Bending correction device of IC (integrated circuit) carrier plate

Abstract

The utility model discloses a bending correction device for an IC carrier plate. The bending correction device comprises a base and a mounting frame arranged at the upper end of the base, when the bending correction device of the IC carrier plate is used, the position of the correction wheel is adjusted through the connecting frame according to the size of the IC carrier plate, then a worker holds a grip to press downwards, and at the moment, a second fixing block moves downwards on the outer side of a first sliding rail through a first sliding block so as to drive a pressing plate to move downwards; and after correction is completed, the grip is loosened, the second fixing block can return to the original position under the action of the elastic force of the reset spring, and then the IC carrier plate is taken out. Through the arrangement of the first sliding rail, the first sliding block, the pressing plate, the first fixing block, the second fixing block, the pressing block, the reset spring, the correction wheel, the elastic base and the elastic plate, manual straightening is omitted, and the IC carrier plate can be prevented from being damaged or scratched during correction.

Description

Technical Field

[0001] The utility model belongs to the technical field related to high-density printed circuit boards and flexible circuit boards, and in particular relates to a bending correction device for an IC carrier board. Background Art

[0002] Printed circuit boards are developing towards being lighter, thinner, shorter and smaller. Thin boards are more likely to bend due to board expansion and contraction, design problems and mechanical stress. Existing bending correction devices for IC substrates mostly use manual correction. When using the bending correction device for IC substrates, in order to reduce scrapping, they are usually straightened manually, but this can easily cause board damage and scratches. Therefore, a bending correction device for IC substrates is essential. Utility Model Content

[0003] The utility model aims to provide a bending correction device for an IC carrier, so as to solve the problem that the existing bending correction device for IC carriers proposed in the above background technology is usually straightened manually to reduce scrapping during use, but it is easy to cause board damage and scratches.

[0004] To achieve the above object, the utility model provides the following technical solution: a device for correcting the bending of an IC substrate, comprising:

[0005] A base and a mounting frame arranged at an upper end of the base;

[0006] The first slide rails are installed at the left and right sides of the front side of the mounting frame, the front side of the first slide rails are connected to the first slider, the front side of the first slider is provided with a connecting block, and the front side of the first connecting block is connected to a pressing plate;

[0007] A second slide rail is installed at both sides of the upper end of the pressing plate, a second slider is connected to the outer side of the upper end of the second slide rail, and a connecting frame is provided at the upper end of the second slider and at the outer side of the pressing plate;

[0008] A correction wheel is installed on the inner side of the connecting frame and below the pressing plate, and an elastic seat is connected to the lower end of the pressing plate and inside the correction wheel;

[0009] The second fixing block and the first fixing block are respectively installed at the upper ends of the pressing plate and the mounting frame, a pressing block is arranged at the inner upper ends of the first fixing block and the second fixing block, a handle is arranged at the front side of the pressing block, and a return spring is connected to the lower end of the rear side of the pressing block and at the upper end of the base;

[0010] An elastic plate is provided at the upper end of the base and below the correction wheel and the elastic seat;

[0011] The arrangement of the first slide rail, the first slider, the pressure plate, the first fixed block, the second fixed block, the pressure block, the return spring, the correction wheel, the elastic seat and the elastic plate can prevent the IC carrier from being damaged or scratched during correction.

[0012] Preferably, a first placement groove is provided at an inner position of the upper end of the elastic plate, and sliding grooves are provided at left and right sides of the elastic plate.

[0013] Preferably, a third sliding block is installed at an inner position of the sliding groove, a connecting plate is arranged at an outer position of the third sliding block, and a tightening knob is arranged at an outer position of the connecting plate.

[0014] Preferably, a limiting plate is connected to the inner side of the connecting plate and located at the upper end of the first placement groove, and a second placement groove is provided at the front side of the limiting plate.

[0015] Preferably, a protective pad is installed at an inner position of the second placement groove, and the protective pad is connected to the second placement groove by gluing.

[0016] Preferably, the protective pad is made of rubber material, and the arrangement of the slide groove, the third slider, the tightening knob, the connecting plate, the limiting plate and the protective pad can play a limiting role on the IC carrier.

