Light source packaging structure and matrix vehicle lamp

Abstract

The embodiment of the utility model discloses a light source packaging structure. The light source packaging structure comprises a substrate; the number of the chips is multiple, the multiple chips are arranged on one side of the substrate at intervals, and a first interval exists between every two adjacent chips; the plurality of fluorescent diaphragms are arranged, the plurality of fluorescent diaphragms and the plurality of chips are arranged on the sides, far away from the substrate, of the plurality of chips in a one-to-one correspondence manner, and a second interval exists between every two adjacent fluorescent diaphragms; the reflecting layer is positioned in the first interval and is used for reflecting light emitted by the chip; and the blocking layer is positioned in the second interval and is used for preventing mutual crosstalk of light emitted by the chips. The embodiment of the utility model further relates to a matrix car lamp. According to the embodiment of the utility model, the reflecting layer is arranged between the chips, and the blocking layer is arranged between the fluorescent diaphragms, so that the reflectivity is improved, the mutual crosstalk of light emitted by the chips can be prevented, and the practicability of the light source packaging structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, and in particular to a light source packaging structure and a matrix vehicle lamp. Background Art

[0002] With the development of automobile intelligence, headlights have shifted from traditional lighting tools and functional safety parts to electronic and intelligent ones, and are likely to become one of the main ways of future automobile interaction. The design of the next generation of headlights is expected to be brighter, better controlled, more intelligent, and can be used for various purposes. ADB (Adaptive Driving Beam) is an intelligent high beam system that determines the position and distance of the front vehicle through the input of video camera signals, and adjusts the illumination area of ​​the light accordingly, such as turning off or dimming the light illumination in the opposite vehicle area to avoid glare to the oncoming vehicle. The performance of ADB headlights depends on the number of LED light-emitting units in the integrated LED light source and their resolution. The fewer LED light-emitting unit points, the worse the intelligent driving lighting function that can be achieved; the larger the LED light-emitting unit points, the lower the resolution, and the worse the accuracy and effect of intelligent driving lighting that can be achieved. On the contrary, if the car headlights are to achieve a more intelligent effect, the LED light source is required to have more and finer matrix partitions, and the volume also needs to be smaller. Based on the above requirements, the spacing between LED light-emitting units needs to be designed to be closer, but in this way, the crosstalk between the light-emitting units will become more serious, which is not conducive to the design of the headlight lens, and the lighting accuracy and resolution will be worse. Utility Model Content

[0003] Therefore, in order to overcome at least some of the defects and shortcomings in the prior art, the embodiments of the utility model provide a light source packaging structure and a matrix car light, by setting a reflective layer between the chips and a barrier layer between the fluorescent films. The reflective layer is used to reflect the light emitted by the chip, and the barrier layer is used to prevent the light emitted by the chips from crosstalking with each other. This setting can improve the reflectivity while preventing the light emitted by the chips from crosstalking with each other, thereby improving the practicality of the light source packaging structure.

[0004] On the one hand, an embodiment of the utility model provides a light source packaging structure, for example, including: a substrate; a chip, which is provided in plurality, and the plurality of chips are arranged at intervals on one side of the substrate, and there is a first spacing between two adjacent chips; a fluorescent film sheet, which is provided in plurality, and the plurality of fluorescent film sheets are arranged one-to-one with the plurality of chips on a side of the plurality of chips away from the substrate, and there is a second spacing between two adjacent fluorescent film sheets; a reflective layer, located within the first spacing, for reflecting light emitted by the chip; and a barrier layer, located within the second spacing, for preventing light emitted by the chips from crosstalking with each other.

[0005] In one embodiment of the present invention, the first spacing is greater than the second spacing.

[0006] In an embodiment of the present invention, the reflective layer is a white reflective layer.

[0007] In one embodiment of the present invention, the barrier layer is a black light absorbing layer.

[0008] In one embodiment of the present invention, the reflective layer has a recessed portion on a side away from the substrate, and the barrier layer has a raised portion on a side close to the substrate corresponding to the recessed portion, and the raised portion is located in the recessed portion.

