Chip fixing device

Abstract

The chip fixing device provided by the utility model comprises a bottom plate and a fixing piece, and the fixing piece is arranged on the bottom plate; the upper plate surface of the bottom plate is used for being attached to one non-bonding-pad surface of the chip; and the fixing piece comprises a pressing piece part which is positioned above the upper plate surface of the bottom plate and is used for clamping and pressing the bonding pad surface of the chip. Therefore, on one hand, the requirement that the chip is not prone to deformation and damage in the process of removing the residual tin on the chip is met.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic product maintenance, and particularly relates to a chip fixing device. Background Art

[0002] When repairing an electronic product, the chip on the main board of the electronic product may be removed and then re-soldered. Since the chip is set on the main board by soldering, a large amount of solder remains on the removed chip. Therefore, the remaining solder needs to be removed before re-soldering. To remove this solder, the chip needs to be fixed first, then the solder is heated, and finally a tool is used to remove the solder.

[0003] In the process of removing the remaining solder on the chip in the prior art, it is necessary to fix the chip by means of left and right clamping so that the entire solder pad with the remaining solder is exposed. This method has defects. Because when the solder is heated, the chip will also be heated, so that the chip expands slightly. In this case, the clamping fixing method is likely to cause the chip to be damaged due to excessive pressure caused by thermal expansion, that is, the damage caused by repair. This kind of damage destroys the internal circuit of the chip and is not repairable. It can only be solved by replacing the chip, and replacing the chip will increase a large amount of maintenance costs, even exceeding the existing value of the electronic product.

[0004] Therefore, there are still problems to be solved in the prior art. Summary of the Utility Model

[0005] The main purpose of the utility model is to propose a chip fixing device, aiming to meet the requirement that the chip is not easily deformed and damaged in the process of removing the remaining solder on the chip.

[0006] To achieve the above purpose, the chip fixing device proposed by the utility model includes a bottom plate and a fixing member. The fixing member is arranged on the bottom plate; the upper plate surface of the bottom plate is used to fit with the non-solder pad side of the chip; the fixing member includes a pressing part, and the pressing part is located above the upper plate surface of the bottom plate and is used to clamp and press the solder pad surface of the chip.

[0007] Preferably, the fixing member is formed with a convex part, the convex part protrudes downward, and the convex part is provided with a first hinge hole.

[0008] Preferably, the bottom plate is provided with a groove, and the convex part is arranged in the groove; the side wall of the groove is provided with a second hinge hole, and a rotating shaft penetrates through the first hinge hole and the second hinge hole.

[0009] Preferably, a torsion spring is arranged at the rotating shaft, and the torsion spring is used to make the pressing part fit with the bottom plate.

[0010] Preferably, the fixing member has opposite first and second ends, and the pressing piece portion is located at the first end; a slope is provided at one end of the groove close to the first end; the slope has a lower end and a higher end, the lower end is close to the second hinge hole, and the higher end is away from the second hinge hole.

[0011] Preferably, the bottom plate is provided with a groove, the fixing member is hinged in the groove, the fixing member has opposite first and second ends, and the pressing piece portion is located at the first end; a first elastic member is provided in the groove; one end of the first elastic member is arranged at the second end, and the other end of the first elastic member is arranged at the bottom of the groove, so that the pressing piece portion fits the bottom plate.

[0012] Preferably, the fixing member further includes a second elastic member for making the pressing piece portion fit the bottom plate.

[0013] Preferably, the second elastic member is arranged as a spring plate, the spring plate is fixed to the bottom plate, and the pressing piece portion is fixed to the spring plate.

[0014] Preferably, the fixing member is hinged to the bottom plate, the second elastic member is arranged as a torsion spring, and the torsion spring is arranged at the hinge shaft where the fixing member is hinged to the bottom plate.

[0015] Preferably, the bottom plate is formed with a shallow groove, and the shallow groove is arranged below the pressing piece portion; the shallow groove is used for placing the chip.

