Dark light full-color image recognition module
By designing an image recognition module including identification module, fixed bracket, main control board and radiator in a dark light environment, the existing module components are solved, complex manufacturing and poor heat dissipation effect are achieved, and more efficient heat dissipation and working efficiency are achieved.
Patent Information
- Application Number
- CN202422108544.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-08-29
AI Technical Summary
When the existing image recognition module works in a dark light environment, there are many components, complex manufacturing and poor heat dissipation effect, which affects the working efficiency of the equipment.
A dark-light full-color image recognition module is designed, using a combination of recognition module, fixed bracket, main control board and radiator, and using an open cavity structure and multiple heat dissipation structures, including a heat dissipation silicone pad and a heat dissipation fin structure, to improve the heat dissipation effect.
The structure of the image recognition module working in a dark light environment is simplified and the heat dissipation effect is improved, and the working efficiency of the equipment is improved.
Smart Images
Figure CN222939506U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of image recognition modules, and particularly relates to a low-light full-color image recognition module. Background Art
[0002] Currently, in public places, image recognition devices are increasingly used, such as in airports, railway stations, and entrances and exits of some places. In strong backlight, when the recognition subject is relatively dark or in low-illumination environments, an image recognition module that can work in low-light environments is required. Currently, existing image recognition modules have many components, a complex manufacturing process, and poor heat dissipation effects. Failure to dissipate heat from the device or components in a timely manner will affect the working efficiency of the image recognition device. Content of the Utility Model
[0003] In order to solve the above problems existing in the prior art, the utility model adopts the following technical solutions:
[0004] A low-light full-color image recognition module includes a recognition module, a fixing bracket, a main control board, and a radiator. The recognition module is arranged on one side of the fixing bracket, the radiator is arranged on the other side of the fixing bracket and forms an open cavity structure with the fixing bracket, and the main control board is installed on the fixing bracket in the cavity structure.
[0005] Preferably, a heat dissipation silica gel pad is arranged between the recognition module and the fixing bracket, and the recognition module is dissipated heat by installing the heat dissipation silica gel pad on the fixing bracket.
[0006] Preferably, a recognition module board is arranged on one side of the fixing bracket close to the recognition module, and the recognition module is installed on the recognition module board.
[0007] Preferably, a heat sink structure is arranged on the surface area of the fixing bracket close to the recognition module outside the recognition module board.
[0008] Preferably, the radiator is provided with a plurality of radiator connection posts protruding from the surface, the fixing bracket is correspondingly provided with through holes, and the radiator is connected to the fixing bracket through a connecting piece. The height of the radiator connection posts is greater than or equal to the maximum thickness of the main control board.
[0009] Further preferably, a main control board avoidance structure is arranged at the corresponding position of the main control board for the radiator connection posts.
[0010] Preferably, a plurality of fixing bracket connecting columns are arranged on both sides of the fixing bracket. Through holes are arranged on the identification module board corresponding to the positions of the fixing bracket connecting columns, and the identification module board is connected to the fixing bracket through a connecting member. Through holes are arranged on the main control board corresponding to the positions of the fixing bracket connecting columns, and the main control board and the fixing bracket are connected through a connecting member.
[0011] Preferably, a plurality of groups of heat sink fin structures arranged in an array are provided on the back of the heat sink, and the heat sink provides heat dissipation for the main control board.
[0012] Preferably, the identification module includes a lens assembly and a base. The lens assembly is connected to the base, and the base is connected to the identification module board.
[0013] Preferably, there is a socket on the back of the main control board, and there is a heat sink avoidance structure at the position corresponding to the socket on the heat sink.
