Chip packaging structure

Abstract

The utility model relates to the technical field of semiconductors, in particular to a chip packaging structure, which comprises a first carrier plate, a second carrier plate and a diversion assembly. A first to-be-guided part is arranged on the first carrier plate, and a second to-be-guided part is arranged on the second carrier plate. The flow guide assembly comprises a first flow guide part and a second flow guide part, one end of the first flow guide part is connected to a first to-be-guided part, the other end of the first flow guide part is provided with an inserting part, one end of the second flow guide part is connected to a second to-be-guided part, and the other end of the second flow guide part is provided with an inserting groove. The inserting parts are inserted into the inserting grooves in an interference mode, and the first direction is perpendicular to the plate face of the first carrier plate and the plate face of the second carrier plate. The first flow guide part can be welded to the first carrier plate, the second flow guide part can be welded to the second carrier plate, then the first carrier plate and the second carrier plate are pressed in the first direction, and butt joint and fixation are completed. The chip packaging structure can reduce the welding difficulty and ensure the quality stability.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a chip packaging structure. Background Art

[0002] With the continuous development of semiconductor technology, the power consumption and heat generation of chips are increasing. Packaging is of great significance to chips. Chips are not only small in size but also very thin. If they are not packaged, it is difficult to directly connect them to other external device circuits. At the same time, exposed chips are easily damaged and affected by moisture, which affects their service life. Therefore, the use of chips cannot be separated from packaging.

[0003] The existing chip packaging structure will set up a carrier to carry the chip, and then weld a conductive copper block between the carriers to ensure smooth conduction between the chips of the two carriers. A conductive piece will also be welded between the carriers to ensure the conductive interconnection of the signal ends of the two carriers. Since the current of the signal end interconnection is small, the size of the conductive piece will be correspondingly small. The conductive piece needs to be welded to the signal ends on the two carriers respectively, which is difficult to weld and may affect the stability of the quality of the chip packaging structure. Utility Model Content

[0004] The purpose of the utility model is to provide a chip packaging structure, which can reduce the difficulty of the production process and ensure the stability of the quality of the chip packaging structure.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A chip packaging structure is provided, comprising:

[0007] a first carrier plate, on which a first flow guide member is disposed;

[0008] A second carrier plate, on which a second flow guide member is arranged:

[0009] The flow guide component includes a first flow guide member and a second flow guide member, wherein one end of the first flow guide member is connected to the first flow guide member to be guided, and the other end is provided with a plug-in portion, one end of the second flow guide member is connected to the second flow guide member to be guided, and the other end is provided with a plug-in slot, the length direction of the plug-in portion and the depth direction of the plug-in slot are both the first direction, the plug-in portion is inserted in the plug-in slot with an interference fit, and the first direction is perpendicular to the plate surfaces of the first carrier plate and the second carrier plate.

[0010] Optionally, the plug-in portion includes a clamping section, the width of which gradually decreases along the first direction and in the direction of the first flow-deflecting member, and the plug-in groove includes a necking section, the groove width of which gradually decreases along the first direction and in the direction of the first flow-deflecting member, and the clamping section is interference-inserted in the necking section.

[0011] Optionally, the plug-in portion includes a guide end, the guide end is located at an end of the plug-in portion, and the width of the guide end gradually increases along the first direction and in a direction pointing to the first flow-guiding member;

[0012] And / or, the plug-in slot includes a guide section, the guide section is located at a slot opening of the plug-in slot, and a slot width of the guide section gradually increases along the first direction and in a direction pointing to the first flow-guiding member.

[0013] Optionally, the plug-in portion is provided with a through hole along a second direction, and the second direction is perpendicular to the first direction.

[0014] Optionally, the first flow guide member and the second flow guide member are both columnar structures and are coaxially arranged, and the axial direction of the columnar structure is perpendicular to the plate surface of the first carrier plate and the plate surface of the second carrier plate.

[0015] Optionally, a third flow-guiding member is provided on the first carrier plate, a fourth flow-guiding member is provided on the second carrier plate, and the chip packaging structure further comprises a flow-guiding plate, the flow-guiding plate comprising a first planar portion, an elastic bending portion, and a second planar portion, one end of the elastic bending portion is connected to the first planar portion, and the other end is connected to the second planar portion, the first planar portion is fitted and connected to the third flow-guiding member, and the second planar portion is fitted and connected to the fourth flow-guiding member.