[0016] A chip fixing device provided by an embodiment of the present application includes a bottom plate and a fixing member, and the fixing member is arranged on the bottom plate; the upper plate surface of the bottom plate is used for fitting with a non-pad surface of the chip; the fixing member includes a pressing piece portion, and the pressing piece portion is located above the upper plate surface of the bottom plate and is used for clamping and pressing the pad surface of the chip. In this way, the requirement that the chip is not easily deformed and damaged during the process of removing the residual tin on the chip is met. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative efforts.

[0018] Figure 1 It is a schematic diagram of an embodiment of the chip fixing device of the present invention;

[0019] Figure 2 For Figure 1 An enlarged view of part A;

[0020] Figure 3 It is a schematic diagram of an embodiment of the chip fixing device of the present invention;

[0021] Figure 4 is Figure 3 A sectional view taken along the dashed line B-B;

[0022] Figure 5 It is a schematic diagram of a fixing member of an embodiment of the chip fixing device of the present utility model.

[0023] Explanation of the reference numerals in the drawings:

[0024] Label Name Label Name 100 Bottom plate 130 Shallow groove 110 Upper plate surface 200 Fixing part 120 Groove 210 Pressing part 121 Second hinge hole 220 Convex part 122 Inclined plane 221 First hinge hole 122a One end of the lower part of the inclined plane 230 First end 122b One end of the upper part of the inclined plane 240 Second end

[0025] The realization, functional features and advantages of the object of the present utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0027] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) in the embodiments of the present utility model, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, if there are descriptions such as "first", "second" in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0029] When repairing electronic products, it may be necessary to remove the chips on the motherboard of the electronic products and then re-weld them. Since the chips are set on the motherboard by welding, there is a large amount of solder residue on the removed chips. Therefore, it is necessary to remove the residual solder before re-welding. To remove this solder, it is necessary to first fix the chip, then heat the solder, and finally use tools to remove the solder.

[0030] In the process of removing the residual tin on the chip in the prior art, it is necessary to fix the chip by means of left and right clamping so that the entire pad with residual solder is exposed. This method has defects because when heating the tin, the chip will also be heated, resulting in a slight expansion of the chip. In this case, the clamping fixation method is likely to cause the chip to be damaged due to excessive pressure caused by thermal expansion, that is, the damage caused by repair. This kind of damage destroys the internal circuit of the chip and is not repairable. Only by replacing the chip can the problem be solved, and replacing the chip will increase a large amount of maintenance costs, even exceeding the existing value of the electronic product.

[0031] To solve the above problems, the present patent provides a chip fixing device, aiming to meet the requirement that the chip is not easily deformed and damaged during the process of removing the residual tin on the chip.

[0032] For the convenience of understanding, the following will specifically describe the specific implementation manners of the embodiments of the present application in conjunction with the accompanying drawings.

[0033] Please refer to Figure 1 and Figure 5 A chip fixing device includes a bottom plate 100 and a fixing member 200. The fixing member 200 is disposed on the bottom plate 100; the upper plate surface 110 of the bottom plate 100 is used to fit with the non-pad side of the chip; the fixing member 200 includes a pressing piece portion 210, and the pressing piece portion 210 is located above the upper plate surface 110 of the bottom plate 100 and is used to clamp and press the pad surface of the chip.

[0034] In this embodiment, the chip has a relative non-pad side and a pad side, and there will be residual solder on the pad side. Therefore, it is necessary to have the pad side facing up and the non-pad side facing down to facilitate the maintenance personnel to clean the solder. The upper plate surface 110 of the bottom plate 100 being used to fit with the non-pad side of the chip can meet the above requirements. The pressing piece portion 210 of the fixing member 200 is located above the upper plate surface 110 of the bottom plate 100, so that the pressing piece portion 210 can clamp and press the pad surface of the chip from top to bottom. The clamping method from top to bottom is less likely to cause damage compared with the left and right clamping method in the prior art. Therefore, the maintenance personnel can fix the chip on the chip fixing device and meet the requirement that the chip is not easily deformed and damaged during the process of removing the residual tin on the chip.