[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0015] The present utility model provides a low-light full-color image recognition module, which includes an identification module, an identification module board, a fixing bracket, a main control board and a heat sink. A fixed and reliable image recognition module is formed by using a stacked structure, with a small number of structural parts. A heat dissipation silica gel pad and multiple heat dissipation structures are provided, and the heat dissipation effect is good. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The drawings are included to provide a further understanding of the embodiments and are incorporated into and constitute a part of this specification. The drawings illustrate the embodiments and are used together with the description to explain the principles of the present utility model. Other embodiments and many of the intended advantages of the embodiments will be readily apparent as they become better understood by reference to the following detailed description. The other features, objects and advantages of the present application will become more apparent from the following detailed description of the non-limiting embodiments made with reference to the accompanying drawings:
[0017] Figure 1 is a schematic structural diagram of a low-light full-color image recognition module from one perspective according to a specific embodiment of the present utility model;
[0018] Figure 2 is a schematic structural diagram of a low-light full-color image recognition module from another perspective according to a specific embodiment of the present utility model;
[0019] Figure 3 is an exploded view of a low-light full-color image recognition module from one perspective according to a specific embodiment of the present utility model;
[0020] Figure 4An exploded view of the low-light full-color image recognition module according to a specific embodiment of the present utility model from another perspective;
[0021] Figure 5 A front view of the low-light full-color image recognition module according to a specific embodiment of the present utility model;
[0022] Figure 6 An exploded view of the recognition module of the low-light full-color image recognition module according to a specific embodiment of the present utility model.
[0023] The meanings of the numbers in the figure: 1. Recognition module; 11. Lens assembly; 111. First lens barrel; 112. Second lens barrel; 113. Lens; 12. Base; 2. Recognition module board; 3. Fixed bracket; 31. Fixed bracket connection column; 4. Main control board; 5. Radiator; 51. Radiator connection column; 6. Thermal silicone pad; 7. Connector. Detailed implementation manners
[0024] In the following detailed description, reference is made to the accompanying drawings, which form a part of the detailed description and illustrate illustrative specific embodiments in which the present application can be practiced. In this regard, directional terms such as "top", "bottom", "left", "right", "upper", "lower", etc. are used with reference to the orientation of the described figures. Since the components of the embodiments can be positioned in several different orientations, the directional terms are used for the purpose of illustration and are in no way limiting. It should be understood that other embodiments can be utilized or logical changes can be made without departing from the scope of the present application. Therefore, the following detailed description should not be taken in a limiting sense, and the scope of the present application is defined by the appended claims.
[0025] For the convenience of those skilled in the art to understand, the present utility model will be further described in detail below with reference to the drawings and embodiments.
[0026] The present application proposes a low-light full-color image recognition module, Figure 1The figure shows a schematic structural diagram of a low-light full-color image recognition module, which includes an identification module 1, an identification module board 2, a fixing bracket 3, a main control board 4, and a radiator 5. The identification module 1 is installed on the identification module board 2. The identification module board 2 is arranged on one side of the fixing bracket 3. The identification module board 2 is installed on the fixing bracket 3 through a connecting member 7. The radiator 5 is arranged on the other side of the fixing bracket 3 and forms an open cavity structure with the fixing bracket 3. The main control board 4 is installed on the fixing bracket 3 in the cavity structure. A heat sink structure is provided on the surface area of the fixing bracket 3 close to the identification module 1 outside the identification module board 2. The radiator 5 is provided with a plurality of radiator connection posts 51 protruding from the surface. The fixing bracket 3 is correspondingly provided with through holes, and the radiator 5 is connected to the fixing bracket 3 through the connecting member 7. The height of the radiator connection post 51 is greater than or equal to the maximum thickness of the main control board 4. A plurality of groups of heat sink structures arranged in an array are provided on the back of the radiator 5. The identification module 1 includes a lens assembly 11 and a base 12. The lens assembly 11 is connected to the base 12, and the base 12 is connected to the identification module board 2.
[0027] In a specific embodiment, the connecting member 7 is a screw or can also be a single-phase copper post with threads. The radiator connection post 51 or the fixing bracket connection post 31 corresponding to the connecting member 7 is provided with a thread for cooperating with the screw or a connection hole matching the size of the connecting member 7.
