Bearing device and transfer assembly

Abstract

The utility model discloses a bearing device and a transfer assembly. The bearing device comprises a base body, a containing groove is defined in the base body, and the base body further comprises a first supporting part and a second supporting part which are arranged in the containing groove. The first supporting part is arranged around the second supporting part; the second supporting part is located on the inner side of the first supporting part, the second supporting part extends from the center of the containing groove to the groove wall of the containing groove, and the height of the second supporting part is gradually increased in the direction from the center of the containing groove to the groove wall of the containing groove; wherein the first supporting part and the second supporting part are used for jointly supporting the BGA carrier plate. According to the bearing device, the BGA carrier plate is erected in the accommodating groove, so that the contact area between the BGA carrier plate and the base body is greatly reduced, and the probability that the BGA carrier plate is polluted, crushed and scratched is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of auxiliary jigs for producing BGA carriers, and particularly relates to a carrying device and a transfer component. Background Art

[0002] In the process of producing BGA carriers, it is necessary to store and transfer BGA carriers. BGA carriers are important electronic components, and their surfaces should not be rubbed or scratched during manufacturing and transfer. Therefore, trays are generally used to hold them for convenient storage and transfer.

[0003] In the prior art, after the BGA carrier is placed on the tray, there is a large area of contact between the bottom surface of the BGA carrier and the tray. If there are debris particles on the tray, it is easy to scratch the BGA carrier during the transfer process. Summary of the Utility Model

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides a carrying device, which mounts the BGA carrier in the accommodation groove, greatly reducing the contact area between the BGA carrier and the base body, and reducing the probability of the BGA carrier being contaminated, crushed or scratched.

[0005] The utility model also provides a transfer component with the above-mentioned carrying device.

[0006] According to the carrying device of the first aspect embodiment of the utility model, it includes:

[0007] The base body defines an accommodation groove, and the base body further includes a first support portion and a second support portion arranged in the accommodation groove;

[0008] The first support portion is arranged around the second support portion;

[0009] The second support portion is located inside the first support portion, and the second support portion extends from the center of the accommodation groove towards the groove wall of the accommodation groove. And, along the direction from the center of the accommodation groove to the groove wall of the accommodation groove, the height of the second support portion gradually increases;

[0010] Wherein, the first support portion and the second support portion are used to jointly support the BGA carrier.

[0011] According to the carrying device of the embodiment of the utility model, it has at least the following beneficial effects:

[0012] In the embodiment of the present application, the carrier device supports the BGA carrier board through the first support portion and the second support portion. The first support portion is used to support the edge of the BGA carrier board, and the second support portion is used to support the middle area of the BGA carrier board, thereby mounting the BGA carrier board in the accommodation groove, avoiding direct contact between the BGA carrier board and the bottom of the accommodation groove, and thus greatly reducing the contact area between the BGA carrier board and the substrate, and reducing the probability of the BGA carrier board being contaminated, bruised, or scratched.

[0013] According to some embodiments of the present invention, the top surface of the second support portion is arc-shaped.

[0014] According to some embodiments of the present invention, the substrate further includes at least one pick-and-place groove, and the pick-and-place groove communicates with the accommodation groove; wherein, the distance from the bottom of the pick-and-place groove to the top surface of the substrate should be at least not less than the distance from the top surface of the first support portion to the top surface of the substrate.

[0015] According to some embodiments of the present invention, the number of the pick-and-place grooves is two, and the two pick-and-place grooves are respectively arranged on opposite sides of the accommodation groove. Among them, the opposite sides define a central axis, and the two pick-and-place grooves are asymmetric along the central axis.

[0016] According to some embodiments of the present invention, at least two slots are provided on the outer peripheral side of the substrate. The slots are grouped in pairs, and the two slots in the same group are respectively arranged on opposite sides of the substrate. The opposite sides define a central axis, and the two slots in the same group are symmetric along the central axis.

[0017] According to some embodiments of the present invention, the distance from the top surface of the first support portion to the top surface of the substrate is not less than the thickness of the BGA carrier board.