[0035] It should be noted that based on the technical solution that the fixing member 200 clamps and presses the pad surface of the chip through the pressing piece portion 210, further, there is a technical problem of how the pressing piece portion 210 realizes clamping and pressing the pad surface of the chip from top to bottom. To solve the above problems, the present application provides a preferred implementation manner.

[0036] Please refer to Figure 5, the fixing member 200 is formed with a convex portion 220 which protrudes downward, and a first hinge hole 221 is provided on the convex portion 220.

[0037] In this embodiment, by providing the first hinge hole 221 on the convex portion 220 of the fixing member 200 for the rotation shaft to pass through, the fixing member 200 can rotate around the rotation shaft, so as to meet the requirement of clamping and pressing the chip solder pad surface from top to bottom. In this embodiment, the position where the fixing portion is formed on the fixing member 200 is not limited. It may be formed by protruding downward at the middle position of the fixing member 200, or may be formed by protruding downward at the end of the fixing member 200 away from the pressing piece portion 210.

[0038] It should be noted that, based on the technical solution of providing the first hinge hole 221 on the convex portion 220, further, there is a technical problem of how the fixing member 200 is hinged to the bottom plate 100. To solve the above problem, the present application provides a preferred implementation manner.

[0039] Please refer to Figures 1-4 , the bottom plate 100 is provided with a groove 120, and the convex portion 220 is disposed in the groove 120; a second hinge hole 121 is provided on the side wall of the groove 120, and a rotation shaft passes through the first hinge hole 221 and the second hinge hole 121.

[0040] In this embodiment, by providing the second hinge hole 121 on the side wall of the groove 120, the rotation shaft can pass through the first hinge hole 221 and the second hinge hole 121, so that the fixing member 200 is hinged to the bottom plate 100. Since the convex portion 220 of the fixing member 200 is disposed in the groove 120, the distance between the pressing piece portion 210 of the fixing member 200 and the upper plate surface 110 of the bottom plate 100 is smaller, and it is more stable when clamping the chip.

[0041] It should be noted that, based on the technical solution that the second hinge hole 121 is provided on the side wall of the groove 120 and the rotation shaft passes through the first hinge hole 221 and the second hinge hole 121, further, when the maintenance personnel clean the residual solder, the pressing piece portion 210 needs to clamp and press the chip solder pad surface, so there is a technical problem of how to make the pressing piece portion 210 clamp and press the chip solder pad surface. To solve the above problem, the present application provides a preferred implementation manner.

[0042] Optionally, a torsion spring is provided at the rotation shaft, and the torsion spring is used to make the pressing piece portion 210 fit the bottom plate 100.

[0043] In this embodiment, by providing a torsion spring at the rotation shaft, the pressing piece portion 210 can fit the bottom plate 100, so as to clamp and press the chip placed on the bottom plate 100. Since the rotation shaft is located in the groove 120, the torsion spring is not easily affected by the outside of the groove 120. When no external force acts on the fixing member 200, the fixing member 200 will fit the bottom plate 100.

[0044] It should be noted that, based on the technical solution in which the convex portion 220 is provided in the groove 120, further, there is a technical problem of how to avoid the convex portion 220 from tilting and getting stuck at the end of the groove 120 when the tablet pressing portion 210 fits against the bottom plate 100, resulting in the tablet pressing portion 210 being unable to continue to fit against the bottom plate 100. To solve the above problems, the present application provides a preferred implementation.

[0045] Please refer to Figure 2 and Figure 5 , the fixing member 200 has opposite first end 230 and second end 240, and the tablet pressing portion 210 is located at the first end 230; one end of the groove 120 near the first end 230 is provided with an inclined surface 122; the inclined surface 122 has one end at a lower position and the other end at a higher position, the end at the lower position is close to the second hinge hole 121, and the end at the higher position is far from the second hinge hole 121.

