Wafer pushing machine capable of intelligently identifying wafer

Abstract

The utility model discloses an intelligent wafer identification pushing machine, which relates to the technical field of wafer identification and comprises a case, the case is a protection structure of an internal structure of the pushing machine, a display screen and function keys are mounted on one side of the case through a formed inclined plane, a signal indicator lamp is fixed at the top of the case, a mounting groove is arranged at the top of the case, and the mounting groove is communicated with the display screen and the function keys. The mounting groove accommodates the first wafer accommodating groove and the second wafer accommodating groove in a matched manner. According to the utility model, the first wafer accommodating groove and the second wafer accommodating groove are internally provided with the plurality of horizontal object placing plates which are longitudinally arranged in parallel at equal intervals and the push-broom driving structures, so that the push-broom driving structures can drive the push-broom plates to rotate by taking one ends as axes, and push-broom pushing of wafers at the tops of the horizontal object placing plates is realized; and meanwhile, the placement positions of the wafers on different horizontal placement plates are adjusted, so that the overall space of the wafer test equipment is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer identification, in particular to an intelligent wafer identification and pusher. Background Technique

[0002] A wafer pusher is a device that can automatically push a semiconductor wafer onto a detection table. As a pushing and traction structure for wafer transmission on the back of the device, the wafer pusher can ensure the accurate positioning of the wafer inside the device; by combining a numerical control unit, the wafer can be pushed to a specified cutting or reprocessing station. Therefore, it plays a key role in the semiconductor manufacturing process. However, the existing propulsion structure of the wafer identification pusher often adjusts the water level position of the wafer inside the device on the horizontal plane, and it is difficult to push and position the wafer in the vertical direction, resulting in a large overall volume of the wafer testing equipment, which is not conducive to saving the overall space of the wafer testing equipment. For this reason, we propose an intelligent wafer identification pusher. Content of the Utility Model

[0003] The purpose of the utility model is to provide an intelligent wafer identification pusher to solve the problems raised in the above background technique.

[0004] To achieve the above object, the present utility model provides the following technical solution: A wafer intelligent identification and pushing machine, comprising a chassis. The chassis is a protective structure for the internal structure of the pushing machine, playing a protective role. On one side of the chassis, a display screen and function buttons are installed through the formed inclined plane. The display screen displays wafer identification information. A signal indicator light is fixed on the top of the chassis, and the signal indicator light is used to indicate the operating state of the pushing machine. An installation slot is opened on the top of the chassis, and the installation slot is adapted to accommodate a first wafer accommodating slot and a second wafer accommodating slot. Both the first wafer accommodating slot and the second wafer accommodating slot are transparent thin glass troughs or transparent thin resin troughs. One end of the installation slot is connected to two symmetrically installed drive shafts through the motor output end. The surface of the drive shaft is threadedly connected to the first wafer accommodating slot and the second wafer accommodating slot. The tops of the first wafer accommodating slot and the second wafer accommodating slot are respectively connected with a push-sweeping drive structure. The output ends of the two push-sweeping drive structures are connected with a push-sweeping plate. A plurality of mutually parallel horizontal placement plates are respectively fixed on the inner walls of the first wafer accommodating slot and the second wafer accommodating slot. A laser scanner is fixed on the top of the chassis through a lifting rod. A controller for intelligently identifying wafers is installed in the chassis. The input end of the controller is electrically connected to a power supply unit. The other end of the controller is connected with function buttons. The input end of the controller is connected with a laser scanner. In the initial state, the operator places the wafer on any horizontal placement plate, adjusts the target position of the wafer through the function buttons. After the controller receives the target position signal, it transmits a control instruction to the drive shaft and the timer inside the controller. The drive shaft includes a rotating shaft and a rotation speed sensor. The rotation speed sensor sends the rotation speed information of the drive shaft to the controller. The rotation duration of the drive shaft is controlled through the timer, so as to adjust the height of the first wafer accommodating slot or the second wafer accommodating slot. The height of the laser scanner is controlled through the lifting rod. After scanning the position where the wafer is located, the controller sends a control signal to the servo at the corresponding height. The output end of the servo pulls the push-sweeping plate to push and sweep the wafer on the horizontal placement plate to the designated position. The push-sweeping plate is driven by the push-sweeping drive structure to rotate with one end as the axis, so as to realize the pushing and sweeping of the wafer on the top of the horizontal placement plate, and adjust the placement position of the wafer on different horizontal placement plates, which is beneficial to saving the overall space of the wafer testing equipment.

