Optical device, optical network equipment and optical network system

Abstract

The embodiment of the utility model provides an optical device, optical network equipment and an optical network system, relates to the technical field of optical networks, and is used for improving the problem of multiple discontinuous points of link impedance and improving the transmission quality of high-speed signals. The optical device comprises at least one photoelectric connection module. The photoelectric connection module comprises a shell, a photoelectric conversion assembly and a first circuit board. A cavity is formed in the shell, and a first through hole communicating with the cavity is further formed in the shell. The photoelectric conversion assembly is located in the cavity and arranged on the inner wall of the shell. The photoelectric conversion assembly is used for photoelectric conversion. One end of the first circuit board penetrates through the first through hole, extends into the cavity and is electrically connected with the photoelectric conversion assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of optical networks, in particular to an optical device, an optical network device and an optical network system. Background Art

[0002] With the evolution of passive optical network (PON) systems towards higher speeds, the requirements for performance indicators such as device power consumption and link insertion loss in optical network devices are becoming increasingly stringent.

[0003] The high-speed device solution based on the traditional transistor outline (TO) scheme has the problems of many link impedance discontinuity points, resulting in deterioration of high-speed signal transmission quality and limited bandwidth. Summary of the Utility Model

[0004] The purpose of this application is to provide an optical device, an optical network device and an optical network system, which are used to improve the problem of many link impedance discontinuity points and improve the high-speed signal transmission quality.

[0005] In the first aspect of the embodiments of this application, an optical device is provided, which includes at least one optoelectronic connection module. The optoelectronic connection module includes a housing, an optoelectronic conversion component and a first circuit board. A cavity is formed on the housing, and a first through hole communicating with the cavity is also formed on the housing. The optoelectronic conversion component is located in the cavity and is disposed on the inner wall of the housing. One end of the first circuit board passes through the first through hole and extends into the cavity, and is electrically connected to the optoelectronic conversion component. Among them, the optoelectronic conversion component is used for optoelectronic conversion. For example, converting an optical signal into an electrical signal; or converting an electrical signal into an optical signal.

[0006] In the related art, traditional optoelectronic conversion components adopt the Transistor Outline (TO) packaging method and are connected to the external structure through glass insulators. However, in the connection method through glass insulators, there are many impedance discontinuity points, which will further lead to the deterioration of high-speed signal quality, limited bandwidth, and serious deterioration of high-speed performance. In the optoelectronic device provided by the embodiment of the present application, the optoelectronic conversion component can be electrically connected to the outside through the first circuit board extending into the cavity without using a glass insulator, and the electrical signal exchange between the optoelectronic conversion component in the housing and the external structure can be completed without using a glass insulator. Furthermore, the impedance discontinuity points of the link can be reduced. Moreover, the first circuit board is more easily arranged through the circuit layout, further improving the impedance discontinuity problem. In addition, in the related art, when using the TO packaging method, when the optoelectronic conversion component dissipates heat, the heat needs to be first diffused to the TO base, and then diffused to the housing through the TO base and dissipated from the optoelectronic device through the housing. At this time, the heat dissipation path is long and the heat dissipation effect is poor. In the optoelectronic device provided by the embodiment of the present application, the optoelectronic conversion component is arranged on the inner wall of the housing. The heat dissipated by the optoelectronic conversion component can be directly diffused to the housing and then dissipated from the optoelectronic device through the housing. That is to say, the heat dissipated by the optoelectronic conversion component can be directly diffused to the housing without passing through the TO base, and the heat transfer path is shorter and the heat dissipation effect is better. In summary, the optoelectronic device provided by the present application can improve the problem of many impedance discontinuity points, thereby ensuring the high-speed signal quality, improving the situation of limited bandwidth and serious deterioration of high-speed performance caused by the deterioration of high-speed signal quality. Moreover, it can improve the heat dissipation effect of the optoelectronic connection module, prevent the optoelectronic conversion component from being damaged due to excessive heat, and improve the service life of the optoelectronic device.

[0007] In an optional implementation manner, the optoelectronic connection module further includes an insulating and sealing part. The insulating and sealing part plugs the first gap between the first circuit board and the inner wall of the first through hole, so that the first circuit board is insulated and sealed with the housing. The first circuit board and the housing are insulated through the insulating and sealing part to prevent conduction between the first circuit board and the housing. In addition, the first circuit board and the housing are sealed through the insulating and sealing part to ensure the airtightness between the first circuit board and the housing, prevent water vapor and the like from entering the housing, and affect the normal operation of the optoelectronic conversion component in the housing. Prevent the optoelectronic conversion component from being damaged due to the entry of water vapor and ensure the service life of the optoelectronic device.

[0008] In an optional implementation manner, the insulating and sealing part is filled between the first circuit board and the inner wall of the first through hole. At this time, the insulating and sealing part filled between the first circuit board and the inner wall of the first through hole plugs the first gap between the first circuit board and the inner wall of the first through hole to ensure the airtightness between the first circuit board and the housing.

[0009] In another alternative embodiment, the insulating and sealing portion is disposed outside the first through hole and covers the orifice of the first through hole and a part of the outer surface of the housing. At this time, by covering the orifice of the first through hole and a part of the outer surface of the housing with the insulating and sealing portion, it is ensured that the insulating and sealing portion can block the first gap between the first circuit board and the inner wall of the first through hole. Moreover, when the insulating and sealing portion is disposed in the first through hole, it is more convenient for installation.

[0010] In yet another alternative embodiment, a part of the insulating and sealing portion is filled between the first circuit board and the inner wall of the first through hole; another part of the insulating and sealing portion is disposed outside the first through hole and covers the orifice of the first through hole and a part of the outer surface of the housing. At this time, there is an insulating and sealing portion both inside and outside the through hole, further ensuring that the insulating and sealing portion can block the first gap between the first circuit board and the inner wall of the first through hole and improving the airtightness between the first circuit board and the housing.

[0011] In an alternative embodiment, a groove is formed on the outer surface of the housing. The groove is disposed around the periphery of the orifice of the first through hole and is in communication with the first through hole. At least a part of the insulating and sealing portion is also filled in the groove. By providing the insulating and sealing portion in the groove, the groove can accommodate the insulating and sealing portion, and in the direction parallel to the outer surface of the housing, the side wall of the groove can limit the sealing and insulating portion, improving the stability of the connection between the sealing and insulating portion and the housing.

