Packaging structure for packaging pressure sensor chip

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a packaging structure for packaging a pressure sensor chip. The packaging structure comprises a packaging shell with a containing groove and a bearing plate arranged at the bottom of the containing groove. The bearing plate comprises a bearing plate part and two connecting plate parts, the bearing plate part is used for bearing a chip, the two connecting plate parts are connected to the two opposite sides of the bearing plate part in the first direction respectively and connected into the first containing groove channels of the packaging shell respectively, and the first containing groove channels are communicated with the containing groove. The bearing plate part is provided with a vent hole penetrating through the bearing plate part in the thickness direction of the bearing plate part, the packaging shell is provided with a first air channel communicating the vent hole with the exterior of the packaging shell, and the first direction is perpendicular to the thickness direction. The packaging structure for packaging the pressure sensor chip can effectively prevent the conditions that the bearing plate shifts and the vent holes are not communicated with the air channels due to external vibration or impact, and improves the structural stability and reliability of the packaging structure for packaging the pressure sensor chip.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a packaging structure for packaging a pressure sensor chip. Background Art

[0002] In the field of electronics, packaging structures play a role in protecting electronic components, simplifying circuit design, facilitating installation and maintenance, and are widely used in integrated circuits, electronic devices, sensors, and electronic components. Specifically, in the field of semiconductor devices, semiconductor devices usually contain some sensitive components, such as sensor chips, circuits, and sensing components. The packaging structure can package these components together to improve the reliability, stability, and life of semiconductor devices.

[0003] In actual applications, existing sensor chips or sensing elements need to conduct air pressure with the outside world, so a vent is usually set on the packaging shell of the packaging structure, and the sensor chip or sensing element is installed in the packaging shell and located above the vent. However, in actual applications, after the sensor chip or sensing element is installed above the vent through a carrier plate, if the connection strength between the carrier plate and the packaging shell is weak, it will be affected by vibration or impact, so that the sensor chip or sensing element installed thereon is misaligned with the vent, and it is impossible to conduct air pressure with the outside world through the vent, thereby affecting the detection accuracy of the sensor chip or sensing element. Utility Model Content

[0004] An embodiment of the utility model provides a packaging structure for packaging a pressure sensor chip, aiming to improve the connection strength and reliability of the packaging structure.

[0005] In order to solve the above technical problems, the embodiments of the present utility model disclose the following technical solutions:

[0006] Disclosed is a packaging structure for packaging a pressure sensor chip, comprising: a packaging shell and a carrier plate, wherein the packaging shell has a receiving groove;

[0007] The carrying plate includes a carrying plate portion and two connecting plate portions, wherein the carrying plate portion is disposed at the bottom of the receiving groove, and the two connecting plate portions are respectively connected to two opposite sides of the carrying plate portion in a first direction, and are respectively connected to the first receiving groove of the packaging shell, and the first receiving groove is communicated with the receiving groove;

[0008] Among them, the carrier plate portion is provided with a vent hole that penetrates along its thickness direction. After the pressure sensor chip is aligned with the vent hole, the pressure sensor chip is fixedly connected to the carrier plate portion. The packaging shell is provided with a first air channel, which connects the vent hole with the outside of the packaging shell, and the first direction is perpendicular to the thickness direction.

[0009] In addition to one or more of the features disclosed above, or as an alternative, each of the connecting plate portions is provided with a recessed portion, and a wall surface of the first receiving channel is provided with an engaging portion engaged in the recessed portion.

[0010] In addition to or as an alternative to one or more of the features disclosed above, the carrier plate is made of a metal material.

[0011] In addition to or as an alternative to one or more of the features disclosed above, the diameter of the vent hole is less than 0.4 mm, and the size of the pressure sensor chip is twice the diameter of the vent hole.

[0012] In addition to one or more of the features disclosed above, or as an alternative, it also includes a connecting rib, one end of which is connected to the connecting plate portion, and the other end is passed through a second receiving groove of the packaging shell, and the second receiving groove is connected to the first receiving groove.

[0013] In addition to one or more of the features disclosed above, or as an alternative, the connecting rib has a bending section and an extension section, the extension section and the connecting plate portion both extend along the first direction and are staggered in the thickness direction, and the bending section is connected between the connecting plate portion and the extension section.

[0014] In addition to or as an alternative to one or more of the features disclosed above, the invention further includes a boss protruding from the outer wall of the packaging shell, wherein a second air passage is provided in the boss, and the second air passage is connected to an end of the first air passage away from the vent hole.