[0046] In this embodiment, an inclined surface 122 is provided at one end of the groove 120 near the first end 230, and the end of the inclined surface 122 at the lower position is close to the second hinge hole 121, and the end at the higher position is far from the second hinge hole 121. When the tablet pressing portion 210 fits against the bottom plate 100 and the convex portion 220 tilts, the inclined surface 122 reserves space for the tilt of the convex portion 220, and the convex portion 220 will not get stuck at the end of the groove 120, and the tablet pressing portion 210 can continue to fit against the bottom plate 100. This embodiment can hinge and fix the fixing member 200 in as small a space as possible.

[0047] It should be noted that, in addition to the above implementation, there are other implementations for the tablet pressing portion 210 to clamp and press the solder pad surface of the chip. The specific implementations that meet the above requirements are not limited in this embodiment. For ease of understanding, the present application provides a preferred implementation.

[0048] Please refer to Figure 2 and Figure 5 , the bottom plate 100 is provided with a groove 120, the fixing member 200 is hinged in the groove 120, the fixing member 200 has opposite first end 230 and second end 240, and the tablet pressing portion 210 is located at the first end 230; a first elastic member is provided in the groove 120; one end of the first elastic member is provided at the second end 240, and the other end of the first elastic member is provided at the bottom of the groove 120 to make the tablet pressing portion 210 fit against the bottom plate 100.

[0049] In this embodiment, being hinged in the groove 120 means that when hinged, part of it is located in the groove 120, not that it needs to be completely located in the groove 120. A first elastic member is arranged in the groove 120, with one end of the first elastic member arranged at the second end portion 240 and the other end arranged at the bottom of the groove. The force exerted by the first elastic member causes the second end portion 240 of the fixing member 200 to rotate upward around the hinge point, and the first end portion 230 of the fixing member 200 to rotate downward around the hinge point, thereby enabling the pressing piece portion 210 to clamp and press the welding surface of the chip. In this embodiment, the implementation manner of the first elastic member is not limited. Preferably, the first elastic member can be arranged as a spring or a spring piece.

[0050] It should be noted that in addition to the above implementation manner, there are other implementation manners for the pressing piece portion 210 to clamp and press the welding surface of the chip. The specific implementation manners that meet the above requirements are not limited in this embodiment. For ease of understanding, this application provides a preferred implementation manner.

[0051] Optionally, the fixing member 200 further includes a second elastic member for making the pressing piece portion 210 fit the bottom plate 100.

[0052] In this embodiment, the fixing member 200 further includes a second elastic member, and the second elastic member can make the pressing piece portion 210 fit the bottom plate 100 to meet the requirement that the pressing piece portion 210 clamps and presses the welding surface of the chip.

[0053] It should be noted that there are various implementation manners for the second elastic member. The specific implementation manners that meet the above requirements are not limited in this embodiment. For ease of understanding, this application provides two preferred implementation manners.

[0054] Method 1.

[0055] Optionally, the second elastic member is arranged as a spring piece, the spring piece is fixed to the bottom plate 100, and the pressing piece portion 210 is fixed to the spring piece.

[0056] In this embodiment, the second elastic member is arranged as a spring piece, the spring piece is fixed to the bottom plate 100 and fixed to the pressing piece portion 210, so that the force exerted by the second elastic member can act on the fixing member 200 to make the pressing piece portion 210 of the fixing member 200 clamp and press the welding surface of the chip.

[0057] Method 2.

[0058] Optionally, the fixing member 200 is hinged to the bottom plate 100, the second elastic member is arranged as a torsion spring, and the torsion spring is arranged at the hinge shaft where the fixing member 200 is hinged to the bottom plate 100.

[0059] In this embodiment, the second elastic member is set as a torsion spring, and the torsion spring is arranged at the hinge shaft where the fixing member 200 is hinged to the bottom plate 100, so that the force exerted by the second elastic member can act on the fixing member 200, and the pressing piece portion 210 of the fixing member 200 can clamp and press the chip welding surface.

