodiment, the bottom busbar assembly is set as an integral water-cooling plate structure of the confluent water-cooling plate 5. The confluent water-cooling plate 5 is attached to the bottom end of the heat source. The confluent water-cooling plate 5 and the device water-cooling plate 2 respectively include a bottom flow channel 10 and an upper flow channel. Multiple upper flow channels are all communicated with the bottom flow channel 10 and converge at the bottom flow channel 10. The water-cooling pipes 4 on each transformer body 12 in the transformer area 15 are connected in series as shown at A in Figure 2 and are communicated with the bottom flow channel in the confluent water-cooling plate 5. The water-cooling pipes 4 on the reactor body 13 in the reactor area 16 are connected in series as shown at B in Figure 2 and are communicated with the bottom flow channel in the confluent water-cooling plate 5.
[0038] The upper flow channel of the transformer body 12 in the transformer area 15 is communicated with the water-cooling pipe 4 at the transformer area 15. The upper flow channel of the reactor body 13 in the reactor area 16 is communicated with the water-cooling pipe 4 at the reactor area 16. The bottom flow channel 10 is a series flow channel structure or a parallel flow channel structure. In this embodiment, a series flow channel structure is preferably adopted. The confluent water-cooling plate 5 is provided with a water inlet 8 and a water outlet 9. The water inlet 8 and the water outlet 9 are preferably arranged on the same side of the confluent water-cooling plate 5.
[0039] When manufacturing the product, first place the device water-cooled plate 2 at the corresponding position according to the working conditions, specifically, it can be placed at the corresponding position of the iron core 6 or the winding 7. After the transformer body 12 or the reactor body 13 is manufactured, potting is carried out. After the potting is completed, the water-cooled pipe 4 is connected outside the housing 1.
[0040] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.
[0041] The specific embodiments of the present invention above do not constitute a limitation to the protection scope of the present invention. Any other corresponding changes and deformations made according to the technical concept of the present invention should be included in the protection scope of the claims of the present invention.
Claims
1. A heat dissipation cooling structure for a potted transformer or reactor, characterized in that: The invention comprises a plurality of device water-cooling plates (2) arranged close to a heat source in a shell (1); the device water-cooling plates (2) pass through the shell (1) and extend to the outside of the shell (1) to form an extended section (3) located outside the shell (1); the extended section (3) is connected to a water-cooling pipe (4) and the water-cooling pipe (4) is located outside the shell (1); the device water-cooling plates (2) can be arranged between the iron core (6) and the winding (7), between each layer of winding (7), between a plurality of transformer bodies (12) or a plurality of reactor bodies (13), and between a transformer body (12) and a reactor body (13).
2. The heat dissipation and cooling structure of the potted transformer or reactor according to claim 1, characterized in that: The device water cooling plate (2) is arranged at the heat source in a horizontal, vertical, or sideways manner, or in a combination of horizontal, vertical, and sideways manner.
3. The heat dissipation and cooling structure of the potted transformer or reactor according to claim 2, characterized in that: The device water cooling plate (2) is arranged close to the side surface or the upper and lower ends of the heat source inside the shell (1), and a bottom collector plate assembly is provided at the lower end of the shell (1).
4. The heat dissipation and cooling structure of the potted transformer or reactor according to claim 3, characterized in that: The bottom conduit assembly is configured as a conduit water cooling plate (5) of an integral water cooling plate structure. The conduit water cooling plate (5) is disposed close to a heat source. The conduit water cooling plate (5) and the device water cooling plate (2) respectively include a bottom flow channel (10) and an upper flow channel. The plurality of upper flow channels are all connected to the bottom flow channel (10) and converge at the bottom flow channel (10).
5. The heat dissipation and cooling structure of the potted transformer or reactor according to claim 4, characterized in that: The bottom flow channel (10) is a series flow channel structure.
6. The heat dissipation and cooling structure of the potted transformer or reactor according to claim 5, characterized in that: The converging water cooling plate (5) is provided with a water inlet (8) and a water outlet (9).
7. The heat dissipation and cooling structure of the potted transformer or reactor according to claim 6, characterized in that: The water inlet (8) and the water outlet (9) are located on the same side of the converging water cooling plate (5).
8. The heat dissipation and cooling structure of the potted transformer or reactor according to claim 7, characterized in that: The outer side of the water cooling tube (4) is surrounded by a protective frame (11), and the protective frame (11) is entirely located outside the shell (1).
9. The heat dissipation and cooling structure of the potted transformer or reactor according to claim 8, characterized in that: When the housing (1) includes a plurality of transformer bodies (12), or includes a plurality of reactor bodies (13), or includes an integrated transformer body (12) and a reactor body (13), a partition plate (14) is provided between each transformer body (12), or between each reactor body (13), or between the transformer body (12) and the reactor body (13); the partition plate (14) is in the form of a water-cooled plate or an insulating plate.
10. The heat dissipation and cooling structure of the potted transformer or reactor according to claim 9, characterized in that: When the transformer body (12) and the reactor body (13) are integrated in the housing (1), the transformer body (12) and the reactor body (13) are respectively arranged in the transformer area (15) and the reactor area (16); the water cooling pipes (4) on each transformer body (12) in the transformer area (15) are connected in series and connected to the bottom flow channel in the converging water cooling plate (5); and the water cooling pipes (4) on each reactor body (13) in the reactor area (16) are connected in series and connected to the bottom flow channel in the converging water cooling plate (5).
Citation Information
Patent Citations
High-frequency high-voltage high-power rectifier transformer
CN114188124A
Transformer with double cooling functions
CN212380253U
Fully-encapsulated water-cooled transformer
CN214588365U