[0017] Preferably, fixing plates are installed at the four corner positions of the lower end of the base, and the lower end position of the fixing plates is connected to a supporting column.

[0018] Preferably, a support pad is connected to the lower end of the support column, and the stability of the bending correction device of the IC carrier is enhanced by the arrangement of the support column and the support pad.

[0019] Compared with the prior art, the utility model provides a bending correction device for an IC carrier, which has the following beneficial effects:

[0020] 1. In the bending correction device of the IC carrier, when using the bending correction device of the IC carrier, the IC carrier is first placed in the first placement groove on the inner side of the elastic plate, and then the position of the correction wheel is adjusted through the connecting frame according to the size of the IC carrier. Then the staff holds the handle and presses it downward. At this time, the second fixed block moves downward on the outer side of the first slide rail through the first slider, thereby driving the pressure plate to move downward, so that the correction wheel and the elastic seat contact the IC carrier and correct it. After the correction is completed, the handle is released, and the second fixed block returns to its original position due to the elastic force of the reset spring. Then the IC carrier can be taken out. Through the arrangement of the first slide rail, the first slider, the pressure plate, the first fixed block, the second fixed block, the pressure block, the reset spring, the correction wheel, the elastic seat and the elastic plate, manual straightening is eliminated, which can prevent the IC carrier from being damaged or scratched during correction.

[0021] 2. In the bending correction device of the IC carrier, when using the bending correction device of the IC carrier, first place the IC carrier in the first placement groove on the inner side of the elastic plate, and then move the limiting plate forward in the sliding groove through the third slider, so that the protective pad on the front side of the limiting plate contacts the IC carrier. At this time, the limiting plate can be fixed by the tightening knob, and then the staff holds the handle and presses it down. At this time, the second fixing block will move downward on the outer side of the first slide rail through the first slider, thereby driving the pressure plate to move downward, so that the correction wheel and the elastic seat contact the IC carrier and correct it. Through the setting of the sliding groove, the third slider, the tightening knob, the connecting plate, the limiting plate and the protective pad, the IC carrier can be restricted to avoid the IC carrier from being offset during correction, which affects the quality of the IC carrier correction. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the bending correction device of the IC carrier board of the present invention.

[0023] Figure 2 It is a schematic diagram of the enlarged structure of the limiting plate of the bending correction device of the IC carrier board of the utility model.

[0024] Figure 3 It is a structural schematic diagram of a front view of a limiting plate of a bending correction device for an IC carrier board of the utility model.

[0025] In the figure: 1. base; 2. mounting frame; 3. connecting block; 4. first slider; 5. reset spring; 6. first fixed block; 7. pressure block; 8. second fixed block; 9. handle; 10. second slide rail; 11. pressure plate; 12. connecting frame; 13. correction wheel; 14. support column; 15. support pad; 16. elastic seat; 17. elastic plate; 18. first placement slot; 19. first slide rail; 20. third slider; 21. tightening knob; 22. slide slot; 23. connecting plate; 24. second placement slot; 25. protective pad; 26. limiting plate; 27. second slider. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] The utility model provides Figure 1-3The bending correction device of the IC carrier shown in the figure is a bending correction device of the IC carrier, comprising a base 1 and a mounting frame 2 arranged at the upper end position of the base 1; first slide rails 19 are installed at the left and right sides of the front side of the mounting frame 2, a first slider 4 is connected to the front side position of the first slide rail 19, a connecting block 3 is arranged at the front side position of the first slider 4, and a pressing plate 11 is connected to the front side position of the first connecting block 3; second slide rails 10 are installed at the front and rear sides of the upper end of the pressing plate 11, a second slider 27 is connected to the upper outer side position of the second slide rail 10, and a connecting frame 12 is arranged at the upper end of the second slider 27 and at the outer side position of the pressing plate 11; a correction wheel 13 is installed on the inner side of the connecting frame 12 and at the lower position of the pressing plate 11, and the pressing plate 11 An elastic seat 16 is connected to the lower end and located on the inner side of the correction wheel 13; the second fixed block 8 and the first fixed block 6 are respectively installed at the upper ends of the pressing plate 11 and the mounting frame 2, and a pressing block 7 is arranged at the inner upper end of the first fixed block 6 and the second fixed block 8, a grip 9 is arranged at the front side of the pressing block 7, and a reset spring 5 is connected to the lower rear end of the pressing block 7 and located at the upper end of the base 1; an elastic plate 17 is arranged at the upper end of the base 1 and located below the correction wheel 13 and the elastic seat 16; through the arrangement of the first slide rail 19, the first slider 4, the pressing plate 11, the first fixed block 6, the second fixed block 8, the pressing block 7, the reset spring 5, the correction wheel 13, the elastic seat 16 and the elastic plate 17, the IC carrier can be prevented from being damaged or scratched during correction.