[0012] In an alternative embodiment, the material of the insulating and sealing portion is sealing glass. The sealing glass has good electrical insulation and good sealing and waterproof properties, preventing the current in the first circuit board from short - circuiting, and at the same time ensuring the sealing performance at the first gap between the first circuit board and the inner wall of the first through hole, thereby preventing water vapor from entering the cavity and affecting the normal operation of the optoelectronic conversion component in the housing.

[0013] In an alternative embodiment, the optoelectronic connection module further includes a sealing film. The sealing film covers the insulating and sealing portion. The material of the sealing film is parylene. Parylene has good hydrophobic properties. After the insulating and sealing portion blocks the first gap between the first circuit board and the inner wall of the first through hole, the sealing film of parylene is used to cover the insulating and sealing portion to further improve the airtightness between the first circuit board and the inner wall of the first through hole and prevent water vapor from entering the housing.

[0014] In an optional embodiment, the optoelectronic connection module also includes a support member. The support member is disposed in the first through hole and connected to the inner wall of the first through hole. The support member is located on the side of the insulating sealing portion facing the cavity and is connected to the insulating sealing portion. The support member can support the insulating sealing portion. During assembly processing, when the insulating sealing material is disposed between the first circuit board and the inner wall of the first through hole, the support member can support and limit the insulating sealing material to prevent the insulating sealing material from detaching from between the first circuit board and the inner wall of the first through hole, and ensure that the insulating sealing portion formed by the insulating sealing material after curing can block the first gap between the first circuit board and the inner wall of the first through hole.

[0015] In an optional embodiment, the support member is an annular structure and is disposed around the first circuit board. The support member with an annular structure is disposed around the circuit board, thereby providing support for different positions of the insulating support portion disposed around the circuit board, further ensuring that the insulating sealing portion formed by the insulating sealing material after curing can block the first gap between the first circuit board and the inner wall of the first through hole.

[0016] In an optional embodiment, there is a second gap between the support member and the first circuit board. The width of the second gap is d. Among them, 20μm≤d≤1000μm. Exemplarily, the distance d between the end of the support member facing the circuit board and the circuit board is 20μm, 50μm, 80μm, 200μm, 500μm, 800μm, 1000μm, etc. When d≥20μm, it can be ensured that during production and processing, the support member can be conveniently sleeved on the peripheral side of the circuit board and will not be conductive with the circuit board. And d≤1000μm, so as to ensure that the insulating sealing material will not flow away in large quantities through the second gap between the support member and the circuit board, so as to ensure that the insulating sealing portion formed by the insulating sealing material after curing can block the first gap between the first circuit board and the inner wall of the first through hole.

[0017] In an optional embodiment, the optoelectronic connection module includes a boss. The boss is arranged on the inner wall of the first through hole. The boss is connected to the shell. The boss is located on the side of the support member away from the insulating sealing portion, and abuts or is connected to the support member. The support portion is limited by the boss to ensure that during the curing process of the insulating sealing material, the support portion will not be separated from the shell, so that the insulating sealing material loses the support of the support portion and separates from the shell, so as to ensure that the insulating sealing portion formed by the insulating sealing material after curing can block the first gap between the first circuit board and the inner wall of the first through hole.

[0018] In an alternative embodiment, the material of the housing is Kovar, aluminum matrix silicon carbide, ceramic or stainless steel. The above materials all have good mechanical strength and thermal conductivity. The housing made of the above materials can provide good protection for the optoelectronic conversion components in the cavity, and improve the ability of the heat generated during the operation of the optoelectronic conversion components to dissipate outward, preventing the optoelectronic conversion components from being damaged due to excessive heat.

[0019] In an alternative embodiment, the optoelectronic connection module further includes a support member. The support member is disposed in the first through hole and connected to the inner wall of the first through hole. The support member is made of the same material as the housing. At this time, during the production and processing process, the support member and the housing are made of the same material, and there is no need to prepare other materials separately for the support member, which is convenient for production and processing.

[0020] In an alternative embodiment, the housing includes a carrier plate, side plates and a cover plate. The optoelectronic conversion components are disposed on the carrier plate. The material of the carrier plate is aluminum matrix silicon carbide. The side plates are wound around the periphery of the carrier plate. The material of the side plates is Kovar, stainless steel or ceramic. The cover plate is disposed on the side of the side plates away from the carrier plate. The cover plate is welded to the side plates. The material of the cover plate is Kovar, stainless steel or ceramic. The aluminum matrix silicon carbide has better thermal conductivity. When the carrier plate connected to the optoelectronic conversion components is made of aluminum matrix silicon carbide, the heat dissipation effect of the optoelectronic conversion components through the carrier plate can be further improved. During the processing and production, after connecting the carrier plate and the side plates, the optoelectronic conversion components are disposed in the cavity, and finally the cover plate is hermetically welded to the end of the side plates away from the carrier plate. The process of hermetic welding is more difficult. If the side plates and the cover plate are made of aluminum matrix silicon carbide, due to the large welding difficulty of the aluminum matrix silicon carbide material itself, it is more difficult to perform the hermetic welding between the side plates and the cover plate. When the side plates and the cover plate are made of materials such as Kovar, stainless steel or ceramic, the welding difficulty is lower, and it is easier to complete the hermetic welding between the side plates and the cover plate.

[0021] In an alternative embodiment, the first circuit board is a flexible circuit board. The flexible circuit board has a thin thickness and occupies a small space, which is more conducive to the miniaturization of optical devices. In addition, the flexible circuit board has good bendability, and through the bending of the flexible circuit board, it is more convenient to realize the electrical connection between the optoelectronic conversion components and the external structure through the flexible circuit board.

[0022] In an alternative embodiment, the optoelectronic conversion component includes a laser diode (LD) and a thermoelectric cooler (TEC). The laser diode is electrically connected to the first circuit board and is used to convert an electrical signal into an optical signal. One end of the thermoelectric cooler is connected to the laser diode, and the other end is connected to the inner wall of the housing. Through the first circuit board, the problem of many impedance discontinuity points in the electrical connection link between the laser diode and the external structure is improved, ensuring the quality of high-speed signals. The electrical signal is converted into an optical signal through the laser diode, and then the laser diode is cooled by the thermoelectric cooler, and the heat is transferred to the housing and dissipated from the optical device through the housing. The heat dissipation effect of the optoelectronic connection module is ensured, preventing the laser diode from being damaged due to excessive heat, and improving the service life of the laser diode.