[0015] In addition to one or more of the features disclosed above, or as an alternative, there are also multiple pins, the first end of each of the pins is exposed in the receiving groove, the second end of each of the pins passes through and extends out of the outside of the packaging shell, and the first end of the pin is electrically connected to the pressure sensor chip.

[0016] In addition to or as an alternative to one or more of the features disclosed above, a support platform is protruding from the bottom of the receiving groove, and the first end of each of the pins is connected to the support platform and exposed in the receiving groove.

[0017] In addition to or as an alternative to one or more of the features disclosed above, a first end of at least one of the pins is connected to the connecting plate portion.

[0018] In addition to or as an alternative to one or more of the features disclosed above, a packaging cover is further included, wherein the packaging cover is disposed at the notch of the receiving groove of the packaging shell and closes a side of the receiving groove away from the groove bottom.

[0019] One of the above technical solutions has at least the following advantages or beneficial effects: the packaging structure for packaging a pressure sensor chip disclosed in the present application has a vent hole on the carrier plate portion, which is located at the bottom of the accommodating groove and is used to carry the chip. The carrier plate portion is connected to the first receiving groove of the packaging shell on opposite sides of the first direction through two connecting plate portions to increase the connection area between the carrier plate and the packaging shell, thereby ensuring that the connection between the carrier plate and the packaging shell is stable and reliable, and can also effectively avoid the displacement of the carrier plate caused by external vibration or impact, the situation where the vent hole is not connected to the first air channel, and the situation where the chip or the sensing element cannot sense the external air pressure due to the misalignment of the vent hole and the first air channel, thereby improving the structural stability and reliability of the packaging structure.

[0020] Another technical solution among the above technical solutions has at least the following advantages or beneficial effects: compared with a carrier plate made of plastic, a carrier plate made of metal material can be prepared with ventilation holes having smaller apertures and can carry chips of smaller size. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0022] Figure 1 is a structural schematic diagram of a packaging structure for packaging a pressure sensor chip provided according to an embodiment of the present application;

[0023] Figure 2 is a top view of a packaging structure for packaging a pressure sensor chip provided according to an embodiment of the present application;

[0024] Figure 3 yes Figure 2 Sectional view at AA in the middle;

[0025] Figure 4 yes Figure 3 A cross-sectional view of a packaging structure for packaging a pressure sensor chip after removing a carrier plate;

[0026] Figure 5 FIG. 1 is a schematic diagram of a structure of a carrier board for packaging a pressure sensor chip according to an embodiment of the present application. Figure 1 ;

[0027] Figure 6 yes Figure 2 Sectional view at the middle BB;

[0028] Figure 7 FIG. 1 is a schematic diagram of a structure of a carrier board for packaging a pressure sensor chip according to an embodiment of the present application. Figure 2 .

[0029] Description of reference numerals:

[0030] 10. Encapsulation shell; 101. Accommodation groove; 1011. Groove bottom; 1012. First air channel; 1013. First receiving groove; 10131. Fitting portion; 1014. Second receiving groove; 1015. Support platform;

[0031] 20, bearing plate; 201, bearing plate portion; 2011, vent hole; 202, connecting plate portion; 2021, recessed portion;

[0032] 30, connecting rib; 301, bending section; 302, extension section;

[0033] 40. Boss; 41. Second airway;

[0034] 50. Pins;

[0035] 60. Encapsulating cover body;

[0036] 70. Pressure sensor chip. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and beneficial effects of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining the utility model, and are not intended to limit the utility model.

[0038] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present utility model, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0039] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly stipulated and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0041] The utility model embodiment discloses a packaging structure for packaging a pressure sensor chip, referring to Figure 1 and Figure 3 The packaging structure for packaging a pressure sensor chip includes: a packaging shell 10, a carrier board 20, and a plurality of pins 50. The packaging shell 10 has a receiving groove 101, and the receiving groove 101 is used to accommodate the carrier board 20 and the pressure sensor chip 70. The carrier board 20 is used to carry the pressure sensor chip 70. The pins 50 are used to electrically connect the pressure sensor chip 70 and the external circuit.

[0042] Reference Figure 3 and Figure 4 In some embodiments, the carrier plate 20 includes a carrier plate portion 201 and two connecting plate portions 202. The carrier plate portion 201 is disposed at the bottom 1011 of the receiving groove 101, and is used to carry the pressure sensor chip 70. The two connecting plate portions 202 are respectively connected to the opposite sides of the carrier plate portion 201 in the first direction, and are respectively connected to the first receiving groove 1013 of the packaging shell 10, and the first receiving groove 1013 is connected to the receiving groove 101. Specifically, in actual production, the packaging shell 10 is usually a plastic product, which is made by injection molding. Before making the packaging shell 10, the present application places the pre-fabricated carrier plate 20 in the injection mold of the packaging shell 10, and then performs injection molding, so that the first receiving groove 1013 for connecting with the connecting plate portion 202 can be manufactured on the packaging shell 10. It should be noted that the first direction is perpendicular to the thickness direction of the carrier plate 20.