[0009] In one embodiment of the present invention, in a direction extending from the substrate toward the fluorescent film, the maximum height of the barrier layer is greater than the thickness of the fluorescent film.

[0010] In one embodiment of the utility model, the barrier layer has a protrusion on a side away from the substrate, the protrusion has a first surface, the fluorescent film has a second surface on a side close to the substrate, and the distance from the first surface to the second surface is greater than the thickness of the fluorescent film.

[0011] In one embodiment of the present invention, the reflective layer and the barrier layer are metal film layers or distributed Bragg reflector layers, and the reflective layer and the barrier layer cover the sides of the chip and the fluorescent film.

[0012] In an embodiment of the present invention, the reflective layer and the barrier layer enclose a containing space, and a white reflective layer is arranged in the containing space.

[0013] On the other hand, an embodiment of the present invention provides a matrix vehicle lamp, for example, including: a light source packaging structure as described in any one of the above items.

[0014] It can be seen from the above that the above technical solution has at least one or more of the following beneficial effects:

[0015] In the embodiment of the utility model, a reflective layer is arranged between the chips, and a barrier layer is arranged between the fluorescent films. The reflective layer is used to reflect the light emitted by the chips, and the barrier layer is used to prevent the light emitted by the chips from crosstalking with each other. This arrangement can prevent the light emitted by the chips from crosstalking with each other while improving the reflectivity, thereby improving the practicality of the light source packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The specific implementation of the present utility model will be described in detail below with reference to the accompanying drawings.

[0017] Figure 1A schematic structural diagram of a first light source packaging structure provided in an embodiment of the utility model.

[0018] Figure 2 A schematic structural diagram of a second light source packaging structure provided in an embodiment of the utility model.

[0019] Figure 3 for Figure 1 A schematic structural diagram of a first partial light source packaging structure is shown.

[0020] Figure 4 for Figure 1 A schematic structural diagram of a second partial light source packaging structure is shown.

[0021] Figure 5 for Figure 1 A schematic structural diagram of a third partial light source packaging structure is shown.

[0022] Figure 6 A schematic structural diagram of a third light source packaging structure provided in an embodiment of the utility model.

[0023] Figure 7 for Figure 6 A schematic structural diagram of a portion of a light source packaging structure is shown.

[0024] Figure 8 This is a schematic structural diagram of a fourth light source packaging structure provided in an embodiment of the utility model.

[0025] Fig. 9 This is a schematic structural diagram of a fifth light source packaging structure provided in an embodiment of the utility model.

[0026] Fig.10 for Figure 2 A schematic structural diagram of a portion of a light source packaging structure is shown.

[0027] Fig.11 for Figure 2 A schematic structural diagram of another partial light source packaging structure is shown.

[0028] Description of Reference Numerals

[0029] 10: light source packaging structure; 100: substrate; 200: chip; 300: fluorescent film; 310: second surface; 400: reflective layer; 410: recessed portion; 500: barrier layer; 510: protruding portion; 511: first surface; 520: raised portion; 600: first spacing; 700: second spacing; 800: accommodating space. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0031] In order to enable those skilled in the art to better understand the technical solution of the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solution in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of the present invention.

[0032] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0033] It should also be noted that the division of multiple embodiments in the present invention is only for the convenience of description and should not constitute a special limitation. The features in various embodiments can be combined and referenced to each other without contradiction.

[0034] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a light source packaging structure 10. The light source packaging structure 10 is, for example, an LED packaging structure. Specifically, the light source packaging structure 10 includes, for example: a substrate 100, a chip 200 (ie, a light-emitting unit), a fluorescent film 300, a reflective layer 400, and a barrier layer 500.