[0023] In an alternative embodiment, the optical device further includes an optical receiving component, an optical fiber pigtail, and a tee. The optical receiving component is used to receive an optical signal and convert the optical signal into an electrical signal. The optical fiber pigtail is used to receive the optical signal emitted by the laser diode and is also used to emit the optical signal to the optical receiving component. The tee is respectively connected to the optoelectronic conversion component, the optical receiving component, and the optical fiber pigtail. The optical signal emitted by the laser diode can be transmitted to the optical fiber pigtail in the tee, and the optical fiber pigtail receives the optical signal and transmits it out of the optical device. Thus, the optical device transmits the optical signal outward. Alternatively, an external device transmits the optical signal to the tee through the optical fiber pigtail, and the optical signal is transmitted to the optical receiving component in the tee, thereby enabling the optical device to receive an external optical signal.

[0024] In an alternative embodiment, the optoelectronic conversion component includes a photodiode (PD). The photodiode is electrically connected to the first circuit board. The photodiode is used to convert an optical signal into an electrical signal. Through the first circuit board, the problem of many impedance discontinuity points in the electrical connection link between the photodiode and the external structure is improved, ensuring the quality of high-speed signals. Then, the optical signal is converted into an electrical signal by the photodiode and transmitted to the first circuit board.

[0025] In some other embodiments of the present application, at least one optoelectronic connection module includes a first optoelectronic connection module and a second optoelectronic connection module. The optoelectronic conversion component of the first optoelectronic connection module includes a laser diode for converting an electrical signal into an optical signal. The optoelectronic conversion component of the second optoelectronic connection module includes a photodiode for converting an optical signal into an electrical signal. The optical device further includes a pigtail and a tee. The pigtail is used to receive the optical signal emitted by the laser diode and to emit the optical signal to the photodiode. The tee is connected to the first optoelectronic connection module, the second optoelectronic connection module, and the pigtail respectively. The laser diode in the first optoelectronic connection module can convert the electrical signal into an optical signal and transmit it to the pigtail through the tee. The pigtail receives the optical signal and transmits it out of the optical device. Thus, the optical device transmits the optical signal outward. Alternatively, an external device transmits the optical signal to the tee through the pigtail, and the optical signal is transmitted to the photodiode of the second optoelectronic connection module in the tee, so that the optical device receives the external optical signal. Moreover, the laser diode is electrically connected to the external structure through the first circuit board in the first optoelectronic connection module, thereby improving the problem of many impedance discontinuity points in the electrical connection link between the laser diode and the external structure. The photodiode is electrically connected to the external structure through the first circuit board in the second optoelectronic connection module, improving the problem of many impedance discontinuity points in the electrical connection link between the photodiode and the external structure. Thus, the quality of the high-speed signals at the optical transmitter and the optical receiver is ensured.

[0026] In a second aspect of the embodiments of the present application, an optical device is provided, including at least one optoelectronic connection module. The optoelectronic connection module includes a housing, an optoelectronic conversion component, a first circuit board, and an insulating and sealing portion. A cavity is formed on the housing, and a first through hole communicating with the cavity is formed on the housing. The optoelectronic conversion component is located in the cavity. Wherein, the optoelectronic conversion component is used for optoelectronic conversion. One end of the first circuit board passes through the first through hole and extends into the cavity, and is electrically connected to the optoelectronic conversion component. The insulating and sealing portion seals the first gap between the first circuit board and the inner wall of the first through hole, so that the first circuit board is insulated and sealedly connected to the housing. And the material of the insulating and sealing portion is sealing glass.

[0027] At this time, the optoelectronic conversion component can be electrically connected to the outside through the first circuit board extending into the cavity without a glass insulator, reducing the impedance discontinuity points at both ends of the wire arranged in the glass insulator. Moreover, the first circuit board is easier to arrange the circuit layout to improve the impedance discontinuity problem. In addition, the sealing glass has good electrical insulation and good sealing and waterproof properties. The first circuit board and the housing are sealed by an insulating and sealing part made of the sealing glass material to ensure the airtightness between the first circuit board and the housing and prevent water vapor and the like from entering the housing. In summary, another optical device provided by the present application can improve the problem of many impedance discontinuity points, thereby ensuring the high-speed signal quality, improving the situation of bandwidth limitation and serious deterioration of high-speed performance caused by the deterioration of high-speed signal quality. Moreover, it can ensure the airtightness of the optoelectronic connection module, prevent water vapor and the like from entering the housing, affect the normal operation of the optoelectronic conversion component in the housing or even cause damage to the optoelectronic conversion component, and thereby ensure the service life of the optical device.

[0028] In the third aspect of the embodiments of the present application, an optical network device is provided, including the optical device in any of the above embodiments and a second circuit board. The optical device is arranged on one side of the second circuit board, and the first circuit board is electrically connected to the second circuit board. The above optical network device has the same technical effects as the optical device provided in the foregoing embodiments, and will not be described in detail here.

[0029] In the fourth aspect of the embodiments of the present application, an optical network system is provided, including at least one optical network device in any of the above embodiments and an optical fiber. The optical fiber is connected to the optical network device. The above optical network system has the same technical effects as the optical network device provided in the foregoing embodiments, and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of an optical network system provided by an embodiment of the present application;

[0031] Figure 2 It is a schematic structural diagram of an optical network device provided by an embodiment of the present application;

[0032] Figure 3 It is a schematic structural diagram of the first optoelectronic connection module provided by an embodiment of the present application;

[0033] Figure 4 It is a schematic structural diagram of the second optoelectronic connection module provided by an embodiment of the present application;

[0034] Figure 5 It is a schematic structural diagram of the third optoelectronic connection module provided by an embodiment of the present application;

[0035] Figure 6 It is a schematic structural diagram of the fourth optoelectronic connection module provided by an embodiment of the present application;

[0036] Figure 7 Schematic diagram of the fifth optical and electrical connection module provided by the embodiment of the present application;

[0037] Figure 8A Schematic diagram of the sixth optical and electrical connection module provided by the embodiment of the present application;