[0028] In a specific embodiment, the main control board 4 is provided with a main control board avoidance structure at the corresponding position of the radiator connection post 51, which reduces the volume of the overall low-light full-color image recognition module while maximizing the usable area of the main control board 4.
[0029] In a specific embodiment, a plurality of fixing bracket connection posts are provided on both sides of the fixing bracket 3. The identification module board 2 is provided with through holes at the positions of the fixing bracket connection posts 31 on one side corresponding to the fixing bracket 3. The main control board 4 is provided with through holes at the positions of the fixing bracket connection posts 31 on the other side corresponding to the fixing bracket 3. The identification module board 2 is connected to the fixing bracket 3 through the connecting member 7, and the main control board 4 and the fixing bracket 3 are also connected. The fixing bracket connection posts are arranged around the fixing bracket to provide a stable support structure, or can also be arranged at other positions of the fixing bracket.
[0030] In a specific embodiment, there is a socket on the back of the main control board 4. The socket is a Wafer vertical socket or can also be other debugging interface terminals. The number and position of the sockets of the main control board 4 are set according to specific functional requirements. The radiator 5 has a radiator avoidance structure at the corresponding position of the socket.
[0031] In a specific embodiment, an inter-board connector is provided between the identification module board 2 and the main control board 4. The inter-board connector connects the identification module board 2 and the main control board 4 for signal transmission. The fixed bracket 3 is provided with a fixed bracket avoidance structure at the corresponding position of the inter-board connector.
[0032] Figure 2 Fig. shows a schematic structural diagram of another perspective of the low-light full-color image recognition module, as Figure 2 shown, a low-light full-color image recognition module, including an identification module 1, an identification module board 2, a fixed bracket 3, a main control board 4 and a radiator 5. The identification module 1 is installed on the identification module board 2. The identification module board 2 is disposed on one side of the fixed bracket 3. The radiator 5 is disposed on the other side of the fixed bracket 3 and forms an open cavity structure with the fixed bracket 3. The main control board 4 is installed on the fixed bracket 3 in the cavity structure. The identification module 1 includes a lens assembly 11 and a base 12. The lens assembly 11 is connected to the base 12, and the base 12 is connected to the identification module board 2. A heat sink structure is provided on the surface area of the side of the fixed bracket 3 close to the identification module 1 outside the identification module board 2.
[0033] The radiator 5 is provided with a plurality of radiator connection posts 51 protruding from the surface. The fixed bracket 3 is correspondingly provided with through holes. The radiator 5 is connected to the fixed bracket 3 through a connecting member 7. The height of the radiator connection posts 51 is greater than or equal to the maximum thickness of the main control board 4. A plurality of fixed bracket connection posts 31 are provided on the side of the fixed bracket 3 close to the main control board 4. The main control board 4 is correspondingly provided with through holes at the positions of the fixed bracket connection posts 31. The main control board 4 and the fixed bracket 3 are connected through a connecting member 7. A plurality of groups of arrayed heat sink structures are provided on the back surface of the radiator 5.
[0034] In a specific embodiment, there is a socket on the back of the main control board 4. The socket is a Wafer vertical socket, or it can be other debugging interface terminals. The radiator 5 has a radiator avoidance structure at the corresponding position of the socket.
[0035] In a specific embodiment, the connecting member 7 can be a screw or a single-phase copper post with threads. The radiator connection posts 51 or the fixed bracket connection posts 31 corresponding to the connecting member 7 are provided with threads for cooperating with the screw or connection holes matching the size of the connecting member 7.
[0036] In a specific embodiment, the main control board 4 is provided with a plurality of main control board avoidance structures at the corresponding positions of the radiator connection posts 51, reducing the volume of the overall low-light full-color image recognition module while maximizing the usable area of the main control board 4.