[0018] According to some embodiments of the present invention, a marking groove is provided on the top surface of the substrate. The marking groove has an opening provided on the top surface of the substrate and an opening provided on the outer peripheral wall of the substrate, and the marking groove is used to accommodate a marking member.

[0019] According to the second aspect embodiment of the present invention, a transfer assembly includes:

[0020] A plurality of the carrier devices according to any one of the above embodiments, and the carrier devices are stacked in sequence along the thickness direction, and the adjacent two substrates define a closed accommodation cavity.

[0021] The transfer assembly according to the embodiment of the present invention has at least the following beneficial effects:

[0022] The transfer component of the present application stacks the carrying devices. On the one hand, it is convenient for centralized handling and improves the handling efficiency of the carrying devices. On the other hand, stacking can create a closed accommodation cavity environment to prevent the BGA carrier board from being exposed to the air and increasing dust deposition.

[0023] According to some embodiments of the present invention, the base body includes a middle bottom plate and a peripheral protrusion. The peripheral protrusion is arranged around the middle bottom plate, and the peripheral protrusion and the middle bottom plate jointly define the accommodation groove.

[0024] Wherein, a groove is provided on the back surface of the peripheral protrusion, and reinforcing ribs connecting the two side walls of the groove are arranged in the groove.

[0025] According to some embodiments of the present invention, when multiple carrying devices are stacked, the peripheral protrusion of the lower carrying device is inserted into the groove of the upper carrying device and abuts against the reinforcing rib.

[0026] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0027] The following further describes the present invention with reference to the drawings and embodiments, wherein:

[0028] Figure 1 is an axonometric view of the carrying device according to an embodiment of the present invention;

[0029] Figure 2 is a top view of the carrying device according to an embodiment of the present invention;

[0030] Figure 3 is a bottom view of the carrying device according to an embodiment of the present invention;

[0031] Figure 4 is an axonometric view of the transfer component according to an embodiment of the present invention;

[0032] Figure 5 is a cross-sectional view of the transfer component according to an embodiment of the present invention;

[0033] Figure 6 is Figure 5 an enlarged schematic view of area A in

[0034] Reference Signs:

[0035] Base body 100; Middle bottom plate 101; Peripheral protrusion 102; Reinforcing rib 103; Groove 104; Accommodation groove 110; Accommodation cavity 111; Pick-and-place groove 120; Central axis 130; Marking groove 140; Slot 150;

[0036] The first support part 200;

[0037] The second support part 300;

[0038] The BGA carrier board 400. Specific implementation manners

[0039] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0040] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0041] In the description of the present utility model, the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If the first and the second are described only for the purpose of distinguishing technical features, they should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence relationship of the indicated technical features.

[0042] In the description of the present utility model, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.

[0043] In the description of the present utility model, the description referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0044] During the production of BGA carriers, it is necessary to store and transport the BGA carriers. BGA carriers are important electronic components, and their surfaces should not be rubbed or scratched during manufacturing and transportation. Therefore, trays are generally used to hold them for convenient storage and transportation.

[0045] In the prior art, after the BGA carrier is placed on the tray, there is a large area of contact between the bottom surface of the BGA carrier and the tray. If there are debris particles on the tray, it is easy to scratch the BGA carrier during the transportation of the BGA carrier.

[0046] To solve the above problems, an embodiment of the first aspect of the present application proposes a carrying device for accommodating the BGA carrier 400. It should be noted that the BGA carrier 400 includes, but is not limited to, PBGA substrates, CBGA substrates, FCBGA substrates, TBGA substrates, CDPBGA substrates, etc. The carrying device includes a base body 100, and a receiving groove 110 is defined on the base body 100. The BGA carrier 400 can be placed in the receiving groove 110. To avoid large-area contact between the BGA carrier 400 and the bottom of the receiving groove 110, a first support portion 200 and a second support portion 300 are further provided in the receiving groove 110.

[0047] The first support portion 200 is arranged to surround the second support portion 300. In the embodiment shown in Figures 1 to 4 , the first support portion 200 is not only connected to the bottom of the receiving groove 110, but also connected to the side wall of the receiving groove 110, thereby forming a stepped step in the receiving groove 110. When the BGA carrier 400 is placed in the receiving groove 110, the edge of the BGA carrier 400 abuts against the first support portion 200, so that it is erected in the receiving groove 110, avoiding the BGA carrier 400 being directly attached to the bottom of the receiving groove 110.