[0038] Figure 8B It is Figure 8A Enlarged view at A;

[0039] Figure 9 It is Figure 8A Schematic diagram in the P direction after removing the insulation sealing part from the optical and electrical connection module in;

[0040] Figure 10A Schematic diagram of the seventh optical and electrical connection module provided by the embodiment of the present application;

[0041] Figure 10B It is Figure 10A Enlarged view at B;

[0042] Figure 11 Schematic diagram of the eighth optical and electrical connection module provided by the embodiment of the present application;

[0043] Figure 12 Schematic diagram of the ninth optical and electrical connection module provided by the embodiment of the present application;

[0044] Figure 13 Schematic diagram of a optical device provided by the embodiment of the present application;

[0045] Figure 14 Schematic diagram of the tenth optical and electrical connection module provided by the embodiment of the present application;

[0046] Figure 15 Schematic diagram of another optical network device provided by the embodiment of the present application;

[0047] Figure 16 Schematic diagram of another optical device provided by the embodiment of the present application;

[0048] Figure 17 Schematic diagram of the eleventh optical and electrical connection module provided by the embodiment of the present application.

[0049] Reference numerals:

[0050] 100 - Optical network system; 01 - Optical network device; 01A - First optical network device; 01B - Second optical network device; 02 - Optical fiber; 10 - Optical device; 20 - Second circuit board; 11 - Optoelectronic connection module; 11A - First optoelectronic connection module; 11B - Second optoelectronic connection module; 111 - First circuit board; 112 - Housing; 112A - Outer surface; 1121 - Cavity; 1122 - First through - hole; 1123 - Groove; 1124 - Carrier plate; 1125 - Side plate; 1126 - Cover plate; 113 - Optoelectronic conversion component; 1131 - Laser diode; 1132 - Thermoelectric cooler; 113A - Optoelectronic conversion component of the first optoelectronic connection module; 113B - Optoelectronic conversion component of the second optoelectronic connection module; 114 - Insulating and sealing part; 115 - First gap; 116 - Sealing film; 117 - Support; 118 - Second gap; 119 - Boss; 12 - Optical receiving component; 121 - Photodiode; 122 - Glass insulator; 123 - TO base; 124 - Third circuit board; 13 - Pigtail; 14 - Three - way pipe; 15 - Filter film. Detailed implementation manners

[0051] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0052] Hereinafter, terms such as "first", "second", "third", etc. are only used for convenience of description, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0053] In the present application, unless otherwise clearly defined and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed mechanical connection, a detachable mechanical connection, or integrated; or, "connection" can be directly connected, or indirectly connected through an intermediate medium.

[0054] In the embodiments of the present application, words such as "exemplarily", "for example", etc. are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplarily", "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly, using words such as "exemplarily", "for example" aims to present relevant concepts in a specific manner.

[0055] In the accompanying drawings of the embodiments of the present application, components are represented by guiding lines with arrows; parts are only represented by guiding lines; hollow structures such as cavities and openings are represented by curved guiding lines.

[0056] An embodiment of the present application provides an optical network system 100. As Figure 1 shown, the optical network system 100 may include at least one optical network device 01 and an optical fiber 02. The optical fiber 02 is connected to the optical network device 01. Exemplarily, the optical network system 100 may include a first optical network device 01A and a second optical network device 01B. The first optical network device 01A and the second optical network device 01B are connected by the optical fiber 02 and optical signals are transmitted through the optical fiber 02. For example, the optical network device 01 may be an optical modem, a router, an optical module, a switch, a server, etc.

[0057] On this basis, as Figure 2 shown, the optical network device 01 may include an optical device 10. The optical device 10 includes at least one optoelectronic connection module 11. The optoelectronic connection module 11 may include a first circuit board 111. The optical network device 01 may further include a second circuit board 20. The optical device 10 is disposed on one side of the second circuit board 20, and the first circuit board 111 is electrically connected to the second circuit board 20. After the second circuit board 20 transmits an electrical signal to the optical device 10, the optical device 10 converts the electrical signal into an optical signal and transmits it to the optical fiber 02 (as Figure 1 shown). Alternatively, the optical device 10 receives the optical signal transmitted by the optical fiber 02, converts the optical signal into an electrical signal, and then transmits it to the second circuit board 20.

[0058] The structure of the above optical device 10 will be illustrated by way of example below. As Figure 3 shown, the optoelectronic connection module 11 may further include a housing 112 and an optoelectronic conversion component 113. A cavity 1121 is formed in the housing 112. The optoelectronic conversion component 113 is located in the cavity 1121. And the optoelectronic conversion component 113 is used to convert an electrical signal into an optical signal to achieve optoelectronic conversion. Alternatively, the optoelectronic conversion component 113 may also be used to convert an optical signal into an electrical signal to achieve optoelectronic conversion.

[0059] The traditional optoelectronic conversion component 113 adopts the TO packaging method. One end of the TO base 123 extends into the cavity 1121 of the housing 112. One end of the wire arranged in the glass insulator 122 passes through the TO base 123 and is electrically connected to the optoelectronic conversion component 113 in the cavity 1121. The other end of the wire arranged in the glass insulator 122 is electrically connected to the second circuit board 20 through a flexible circuit board. At this time, impedance discontinuities will occur at the connection between the optoelectronic conversion component 113 and one end of the wire arranged in the glass insulator 122, at the connection between the wire arranged in the glass insulator 122 and the glass, at the connection between the other end of the wire arranged in the glass insulator 122 and the flexible circuit board, and at the connection between the flexible circuit board and the second circuit board 20. Moreover, there are many impedance discontinuity points in the glass insulator 122 itself. That is to say, there are many impedance discontinuity points in the link of this method, which will further lead to the deterioration of the high-speed signal quality, limited bandwidth, and serious deterioration of the high-speed performance.

[0060] To solve the problem of many impedance discontinuity points in the above link, continue as Figure 3 shown, a first through hole 1122 communicating with the cavity 1121 is further opened on the housing 112. One end of the first circuit board 111 passes through the first through hole 1122 and extends into the cavity 1121, and is electrically connected to the optoelectronic conversion component 113. The optoelectronic conversion component 113 can be electrically connected to the second circuit board 20 through the first circuit board 111 extending into the cavity 1121 without the glass insulator 122, reducing the impedance discontinuity points at both ends of the wire arranged in the glass insulator 122 and inside the glass insulator 122. Moreover, the first circuit board 111 is more easily routed to improve the impedance discontinuity problem. Therefore, an optical device 10 provided by an embodiment of the present application can improve the problem of many impedance discontinuity points, thereby ensuring the high-speed signal quality and improving the situation of limited bandwidth and serious deterioration of the high-speed performance caused by the deterioration of the high-speed signal quality.

