Pin connecting mechanism and multilayer microelectronic module

Abstract

The utility model discloses a pin connecting mechanism and a multilayer microelectronic module, comprising: a pin connector comprising a limiting tube, a pin connected with the limiting tube and a housing arranged outside the limiting tube, the pin penetrating through an upper layer circuit board; the pins penetrate through the lower-layer circuit board to be installed; when the upper-layer circuit board and the lower-layer circuit board are assembled, one end, close to the upper-layer circuit board, of each pin is inserted into the corresponding limiting tube. According to the pin connecting mechanism provided by the utility model, the circuit boards are convenient to assemble and disassemble, the pin connector can ensure that the intervals of the upper circuit board and the lower circuit board are consistent, the connecting strength of the circuit boards is enhanced, and the problems of pin breakage, circuit board bonding pad falling and the like caused by inclined pin welding are avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging, and in particular relates to a pin connection mechanism and a multi-layer microelectronic module. Background Art

[0002] In order to meet the application needs in aerospace equipment and other fields, and in view of the requirements of miniaturization and high-density integration of microelectronic modules, most microelectronic modules must have a double-layer or multi-layer board structure, and the connection of pins between circuit boards has also become a major focus in the packaging process of microelectronic modules. Traditional pin connection uses gold-plated pins to directly penetrate the through holes of the double-layer board for welding and fixing. In the absence of a dedicated fixed positioning fixture, it is very easy to cause the lead leg welding to tilt, and then the double-layer board welding of the microelectronic module will tilt, which will affect the subsequent packaging and glue filling processes of the circuit in the tube shell, and it is easy to cause the lead leg to break due to mechanical stress, thermal stress or other external forces, or cause the circuit board pad to fall off, and the electrical connection of the circuit will be interrupted, resulting in the microelectronic module not being able to work properly. Summary of the invention

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and to provide a pin connection mechanism and a multi-layer microelectronic module. The circuit board can be easily assembled and disassembled, and the pin connector can ensure that the spacing between the upper and lower circuit boards is consistent, thereby enhancing the connection strength of the circuit board and avoiding problems such as lead leg breakage and circuit board pad falling off due to tilted lead leg welding.

[0004] The utility model provides the following technical solutions:

[0005] In a first aspect, a pin connection mechanism is provided, comprising:

[0006] The pin connector comprises a position limiting tube, a lead pin connected to the position limiting tube, and a shell arranged outside the position limiting tube, wherein the lead pin penetrates the upper circuit board for installation;

[0007] The pin is installed through the lower circuit board; when the upper circuit board and the lower circuit board are assembled, one end of the pin close to the upper circuit board is inserted into the limiting tube.

[0008] Furthermore, the pin connector also includes a plurality of arc-shaped paddles disposed in the limiting tube, and the paddles are connected to the inner wall of the limiting tube via elastic springs.

[0009] Furthermore, the number of the paddles is 4, the paddles are arranged at intervals and the cross-section of the space enclosed by the paddles is circular, and the pins are inserted into the space enclosed by the paddles.

[0010] Furthermore, the cross-sectional diameter of the space enclosed by the paddle gradually decreases along the direction from the open end to the closed end of the limiting tube.

[0011] Furthermore, the position limiting tube, the guide pin, the paddle and the elastic spring are all made of metal materials, the shell is made of insulating material, and the pins are gold-plated pins.

[0012] Furthermore, the lead pin is fixedly connected to the upper circuit board through upper soldering.

[0013] Furthermore, the pin is fixedly connected to the lower circuit board through lower solder.

[0014] Furthermore, the pins are fixed to the insertion edges of the pin connector by epoxy resin glue.

[0015] In a second aspect, a multi-layer microelectronic module is provided, comprising a multi-layer circuit board, wherein adjacent layers of the circuit boards are connected via the pin connection mechanism described in the first aspect.