[0048] In addition, to avoid the central area of the BGA carrier 400 being concave and deformed due to its own weight, a second support portion 300 is further provided in the carrying device of the embodiment of the present application. The second support portion 300 is located inside the first support portion 200. As shown in Figures 2 to 4 , the first support portion 200 is approximately annular, and the second support portion 300 is a strip-shaped member. There are four second support portions 300 provided in the receiving groove 110. Each pair of the second support portions 300 forms a group and extends from the center of the receiving groove 110 to the groove wall of the receiving groove 110. The adjacent second support portions 300 are perpendicular to each other, so that the four second support portions 300 are in a cross shape and can support the BGA carrier 400 in four directions, reducing the probability of the BGA carrier 400 being concave and deformed.

[0049] Furthermore, along the direction from the center of the receiving groove 110 to the groove wall of the receiving groove 110, the height of the second support portion 300 gradually increases. In the example shown inFigure 2 and Figure 4 In the embodiment shown, the height difference between one end of the second support portion 300 close to the center of the accommodation groove 110 and one end close to the groove wall of the accommodation groove 110 is 1.5 mm, so as to effectively avoid the problem that the BGA carrier 400 is placed unevenly due to the deformation deviation of the injection molding process. Moreover, since the height of the second support portion 300 gradually decreases from the outside to the center, and the drooping curve of the BGA carrier 400 is simulated in design, when contacting with the BGA carrier 400, the drooping force can be dispersed, and the problem that the BGA carrier 400 is scratched due to stress concentration caused by small-area contact between the BGA carrier 400 and the second support portion 300 can be avoided.

[0050] Based on the above, in the carrying device of the embodiment of the present application, the BGA carrier 400 is supported by the first support portion 200 and the second support portion 300 together. The first support portion 200 is used to support the edge of the BGA carrier 400, and the second support portion 300 is used to support the middle area of the BGA carrier 400, so that the BGA carrier 400 is erected in the accommodation groove 110, avoiding the direct contact between the BGA carrier 400 and the bottom of the accommodation groove 110, and further greatly reducing the contact area between the BGA carrier 400 and the base body 100, and reducing the probability of the BGA carrier 400 being contaminated, crushed, and scratched.

[0051] In some embodiments, the top surface of the second support portion 300 is arc-shaped. Thus, on the one hand, the arc-shaped setting can reduce the probability of debris particles adhering to the top surface of the second support portion 300 to keep the top surface of the second support portion 300 smooth and clean. On the other hand, the contact area between the second support portion 300 and the BGA carrier 400 is further reduced.

[0052] In some embodiments, the base body 100 further includes at least one pick-and-place groove 120, and the pick-and-place groove 120 is communicated with the accommodation groove 110, so as to facilitate the robot or the operator to place the BGA carrier 400 in the accommodation groove 110 or take out the BGA carrier 400 from the accommodation groove 110. It can be understood that after the BGA carrier 400 is placed in the accommodation groove 110 and abuts against the top surface of the first support portion 200, the distance between the BGA carrier 400 and the side wall of the accommodation groove 110 is relatively small. If the material is taken through the distance between the BGA carrier 400 and the side wall of the accommodation groove 110, on the one hand, the operation space is too small and the material-taking difficulty is relatively large. On the other hand, since the force application point is small and relatively concentrated, it is easy to cause damage to the BGA carrier 400 or damage to the BGA carrier 400 caused by dropping. Therefore, in the embodiment shown in Figure 2 the pick-and-place groove 120 is designed to communicate with the accommodation groove 110, and the pick-and-place groove 120 provides a force application space for the robot or the operator.

[0053] It should be understood that the distance from the bottom of the pick-and-place groove 120 to the top surface of the base 100 should be at least not less than the distance from the top surface of the first support portion 200 to the top surface of the base 100, so that the BGA carrier 400 can be exposed in the pick-and-place groove 120. Further, in the embodiment as shown in Figure 2 , the bottom of the pick-and-place groove 120 is flush with the bottom of the accommodation groove 110, so that there is a certain gap between the bottom surface of the BGA carrier 400 and the bottom of the pick-and-place groove 120, which is more convenient for material taking.