[0061] In addition, when the traditional optoelectronic conversion component 113 adopts the TO packaging method, the optoelectronic conversion component 113 is fixedly arranged on the TO base 123. When the optoelectronic conversion component 113 works, the optoelectronic conversion component 113 generates heat, and the heat needs to be first diffused to the TO base 123, then diffused to the housing 112 through the TO base 123, and dissipated from the optical device 10 through the housing 112. At this time, the heat dissipation path is long, the heat dissipation effect is poor, and it is easy to cause the optoelectronic conversion component 113 to be damaged due to excessive heat, especially for high-bandwidth scenarios of 50G and above, the optoelectronic conversion component 113 has high power consumption and large heat dissipation, and is more likely to be damaged due to excessive heat.

[0062] To solve the problem of poor heat dissipation effect, continue as Figure 3As shown, the photoelectric conversion component 113 can be disposed on the inner wall of the housing 112. The heat dissipated by the photoelectric conversion component 113 can directly diffuse to the housing 112 and then dissipate out of the optical device 10 through the housing 112. That is to say, the heat dissipated by the photoelectric conversion component 113 can directly diffuse to the housing 112 without passing through the TO base 123, the heat transfer path is shorter, and the heat dissipation effect is better. Furthermore, it prevents the photoelectric conversion component 113 from being damaged due to excessive heat, and improves the service life of the optical device 10.

[0063] Furthermore, continuing as Figure 3 shown, the optoelectronic connection module 11 may further include an insulating and sealing portion 114. The insulating and sealing portion 114 seals the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122, so that the first circuit board 111 is insulated and sealingly connected to the housing 112. The first circuit board 111 and the housing 112 are insulated by the insulating and sealing portion 114 to prevent conduction between the first circuit board 111 and the housing 112. In addition, the first circuit board 111 and the housing 112 are sealed by the insulating and sealing portion 114 to ensure the airtightness between the first circuit board 111 and the housing 112, prevent water vapor and the like from entering the housing 112, and affect the normal operation of the photoelectric conversion component 113 inside the housing 112. Prevent the photoelectric conversion component 113 from being damaged due to the entry of water vapor, and ensure the service life of the optical device 10.

[0064] In some embodiments of the present application, as Figure 4 shown, the insulating and sealing portion 114 is filled between the first circuit board 111 and the inner wall of the first through hole 1122. Through the insulating and sealing portion 114 filled between the first circuit board 111 and the inner wall of the first through hole 1122, the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122 is sealed to ensure the airtightness between the first circuit board 111 and the housing 112.

[0065] Or, in some other embodiments of the present application, as Figure 5 shown, the insulating and sealing portion 114 is disposed outside the first through hole 1122 and covers the orifice of the first through hole 1122 and a part of the outer surface 112A of the housing 112. By covering the orifice of the first through hole 1122 and a part of the outer surface 112A of the housing 112 with the insulating and sealing portion 114, it is ensured that the insulating and sealing portion 114 can seal the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122. Moreover, when the insulating and sealing portion 114 is disposed on the first through hole 1122, it is more convenient for installation.

[0066] Or, in still some other embodiments of the present application, continuing as Figure 3As shown, a part of the insulating and sealing portion 114 is filled between the first circuit board 111 and the inner wall of the first through hole 1122; another part of the insulating and sealing portion 114 is disposed outside the first through hole 1122 and covers the orifice of the first through hole 1122 and a part of the outer surface 112A of the housing 112. At this time, there is the insulating and sealing portion 114 inside and outside the through hole, which further ensures that the insulating and sealing portion 114 can block the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122, and improves the airtightness between the first circuit board 111 and the housing 112.

[0067] Further, as Figure 6 shown, a groove 1123 is formed in the outer surface 112A of the housing 112. The groove 1123 is disposed around the periphery of the orifice of the first through hole 1122, and the groove 1123 communicates with the first through hole 1122. At least a part of the insulating and sealing portion 114 is also filled in the groove 1123. By providing the insulating and sealing portion 114 in the groove 1123, the groove 1123 can accommodate the insulating and sealing portion 114, and in the direction parallel to the outer surface 112A of the housing 112, the side wall of the groove 1123 can limit the sealing and insulating portion, improving the connection stability between the sealing and insulating portion and the housing 112.

[0068] As described above, as Figure 3 、 Figure 4 、 Figure 5 and Figure 6 shown, in any of the embodiments described above, the material of the insulating and sealing portion 114 may be sealing glass. The sealing glass has good electrical insulation and good sealing and waterproof properties, preventing the current in the first circuit board 111 from short - circuiting, and at the same time ensuring the sealing performance at the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122, thereby preventing water vapor from entering the cavity 1121 and affecting the normal operation of the optoelectronic conversion component 113 inside the housing 112.

[0069] Exemplarily, the above - mentioned insulating and sealing portion 114 can be welded to the first circuit board 111, and the insulating and sealing portion 114 can also be welded to the housing 112. Or, again exemplarily, the sealing glass can be fusion - welded onto the first circuit board 111 and the housing 112, and after curing and forming, the above - mentioned insulating and sealing portion 114 is formed.

[0070] Or, as Figure 7As shown, the optoelectronic connection module 11 further includes a sealing film 116. The sealing film 116 covers the insulating and sealing portion 114. The material of the sealing film 116 is parylene. Parylene has good hydrophobic properties. After the insulating and sealing portion 114 seals the first gap 115 between the inner wall of the first circuit board 111 and the first through hole 1122, the insulating and sealing portion 114 is further covered with the parylene sealing film 116 to further improve the airtightness between the first circuit board 111 and the inner wall of the first through hole 1122 and prevent water vapor from entering the housing 112.

[0071] Exemplarily, as Figure 7 shown in the embodiment, the material of the insulating and sealing portion 114 can be resin, rubber, etc.