[0005] As a further solution of the present utility model: The function buttons include a start / stop button, an adjustment button, an operation button and a reset button. The bottom of the chassis is connected with support feet, and the bottom of the support feet is adhesively connected with gaskets. The support feet and the gaskets can enhance the anti-slip ability of the bottom of the pushing machine.

[0006] As a further solution of the present utility model: The signal indicator light is formed by connecting a plurality of color-different colored lights in parallel. The signal indicator light is a running horse lamp or a breathing lamp. By indicating the operating state of the pushing machine through the signal indicator light, the operator can quickly identify whether the pushing machine has a fault.

[0007] As a further solution of the present utility model: A bearing is movably connected to the top of the drive shaft, a support rod is fixed to the top of the chassis, and the top of the support rod is movably connected to the top end of the drive shaft through a bearing. The support rod can stably connect the top of the drive shaft and improve the reliability of the operation of the wafer pusher.

[0008] As a further solution of the present utility model: Limit posts are integrally formed at one ends of the first wafer accommodating groove and the second wafer accommodating groove respectively, and the drive shaft threadedly penetrates through the inside of the limit posts.

[0009] As a further solution of the present utility model: The pushing and sweeping drive structure includes a connecting rod and a servo motor. The top of the connecting rod is fixed to the servo motor, and the output end of the servo motor is fixedly connected to one end of the pushing and sweeping plate. When the servo motor is started, the output end of the servo motor can pull the pushing and sweeping plate to rotate in the horizontal direction to push and sweep the wafer.

[0010] As a further solution of the present utility model: A plurality of limiting plates are respectively welded to the bottoms of the first wafer accommodating groove and the second wafer accommodating groove, and depressions adapted to the limiting plates are formed at the inner bottom of the installation groove, which can stabilize the bottoms of the first wafer accommodating groove and the second wafer accommodating groove.

[0011] Compared with the prior art, the beneficial effects of the present utility model are:

[0012] 1. By arranging a plurality of horizontally placed plates that are longitudinally equidistantly parallel and a pushing and sweeping drive structure in the first wafer accommodating groove and the second wafer accommodating groove, the present utility model can drive the pushing and sweeping plate to rotate with one end as the axis through the pushing and sweeping drive structure, push and sweep the wafer on the top of the horizontally placed plates, and at the same time adjust the placement position of the wafer on different horizontally placed plates, which is beneficial to saving the overall space of the wafer testing equipment.

[0013] 2. By movably connecting the top end of the drive shaft to the support rod through a bearing, the present utility model can stably connect the top of the drive shaft and improve the reliability of the operation of the wafer pusher. By providing a semi-circular pushing and sweeping piece and opening a chamfered surface at one end of the pushing and sweeping piece, the pushing and sweeping alignment accuracy of the wafer can be improved. Description of the Drawings

[0014] Figure 1 is a three-dimensional structure diagram of the present utility model;

[0015] Figure 2 is a connection structure diagram of the horizontally placed plates of the present utility model;

[0016] Figure 3 is of the present utility model Figure 2 the enlarged view of A in;

[0017] Figure 4 is a structure diagram of the back view angle of the present utility model;

[0018] Figure 5 This is the signal transmission module diagram of the present utility model.