[0060] It should be noted that during the process of the chip being clamped and pressed by the pressing piece portion 210, it is not easy to have a lateral displacement. The specific implementation method to meet the above requirements is not limited in this embodiment. For the convenience of understanding, the present application provides a preferred implementation method.

[0061] Please refer to Figure 1 , a shallow groove 130 is formed on the bottom plate 100, and the shallow groove 130 is arranged below the pressing piece portion 210; the shallow groove 130 is used to place the chip.

[0062] In this embodiment, a shallow groove 130 for placing the chip is formed on the bottom plate 100, and the shallow groove 130 is arranged below the pressing piece portion 210, so that the chip can be clamped and pressed by the pressing piece portion 210 in the direction of the pressing piece portion 210 fitting to the bottom plate 100. At the same time, the shallow groove 130 can also make the chip not easy to have a lateral displacement during the clamping and pressing process.

[0063] In summary, a chip fixing device provided by an embodiment of the present application includes a bottom plate 100 and a fixing member 200, and the fixing member 200 is arranged on the bottom plate 100; the upper plate surface 110 of the bottom plate 100 is used to fit with the non-welding pad side of the chip; the fixing member 200 includes a pressing piece portion 210, and the pressing piece portion 210 is located above the upper plate surface 110 of the bottom plate 100 and is used to clamp and press the welding surface of the chip. In this way, the requirement that the chip is not easily deformed and damaged during the process of removing the residual tin on the chip is met.

[0064] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made by using the specification and drawings of the present invention under the inventive concept of the present invention, or directly / indirectly applied to other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A chip fixing device, characterized in that: It includes a base plate and a fixing part, wherein the fixing part is arranged on the base plate; the upper plate surface of the base plate is used to fit with the non-pad side of the chip; the fixing part includes a pressing sheet part, which is located above the upper plate surface of the base plate and is used to clamp and press the pad surface of the chip.

2. The chip fixing device according to claim 1, characterized in that: The fixing piece is formed with a convex portion, the convex portion is formed to protrude downward, and the convex portion is provided with a first hinge hole.

3. The chip fixing device according to claim 2, characterized in that: The bottom plate is provided with a groove, and the convex part is arranged in the groove; The side wall of the groove is provided with a second hinge hole, and the first hinge hole and the second hinge hole are penetrated by a rotating shaft.

4. The chip fixing device according to claim 3, characterized in that: A torsion spring is arranged at the rotating shaft, and the torsion spring is used to make the pressing part fit the bottom plate.

5. The chip fixing device according to claim 3, characterized in that: The fixing member has a first end and a second end opposite to each other, and the pressing piece is located at the first end; An end of the groove close to the first end is provided with an inclined surface; The inclined surface has one end located at a low position and the other end located at a high position, wherein the one end located at the low position is close to the second hinge hole, and the other end located at the high position is far away from the second hinge hole.

6. The chip fixing device according to claim 2, characterized in that: The bottom plate is provided with a groove, the fixing member is hinged in the groove, the fixing member has a first end and a second end opposite to each other, and the pressing part is located at the first end; A first elastic member is arranged in the groove; one end of the first elastic member is arranged at the second end portion, and the other end of the first elastic member is arranged at the groove bottom of the groove, so that the pressing portion is attached to the bottom plate.

7. The chip fixing device according to claim 1, characterized in that: The fixing member further includes a second elastic member, and the second elastic member is used to make the pressing piece fit the bottom plate.

8. The chip fixing device according to claim 7, characterized in that: The second elastic member is configured as a spring sheet, the spring sheet is fixed to the bottom plate, and the pressing portion is fixed to the spring sheet.

9. The chip fixing device according to claim 7, characterized in that: The fixing member is hinged to the bottom plate, the second elastic member is configured as a torsion spring, and the torsion spring is disposed at a hinge axis where the fixing member and the bottom plate are hinged.

10. The chip fixing device according to any one of claims 1 to 9, characterized in that: The bottom plate is formed with a shallow groove, which is arranged below the pressing part; the shallow groove is used for placing the chip.

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