[0072] However, the thickness of the first circuit board 111 is small, and in order to ensure the rigidity of the housing 112, the wall thickness of the housing 112 is large. The size of the first through hole 1122 that can be formed in the housing 112 during the process production is much larger than the thickness of the first circuit board 111. Therefore, the distance between the first circuit board 111 and the inner wall of the first through hole 1122 is large. During the process of forming the insulating and sealing portion 114, the insulating sealing material (such as sealing glass) may move in the axial direction of the first through hole 1122, so that the formed insulating and sealing portion 114 cannot completely seal the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122.

[0073] To solve the above problems, as Figure 8A and Figure 8B shown, the optoelectronic connection module 11 may further include a support member 117. The support member 117 is disposed in the first through hole 1122 and is connected to the inner wall of the first through hole 1122. And the support member 117 is located on the side of the insulating and sealing portion 114 facing the cavity 1121 and is connected to the insulating and sealing portion 114. The support member 117 can support the insulating and sealing portion 114. During the assembly and processing, when the insulating sealing material is disposed between the first circuit board 111 and the inner wall of the first through hole 1122, the support member 117 can support and limit the insulating sealing material to prevent the insulating sealing material from separating from between the first circuit board 111 and the inner wall of the first through hole 1122, and ensure that the insulating and sealing portion 114 formed after the insulating sealing material is cured can seal the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122.

[0074] Exemplarily, in the processing and production, a first through hole 1122 is formed in the housing 112, and then the support member 117 is fixed to the inner wall of the first through hole 1122 and connected to the housing. Among them, the support member 117 and the housing 112 can be connected by means of abutting, mechanical fixing, welding, gluing, etc. Then, an insulating sealing material is disposed between the first circuit board 111 and the inner wall of the first through hole 1122, and an insulating sealing portion 114 is formed under the support of the support member 117.

[0075] Further, as Figure 9 shown, the support member 117 can be a ring structure and is disposed around the periphery of the first circuit board 111. By surrounding the periphery of the circuit board with the support member 117 having a ring structure, it further provides support for different positions of the insulating support portion provided around the circuit board, and further ensures that the insulating sealing portion 114 formed after the curing of the insulating sealing material can block the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122.

[0076] Of course, it can be understood that the support member 117 can also be a plate structure and is disposed between the first circuit board 111 and the inner wall of the first through hole 1122. Alternatively, the optoelectronic connection module 11 can further include a plurality of support members 117 having a plate structure, and the plurality of support members 117 are distributed in a circle around the periphery of the first circuit board 111.

[0077] Continuing as Figure 8B shown, there is a second gap 118 between the support member 117 and the first circuit board 111. The width of the second gap 118 is d. Among them, 20μm ≤ d ≤ 1000μm. Exemplarily, the distance d between the end of the support member 117 facing the circuit board and the circuit board is 20μm, 50μm, 80μm, 200μm, 500μm, 800μm, 1000μm, etc. When d ≥ 20μm, it can ensure that during production and processing, it is convenient to sleeved the support member 117 around the periphery of the circuit board and it will not conduct with the circuit board. And d ≤ 1000μm to ensure that the insulating sealing material will not flow away in large quantities through the second gap 118 between the support member 117 and the circuit board, so as to ensure that the insulating sealing portion 114 formed after the curing of the insulating sealing material can block the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122.

[0078] In addition, as Figure 10A and Figure 10BAs shown, the optoelectronic connection module 11 may also include a boss 119. The boss 119 is disposed on the inner wall of the first through hole 1122. The boss 119 is connected to the housing 112. The boss 119 is located on the side of the support member 117 away from the insulating sealing portion 114, and is in contact with or connected to the support member 117. The support portion is limited by the boss 119 to ensure that during the curing process of the insulating sealing material, the support portion will not be separated from the housing 112, so that the insulating sealing material loses the support of the support portion and is separated from the housing 112, so as to ensure that the insulating sealing portion 114 formed by the insulating sealing material after curing can block the first gap 115 between the first circuit board 111 and the inner wall of the first through hole 1122.

[0079] Exemplarily, the boss 119 may be an integrally formed structure with the housing 112. Of course, the boss 119 may also be connected to the housing 112 by bonding, welding, etc. This application does not make any specific limitation.

[0080] The material of the housing 112 described in any of the above embodiments can be Kovar, aluminum-based silicon carbide, ceramic or stainless steel. Kovar, aluminum-based silicon carbide, ceramic or stainless steel all have good mechanical strength and thermal conductivity. The housing 112 made of the above materials can provide good protection for the photoelectric conversion component 113 in the cavity 1121, and improve the ability of the heat generated by the photoelectric conversion component 113 when working to dissipate outward, thereby preventing the photoelectric conversion component 113 from being damaged by excessive heat.

[0081] Furthermore, the material of the support member 117 described in any of the above embodiments is the same as that of the housing 112. In this case, during the production process, the support member 117 and the housing 112 are made of the same material, and there is no need to prepare other materials for the support member 117 separately, which facilitates production and processing.

[0082] Continue as Figure 11As shown in the figure, the housing 112 includes a carrier plate 1124, side plates 1125 and a cover plate 1126. The photoelectric conversion component 113 is disposed on the carrier plate 1124. The material of the carrier plate 1124 is aluminum-based silicon carbide. The side plates 1125 are wound around the periphery of the carrier plate 1124. The material of the side plates 1125 is kovar, stainless steel or ceramic. The cover plate 1126 is covered on the side of the side plates 1125 facing away from the carrier plate 1124. The cover plate 1126 is welded to the side plates 1125. The material of the cover plate 1126 is kovar, stainless steel or ceramic. Aluminum-based silicon carbide has better heat conduction ability. When the carrier plate 1124 connected to the photoelectric conversion component 113 adopts aluminum-based silicon carbide material, the heat dissipation effect of the photoelectric conversion component 113 through the carrier plate 1124 can be further improved. During processing and production, after connecting the carrier plate 1124 and the side plates 1125, the photoelectric conversion component 113 is disposed in the cavity 1121, and finally the cover plate 1126 is parallel seam welded to the end of the side plates 1125 facing away from the carrier plate 1124. The process of parallel seam welding is more difficult. If the side plates 1125 and the cover plate 1126 adopt aluminum-based silicon carbide, due to the large welding difficulty of the aluminum-based silicon carbide material itself, the parallel seam welding between the side plates 1125 and the cover plate 1126 is more difficult. When the side plates 1125 and the cover plate 1126 adopt materials such as kovar, stainless steel or ceramic, the welding difficulty is lower, and it is easier to complete the parallel seam welding between the side plates 1125 and the cover plate 1126.