[0016] Furthermore, the surface of each layer of the circuit board is provided with circuit components and via holes for installing the pins and / or the pin connectors.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] The utility model provides a pin connection mechanism, in which a pin connector is installed on an upper circuit board, and a pin is installed on a lower circuit board. The upper and lower circuit boards can be assembled by inserting one end of the pin close to the upper circuit board into a limiting tube. The operation is convenient, and it is convenient for connecting and disassembling the circuit boards of each layer during the microelectronic module test, so as to better perform circuit failure analysis and rework operations. In addition, the limiting tube has a limiting and fixing effect on the pin position, which can ensure that the intervals between the upper and lower circuit boards are consistent, and the pin connector can enhance the connection strength of the upper and lower circuit boards, and avoid problems such as lead leg breakage and circuit board pad falling off due to the tilt of lead leg welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a front cross-sectional view of a pin connector in an embodiment of the utility model;

[0020] Figure 2 It is a bottom view of the pin connector in the embodiment of the utility model;

[0021] Figure 3 It is a front view of the upper circuit board in the embodiment of the utility model;

[0022] Figure 4 is a side view of the upper circuit board in the embodiment of the utility model;

[0023] Figure 5 is a top view of the upper circuit board in the embodiment of the utility model;

[0024] Figure 6 It is a front view of the lower circuit board in the embodiment of the utility model;

[0025] Figure 7 is a side view of the lower circuit board in the embodiment of the utility model;

[0026] Figure 8 is a top view of the lower circuit board in the embodiment of the utility model;

[0027] Fig. 9 is a front view of a double-layer microelectronic module in an embodiment of the utility model;

[0028] Fig.10 is a side view of a double-layer microelectronic module in an embodiment of the utility model;

[0029] The markings in the figure are: 1. Pin connector; 11. Shell; 12. Limit tube; 13. Lead pin; 14. Pick; 15. Elastic spring; 2. Pin; 3. Upper circuit board; 4. Upper circuit components; 5. Upper solder; 6. Lower circuit board; 7. Lower circuit components; 8. Lower solder; 9. Epoxy resin glue. DETAILED DESCRIPTION

[0030] The utility model is further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and cannot be used to limit the protection scope of the utility model.

[0031] It should be noted that, in the description of the present invention, the directions or positional relationships indicated by terms such as "front", "rear", "left", "right", "up", "down", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0032] In the description of the present invention, it is to be understood that the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the feature. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0033] Example 1

[0034] like Figure 1 to Figure 10As shown, this embodiment provides a pin connection mechanism, including a pin connector 1 and a pin 2.

[0035] like Figure 6~Figure 8 As shown, the pin 2 is installed through the lower circuit board 6. Specifically, the pin 2 is a gold-plated pin, and the pin 2 is fixedly connected to the lower circuit board 6 through the lower solder 8.

[0036] like Figure 1~Figure 5 As shown, the pin connector 1 includes a limiting tube 12, a lead pin 13 connected to the limiting tube 12, and a shell 11 arranged outside the limiting tube 12. The limiting tube 12 and the lead pin 13 are an integrated structure. The lead pin 13 is installed through the upper circuit board 4, and the lead pin 13 is fixedly connected to the upper circuit board 3 through the upper solder 5. The pin connector 1 also includes a plurality of arc-shaped paddles 14 arranged in the limiting tube 12, and the paddles 14 are connected to the inner wall of the limiting tube 12 through elastic springs 15. When the upper circuit board 3 and the lower circuit board 6 are assembled, the end of the pin 2 close to the upper circuit board 3 is inserted between the paddles 14 in the limiting tube 12, and the insertion edge of the pin 2 and the limiting tube 12 is fixed by epoxy resin glue 9.

[0037] like Figure 1 and Figure 2 As shown, the outer shell of the pin connector 1 is an insulating material, such as high temperature resistant and wear resistant plastic, which can protect the circuit. The limit tube 12, the guide pin 13, the paddle 14 and the elastic spring 15 are all made of metal materials, which facilitates the electrical connection between the upper and lower circuit boards. The use of the paddle 14 and the elastic spring 15 enables the pin connector 1 to have a strong bearing capacity, and it can remain intact even if it is subjected to a large external force. It can also adapt to the attenuation of electromagnetic interference, and the contact area is relatively large. It can withstand large currents and voltages, has a certain ability to shield electromagnetic interference, can resist obvious pulling, kneading and thermal shock, is not easy to detach from the circuit board, and can also meet different high voltage and high current transmission requirements, and is suitable for various industrial production environments. Among them, the elastic spring 15 can be made of phosphor bronze or other metal materials with good elasticity to provide sufficient mechanical support and stability. Epoxy resin glue 9 has strong adhesion to various polar materials such as metals and plastics, and has the required performance, such as high and low temperature resistance, high strength, high flexibility, aging resistance, corrosion resistance to various media such as acids, alkalis, salts, solvents, etc., and has good volume resistivity and dielectric strength.