[0019] In the figure: 1. Chassis; 2. Display screen; 3. Function buttons; 4. Support feet; 5. Signal indicator lights; 6. Installation grooves; 7. Limiting plates; 8. First wafer accommodating grooves; 9. Connecting rods; 10. Servos; 11. Pushing and sweeping plates; 12. Horizontal placing plates; 13. Second wafer accommodating grooves; 14. Support rods; 15. Bearings; 16. Driving shafts; 17. Limiting columns; 18. Lifting rods; 19. Laser scanners. Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] Please refer to Figures 1-5 , the present utility model provides a technical solution: a wafer intelligent identification and pushing machine, including a chassis 1. The chassis 1 is a protective structure for the internal structure of the pushing machine and plays a protective role. One side of the chassis 1 is installed with a display screen 2 and function buttons 3 through a formed inclined surface. The function buttons 3 include start / stop buttons, adjustment buttons, operation buttons, and reset buttons. The bottom of the chassis 1 is connected with support feet 4, and the bottom of the support feet 4 is adhesively connected with gaskets. The support feet 4 and the gaskets can enhance the anti-slip ability of the bottom of the pushing machine. The display screen 2 displays wafer identification information.

[0022] A signal indicator light 5 is fixed on the top of the chassis 1. The signal indicator light 5 is used to indicate the operating state of the wafer pushing machine. An installation groove 6 is formed on the top of the chassis 1. The installation groove 6 is adapted to accommodate the first wafer accommodating groove 8 and the second wafer accommodating groove 13. Both the first wafer accommodating groove 8 and the second wafer accommodating groove 13 are transparent thin glass grooves or transparent thin resin grooves. One end of the installation groove 6 is connected with two symmetrically installed drive shafts 16 through the motor output end. The surfaces of the drive shafts 16 are threadedly connected with the first wafer accommodating groove 8 and the second wafer accommodating groove 13. The tops of the first wafer accommodating groove 8 and the second wafer accommodating groove 13 are respectively connected with a pushing and sweeping drive structure. The pushing and sweeping drive structure includes a connecting rod 9 and a servo motor 10. The top of the connecting rod 9 is fixed to the servo motor 10. The output end of the servo motor 10 is fixedly connected with one end of a pushing and sweeping plate 11. When the servo motor 10 is started, the output end of the servo motor 10 can pull the pushing and sweeping plate 11 to rotate in the horizontal direction to push and sweep the wafer. The output ends of the two pushing and sweeping drive structures are connected with a pushing and sweeping plate 11. A plurality of mutually parallel horizontal placing plates 12 are respectively fixed on the inner walls of the first wafer accommodating groove 8 and the second wafer accommodating groove 13. A laser scanner 19 is fixed on the top of the chassis 1 through a lifting rod 18.

[0023] Preferably, as Figure 2 shown, the signal indicator light 5 is formed by connecting a plurality of colored lights in parallel. The signal indicator light 5 is a running horse lamp or a breathing lamp. By using the signal indicator light 5 to indicate the operating state of the wafer pushing machine, the operator can quickly identify whether the wafer pushing machine has a fault.

[0024] Preferably, as Figure 4 shown, the top of the drive shaft 16 is movably connected with a bearing 15. A support rod 14 is fixed on the top of the chassis 1. The top of the support rod 14 is movably connected with the top end of the drive shaft 16 through the bearing 15. The support rod 14 can stably connect the top of the drive shaft 16 and improve the reliability of the operation of the wafer pushing machine.

[0025] Preferably, as Figure 4 shown, a limiting post 17 is integrally formed at one end of each of the first wafer accommodating groove 8 and the second wafer accommodating groove 13. The drive shaft 16 threadedly penetrates through the inside of the limiting post 17.

[0026] Preferably, as Figure 1 shown, a plurality of limiting plates 7 are respectively welded to the bottoms of the first wafer accommodating groove 8 and the second wafer accommodating groove 13. A recess adapted to the limiting plates 7 is formed at the inner bottom of the installation groove 6, which can stabilize the bottoms of the first wafer accommodating groove 8 and the second wafer accommodating groove 13.