[0083] In addition, the first circuit board 111 described in any of the above embodiments may be a flexible circuit board. The flexible circuit board has a thin thickness and occupies a small space, which is more conducive to realizing the miniaturization of the optical device 10. In addition, the flexible circuit board has good bendability. Through the bending of the flexible circuit board, it is more convenient to realize the electrical connection between the photoelectric conversion component 113 and the second circuit board 20 through the flexible circuit board.

[0084] In some embodiments of the present application, as Figure 12 shown, the photoelectric conversion component 113 may include a laser diode 1131 and a semiconductor refrigerator 1132. The laser diode 1131 is electrically connected to the first circuit board 111 and is used to convert an electrical signal into an optical signal. One end of the semiconductor refrigerator 1132 is connected to the laser diode 1131, and the other end is connected to the inner wall of the housing 112. Through the first circuit board 111, the problem of many impedance discontinuity points in the electrical connection link between the laser diode 1131 and the external structure is improved, and the quality of the high-speed signal is guaranteed. The electrical signal is converted into an optical signal through the laser diode 1131, and then the laser diode 1131 is cooled by the semiconductor refrigerator 1132, and the heat is transmitted to the housing 112 and dissipated from the optical device 10 through the housing 112. The heat dissipation effect of the photoelectric connection module 11 is guaranteed, the laser diode 1131 is prevented from being damaged due to overheating, and the service life of the laser diode 1131 is improved.

[0085] Further, as Figure 13 shown, the optical device 10 further includes an optical receiving component 12, a pigtail 13, and a tee 14. The optical receiving component 12 is configured to receive an optical signal and convert the optical signal into an electrical signal. The pigtail 13 is configured to receive the optical signal emitted by the laser diode 1131 and to emit the optical signal to the optical receiving component 12. The tee 14 is connected to the optoelectronic conversion component 113, the optical receiving component 12, and the pigtail 13 respectively. The optical signal emitted by the laser diode 1131 can be transmitted within the tee 14 to the pigtail 13, and the pigtail 13 receives the optical signal and transmits it out of the optical device 10. Thus, the optical device 10 transmits the optical signal outward. Alternatively, an external device transmits the optical signal to the tee 14 through the pigtail 13, and within the tee 14, it is transmitted to the optical receiving component 12, thereby enabling the optical device 10 to receive an external optical signal.

[0086] Continuing as Figure 13 shown, the optical receiving component 12 can adopt a TO package. The optical receiving component 12 can include a photodiode 121, a glass insulator 122, a TO base 123, and a third circuit board 124. The glass insulator 122 is connected to the TO base 123. A wire is provided within the glass insulator 122, and the photodiode 121 is electrically connected to the third circuit board 124 through the wire provided within the glass insulator 122, and the third circuit board 124 is electrically connected to the second circuit board 20. Among them, the third circuit board 124 can be a flexible circuit board.

[0087] Exemplarily, the TO base 123 can be connected to the tee 14 by methods such as eutectic welding, laser welding, and glue bonding.

[0088] Further, continuing as Figure 13 shown, the optical device 10 further includes a filter 15. The filter 15 is disposed within the tee 14 and is configured to reflect the optical signal emitted by the pigtail 13 to the optical receiving component 12.

[0089] In the above embodiments as Figure 3 and Figure 13 shown, the optical device 10 includes both an optoelectronic conversion component 113 for converting an electrical signal into an optical signal and an optical receiving component 12 for converting an optical signal into an electrical signal as an example. In other embodiments of the present application, the optical device 10 may also only include the optoelectronic conversion component 113 for converting an electrical signal into an optical signal.

[0090] Or, in some other embodiments of the present application, as Figure 14As shown, the optoelectronic conversion component 113 may include a photodiode 121. The photodiode 121 is electrically connected to the first circuit board 111. The photodiode 121 is used to convert an optical signal into an electrical signal. Through the first circuit board 111, the problem of many impedance discontinuity points in the electrical connection link between the photodiode 121 and the external structure is improved, ensuring the quality of high-speed signals. Then, the optical signal is converted into an electrical signal by the photodiode 121 and transmitted to the first circuit board 111.

[0091] Further, the optical network device 01 may be as Figure 15 shown. The optical device 10 of the optical network device 01 may be as Figure 16 shown and includes a first optoelectronic connection module 11A and a second optoelectronic connection module 11B. The optoelectronic conversion component 113A of the first optoelectronic connection module includes a laser diode 1131 for converting an electrical signal into an optical signal. The optoelectronic conversion component 113B of the second optoelectronic connection module includes a photodiode 121 for converting an optical signal into an electrical signal. The optical device 10 further includes a pigtail 13 and a tee 14. The pigtail 13 is used to receive the optical signal emitted by the laser diode 1131 and to emit the optical signal to the photodiode 121. The tee 14 is respectively connected to the first optoelectronic connection module 11A, the second optoelectronic connection module 11B, and the pigtail 13. The laser diode 1131 in the first optoelectronic connection module 11A can convert an electrical signal into an optical signal and transmit it to the pigtail 13 through the tee 14. The pigtail 13 receives the optical signal and transmits it out of the optical device 10. Thus, the optical device 10 transmits an optical signal outward. Alternatively, an external device transmits an optical signal to the tee 14 through the pigtail 13, and transmits it to the photodiode 121 of the second optoelectronic connection module 11B in the tee 14, thus enabling the optical device 10 to receive an external optical signal. Moreover, the laser diode 1131 is electrically connected to the external structure through the first circuit board 111 in the first optoelectronic connection module 11A, thereby improving the problem of many impedance discontinuity points in the electrical connection link between the laser diode 1131 and the external structure. The photodiode 121 is electrically connected to the external structure through the first circuit board 111 in the second optoelectronic connection module 11B, improving the problem of many impedance discontinuity points in the electrical connection link between the photodiode 121 and the external structure. Thus, the quality of high-speed signals at the optical transmitter and optical receiver is ensured.