[0016] Optionally, the cross-section of the elastic bending portion is a curved structure or a broken line structure.

[0017] Optionally, the guide plate is in a C-shaped structure, an S-shaped structure, a W-shaped structure, a spliced ​​structure of multiple C-shaped structures, a spliced ​​structure of multiple S-shaped structures, or a spliced ​​structure of multiple W-shaped structures.

[0018] Optionally, the guide plate is a spliced ​​structure of multiple C-shaped structures, and the opening directions of the multiple C-shaped structures are inconsistent.

[0019] Optionally, the flow guide component includes a first flow guide component and a second flow guide component, part of the first flow guide component and part of the second flow guide component connected to the first flow guide component are power chips, the multiple power chips on the first carrier plate and the second carrier plate are staggered, and the first flow guide component and the second flow guide component connected to the second flow guide component are both signal interconnection terminals.

[0020] Beneficial effects of the utility model:

[0021] The utility model provides a chip packaging structure, including a first carrier plate, a second carrier plate and a flow guide assembly. The first carrier plate is provided with a first flow guide member, and the second carrier plate is provided with a second flow guide member. The flow guide assembly includes a first flow guide member and a second flow guide member, one end of the first flow guide member is connected to the first flow guide member, and the other end is provided with a plug-in portion, one end of the second flow guide member is connected to the second flow guide member, and the other end is provided with a plug-in slot, the length direction of the plug-in portion and the depth direction of the plug-in slot are both the first direction, the plug-in portion is inserted in the plug-in slot with interference fit, and the first direction is perpendicular to the plate surface of the first carrier plate and the plate surface of the second carrier plate. Therefore, the first flow guide member can be welded to the first carrier plate first, and the second flow guide member can be welded to the second carrier plate, and then the first carrier plate and the second carrier plate can be pressed along the first direction to complete the docking and fixation of the plug-in portion and the plug-in slot. Compared to the prior art, in which the guide member is placed between the first carrier plate and the second carrier plate for welding, the chip packaging structure of the utility model can separately weld the first guide member and the first carrier plate, and the second guide member and the second carrier plate, which greatly reduces the welding difficulty and thus can ensure the stability of the chip packaging structure quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a chip packaging structure provided by an embodiment of the utility model;

[0023] Figure 2 is an exploded diagram of a chip packaging structure provided by an embodiment of the utility model;

[0024] Figure 3 is an exploded view of the second flow guide assembly provided in an embodiment of the utility model;

[0025] Figure 4 is a perspective view of a second flow guide member of a second flow guide assembly provided by an embodiment of the utility model;

[0026] Figure 5 It is an exploded view of the first flow guide assembly provided in the embodiment of the utility model;

[0027] Figure 6 is a cross-sectional view of a first flow guide assembly provided in an embodiment of the utility model;

[0028] Figure 7 It is a structural schematic diagram of a chip packaging structure (including a guide plate) provided in an embodiment of the utility model;

[0029] Figure 8It is an exploded view of a chip packaging structure (including a guide plate) provided by an embodiment of the utility model;

[0030] Fig. 9 It is a structural schematic diagram of the guide plate provided in the embodiment of the utility model.

[0031] In the figure:

[0032] 1. first carrier board; 11. power chip;

[0033] 2. A second carrier plate;

[0034] 3. flow guide assembly; 31. first flow guide member; 311. plug-in portion; 3111. clamping section; 3112. guide end; 3113. through hole; 32. second flow guide member; 321. plug-in slot; 3211. necking section; 3212. guide section; 301. first flow guide assembly; 302. second flow guide assembly;

[0035] 4. guide plate; 41. first plane portion; 42. elastic bending portion; 43. second plane portion. DETAILED DESCRIPTION