[0043] Furthermore, in order to further improve the reliability of the packaging structure for packaging the pressure sensor chip, refer to Figure 3 and Figure 5 In some embodiments, each connecting plate portion 202 is provided with a recessed portion 2021, and a wall surface of the first receiving groove 1013 is provided with an engaging portion 10131 engaged in the recessed portion 2021. With such an arrangement, when the encapsulating shell 10 is formed by injection molding, the two sides of the supporting plate portion 201 in the first direction can be covered by the encapsulating shell 10, so that the connection between the supporting plate 20 and the encapsulating shell 10 is more stable. Further, in some embodiments, the connecting plate portion 202 can be formed with the recessed portion 2021 by stamping.

[0044] In some embodiments, the packaging structure for packaging the pressure sensor chip further includes a connecting rib 30. Figure 3 , Figure 4 and Figure 5 One end of the connecting rib 30 is connected to the connecting plate portion 202, and the other end is inserted into the second receiving groove 1014 of the packaging shell 10, and the second receiving groove 1014 is connected to the first receiving groove 1013. The second receiving groove 1014 is formed in the same manner as the first receiving groove 1013. In some embodiments, the connecting rib 30 is connected to the side of the connecting plate portion 202 away from the load-bearing plate portion 201 (see Figure 3 ), in some embodiments, the connecting rib 30 is connected to the side wall of the connecting plate portion 202 in the second direction (not shown in the figure). It should be noted that the first direction, the second direction and the thickness direction of the load-bearing plate 20 intersect and are perpendicular to each other. Further, in some embodiments, the connecting rib 30 includes a bending section 301 and an extension section 302, and the extension section 302 and the connecting plate portion 202 both extend along the first direction and are staggered in the thickness direction of the load-bearing plate 20, and the bending section 301 is connected between the connecting plate portion 202 and the extension section 302. Such an arrangement can increase the contact area between the connecting rib 30 and the packaging shell 10, and improve the structural stability and reliability of the load-bearing plate 20. In some embodiments, the connecting rib 30 can be connected to the connecting plate portion 202 by welding. In some embodiments, the connecting plate portion 202, the load-bearing plate portion 201 and the connecting rib 30 are integrally formed, and the bending section 301 can be formed by stamping.

[0045] Reference Figure 6, a vent hole 2011 is provided on the carrier plate portion 201 and passes through along the thickness direction thereof. After the pressure sensor chip 70 is aligned with the vent hole 2011, it is fixedly connected to the carrier plate portion 201. A first air passage 1012 is provided on the packaging shell 10, and the first air passage 1012 connects the vent hole 2011 with the outside of the packaging shell 10. In some embodiments, the carrier plate 20 is a plastic product, and the carrier plate 20 is formed by injection molding. Before injection molding, an ejector pin is fixed at a preset position of the mold. After injection molding, the ejector pin is removed, and the vent hole 2011 is formed at the position of the ejector pin. However, the carrier plate 20 of a plastic product is limited by the plastic sealing process, and the minimum aperture of the vent hole 2011 can only be 0.4 mm. The size of the pressure sensor chip 70 mounted on the carrier plate 20 usually needs to be controlled to be more than twice the aperture, and the size of the vent hole 2011 limits the application of smaller pressure sensor chips 70. If a vent hole 2011 with a smaller aperture is to be formed by injection molding, the ejector pin used to form the vent hole 2011 may be difficult to remove after injection molding, so that it is impossible to open an outlet hole on the carrier plate 20, or it is difficult to remove the ejector pin used to form the vent hole, which reduces the manufacturing efficiency of the carrier plate 20. In order to enable the carrier plate 20 to carry a smaller pressure sensor chip 70, in some embodiments, the carrier plate 20 is made of metal material, and punching holes in the metal plate can make the aperture of the vent hole 2011 less than 0.4 mm, and the process of manufacturing the vent hole 2011 is simpler and more efficient than the process of manufacturing the vent hole 2011 by injection molding. The carrier plate 20 made of metal material is not easily affected by thermal expansion and contraction during the subsequent injection molding of the packaging shell 10. When the pressure sensor chip 70 is fixed to the carrier plate portion 201 by glue, the adhesive force of the glue layer between the pressure sensor chip 70 and the carrier plate portion 201 can be greatly improved. Moreover, the carrier plate 20 made of metal material can form the above-mentioned raised bending portion and recessed portion 2021 by stamping. Furthermore, the carrier plate 20 made of metal material has high mechanical strength, can bear large physical stress and impact, and is not easily deformed by air pressure when working for a long time. Moreover, in practical applications, when the size of the pressure sensor chip 70 carried by the carrier plate 20 is small, the contact area between the pressure sensor chip 70 and the carrier plate 20 is also small, and it is easy to shift when subjected to external impact or vibration. The carrier plate 20 made of metal material has high surface flatness. When the pressure sensor chip 70 is fixed to the carrier plate 20 by glue, the bonding strength of the glue can be improved to improve the stability of the connection between the pressure sensor chip 70 and the carrier plate 20.At the same time, the pressure sensor chip 70 with a smaller size is more likely to have overheating or performance degradation due to excessively high local temperatures and is more sensitive to electromagnetic interference. The carrier plate 20 made of metal material has good thermal conductivity and can effectively dissipate the heat generated by the pressure sensor chip 70 when it is working, thereby preventing the pressure sensor chip 70 from overheating and affecting performance or life. At the same time, the carrier plate 20 made of metal has a good electromagnetic shielding effect, which can reduce the impact of external electromagnetic interference on the pressure sensor chip 70 and improve the accuracy and reliability of measurement. It is worth mentioning that in some embodiments, the pressure sensor chip 70 needs to be grounded, and the carrier plate 20 made of metal can serve as an effective grounding material to provide electrical performance support. In some embodiments, the metal material used to prepare the carrier plate 20 is selected from copper, iron or alloy materials. At the same time, in order to avoid oxidation of the carrier plate 20, the surface of the carrier plate 20 has an electroplating layer, and the electroplating material is silver or copper.