[0028] like Figure 1 As shown, in order to prevent the IC carrier from being damaged or scratched during correction, when using the bending correction device for the IC carrier, the IC carrier is first placed in the first placement groove 18 on the inner side of the elastic plate 17, and then the position of the correction wheel 13 is adjusted through the connecting frame 12 according to the size of the IC carrier. Then the staff holds the handle 9 and presses it downward. At this time, the second fixed block 8 will move downward on the outer side of the first slide rail 19 through the first slider 4, thereby driving the pressing plate 11 to move downward, so that the correction wheel 13 and the elastic seat 16 contact the IC carrier and correct it. After the correction is completed, the handle 9 is released, and the second fixed block 8 returns to its original position due to the elastic force of the reset spring 5. Then the IC carrier can be taken out. Through the arrangement of the first slide rail 19, the first slider 4, the pressing plate 11, the first fixed block 6, the second fixed block 8, the pressing block 7, the reset spring 5, the correction wheel 13, the elastic seat 16 and the elastic plate 17, manual straightening is eliminated, which can prevent the IC carrier from being damaged or scratched during correction.

[0029] A first placement groove 18 is provided at the inner side of the upper end of the elastic plate 17, and a slide groove 22 is provided at the left and right sides of the elastic plate 17. A third slider 20 is installed at the inner position of the slide groove 22, a connecting plate 23 is provided at the outer position of the third slider 20, and a tightening knob 21 is provided at the outer position of the connecting plate 23. A limiting plate 26 is connected to the inner side of the connecting plate 23 and located at the upper end of the first placement groove 18. A second placement groove 24 is provided at the front side of the limiting plate 26, and a protective pad 25 is installed at the inner position of the second placement groove 24. The protective pad 25 is connected to the second placement groove 24 by gluing. The protective pad 25 is made of rubber material. The setting of the slide groove 22, the third slider 20, the tightening knob 21, the connecting plate 23, the limiting plate 26 and the protective pad 25 can play a limiting role on the IC carrier.

[0030] like Figure 1 , Figure 2 and Figure 3 As shown, in order to limit the IC carrier, when using the bending correction device of the IC carrier, the IC carrier is first placed in the first placement groove 18 on the inner side of the elastic plate 17, and then the limiting plate 26 is moved forward in the slide groove 22 through the third slider 20, so that the protective pad 25 on the front side of the limiting plate 26 contacts the IC carrier. At this time, the limiting plate 26 can be fixed by the tightening knob 21, and then the staff holds the handle 9 and presses it downward. At this time, the second fixing block 8 will move downward on the outer side of the first slide rail 19 through the first slider 4, thereby driving the pressing plate 11 to move downward, so that the correction wheel 13 and the elastic seat 16 contact the IC carrier and correct it. Through the setting of the slide groove 22, the third slider 20, the tightening knob 21, the connecting plate 23, the limiting plate 26 and the protective pad 25, the IC carrier can be restricted to avoid the IC carrier from deviating during correction, which affects the quality of the IC carrier correction.

[0031] A fixing plate is installed at the four corners of the lower end of the base 1, a support column 14 is connected to the lower end of the fixing plate, and a support pad 15 is connected to the lower end of the support column 14. The arrangement of the support column 14 and the support pad 15 enhances the stability of the bending correction device of the IC carrier.