[0027] Working principle: When in use, a controller for intelligently identifying wafers is installed in the chassis 1. The input end of the controller is electrically connected to the power supply unit. The other end of the controller is connected to a function button 3. The input end of the controller is connected to a laser scanner 19. In the initial state, the operator places the wafer on any horizontal placement board 12 and adjusts the target position of the wafer through the function button 3. After the controller receives the target position signal, it transmits a control instruction to the drive shaft 16 and the timer inside the controller. The drive shaft 16 includes a rotating shaft and a rotational speed sensor. The rotational speed sensor sends the rotational speed information of the drive shaft 16 to the controller, and the rotation duration of the drive shaft 16 is controlled by the timer, so as to adjust the height of the first wafer accommodating groove 8 or the second wafer accommodating groove 13. The height of the laser scanner 19 is controlled by the lifting rod 18. After scanning the position where the wafer is located, the controller sends a control signal to the servo 10 at the corresponding height. The output end of the servo 10 pulls the pushing and sweeping board 11 to push and sweep the wafer on the horizontal placement board 12 to the specified position. The pushing and sweeping board 11 is driven to rotate around one end by the pushing and sweeping drive structure, so as to realize the pushing and sweeping of the wafer on the top of the horizontal placement board 12 and adjust the placement position of the wafer on different horizontal placement boards 12, which is beneficial to saving the overall space of the wafer testing equipment.

[0028] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0029] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer intelligent identification and pushing machine, characterized in that: The invention comprises a chassis (1), a display screen (2) and a function key (3) are installed on one side of the chassis (1) through an inclined surface, a signal indicator light (5) is fixed on the top of the chassis (1), a mounting groove (6) is opened on the top of the chassis (1), one end of the mounting groove (6) is connected to two symmetrically installed drive shafts (16) through the output end of a motor, a first wafer accommodating groove (8) and a second wafer accommodating groove (13) are threadedly connected on the surface of the drive shaft (16), the tops of the first wafer accommodating groove (8) and the second wafer accommodating groove (13) are respectively connected to a push-sweep drive structure, the output ends of the two push-sweep drive structures are connected to a push-sweep plate (11), the inner walls of the first wafer accommodating groove (8) and the second wafer accommodating groove (13) are respectively fixed with a plurality of mutually parallel horizontal storage plates (12), and a laser scanner (19) is fixed on the top of the chassis (1) through a lifting rod (18).

2. The wafer intelligent recognition and pushing machine according to claim 1, characterized in that: The function buttons (3) include a start / stop button, an adjustment button, an operation button and a reset button. The bottom of the chassis (1) is connected to a support foot (4), and a gasket is glued to the bottom of the support foot (4).

3. The wafer intelligent recognition and pushing machine according to claim 1, characterized in that: The signal indicator light (5) is composed of a plurality of colored lights of different colors connected in parallel, and the signal indicator light (5) is a running light or a breathing light.

4. The wafer intelligent recognition and pushing machine according to claim 1, characterized in that: The top of the driving shaft (16) is movably connected to the bearing (15), the top of the chassis (1) is fixed with a support rod (14), and the top of the support rod (14) is movably connected to the top of the driving shaft (16) through the bearing (15).

5. The wafer intelligent recognition and pushing machine according to claim 1, characterized in that: A limiting column (17) is integrally formed at one end of the first wafer accommodating groove (8) and the second wafer accommodating groove (13), and a driving shaft (16) is threadedly passed through the interior of the limiting column (17).

6. The wafer intelligent recognition and pushing machine according to claim 1, characterized in that: The push-broom driving structure comprises a connecting rod (9) and a steering gear (10), the top of the connecting rod (9) is fixed to the steering gear (10), and the output end of the steering gear (10) is fixedly connected to one end of the push-broom plate (11).

7. The wafer intelligent recognition and pushing machine according to claim 1, characterized in that: A plurality of limiting plates (7) are respectively welded to the bottom of the first wafer accommodating groove (8) and the second wafer accommodating groove (13), and a recess adapted to the limiting plates (7) is provided at the inner bottom of the mounting groove (6).

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