[0036] The technical solution of the utility model is further described below in conjunction with the accompanying drawings and implementation methods. It is understood that the specific embodiments described herein are only used to explain the utility model, rather than to limit the utility model. It should also be noted that, for the convenience of description, only the parts related to the utility model are shown in the accompanying drawings, rather than all.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] like Figure 1-Figure 2 As shown, the chip packaging structure of this embodiment includes a first carrier plate 1, a second carrier plate 2 and a flow guide assembly 3. Among them, a first flow guide member to be guided is arranged on the first carrier plate 1, and a second flow guide member to be guided is arranged on the second carrier plate 2. The flow guide assembly 3 includes a first flow guide member 31 and a second flow guide member 32. One end of the first flow guide member 31 is connected to the first flow guide member to be guided, and the other end is provided with a plug-in portion 311. One end of the second flow guide member 32 is connected to the second flow guide member to be guided, and the other end is provided with a plug-in slot 321. The length direction of the plug-in portion 311 and the depth direction of the plug-in slot 321 are both the first direction. The plug-in portion 311 is inserted in the plug-in slot 321 with interference fit, and the first direction is perpendicular to the board surface of the first carrier plate 1 and the board surface of the second carrier plate 2.

[0040] The first guide member 31 can be welded to the first carrier plate 1, and the second guide member 32 can be welded to the second carrier plate 2, and then the first carrier plate 1 and the second carrier plate 2 can be pressed in the first direction to complete the docking and fixing of the plug-in portion 311 and the plug-in slot 321. Compared with the prior art, in which the guide member is placed between the first carrier plate 1 and the second carrier plate 2 for welding, the chip packaging structure of this embodiment can weld the first guide member 31 and the first carrier plate 1 separately, and weld the second guide member 32 and the second carrier plate 2 separately, which greatly reduces the welding difficulty, thereby ensuring the stability of the quality of the chip packaging structure.

[0041] like Figure 3-Figure 6 As shown, optionally, the plug-in portion 311 includes a clamping section 3111, the width of which gradually decreases along the first direction and in the direction pointing to the first flow guide member, and the plug-in slot 321 includes a necking section 3211, the slot width of which gradually decreases along the first direction and in the direction pointing to the first flow guide member, and the clamping section 3111 is inserted in the necking section 3211 with interference fit. That is, the necking of the necking section 3211 will tighten the small diameter end of the clamping section 3111 and prevent the clamping section 3111 from being separated from the necking section 3211, further ensuring that the first flow guide member 31 and the second flow guide member 32 are firmly fixed.

[0042] In order to facilitate the insertion of the plug-in portion 311 of the first flow guide 31 into the plug-in slot 321 of the second flow guide 32, the plug-in portion 311 optionally includes a guide end 3112, the guide end 3112 is located at the end of the plug-in portion 311, and the width of the guide end 3112 gradually increases along the first direction and in the direction pointing to the first flow guide. Optionally, the plug-in slot 321 includes a guide section 3212, the guide section 3212 is located at the notch of the plug-in slot 321, and the slot width of the guide section 3212 gradually increases along the first direction and in the direction pointing to the first flow guide.

[0043] Optionally, the plug part 311 is provided with a through hole 3113 along a second direction, the second direction being perpendicular to the first direction. The through hole 3113 can provide a space for elastic deformation of the plug part 311, so as to facilitate pressing the plug part 311 into the plug slot 321.

[0044] Optionally, the first guide member 31 and the second guide member 32 are both columnar structures and are coaxially arranged. The axial direction of the columnar structure is perpendicular to the plate surface of the first carrier plate 1 and the plate surface of the second carrier plate 2, that is, the axial direction of the columnar structure coincides with the first direction.

[0045] Optionally, the flow guide component 3 includes a first flow guide component 301 and a second flow guide component 302. The first flow guide component 301 has a larger diameter and is suitable for conducting large currents. The second flow guide component 302 has a larger diameter and is suitable for conducting small currents. Part of the first flow guide member and part of the second flow guide member connected to the first flow guide component 301 are power chips 11. The multiple power chips 11 on the first carrier plate 1 and the second carrier plate 2 are staggered to facilitate heat dissipation of the power chips 11. The first flow guide member and the second flow guide member connected to the second flow guide component 302 are both signal interconnection terminals. Optionally, the first flow guide member and the second flow guide member are both provided with multiple, and the flow guide component 3 is correspondingly provided with multiple. That is, the power chip 11 and the corresponding first flow guide component 301 are both provided with multiple, and the signal interconnection terminal and the second flow guide component 302 are also provided with multiple.

