Electromagnetic shielding packaging structure and system packaging module

Abstract

The utility model provides an electromagnetic shielding packaging structure and a system packaging module, and relates to the technical field of chip packaging, the electromagnetic shielding packaging structure comprises a substrate, a plastic package body, a bonding layer, a shielding layer, a shielding metal column and a plurality of chips, one side surface of the substrate is provided with a plurality of mounting areas, a plurality of grounding pads are arranged between the adjacent mounting areas; the plurality of chips are correspondingly pasted on the plurality of pasting areas; the plastic package body is arranged on the substrate, and a plurality of shielding grooves are formed in the plastic package body; the bonding layer covers the surface of the plastic package body and the inner wall of the shielding groove; the shielding layer covers the surface of the bonding layer; the shielding metal columns are formed on the surface of the shielding layer through electroplating and are filled in the shielding grooves. Compared with the prior art, the bonding layer is additionally arranged, so that the bonding force between the shielding layer and the plastic package body is greatly improved, the phenomenon that the shielding layer is separated or layered is avoided, and the structural strength and the electromagnetic shielding effect are improved by utilizing the shielding metal columns.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, and more specifically, to an electromagnetic shielding packaging structure and a system packaging module. Background Art

[0002] After research by the inventor, it is found that with the rapid development of the semiconductor industry, the SIP module structure is widely used in the semiconductor industry. The main advantages of the SIP module are high-density integration, small size of the packaged product, excellent product performance, fast signal transmission frequency, etc. Semiconductor devices cause relatively high-intensity electromagnetic radiation at high frequencies or short wavelengths. With the application of electronic products in high-frequency signals in the communication field, it is necessary for the product to have a partitioned electromagnetic shielding structure to prevent electromagnetic interference phenomena generated by various chips and components from occurring.

[0003] In the existing electromagnetic shielding structure, shielding columns are usually formed by electroplating after grooving directly on the plastic package body, and then a metal cover is formed to achieve electromagnetic shielding. The bonding force between the shielding layer and the plastic package body is poor, and it is easy to separate, affecting the electromagnetic shielding effect. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an electromagnetic shielding packaging structure and a system packaging module, which can improve the bonding force of the shielding layer, avoid the phenomenon of separation and delamination, and ensure the electromagnetic shielding effect.

[0005] The embodiments of the utility model are implemented as follows:

[0006] In a first aspect, the utility model provides an electromagnetic shielding packaging structure, including:

[0007] A substrate, on one side surface of the substrate, there are provided a plurality of mounting areas, and between adjacent mounting areas, there are provided a plurality of ground pads;

[0008] A plurality of chips, the plurality of chips are correspondingly mounted on the plurality of mounting areas and are spaced apart from the ground pads;

[0009] A plastic package body, the plastic package body is disposed on the substrate and covers the plurality of chips and the plurality of ground pads, and on the plastic package body, there are formed a plurality of shielding grooves exposing the ground pads;

[0010] An adhesive layer, the adhesive layer covers the surface of the plastic package body and the inner wall of the shielding grooves;

[0011] A shielding layer, the shielding layer covers the surface of the adhesive layer;

[0012] Shielding metal columns, the shielding metal columns are electroplated on the surface of the shielding layer and are filled in the shielding grooves, and the shielding metal columns are located between adjacent two chips.

[0013] In an alternative embodiment, the shielding trench is a tapered groove, and both the side wall and the bottom wall of the shielding trench are covered with the adhesive layer, and the adhesive layer covers the ground pad.

[0014] In an alternative embodiment, the surface of the ground pad is further covered with a protective solder layer, and the protective solder layer is configured to form the bottom wall of the shielding trench.

[0015] In an alternative embodiment, a plurality of the shielding trenches are distributed in two columns on the plastic package body to form two columns of the shielding metal posts.

[0016] In an alternative embodiment, the two columns of the shielding trenches are arranged in a staggered manner.