[0032] like Figure 1As shown, in order to enhance the stability of the bending correction device of the IC carrier, when using the bending correction device of the IC carrier, first connect the support column 14 with the support pad 15, then connect the support column 14 with the fixing plate, and then fix the fixing plate at the four corners of the lower end of the base 1 by fastening nuts, and then contact the bending correction device of the IC carrier with the desktop through the support pad 15, so that the bending correction device of the IC carrier is placed on the desktop through the support column 14. By setting the support column 14 and the support pad 15, the stability of the bending correction device of the IC carrier is enhanced.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for correcting the bending of an IC substrate, characterized in that: include A base (1) and a mounting frame (2) arranged at the upper end of the base (1); A first slide rail (19) is installed at the left and right sides of the front side of the mounting frame (2); a first slider (4) is connected to the front side of the first slide rail (19); a connecting block (3) is provided at the front side of the first slider (4); and a pressing plate (11) is connected to the front side of the connecting block (3); A second slide rail (10) is installed at both sides of the upper end of the pressing plate (11); a second slider (27) is connected to the outer side of the upper end of the second slide rail (10); and a connecting frame (12) is provided at the upper end of the second slider (27) and at the outer side of the pressing plate (11); A correction wheel (13) is installed on the inner side of the connecting frame (12) and below the pressing plate (11); an elastic seat (16) is connected to the lower end of the pressing plate (11) and inside the correction wheel (13); A second fixing block (8) and a first fixing block (6) are respectively installed at the upper ends of the pressing plate (11) and the mounting frame (2); a pressing block (7) is arranged at the inner upper ends of the first fixing block (6) and the second fixing block (8); a handle (9) is arranged at the front side of the pressing block (7); and a return spring (5) is connected to the lower rear end of the pressing block (7) and at the upper end of the base (1); An elastic plate (17) is provided at the upper end of the base (1) and below the correction wheel (13) and the elastic seat (16); By arranging the first slide rail (19), the first slider (4), the pressure plate (11), the first fixed block (6), the second fixed block (8), the pressure block (7), the return spring (5), the correction wheel (13), the elastic seat (16) and the elastic plate (17), the IC carrier can be prevented from being damaged or scratched during correction.

2. The device for correcting the bending of an IC substrate according to claim 1, characterized in that: A first placement groove (18) is provided at the inner side of the upper end of the elastic plate (17), and sliding grooves (22) are provided at the left and right sides of the elastic plate (17).

3. The device for correcting the bending of an IC substrate according to claim 2, characterized in that: A third sliding block (20) is installed at an inner position of the sliding groove (22), a connecting plate (23) is arranged at an outer position of the third sliding block (20), and a tightening knob (21) is arranged at an outer position of the connecting plate (23).

4. The device for correcting the bending of an IC substrate according to claim 3, characterized in that: A limiting plate (26) is connected to the inner side of the connecting plate (23) and located at the upper end of the first placement groove (18), and a second placement groove (24) is provided at the front side of the limiting plate (26).

5. The device for correcting the bending of an IC substrate according to claim 4, characterized in that: A protective pad (25) is installed at an inner position of the second placement groove (24), and the protective pad (25) is connected to the second placement groove (24) by means of gluing.

6. The device for correcting the bending of an IC substrate according to claim 5, characterized in that: The protective pad (25) is made of rubber material, and can play a limiting role on the IC carrier through the arrangement of the slide groove (22), the third slider (20), the tightening knob (21), the connecting plate (23), the limiting plate (26) and the protective pad (25).

7. The device for correcting the bending of an IC substrate according to claim 1, characterized in that: Fixed plates are installed at the four corner positions of the lower end of the base (1), and the lower end position of the fixed plate is connected to a support column (14).

8. The device for correcting the bending of an IC substrate according to claim 7, characterized in that: A support pad (15) is connected to the lower end of the support column (14), and the stability of the bending correction device of the IC carrier is enhanced by the arrangement of the support column (14) and the support pad (15).

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