[0046] like Figure 7-Figure 9 As shown, optionally, a third flow guide member is provided on the first carrier plate 1, a fourth flow guide member is provided on the second carrier plate 2, and the chip packaging structure further comprises a flow guide plate 4, the flow guide plate 4 comprises a first plane portion 41, an elastic bending portion 42 and a second plane portion 43, one end of the elastic bending portion 42 is connected to the first plane portion 41, and the other end is connected to the second plane portion 43, the first plane portion 41 is attached to the third flow guide member, and the second plane portion 43 is attached to the fourth flow guide member. Optionally, the flow guide plate 4 is formed by bending a metal plate. Optionally, the flow guide plate 4 is made of molybdenum copper.

[0047] The setting of the elastic bending portion 42 can improve the elasticity of the guide member, especially when the angle between the first carrier plate 1 and the second carrier plate 2 changes due to force, the elastic bending portion 42 can absorb part of the force and reduce the force on the guide member and the carrier plate. The guide plate 4 has the function of preventing the guide member and the carrier plate from being damaged by force.

[0048] Optionally, the cross section of the elastic bending portion 42 is a curved structure or a broken line structure. Optionally, the guide plate 4 is a C-shaped structure, an S-shaped structure, a W-shaped structure, a spliced ​​structure of multiple C-shaped structures, a spliced ​​structure of multiple S-shaped structures, or a spliced ​​structure of multiple W-shaped structures. In this embodiment, the guide plate 4 is a C-shaped structure, that is, the guide plate 4 is cut along a plane perpendicular to the elastic bending portion 42 to obtain a C-shaped curved structure.

[0049] Optionally, in other embodiments, the guide plate 4 is a spliced ​​structure of multiple C-shaped structures, and the opening directions of the multiple C-shaped structures are inconsistent. When the guide plate 4 is a plurality of C-shaped structural plates spliced ​​in sequence along the first direction, the opening directions of the multiple C-shaped structures are inconsistent, so that the guide plate 4 has the ability to absorb forces from different directions.

[0050] Optionally, the third flow-guiding member and the fourth flow-guiding member are both provided in plurality, and the flow-guiding plate 4 is provided in plurality accordingly. Some of the third flow-guiding members are power chips 11, and some of the fourth flow-guiding members are power chips 11. The multiple power chips 11 on the first carrier plate 1 and the second carrier plate 2 are arranged in an interlaced manner to prevent the local temperature from being too high and improve the heat dissipation efficiency. The flow-guiding cross-section of the flow-guiding plate 4 is relatively large, and can accommodate a relatively large current of the power chip 11.

[0051] Optionally, both the first guide component 301 and the guide plate 4 are suitable for conducting a larger current in the power chip 11. In the present embodiment, the first guide component 301 and the guide plate 4 are used selectively. Of course, in other embodiments, the first guide component 301 may be provided at some power chips 11, and the guide plate 4 may be provided at some power chips 11, again without making too many restrictions.

[0052] The chip packaging structure uses a plug-in first flow guide component 301 and / or a flow guide plate 4 made of molybdenum copper to provide a large current flow guide channel between the first carrier plate 1 and the second carrier plate 2 of the power module. The first flow guide component 301 and / or the flow guide plate 4 can be designed to be different sizes and different structural styles according to different module layouts. The use of a plug-in first flow guide component 301 can reduce the difficulty of welding and facilitate assembly. The flow guide plate 4 made of molybdenum copper can absorb the stress on the first carrier plate 1 and the second carrier plate 2, protect the power chip 11, and ensure the stability of the flow state. The chip packaging structure uses a plug-in second flow guide component 302 as a small current flow guide channel between the first carrier plate 1 and the second carrier plate 2, which can reduce the difficulty of welding and facilitate assembly. In addition, the multiple power chips 11 of the chip packaging structure are evenly distributed on the first carrier plate 1 and the second carrier plate 2, and the power chips 11 on the first carrier plate 1 and the second carrier plate 2 are staggered, which can reduce heat concentration, reduce the thermal resistance of the entire module, and improve the module power density.