[0092] The above embodiments as Figure 15 and Figure 16 shown take the optical device 10 as an example that includes both a first optoelectronic connection module 11A for converting an electrical signal into an optical signal and a second optoelectronic connection module 11B for converting an optical signal into an electrical signal. In other embodiments of the present application, the optical device 10 may also only include the second optoelectronic connection module 11B for converting an optical signal into an electrical signal.

[0093] In addition, the optoelectronic conversion component 113 in any of the above embodiments is disposed on the inner wall of the housing 112. In other embodiments of the present application, as Figure 17 shown, the optoelectronic conversion component 113 may not be disposed on the inner wall of the housing 112. Exemplarily, the optoelectronic conversion component 113 may be disposed on the first circuit board 111. Alternatively, and again exemplarily, a bracket (not shown in the figure) is provided on the inner wall of the housing 112, and the optoelectronic conversion component 113 may be disposed on the bracket.

[0094] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An optical device, characterized in that: The invention comprises at least one optoelectronic connection module, wherein the optoelectronic connection module comprises: A shell body having a cavity, and a first through hole communicating with the cavity is formed on the shell body; A photoelectric conversion component is located in the cavity and is disposed on the inner wall of the housing; wherein the photoelectric conversion component is used for performing photoelectric conversion; A first circuit board, one end of which passes through the first through hole and extends into the cavity, and is electrically connected to the photoelectric conversion component.

2. The optical device according to claim 1, characterized in that: The optoelectronic connection module also includes: The insulating sealing portion blocks a first gap between the first circuit board and an inner wall of the first through hole, so that the first circuit board is insulated and sealed from the housing.

3. The optical device according to claim 2, characterized in that: The insulating sealing portion is filled between the first circuit board and the inner wall of the first through hole.

4. The optical device according to claim 2, characterized in that: The insulating sealing portion is disposed outside the first through hole and covers the opening of the first through hole and a portion of the outer surface of the shell.

5. The optical device according to claim 2, characterized in that: A portion of the insulating sealing portion is filled between the first circuit board and the inner wall of the first through hole; another portion of the insulating sealing portion is arranged outside the first through hole and covers the opening of the first through hole and a portion of the outer surface of the shell.

6. The optical device according to any one of claims 4 to 5, characterized in that: A groove is formed on the outer surface of the shell, and the groove is arranged around the periphery of the opening of the first through hole, and the groove is communicated with the first through hole; at least a part of the insulating sealing part is also filled in the groove.

7. The optical device according to any one of claims 2 to 5, characterized in that: The insulating sealing part is made of sealing glass.

8. The optical device according to claim 2, characterized in that: The optoelectronic connection module also includes: A sealing film covers the insulating sealing portion, wherein the sealing film is made of polyparaxylene.

9. The optical device according to any one of claims 2 to 5 and 8, characterized in that: The optoelectronic connection module also includes: A support member is disposed in the first through hole and connected to the inner wall of the first through hole; and the support member is located on a side of the insulating sealing portion facing the cavity and connected to the insulating sealing portion.

10. The optical device according to claim 9, characterized in that: The support member is a ring-shaped structure and is arranged around the first circuit board.

11. The optical device according to claim 9, characterized in that: A second gap is provided between the support member and the first circuit board; the width of the second gap is d; wherein 20 μm≤d≤1000 μm.

12. The optical device according to claim 9, characterized in that: The optoelectronic connection module includes: A boss is arranged on the inner wall of the first through hole, and the boss is connected to the shell; the boss is located on the side of the support member away from the insulating sealing portion, and is abutted against or connected to the support member.

13. The optical device according to any one of claims 1 to 5 and 8, characterized in that: The shell is made of Kovar, aluminum-based silicon carbide, ceramic or stainless steel.

14. The optical device according to claim 13, characterized in that: The optoelectronic connection module also includes: A support member is disposed in the first through hole and connected to the inner wall of the first through hole; the support member is made of the same material as the shell.

15. The optical device according to any one of claims 1 to 5 and 8, characterized in that: The housing comprises: A carrier plate, the photoelectric conversion assembly is arranged on the carrier plate, and the material of the carrier plate is aluminum-based silicon carbide; A side plate is arranged around the periphery of the bearing plate, and the material of the side plate is Kovar, stainless steel or ceramic; The cover plate is arranged on the side of the side plate away from the bearing plate, the cover plate is welded to the side plate, and the material of the cover plate is Kovar, stainless steel or ceramic.

16. The optical device according to any one of claims 1 to 5 and 8, characterized in that: The first circuit board is a flexible circuit board.

17. The optical device according to any one of claims 1 to 5 and 8, characterized in that: The photoelectric conversion component comprises: a laser diode, electrically connected to the first circuit board, and configured to convert an electrical signal into an optical signal; A semiconductor refrigerator, one end of which is connected to the laser diode, and the other end of which is connected to the inner wall of the shell.

18. The optical device according to claim 17, characterized in that: The optical device further comprises: A light receiving component, used for receiving a light signal and converting the light signal into an electrical signal; A pigtail, used to receive the optical signal emitted by the laser diode and to emit the optical signal to the optical receiving component; The three-way pipe is respectively connected to the photoelectric conversion component, the light receiving component and the pigtail.

19. The optical device according to any one of claims 1 to 5 and 8, characterized in that: The photoelectric conversion component comprises: A photodiode is electrically connected to the first circuit board, and the photodiode is used to convert an optical signal into an electrical signal.

20. The optical device according to any one of claims 1 to 5 and 8, characterized in that: The at least one optoelectronic connection module comprises: A first optoelectronic connection module, wherein the optoelectronic conversion component of the first optoelectronic connection module includes a laser diode for converting an electrical signal into an optical signal; A second optoelectronic connection module, wherein the optoelectronic conversion component of the second optoelectronic connection module includes a photodiode for converting an optical signal into an electrical signal; The optical device further comprises: A pigtail, used to receive the optical signal emitted by the laser diode and to emit an optical signal to the photodiode; The three-way pipe is connected to the first optoelectronic connection module, the second optoelectronic connection module and the pigtail respectively.

21. An optical network device, characterized in that: include: The optical device according to any one of claims 1 to 20; A second circuit board, the optical device is arranged on one side of the second circuit board, and the first circuit board is electrically connected to the second circuit board.

22. An optical network system, characterized in that: include: At least one optical network device as claimed in claim 21; An optical fiber is connected to the optical network device.

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