[0017] In an alternative embodiment, a communication trench is formed by grooving on the plastic package body, the communication trench communicates with the plurality of shielding trenches, the adhesive layer covers the side wall of the communication trench, and the communication trench is filled with a connecting metal post by electroplating, and the connecting metal post is integrally provided with the shielding metal post.

[0018] In an alternative embodiment, the adhesive layer covers the side wall of the communication trench, the shielding layer covers the adhesive layer in the communication trench, and the connecting metal post is electroplated on the shielding layer.

[0019] In an alternative embodiment, the adhesive layer is configured to expose the side wall of the communication trench, the shielding layer covers the side wall of the communication trench, and the connecting metal post is electroplated on the shielding layer.

[0020] In an alternative embodiment, there are a plurality of the communication trenches, and the plurality of communication trenches communicate with each other and are in a cross ring shape, so that the connecting metal post is in a cross ring column shape, and both sides of each communication trench communicate with the shielding trenches on both sides respectively.

[0021] In a second aspect, the present invention provides a system-in-package module, including a circuit board and the electromagnetic shielding package structure according to any one of the foregoing embodiments, and the substrate is attached to the circuit board.

[0022] The beneficial effects of the embodiments of the present invention include:

[0023] The electromagnetic shielding package structure and system package module provided by the embodiment of the present utility model set multiple mounting areas on the surface of the substrate, and set multiple grounding pads between adjacent mounting areas to achieve grounding by using the grounding pads. At the same time, multiple chips are correspondingly mounted on the multiple mounting areas and are arranged at intervals from the grounding pads. Then, a plastic package body is formed on the substrate by using a plastic packaging process. The plastic package body covers the multiple chips and the multiple grounding pads. Then, slots are formed in the plastic package body to form multiple shielding grooves corresponding to expose the grounding pads. Then, a bonding layer is sputtered on the surface of the plastic package body and the inner wall of the shielding groove, and then a shielding layer is sputtered again on the surface of the bonding layer. Finally, the shielding grooves are filled by using an electroplating process to form shielding metal columns, thereby realizing the electromagnetic shielding function. Compared with the prior art, the present utility model greatly improves the bonding force between the shielding layer and the plastic package body by adding a bonding layer, avoids the phenomenon of detachment or delamination of the shielding layer, and uses the shielding metal columns to improve the structural strength and the electromagnetic shielding effect. Brief Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 Schematic diagram of the electromagnetic shielding package structure provided by the first embodiment of the present utility model;

[0026] Figure 2 For Figure 1 Partial enlarged schematic diagram of II in;

[0027] Figure 3 For Figure 1 Mounting schematic diagram of the substrate and the chip in;

[0028] Figure 4 For Figure 1 Schematic diagram of slotting on the plastic package body in;

[0029] Figure 5 Schematic diagram of the electromagnetic shielding package provided by the second embodiment of the present utility model;

[0030] Figure 6 For Figure 5 Schematic diagram of slotting on the plastic package body in;

[0031] Figure 7 For Figure 5 Cross-sectional schematic diagram at A-A in;

[0032] Icon:

[0033] 100 - Electromagnetic shielding package structure; 110 - Substrate; 111 - Ground pad; 113 - Protective solder layer; 120 - Plastic package; 121 - Shielding groove; 123 - Connecting groove; 130 - Adhesive layer; 140 - Shielding layer; 150 - Shielding metal column; 160 - Chip; 170 - Connecting metal column. Detailed implementation manners

[0034] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings herein can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the scope of protection of the present utility model.

[0036] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0037] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed when in use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0038] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0039] In the description of the present utility model, it should also be noted that, unless otherwise clearly specified and defined, the terms "arranged", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0040] First Embodiment

[0041] Please refer to Figures 1 to 4 , this embodiment provides an electromagnetic shielding package structure 100, which can improve the bonding force of the shielding layer 140, avoid the phenomenon of detachment and delamination, and ensure the electromagnetic shielding effect.