[0038] like Figure 1 and Figure 2As shown, in this embodiment, the number of the paddles 14 is 4, and the paddles 14 are arranged at intervals and the cross section of the space enclosed is circular, and the diameter of the circular cross section is slightly smaller than the diameter of the pin 2, so that the pin 2 can be firmly inserted into the space enclosed by the paddles 14. Furthermore, the cross-sectional diameter of the space enclosed by the paddles 14 gradually decreases along the direction from the open end to the closed end of the limiting tube 12, and the pre-tightening force is provided by the elastic spring 15, so that the pin 2 and the paddle 14 are more firmly in contact.

[0039] The method of using the pin connection mechanism provided in this embodiment is as follows:

[0040] like Fig. 9 and Fig.10 As shown, when assembling two layers of circuit boards, first pass the lead pin 13 of the pin connector 1 through the through hole of the upper circuit board 3 and fix it with the upper solder 5; then pass the pin 2 through the through hole of the lower circuit board 6 and fix it with the lower solder 8; then insert the end of the pin 2 close to the upper circuit board 3 between the paddles 14 of the pin connector 1 to complete the electrical connection; at this time, perform a circuit performance test, and if the test is qualified, then use epoxy resin glue 9 to bond and fix the pin 2 and the pin connector 1 at the insertion edge.

[0041] Example 2

[0042] This embodiment provides a multi-layer microelectronic module, including a multi-layer circuit board, wherein adjacent layers of the circuit boards are connected via the pin connection mechanism described in Embodiment 1.

[0043] Specifically, the surface of each layer of the circuit board is provided with circuit components and vias for installing the pins and / or the pin connectors, and the inner surface of the via is provided with a metal layer. The vias can be used to connect the circuits of two adjacent layers of circuit boards to achieve electrical connection between multi-layer circuit boards.

[0044] like Figure 5 and Figure 8~Figure 10 As shown, in two adjacent layers of circuit boards, the upper circuit board 3 is provided with an upper circuit component 4, and the lower circuit board 6 is provided with a lower circuit component 7. The positions and quantities of vias of the upper circuit board 3 and the lower circuit board 6 match to facilitate assembly and connection of the two.

[0045] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A pin connection mechanism, characterized in that: include: The pin connector comprises a position limiting tube, a lead pin connected to the position limiting tube, and a shell arranged outside the position limiting tube, wherein the lead pin penetrates through the upper circuit board for installation; The pin is installed through the lower circuit board; when the upper circuit board and the lower circuit board are assembled, one end of the pin close to the upper circuit board is inserted into the limiting tube.

2. The pin connection mechanism according to claim 1, characterized in that: The pin connector further comprises a plurality of arc-shaped paddles arranged in the limiting tube, and the paddles are connected to the inner wall of the limiting tube via elastic springs.

3. The pin connection mechanism according to claim 2, characterized in that: The number of the paddles is 4, the paddles are arranged at intervals and the cross section of the space enclosed by the paddles is circular, and the pins are inserted in the space enclosed by the paddles.

4. The pin connection mechanism according to claim 3, characterized in that: The cross-sectional diameter of the space enclosed by the paddle gradually decreases along the direction from the open end to the closed end of the limiting tube.

5. The pin connection mechanism according to claim 2, characterized in that: The limit tube, the guide pin, the paddle and the elastic spring are all made of metal materials, the shell is made of insulating material, and the pins are gold-plated pins.

6. The pin connection mechanism according to claim 1, characterized in that: The lead pin is fixedly connected to the upper circuit board through upper solder.

7. The pin connection mechanism according to claim 1, characterized in that: The pins are fixedly connected to the lower circuit board through lower solder.

8. The pin connection mechanism according to claim 1, characterized in that: The pins are fixed to the insertion edges of the pin connector by epoxy resin glue.

9. A multi-layer microelectronic module, characterized in that: It comprises a multi-layer circuit board, wherein adjacent layers of the circuit boards are connected via the pin connection mechanism described in any one of claims 1 to 8.

10. The multi-layer microelectronic module according to claim 9, characterized in that: The surface of each layer of the circuit board is provided with circuit components and via holes for installing the pins and / or the pin connectors.

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