[0037] Figure 3 An exploded view of the low-light full-color image recognition module is shown, as Figure 3 shown. A low-light full-color image recognition module includes a recognition module 1, a recognition module board 2, a fixing bracket 3, a main control board 4, and a radiator 5. The recognition module 1 is installed on the recognition module board 2. The recognition module board 2 is disposed on one side of the fixing bracket 3. The recognition module board 2 is installed on the fixing bracket 3 through a connecting member 7. The radiator 5 is disposed on the other side of the fixing bracket 3 and forms an open cavity structure with the fixing bracket 3. The main control board 4 is installed on the fixing bracket 3 in the cavity structure. The recognition module 1 includes a lens assembly 11 and a base 12. The lens assembly 11 is connected to the base 12, and the base 12 is connected to the recognition module board 2. A heat dissipation silicone pad 6 is provided between the recognition module 1 and the fixing bracket 3. A heat sink structure is provided on the surface area of the fixing bracket 3 close to the recognition module 1 outside the recognition module board 2.
[0038] In a specific embodiment, 4 radiator connection posts 51 protruding from the surface are provided on the side of the radiator 5 close to the main control board. The radiator connection posts 51 are arranged at the four corners of the radiator, providing good support while providing a good heat dissipation space for the main control board 4 in the open cavity, achieving the best heat dissipation effect. The number of radiator connection posts 51 can also be set to different numbers and placed at different positions. The fixing bracket 3 is correspondingly provided with through holes, and the radiator 5 is connected to the fixing bracket 3 through 4 connecting members 7. The height of the radiator connection posts 51 is greater than or equal to the maximum thickness of the main control board 4. A main control board avoidance structure is provided at the corresponding positions of the main control board 4 for the radiator connection posts 51. Multiple groups of arrayed heat sink structures are provided on the back surface of the radiator 5 to achieve a good heat dissipation effect.
[0039] In a specific embodiment, there is a socket on the back of the main control board 4. The socket is a Wafer vertical socket, or it can be other debugging interface terminals. The radiator 5 has a radiator avoidance structure at the corresponding position of the socket.
[0040] In a specific embodiment, the connecting member 7 can be a screw or a single-sided copper post with threads. The radiator connection posts 51 or the fixing bracket connection posts 31 corresponding to the connecting member 7 are provided with threads for cooperating with the screw or connection holes matching the size of the connecting member 7.
[0041] In a specific embodiment, fixing bracket connection columns 31 protruding from the surface are provided on both sides of the fixing bracket 3. The identification module board 2 is provided with through holes corresponding to the 4 fixing bracket connection columns 31 on one side of the fixing bracket 3. The identification module board 2 is connected to the fixing bracket 3 through 4 connecting members 7. The 4 fixing bracket connection columns 31 are arranged avoiding the heat sink structure on the fixing bracket 3 and are located around the heat dissipation silica gel pad 6, so as to achieve a good heat dissipation effect. The fixing bracket connection columns 31 can also be arranged at other positions of the fixing bracket 3. The main control board 4 is provided with through holes corresponding to the positions of the fixing bracket connection columns 31 on the other side of the fixing bracket 3, and the main control board 4 and the fixing bracket 3 are connected through the connecting members 7.
[0042] Figure 4 An exploded view of another perspective of the low-light full-color image recognition module is shown, as Figure 4 shown, a low-light full-color image recognition module, including an identification module 1, an identification module board 2, a fixing bracket 3, a main control board 4 and a radiator 5. The identification module 1 is installed on the identification module board 2. The identification module board 2 is arranged on one side of the fixing bracket 3. The identification module board 2 is installed on the fixing bracket 3 through a connecting member 7. The radiator 5 is arranged on the other side of the fixing bracket 3 and forms an open cavity structure with the fixing bracket 3. The main control board 4 is installed on the fixing bracket 3 in the cavity structure. A heat dissipation silica gel pad 6 is arranged between the identification module 1 and the fixing bracket 3. The radiator 5 is provided with a plurality of radiator connection columns 51 protruding from the surface. The fixing bracket 3 is correspondingly provided with through holes, and the radiator 5 is connected to the fixing bracket 3 through the connecting member 7. The height of the radiator connection columns 51 is greater than or equal to the maximum thickness of the main control board 4. A plurality of groups of heat sink structures arranged in an array are provided on the back surface of the radiator 5.