[0042] The electromagnetic shielding package structure 100 provided in this embodiment includes a substrate 110, a plastic package 120, an adhesive layer 130, a shielding layer 140, shielding metal posts 150, and a plurality of chips 160. A plurality of mounting areas are provided on one side surface of the substrate 110, and a plurality of ground pads 111 are provided between adjacent mounting areas; the plurality of chips 160 are correspondingly mounted on the plurality of mounting areas and are spaced apart from the ground pads 111; the plastic package 120 is provided on the substrate 110 and covers the plurality of chips 160 and the plurality of ground pads 111. A plurality of shielding grooves 121 exposing the ground pads 111 are formed by grooving on the plastic package 120; the adhesive layer 130 covers the surface of the plastic package 120 and the inner wall of the shielding grooves 121; the shielding layer 140 covers the surface of the adhesive layer 130; the shielding metal posts 150 are electroplated on the surface of the shielding layer 140 and fill the shielding grooves 121, and the shielding metal posts 150 are located between two adjacent chips 160.

[0043] It should be noted that in this embodiment, a plurality of mounting areas are provided on the surface of the substrate 110, and a plurality of ground pads 111 are provided between adjacent mounting areas. The ground pads 111 are used to achieve grounding. At the same time, a plurality of chips 160 are correspondingly mounted on the plurality of mounting areas and are arranged at intervals from the ground pads 111. Then, a plastic package 120 is formed on the substrate 110 by a plastic packaging process. The plastic package 120 covers the plurality of chips 160 and the plurality of ground pads 111. Then, slots are formed in the plastic package 120 to form a plurality of shielding grooves 121 corresponding to expose the ground pads 111. Then, a bonding layer 130 is sputtered on the surface of the plastic package 120 and the inner wall of the shielding grooves 121. Then, a shielding layer 140 is sputtered again on the surface of the bonding layer 130. Finally, the shielding grooves 121 are filled by an electroplating process to form shielding metal columns 150, thereby realizing the electromagnetic shielding function. By adding the bonding layer 130, the bonding force between the shielding layer 140 and the plastic package 120 is greatly improved, avoiding the phenomenon of detachment or delamination of the shielding layer 140, and using the shielding metal columns 150 to improve the structural strength and electromagnetic shielding effect.

[0044] It should be noted that in this embodiment, both the bonding layer 130 and the shielding layer 140 can be formed by a sputtering process. Among them, the bonding layer 130 can be a stainless steel layer, which can play a role in increasing the bonding force between the plastic package 120 and the shielding layer 140. At the same time, the shielding layer 140 can be a copper layer and is sputtered on the surface of the bonding layer 130.

[0045] In this embodiment, a plurality of mounting areas can be provided on the front surface of the substrate 110, and a plurality of ground pads 111 are provided. Ground pins can also be provided on the back surface of the substrate 110 and are connected to an external ground circuit. Among them, the ground pads 111 can be electrically connected to the ground pins through conductive columns or wiring structures in the middle of the substrate 110. In this embodiment, the chips 160 can be chips 160 with different functions. Taking two chips 160 as an example, one of the chips 160 can be a radio frequency chip 160, and the other can be a power amplifier chip 160. A plurality of ground pads 111 and a plurality of shielding metal columns 150 are distributed between the two chips 160.

[0046] In this embodiment, the shielding trench 121 is a tapered groove, and both the side wall and the bottom wall of the shielding trench 121 are covered with an adhesive layer 130, and the adhesive layer 130 covers the ground pad 111. Specifically, the shielding trench 121 being a tapered groove means that the cross-section of the shielding trench 121 is an inverted trapezoidal structure, such that the bottom width of the shielding trench 121 is smaller than the top width. Therefore, during laser grooving, the energy at the initial stage of grooving can be high, and the energy at the later stage can be low, which can effectively avoid damaging the substrate 110 or the bottom ground pad 111 during laser grooving. At the same time, the design of the tapered groove also enables the metal liquid to completely fill the shielding trench 121 when electroplating to form the shielding metal column 150, improving the filling property, and thus ensuring the electromagnetic shielding effect of the shielding metal column 150.