[0046] Continue to refer to Figure 6 In some embodiments, the packaging structure for packaging the pressure sensor chip also includes a boss 40 protruding from the outer wall of the packaging shell 10, and a through second air channel 41 is provided in the boss 40, and the second air channel 41 is connected to the end of the first air channel 1012 away from the vent 2011. Specifically, when the pressure sensor chip 70 is fixed on the carrier plate 201, the vent 2011 is usually located below the sensing surface of the pressure sensor chip 70. When the second air channel 41 senses the external pressure, the air pressure is transmitted to the sensing surface of the pressure sensor chip 70 through the second air channel 41-first air channel 1012-vent 2011, and the sensing surface is deformed by the air pressure difference between the accommodating groove 101 and the first air channel 1012, and then the corresponding electrical signal is output. It should be noted that in some embodiments, the boss 40 is a cylindrical boss 40, and in some embodiments, the boss 40 is a prismatic boss 40. Furthermore, it should be noted that, in some embodiments, the boss 40 and the packaging shell 10 are both plastic-encapsulated bodies, which are integrally formed by injection molding.

[0047] Continue to refer to Figure 6In some embodiments, a plurality of pins 50 are symmetrically distributed on both sides of the carrier board 20 in the second direction, the first end of each pin 50 is exposed in the receiving groove 101, and the second end of each pin 50 passes through and extends outside the package shell 10. The first end of the pin 50 is exposed on the surface of the receiving groove 101 for electrical connection with the pressure sensor chip 70. In some embodiments, a support platform 1015 is also protrudingly provided at the bottom 1011 of the receiving groove 101, and the first end of each pin 50 is connected to the support platform 1015 and exposed in the receiving groove 101. Specifically, in some embodiments, two support platforms 1015 are provided, and the two support platforms 1015 are spaced apart at the bottom 1011 of the receiving groove 101 along the second direction and connected to the inner side wall of the receiving groove 101, and the carrier board 20 is arranged between the two support platforms 1015. In some embodiments, in the thickness direction, a side surface of the support platform 1015 away from the groove bottom 1011 is provided with a limiting groove, the first end of the pin 50 is embedded in the limiting groove, and the side surface of the first end away from the groove bottom 1011 is exposed in the receiving groove 101 (refer to Figure 6 ); In some embodiments, a receiving hole penetrating the supporting platform 1015 and the packaging shell 10 is provided on the side wall of the supporting platform 1015, and the pin 50 is arranged in the receiving hole, and the first end of the pin 50 passes through the end of the receiving hole close to the receiving groove 101, and the end surface of the first end is exposed in the receiving groove 101, and the second end of the pin 50 passes through the end of the receiving hole away from the receiving groove 101, for electrical connection with an external circuit. (not shown in the figure).