[0054] Further, the number of pick-and-place grooves 120 is two. As shown in Figure 2 , the two pick-and-place grooves 120 are respectively arranged on the opposite sides of the accommodation groove 110. Among them, the two sides of the accommodation groove 110 define a central axis 130, and the two pick-and-place grooves 120 are asymmetrically arranged along the central axis 130. It can be understood that when taking the BGA carrier 400, the two side edges of the BGA carrier 400 will be clamped. In addition to the vertical supporting force on the BGA carrier 400, there is inevitably a clamping force in the horizontal direction. If the pick-and-place grooves 120 on both sides are symmetrically arranged, the clamping forces in the horizontal direction on both sides will be superimposed, and there will be a problem that the BGA carrier 400 is bent and warped under force, which will cause damage to the circuit. In the present application, by arranging the sampling grooves on both sides asymmetrically, the horizontal clamping force can be dispersed, and the yield of the picking operation can be improved.

[0055] In some embodiments, at least two slots 150 are arranged on the outer peripheral side of the base 100. The slots 150 are grouped in pairs, and the two slots 150 in the same group are respectively arranged on the opposite sides of the base 100. The opposite sides define a central axis 130, and the two slots 150 in the same group are symmetrically arranged along the central axis 130. It should be understood that the arrangement of the slots 150 can be used as positioning slots for an automatic loading and unloading machine to accurately position the position of the carrying device. Or, the slots 150 can also be used as sampling slots for loading and unloading equipment, so that the carrying device can be lifted and transported to a set position through the slots 150 on both sides. In the embodiment as shown in Figure 1 , two positioning slots and two sampling slots are arranged on one side of the base 100.

[0056] In addition, the loading and unloading of the carrying device can also be carried out by means of a suction cup. The suction cup of the loading and unloading mechanism can adsorb on the top surface area of the base 100, so as to realize the fixation and transportation of the carrying device.

[0057] In some embodiments, the distance from the top surface of the first support portion 200 to the top surface of the base body 100 is not less than the thickness of the BGA carrier 400. Thus, when the BGA carrier 400 is placed in the receiving groove 110 and abuts against the first support portion 200, the top surface of the BGA carrier 400 is still lower than the top surface of the base body 100 and does not protrude from the top surface of the base body 100, thereby reducing the risk of the BGA carrier 400 being scratched by external objects.

[0058] In some embodiments, such as Figure 1 and Figure 2 shown, a marking groove 140 is provided on the top surface of the base body 100. The marking groove 140 is used to accommodate a marking member. An ID code can be set on the marking member, which can be used to trace the production pieces and the number of times of cyclic cleaning of the carrying device, thereby effectively improving the cleanliness and cyclic utilization rate of the carrying device. The opening of the marking groove 140 on the top surface of the base body 100 and the opening on the outer peripheral wall of the base body 100 are provided to facilitate the insertion of the marking member into the marking groove 140.

[0059] It should be noted that this application is made of PEI (polyetherimide material) and CF (carbon fiber), which can resist static electricity and has a point-to-point and point-to-ground resistance between 100 kΩ and 1 GΩ. Moreover, the static charge in each area of the carrying device is less than ±35V.

[0060] In the second aspect of the embodiments of this application, a transfer assembly is also proposed, such as Figures 4 to 6 shown. The transfer assembly includes a plurality of the carrying devices mentioned in the above embodiments. The carrying devices are stacked in sequence along the thickness direction, and adjacent two base bodies 100 define a closed receiving cavity 111. On the one hand, it is convenient for centralized handling and improves the handling efficiency of the carrying device. On the other hand, the stacked arrangement can create a closed receiving cavity 111 environment to prevent the BGA carrier 400 from being exposed to the air and increasing dust deposition.