[0035] Specifically, Figure 1 and Figure 3 As shown, the substrate 100 is, for example, a ceramic substrate with a circuit. There are, for example, multiple chips 200, for example, two or more chips. The multiple chips 200 are arranged at intervals on one side of the substrate 100, and there is a first spacing 600 between two adjacent chips 200. The multiple chips 200 are, for example, flip-chip mounted on the substrate 100 in a dense manner. Figure 1 and Figure 5As shown, for example, there are multiple fluorescent film sheets 300, for example, two or more fluorescent film sheets 300, and the number of fluorescent film sheets 300 is the same as the number of chips 200. The multiple fluorescent film sheets 300 and the multiple chips 200 are arranged one by one on the side of the multiple chips 200 away from the substrate 100, and there is a second spacing 700 between two adjacent fluorescent film sheets 300. Figure 1 and Figure 4 As shown, the reflective layer 400 is located within the first spacing 600 to reflect the light emitted by the chip 200. The barrier layer 500 is located within the second spacing 700 to prevent the light emitted by the chips 200 from crosstalking with each other. The first spacing 600 is, for example, less than 120 μm; the second spacing 700 is, for example, less than 180 μm.

[0036] In the embodiment of the utility model, a reflective layer 400 is arranged between the chips 200, and a barrier layer 500 is arranged between the fluorescent films 300. The reflective layer 400 is used to reflect the light emitted by the chip 200, and the barrier layer 500 is used to prevent the light emitted by the chips 200 from crosstalking with each other. This arrangement can improve the reflectivity while preventing the light emitted by the chips 200 from crosstalking with each other, thereby improving the practicality of the light source packaging structure 10.

[0037] Alternatively, if Figure 1 and Figure 2 As shown, the first spacing 600 is, for example, greater than the second spacing 700. The reflective layer 400 includes, for example, one or more of a white reflective layer, a metal film layer, or a distributed Bragg reflector (DBR). The white reflective layer is, for example, white glue, for example, containing TiO 2 (TiO2 / TiO2), Al 2 O 3 (aluminum oxide), SiO 2 (Silicon dioxide), BaSO 4 (barium sulfate) or CaSO 4 The metal film layer is, for example, a metal material containing one or more of Ag (silver), Al (aluminum), Ni (nickel), Cr (chromium), Au (gold), Pt (platinum), Pd (palladium), Sn (tin), W (tungsten), Rh (rhodium), Ir (iridium), Ru (ruthenium), Mg (magnesium) or Zn (zinc). The distributed Bragg reflector layer is, for example, a metal material containing SiO 2 (Silicon dioxide), SiN (Silicon nitride), SiO x N y (Silicon Oxynitride), TiO 2 (TiO2), Si 3 N 4 (Silicon Nitride), Al2 O 3 (aluminum oxide), TiN (titanium nitride), AlN (aluminum nitride), ZrO 2 The reflective layer 400 is filled in the first spacing 600 between two adjacent chips 200 to improve the reflectivity, so that the light emitted by the chip 200 has higher brightness, thereby improving its practicality.

[0038] Specifically, Figure 1 As shown, in one embodiment of the present invention, a white reflective layer is filled in the first spacing 600 between two adjacent chips 200, and a barrier layer is provided in the second spacing 700 between two adjacent fluorescent films 300. The barrier layer 500 is, for example, a black light absorbing layer. The black light absorbing layer is, for example, black glue, for example, graphite, carbon powder, iron powder, FeS (ferrous sulfide), CuS (copper sulfide), CuO (copper oxide), MnO 2 (manganese dioxide) or Fe 3 O 4 (ferroferric oxide) and the like, or a silicone resin mixed colloid containing two or more black substances. For example, Figure 1 and Figure 4 As shown, white glue is filled in the first spacing 600 between two adjacent chips 200. White glue can improve the reflectivity, that is, increase the luminous brightness of the chip 200; black glue is filled in the second spacing 700 between two adjacent fluorescent diaphragms 300. Black glue has the function of absorbing light. The black glue is arranged between the fluorescent diaphragms 300 to prevent the light emitted by the chips 200 from crosstalking with each other. The black glue and the white glue are filled, for example, by dispensing or molding. White glue is arranged between two adjacent chips 200, and black glue is arranged between two adjacent fluorescent diaphragms 300. This arrangement can effectively prevent crosstalk while improving the reflectivity, thereby improving the practicality of the light source packaging structure 10.