[0048] Further, in some embodiments, each pin is independent of each other and is used to transmit different electrical signals. Figure 7 , the first end of at least one pin 50 is connected to the connecting plate portion 202. In practical applications, the pin 50 is connected to the connecting plate portion 202, and both the pin 50 and the connecting plate portion 202 are made of metal, have good thermal conductivity, and can improve the heat dissipation performance of the packaging structure. In some embodiments, at least one pin 50 is connected to the connecting plate portion 202 on both sides of the carrier plate 20, so that the carrier plate 20 can be more firmly arranged in the injection mold of the packaging shell 10 when the packaging shell 10 is plastic-sealed, so as to ensure that after the packaging shell 10 is prepared, the vent 2011 on the carrier plate portion 201 is connected to the first air channel 1012.

[0049] Reference Figure 6 In some embodiments, the packaging structure for packaging the pressure sensor chip also includes a packaging cover 60, which is covered at the notch of the accommodating groove 101 of the packaging shell 10 to close the notch on one side of the accommodating groove 101 away from the groove bottom 1011 to form a closed cavity structure.

[0050] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A packaging structure for packaging a pressure sensor chip, characterized in that: include: A packaging shell (10) and a carrying plate (20), wherein the packaging shell has a receiving groove (101); The carrier plate (20) comprises a carrier plate portion (201) and two connecting plate portions (202); the carrier plate portion (201) is arranged at the groove bottom (1011) of the accommodating groove (101); the two connecting plate portions (202) are respectively connected to two opposite sides of the carrier plate portion (201) in a first direction, and are respectively connected to a first accommodating groove (1013) of the packaging shell (10); the first accommodating groove (1013) is in communication with the accommodating groove (101); The carrier plate portion (201) is provided with a vent hole (2011) penetrating along the thickness direction thereof; after the pressure sensor chip (70) is aligned with the vent hole (2011), the pressure sensor chip (70) is fixedly connected to the carrier plate portion (201); the packaging shell (10) is provided with a first air channel (1012), the first air channel (1012) connecting the vent hole (2011) with the outside of the packaging shell (10); and the first direction is perpendicular to the thickness direction.

2. The packaging structure for packaging a pressure sensor chip according to claim 1, characterized in that: A recessed portion (2021) is provided on each of the connecting plate portions (202), and an engaging portion (10131) engaged in the recessed portion (2021) is provided on the wall surface of the first receiving groove (1013).

3. The packaging structure for packaging a pressure sensor chip according to claim 1, characterized in that: The carrying plate (20) is made of metal material.

4. The packaging structure for packaging a pressure sensor chip according to claim 1, characterized in that: The diameter of the vent hole (2011) is less than 0.4 mm, and the size of the pressure sensor chip (70) is twice the diameter of the vent hole (2011).

5. The packaging structure for packaging a pressure sensor chip according to claim 1, characterized in that: It also includes a connecting rib (30), one end of which is connected to the connecting plate portion (202), and the other end of which is inserted into a second receiving groove (1014) of the packaging shell (10), and the second receiving groove (1014) is connected to the first receiving groove (1013).

6. The packaging structure for packaging a pressure sensor chip according to claim 5, characterized in that: The connecting rib (30) comprises a bending section (301) and an extension section (302); the extension section (302) and the connecting plate portion (202) both extend along the first direction and are arranged offset in the thickness direction; the bending section (301) is connected between the connecting plate portion (202) and the extension section (302).

7. The packaging structure for packaging a pressure sensor chip according to claim 1, characterized in that: It also includes a boss (40) protruding from the outer wall of the packaging shell (10), wherein a second air channel (41) is provided in the boss (40), and the second air channel (41) is connected to an end of the first air channel (1012) away from the vent hole (2011).

8. The packaging structure for packaging a pressure sensor chip according to claim 1, characterized in that: It also has a plurality of pins (50), the first end of each of the pins (50) being exposed in the accommodating groove (101), the second end of each of the pins (50) penetrating through and extending out of the packaging shell (10), and the first end of the pin (50) being electrically connected to the pressure sensor chip (70).

9. The packaging structure for packaging a pressure sensor chip according to claim 8, characterized in that: A support platform (1015) is protrudingly provided on the bottom (1011) of the receiving groove (101), and the first end of each of the pins (50) is connected to the support platform (1015) and exposed in the receiving groove (101).

10. The packaging structure for packaging a pressure sensor chip according to claim 8, characterized in that: A first end of at least one of the pins (50) is connected to the connecting plate portion (202).

11. The packaging structure for packaging a pressure sensor chip according to claim 1, characterized in that: It also comprises a packaging cover (60), wherein the packaging cover (60) is arranged to cover the notch of the accommodating groove (101) of the packaging shell (10) and closes a side of the accommodating groove (101) away from the groove bottom (1011).

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