[0047] In this embodiment, the surface of the ground pad 111 is further covered with a protective solder layer 113, and the protective solder layer 113 is configured to form the bottom wall of the shielding trench 121. Specifically, the protective solder layer 113 can be formed by printing or dispensing processes to form a protective solder, and the ground pad 111 is protected by the protective solder layer 113 to further avoid laser damage to the ground pad 111 during plastic encapsulation grooving.

[0048] In this embodiment, multiple shielding trenches 121 are arranged in a single row on the plastic encapsulation body 120 to form a shielding fence and achieve the electromagnetic shielding function.

[0049] In some other preferred embodiments, multiple shielding trenches 121 are arranged in two rows on the plastic encapsulation body 120 to form two rows of shielding metal columns 150. Specifically, the multiple shielding trenches 121 arranged in two rows can form two rows of shielding metal columns 150, thereby improving the electromagnetic shielding effect.

[0050] Preferably, the two rows of shielding trenches 121 are arranged in a staggered manner. Specifically, the two rows of shielding trenches 121 are staggered in the distribution direction. Therefore, the two rows of shielding metal columns 150 are also arranged in a staggered manner, such that the two rows of shielding metal columns 150 are staggered in the connection direction of the two chips 160, which can improve the electromagnetic shielding effect.

[0051] In actual preparation, a substrate 110 can be provided first. Then, ground pads 111 are designed in the areas on the surface of the substrate 110 that need to be partitioned and shielded. A protective solder layer 113 is formed on the surface of the ground pads 111 through a printing process. Then, the chip 160 is mounted in the mounting area of the substrate 110. The mounted chip 160 is protected with a molding compound to form a molded body 120. The molding compound can be an epoxy-based resin or a silicone-based resin. Then, a laser grooving process is used to form shielding grooves 121 on the surface of the molded body 120. The shielding grooves 121 are tapered grooves. Then, metal layer sputtering is performed on the surface of the molded body 120 and the shielding grooves 121. First, the first metal sputtering is carried out to sputter and form a stainless steel metal layer as an adhesive layer 130. Then, the second metal sputtering is carried out to sputter and form a copper layer as a shielding layer 140. Finally, a shielding metal column 150 is electroplated on the surface of the shielding layer 140 in the shielding grooves 121. Then, the ball mounting process is completed on the back of the substrate 110 to form back solder balls, and the grounding function is realized through the solder balls corresponding to the grounding pins. Finally, the substrate 110 cutting process is carried out to cut the product into single pieces.

[0052] In summary, this embodiment provides an electromagnetic shielding package structure 100. A plurality of mounting areas are provided on the surface of the substrate 110, and a plurality of ground pads 111 are provided between adjacent mounting areas. The ground pads 111 are used to achieve grounding. At the same time, a plurality of chips 160 are correspondingly mounted in the plurality of mounting areas and are spaced apart from the ground pads 111. Then, a molded body 120 is formed on the substrate 110 by a molding process. The molded body 120 covers the plurality of chips 160 and the plurality of ground pads 111. Then, a plurality of shielding grooves 121 corresponding to exposing the ground pads 111 are formed by grooving on the molded body 120. Then, an adhesive layer 130 is sputtered and formed on the surface of the molded body 120 and the inner wall of the shielding grooves 121. Then, a shielding layer 140 is sputtered and formed again on the surface of the adhesive layer 130. Finally, the shielding grooves 121 are filled by an electroplating process to form shielding metal columns 150, thereby realizing the electromagnetic shielding function. Compared with the prior art, in this embodiment, by adding the adhesive layer 130, the bonding force between the shielding layer 140 and the molded body 120 is greatly improved, avoiding the phenomenon of the shielding layer 140 coming off or delaminating, and the structural strength and electromagnetic shielding effect are improved by using the shielding metal columns 150.