[0043] In a specific embodiment, there is a socket on the back of the main control board 4. The socket is a Wafer vertical socket, or can also be other debugging interface terminals. The radiator 5 has a radiator avoidance structure at the corresponding position of the socket.
[0044] In a specific embodiment, the connecting member 7 can be a screw or a single-phase copper column with threads. The radiator connection columns 51 or the fixing bracket connection columns 31 corresponding to the connecting member 7 are provided with threads matching the screw or connection holes matching the size of the connecting member 7.
[0045] In a specific embodiment, the main control board 4 is provided with a main control board avoidance structure at the corresponding position of the radiator connection columns 51, while maximizing the usable area of the main control board 4 and reducing the volume of the overall low-light full-color image recognition module.
[0046] In a specific embodiment, fixing bracket connection columns 31 are provided on both sides of the fixing bracket 3. Through holes are provided at positions of the fixing bracket connection columns 31 on one side of the fixing bracket 3 corresponding to the recognition module board 2. The recognition module board 2 is connected to the fixing bracket 3 through a connecting member 7. Through holes are provided at positions of the 4 fixing bracket connection columns 31 on the other side of the fixing bracket 3 corresponding to the main control board 4. The main control board 4 is connected to the fixing bracket 3 through a connecting member 7. The 4 fixing bracket connection columns 31 are provided at the edge of the fixing bracket 3, providing a good heat dissipation space for the main control board and achieving a stable structure. Fixing bracket connection columns 31 with other quantities and at other positions can also be provided.
[0047] Figure 5 The front view of the low-light full-color image recognition module is shown, as Figure 5 shown, a low-light full-color image recognition module, comprising a recognition module 1, a recognition module board 2, a fixing bracket 3, a main control board 4 and a radiator 5. The recognition module 1 is mounted on the recognition module board 2. The recognition module board 2 is arranged on one side of the fixing bracket 3. The radiator 5 is arranged on the other side of the fixing bracket 3 and forms an open cavity structure with the fixing bracket 3. The main control board 4 is mounted on the fixing bracket 3 in the cavity structure. The recognition module 1 includes a lens assembly 11 and a base 12. The lens assembly 11 is connected to the base 12, and the base 12 is connected to the recognition module board 2. A heat sink structure is provided on the surface area of the fixing bracket 3 outside the recognition module board 2 close to the recognition module 1. The radiator 5 is provided with a plurality of radiator connection columns 51 protruding from the surface. Through holes are correspondingly provided on the fixing bracket 3. The radiator 5 is connected to the fixing bracket 3 through a connecting member 7. The height of the radiator connection columns 51 is greater than or equal to the maximum thickness of the main control board 4. A main control board avoidance structure is provided at a position corresponding to the radiator connection columns 51 on the main control board 4. A plurality of fixing bracket connection columns 31 are provided on one side of the fixing bracket 3 close to the main control board 4. Through holes are provided at positions of the fixing bracket connection columns 31 corresponding to the main control board 4. The main control board 4 is connected to the fixing bracket 3 through a connecting member 7. A plurality of groups of heat sink structures arranged in an array are provided on the back surface of the radiator 5.
[0048] In a specific embodiment, there is a socket on the back of the main control board 4. The socket is a Wafer vertical socket, or other debugging interface terminals can also be used. The radiator 5 has a radiator avoidance structure at a position corresponding to the socket.
[0049] In a specific embodiment, a heat dissipation silica gel pad 6 is provided between the identification module 1 and the fixed bracket 3. The heat dissipation silica gel sheet 6 is attached to the identification module board 2 and the fixed bracket 3 to form a heat channel between the identification module board 2 and the fixed bracket 3, transferring the heat of the heat-generating components on the identification module board 2 to the fixed bracket 3 to prevent the heat-generating components on the identification module board 2 from overheating when the identification module 1 operates for a long time.