[0061] In some embodiments, such as Figure 3 and Figure 6 shown, the base body 100 includes a middle bottom plate 101 and a peripheral protrusion 102. The peripheral protrusion 102 is arranged around the middle bottom plate 101. The peripheral protrusion 102 and the middle bottom plate 101 jointly define the receiving groove 110. A groove 104 is provided on the back surface of the peripheral protrusion 102, and a reinforcing rib 103 connecting the two side walls of the groove 104 is provided in the groove 104. It should be understood that the entire substrate can be integrally injection-molded. To reduce the manufacturing cost, the base body 100 is a thin-shell structure, with the middle bent downward to define the receiving groove 110 and the periphery bent upward to define the peripheral protrusion 102. To prevent the peripheral protrusion 102 from deforming during handling or stacking, a reinforcing rib 103 is provided in the groove 104 on the back surface of the peripheral protrusion 102 to enhance its structural strength.

[0062] Further, during the stacking process of the carrying components, the circumferential protrusions 102 of the lower carrying device are inserted into the grooves 104 of the upper carrying device and are in contact with the reinforcing ribs 103. On the one hand, this plug-in stacking can make the structure of the stacked transfer components more stable, avoiding the upper and lower carrying devices from sliding relative to each other and falling off during the transfer process. On the other hand, the plug-in stacking can reduce the height dimension after stacking, so that more layers of carrying devices can be accommodated in a limited height space.

[0063] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by those of ordinary skill in the art without departing from the gist of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A carrier device for accommodating a BGA carrier board, characterized in that: include: A base body, wherein the base body defines a receiving groove, and the base body further comprises a first supporting portion and a second supporting portion disposed in the receiving groove; The first supporting portion is disposed around the second supporting portion; The second supporting portion is located at the inner side of the first supporting portion, the second supporting portion extends from the center of the containing groove toward the groove wall of the containing groove, and the height of the second supporting portion gradually increases along the direction from the center of the containing groove to the groove wall of the containing groove; Wherein, the first supporting portion and the second supporting portion are used to jointly support the BGA carrier board.

2. The carrying device according to claim 1, characterized in that: The top surface of the second supporting portion is arc-shaped.

3. The carrying device according to claim 1, characterized in that: The base also includes at least one pick-up and release groove, which is connected to the accommodating groove; wherein the distance from the bottom of the pick-up and release groove to the top surface of the base should be at least not less than the distance from the top surface of the first support portion to the top surface of the base.

4. The carrying device according to claim 3, characterized in that: The number of the pick-up and release grooves is two, and the two pick-up and release grooves are respectively arranged on opposite sides of the accommodating groove, wherein the opposite sides define a central axis, and the two pick-up and release grooves are asymmetric along the central axis.

5. The carrying device according to claim 1, characterized in that: At least two slots are arranged on the outer peripheral side of the base, and the slots are grouped in pairs. The two slots in the same group are respectively arranged on opposite sides of the base, and the opposite sides define a central axis. The two slots in the same group are symmetrical along the central axis.

6. The carrying device according to claim 1, characterized in that: The distance from the top surface of the first supporting portion to the top surface of the base is not less than the thickness of the BGA carrier.

7. The carrying device according to claim 1, characterized in that: The top surface of the base is provided with a marking groove, wherein the marking groove has an opening provided on the top surface of the base and an opening provided on the outer peripheral wall of the base, and the marking groove is used for accommodating a marking member.

8. A transport component, characterized in that: include: A plurality of carrying devices according to any one of claims 1 to 7, wherein each of the carrying devices is stacked in sequence along the thickness direction, and two adjacent substrates define a closed accommodating cavity.

9. The transport assembly according to claim 8, characterized in that: The base body includes a middle bottom plate and a peripheral protrusion, wherein the peripheral protrusion is arranged around the middle bottom plate, and the peripheral protrusion and the middle bottom plate jointly define the accommodation groove; Wherein, a groove is arranged on the back side of the peripheral protrusion, and reinforcing ribs are arranged in the groove to connect the groove walls on both sides of the groove.

10. The transfer assembly according to claim 9, characterized in that: When a plurality of the carrying devices are stacked, the peripheral protrusions of the lower carrying device are inserted into the grooves of the upper carrying device and abut against the reinforcing ribs.

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