[0053] Second Embodiment

[0054] Referring to Figures 5 to 7 , this embodiment provides an electromagnetic shielding package structure 100. Its basic structure, principle, and the resulting technical effects are the same as those of the first embodiment. For a brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the first embodiment.

[0055] In this embodiment, a connecting groove 123 is also formed by grooving on the plastic package body, and the connecting groove 123 communicates with a plurality of shielding grooves 121. The adhesive layer 130 covers the side wall of the connecting groove 123, and the connecting groove 123 is filled with a connecting metal column 170 by electroplating. The connecting metal column 170 and the shielding metal column 150 are integrally arranged. Specifically, when grooving, the connecting groove 123 and the shielding groove 121 can be grooved together to form an integral groove structure, and the connecting metal column 170 and the shielding metal column 150 can also be formed together during subsequent electroplating, so as to block the gap between the shielding metal columns 150, reduce the signal of a specific wavelength from passing through the gap, and improve the electromagnetic shielding effect.

[0056] It should be noted that the depth of the connecting groove 123 can be the same as that of the shielding groove 121, and they can be grooved together when grooving.

[0057] Further, in this embodiment, the adhesive layer 130 covers the side wall of the connecting groove 123, the shielding layer 140 covers the adhesive layer 130 in the connecting groove 123, and the connecting metal column 170 is electroplated on the shielding layer 140. Specifically, when sputtering the adhesive layer 130, the side walls and the bottom walls of the connecting groove 123 and the shielding groove 121 can be covered. The shielding layer 140 can cover the adhesive layer 130 in both the connecting groove 123 and the shielding groove 121, so as to ensure the electromagnetic shielding effect while improving the bonding force between the plastic package body 120 and the shielding layer 140.

[0058] In other preferred embodiments of the present invention, the adhesive layer 130 is configured to expose the side wall of the connecting groove 123, the shielding layer 140 covers the side wall of the connecting groove 123, and the connecting metal column 170 is electroplated on the shielding layer 140. Specifically, when sputtering to form the adhesive layer 130, the connecting groove 123 can be blocked by a mask, so as to ensure that the adhesive layer 130 is only formed on the side walls and the bottom wall of the shielding groove 121, and only the shielding layer 140 is sputtered on the connecting groove 123, which saves the material of the adhesive layer 130 and also ensures the electromagnetic shielding effect.

[0059] In this embodiment, there are a plurality of connecting grooves 123, and the plurality of connecting grooves 123 communicate with each other and are all in a cross-ring shape, so that the connecting metal column 170 is in a cross-ring column shape, and both sides of each connecting groove 123 communicate with the shielding grooves 121 on both sides. Specifically, each connecting groove 123 is in a cross-ring shape, so that a part of the plastic package body 120 can be reserved in the middle area. On the one hand, it can reduce the metal material used for electroplating the connecting metal column 170 subsequently, and on the other hand, it can increase the contact area between the plastic package body 120 and the adhesive layer 130 or the shielding layer 140, and further improve the bonding force.

[0060] Third Embodiment

[0061] This embodiment provides a system-in-package module, including a circuit board and an electromagnetic shielding package structure 100. The basic structure, principle, and technical effects generated by the electromagnetic shielding package structure 100 are the same as those of the first embodiment or the second embodiment. For a brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the first embodiment or the second embodiment.