[0050] In a specific embodiment, the connecting member 7 can be a screw or a single-phase copper post with threads. The radiator connecting post 51 or the fixed bracket connecting post 31 corresponding to the connecting member 7 is provided with a thread for cooperating with the screw or a connecting hole matching the size of the connecting member 7.
[0051] Figure 6 The exploded view of the identification module of the low-light full-color image recognition module is shown, as Figure 6 shown, the identification module 1 includes a lens assembly 11 and a base 12. The lens assembly 11 includes a first lens barrel 111, a second lens barrel 112, and a lens 113. The main body of the first lens barrel 111 is cylindrical, and its outer side is provided with threads. The lens 113 is embedded in the first lens barrel 111. The main body of the second lens barrel 112 is cylindrical, and its inner side is provided with threads. The first lens barrel 111 and the second lens barrel 112 are connected by threads, and the second lens barrel 112 is connected to the base 12.
[0052] The above description is only the preferred embodiment of the present application and the explanation of the applied technical principles. Those skilled in the art should understand that the scope of the utility model involved in the present application is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above utility model concept. For example, the technical solutions formed by mutually replacing the above features with the technical features (but not limited to) having similar functions disclosed in the present application.
[0053] Obviously, those skilled in the art can make various modifications and changes to the embodiments of the present application without departing from the spirit and scope of the present application. In this way, if these modifications and changes are within the scope of the claims of the present application and their equivalent forms, the present application also aims to cover these modifications and changes. The word "comprising" does not exclude the presence of other elements or steps not listed in the claims. The simple fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.
Claims
1. A dark-light full-color image recognition module, characterized in that: It includes an identification module, a fixed bracket, a main control board and a radiator. The identification module is arranged on one side of the fixed bracket, the radiator is arranged on the other side of the fixed bracket and forms an open cavity structure with the fixed bracket, and the main control board is installed on the fixed bracket in the cavity structure.
2. A dark-light full-color image recognition module according to claim 1, characterized in that: A heat dissipation silicone pad is arranged between the identification module and the fixing bracket.
3. The dark-light full-color image recognition module according to claim 1, characterized in that: An identification module board is arranged on one side of the fixing bracket close to the identification module, and the identification module is mounted on the identification module board.
4. The dark-light full-color image recognition module according to claim 1, characterized in that: A heat sink structure is arranged on a surface area of one side of the fixing bracket outside the identification module plate and close to the identification module.
5. The dark-light full-color image recognition module according to claim 1, characterized in that: The radiator is provided with a plurality of radiator connecting columns protruding from the surface, and the fixing bracket is correspondingly provided with through holes. The radiator is connected to the fixing bracket through a connecting piece, and the height of the radiator connecting columns is greater than or equal to the maximum thickness of the main control board.
6. The dark-light full-color image recognition module according to claim 5, characterized in that: The main control board is provided with a main control board avoidance structure at a position corresponding to the radiator connection column.
7. The dark-light full-color image recognition module according to claim 1, characterized in that: A plurality of fixed bracket connecting columns are arranged on both sides of the fixed bracket, through holes are arranged at positions of the identification module board corresponding to the fixed bracket connecting columns, the identification module board is connected to the fixed bracket through a connecting piece, and a through hole is arranged at positions of the main control board corresponding to the fixed bracket connecting columns, the main control board and the fixed bracket are connected through a connecting piece.
8. The dark-light full-color image recognition module according to claim 1, characterized in that: The back side of the radiator is provided with a plurality of groups of heat sink structures arranged in an array.
9. The dark-light full-color image recognition module according to claim 1, characterized in that: The identification module comprises a lens assembly and a base, wherein the lens assembly is connected to the base, and the base is connected to the identification module board.
10. The dark-light full-color image recognition module according to claim 1, characterized in that: A socket is arranged on the back of the main control board, and a radiator avoidance structure is arranged on the radiator at a position corresponding to the socket.