[0053] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A chip packaging structure, characterized in that: include: A first carrier plate (1), wherein a first flow guide member is arranged on the first carrier plate (1); A second carrier plate (2), on which a second flow guide member is arranged: The flow guide assembly (3) comprises a first flow guide member (31) and a second flow guide member (32), wherein one end of the first flow guide member (31) is connected to the first flow guide member to be guided, and the other end is provided with a plug-in portion (311); one end of the second flow guide member (32) is connected to the second flow guide member to be guided, and the other end is provided with a plug-in slot (321); the length direction of the plug-in portion (311) and the depth direction of the plug-in slot (321) are both a first direction; the plug-in portion (311) is inserted into the plug-in slot (321) with interference fit; and the first direction is perpendicular to the plate surface of the first carrier plate (1) and the plate surface of the second carrier plate (2).

2. The chip packaging structure according to claim 1, characterized in that: The plug-in portion (311) comprises a clamping section (3111), the width of which gradually decreases along the first direction and in the direction pointing to the first flow-guiding member to be disposed; the plug-in slot (321) comprises a necking section (3211), the slot width of which gradually decreases along the first direction and in the direction pointing to the first flow-guiding member to be disposed; and the clamping section (3111) is interference-inserted in the necking section (3211).

3. The chip packaging structure according to claim 1, characterized in that: The plug-in portion (311) comprises a guide end (3112), the guide end (3112) is located at the end of the plug-in portion (311), and the width of the guide end (3112) gradually increases along the first direction and in the direction pointing to the first flow-guiding member; And / or, the plug-in slot (321) comprises a guide section (3212), the guide section (3212) is located at the slot opening of the plug-in slot (321), and the slot width of the guide section (3212) gradually increases along the first direction and in the direction pointing to the first flow-guiding member.

4. The chip packaging structure according to claim 1, characterized in that: The plug-in portion (311) is provided with a through hole (3113) extending along a second direction, and the second direction is perpendicular to the first direction.

5. The chip packaging structure according to claim 1, characterized in that: The first flow guide (31) and the second flow guide (32) are both columnar structures and are coaxially arranged, and the axial direction of the columnar structure is perpendicular to the plate surface of the first carrier plate (1) and the plate surface of the second carrier plate (2).

6. The chip packaging structure according to any one of claims 1 to 5, characterized in that: A third flow-guiding member is arranged on the first carrier plate (1), a fourth flow-guiding member is arranged on the second carrier plate (2), and the chip packaging structure further comprises a flow-guiding plate (4), the flow-guiding plate (4) comprising a first plane portion (41), an elastic bending portion (42) and a second plane portion (43), one end of the elastic bending portion (42) being connected to the first plane portion (41), and the other end being connected to the second plane portion (43), the first plane portion (41) being fitted and connected to the third flow-guiding member, and the second plane portion (43) being fitted and connected to the fourth flow-guiding member.

7. The chip packaging structure according to claim 6, characterized in that: The cross section of the elastic bending portion (42) is a curved structure or a broken line structure.

8. The chip packaging structure according to claim 7, characterized in that: The guide plate (4) is in a C-shaped structure, an S-shaped structure, a W-shaped structure, a spliced ​​structure of multiple C-shaped structures, a spliced ​​structure of multiple S-shaped structures, or a spliced ​​structure of multiple W-shaped structures.

9. The chip packaging structure according to claim 8, characterized in that: The guide plate (4) is a spliced ​​structure of multiple C-shaped structures, and the opening directions of the multiple C-shaped structures are inconsistent.

10. The chip packaging structure according to any one of claims 1 to 5, characterized in that: The flow guide component (3) comprises a first flow guide component (301) and a second flow guide component (302); part of the first flow guide component and part of the second flow guide component connected to the first flow guide component (301) are power chips (11); a plurality of the power chips (11) on the first carrier plate (1) and the second carrier plate (2) are arranged in an alternating manner; and the first flow guide component and the second flow guide component connected to the second flow guide component (302) are both signal interconnection terminals.

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