[0062] The system-in-package module provided in this embodiment includes a circuit board and an electromagnetic shielding package structure 100. The electromagnetic shielding package structure 100 includes a substrate 110, a molding compound 120, an adhesive layer 130, a shielding layer 140, shielding metal posts 150, and a plurality of chips 160. A plurality of mounting areas are provided on one side surface of the substrate 110, and a plurality of ground pads 111 are provided between adjacent mounting areas; the plurality of chips 160 are correspondingly mounted on the plurality of mounting areas and are spaced apart from the ground pads 111; the molding compound 120 is disposed on the substrate 110 and covers the plurality of chips 160 and the plurality of ground pads 111. Shielding grooves 121 exposing the ground pads 111 are formed by grooving on the molding compound 120; the adhesive layer 130 covers the surface of the molding compound 120 and the inner walls of the shielding grooves 121; the shielding layer 140 covers the surface of the adhesive layer 130; the shielding metal posts 150 are electroplated on the surface of the shielding layer 140 and fill the shielding grooves 121, and the shielding metal posts 150 are located between two adjacent chips 160. The substrate 110 is mounted on the circuit board.

[0063] Specifically, a plurality of solder balls are further provided on one side surface of the substrate 110 provided with ground pins. The substrate 110 can be fixedly welded to the circuit board through the plurality of solder balls to achieve electrical connection. At the same time, a ground circuit can also be provided on the circuit board, and the ground circuit realizes electrical connection with the ground pins and the ground pads 111 through the solder balls.

[0064] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electromagnetic shielding packaging structure, characterized in that: include: A substrate, wherein a plurality of mounting areas are arranged on a surface of one side of the substrate, and a plurality of ground pads are arranged between adjacent mounting areas; A plurality of chips, wherein the plurality of chips are mounted on the plurality of mounting areas correspondingly and are spaced apart from the ground pads; A plastic package body, the plastic package body is arranged on the substrate and covers the plurality of chips and the plurality of grounding pads, and the plastic package body is grooved to form a plurality of shielding grooves exposing the grounding pads; An adhesive layer, the adhesive layer covering the surface of the plastic package body and the inner wall of the shielding groove; A shielding layer, the shielding layer covering the surface of the adhesive layer; A shielding metal column is formed on the surface of the shielding layer by electroplating and fills the shielding groove, and the shielding metal column is located between two adjacent chips.

2. The electromagnetic shielding packaging structure according to claim 1, characterized in that: The shielding groove is a conical groove, the side wall and the bottom wall of the shielding groove are both covered with the adhesive layer, and the adhesive layer covers the grounding pad.

3. The electromagnetic shielding packaging structure according to claim 1, characterized in that: The surface of the ground pad is also covered with a protective solder layer, and the protective solder layer is configured to form a bottom wall of the shielding trench.

4. The electromagnetic shielding packaging structure according to claim 1, characterized in that: The plurality of shielding grooves are distributed in two rows on the plastic package body to form two rows of shielding metal columns.

5. The electromagnetic shielding packaging structure according to claim 4, characterized in that: The two rows of shielding grooves are staggered.

6. The electromagnetic shielding packaging structure according to claim 4, characterized in that: The plastic package body is also grooved to form a connecting groove, which is connected to the plurality of shielding grooves. The connecting groove is filled with connecting metal columns electroplated therein, and the connecting metal columns are integrally arranged with the shielding metal columns.

7. The electromagnetic shielding packaging structure according to claim 6, characterized in that: The adhesive layer covers the sidewalls of the connecting groove, the shielding layer covers the adhesive layer in the connecting groove, and the connecting metal column is formed on the shielding layer by electroplating.

8. The electromagnetic shielding packaging structure according to claim 6, characterized in that: The adhesive layer is configured to expose the sidewall of the connecting groove, the shielding layer covers the sidewall of the connecting groove, and the connecting metal column is formed on the shielding layer by electroplating.

9. The electromagnetic shielding packaging structure according to claim 6, characterized in that: The connecting grooves include a plurality of connecting grooves, which are interconnected and each has a cross ring shape, so that the connecting metal column has a cross ring column shape, and both sides of each connecting groove are respectively connected to the shielding grooves on both sides.

10. A system packaging module, characterized in that: It comprises a circuit board and the electromagnetic shielding packaging structure as described in any one of claims 1 to 9, wherein the substrate is attached to the circuit board.

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