[0039] Alternatively, if Figure 6 and Figure 7As shown, the side of the reflective layer 400 away from the substrate 100 has a recessed portion 410, and the side of the barrier layer 500 close to the substrate 100 is provided with a convex portion 520 corresponding to the recessed portion 410, and the convex portion 520 is located in the recessed portion 410. For example, a recessed portion 410 is formed near the middle of the side of the reflective layer 400 away from the substrate 100, and when the barrier layer 500 is filled, the barrier layer 500 is arranged in the recessed portion 410, that is, the barrier layer 500 is formed with a convex portion 520 corresponding to the recessed portion 410. The arrangement of the recessed portion 410 and the convex portion 520 enables the side of the barrier layer 500 close to the substrate 100 to protrude from the surface of the fluorescent film 300 close to the substrate 100. This arrangement can improve the anti-crosstalk effect without affecting the reflection effect of the reflective layer 400, thereby improving the practicality of the light source packaging structure 10.

[0040] like Figure 8 and Fig. 9 As shown, in the direction extending from the substrate 100 to the fluorescent film 300, the maximum height of the barrier layer 500 is greater than the thickness of the fluorescent film 300. Specifically, the barrier layer 500 has a protrusion 510 on the side away from the substrate 100, and the protrusion 510 has a first surface 511. The fluorescent film 300 has a second surface 310 on the side close to the substrate 100, and the distance from the first surface 511 to the second surface 310 is greater than the thickness of the fluorescent film 300. This setting can improve the anti-crosstalk effect without affecting the reflection effect of the reflective layer 400, thereby improving the practicality of the light source packaging structure 10. Optionally, the first surface 511 is, for example, arc-shaped, or the first surface 511 is parallel to the second surface 310. The protrusion 510 can have a variety of shapes, which are not limited here.

[0041] like Fig.10 and Fig.11 As shown, in another embodiment of the present invention, the reflective layer 400 and the barrier layer 500 are, for example, a metal film layer or a distributed Bragg reflector layer. The reflective layer 400 and the barrier layer 500 cover the sides of the chip 200 and the fluorescent film 300. The thickness of the metal film layer or the distributed Bragg reflector layer is less than 5 μm. Specifically, Figure 2 and Fig.11As shown, the reflective layer 400 and the barrier layer 500 enclose a housing space 800, and a white reflective layer is disposed in the housing space 800. For example, the fluorescent film 300 covers the side of the chip 200 away from the substrate 100, and a metal film layer or a distributed Bragg reflector layer is plated on the sides of the chip 200 and the fluorescent film 300. The metal film layer or the distributed Bragg reflector layer can improve the reflectivity and also prevent crosstalk. After the metal film layer or the distributed Bragg reflector layer is plated on the sides of the chip 200 and the fluorescent film 300, the metal film layer or the distributed Bragg reflector layer can enclose a housing space 800, and a white reflective layer, i.e., white glue, is filled in the housing space 800, which can improve the luminous effect of the chip 200. This configuration is achieved by coating the sides of the chip 200 and the fluorescent film 300 with a metal film layer or a distributed Bragg reflector layer, and then filling a white reflective layer, i.e., white glue, in the accommodation space 800 enclosed by the metal film layer or the distributed Bragg reflector layer. This improves the reflectivity and can also effectively prevent crosstalk, thereby improving the practicality of the light source packaging structure 10. Of course, the accommodation space 800 can also be filled with a black light absorbing layer, i.e., black glue, which is not limited here.

[0042] The embodiment of the utility model further provides a matrix vehicle lamp, comprising the light source packaging structure 10 as described above.

[0043] The present invention also provides a light source packaging method for manufacturing the light source packaging structure 10 as described above. The light source packaging method includes:

[0044] S1: providing a substrate 100;

[0045] S2: fixing the chip 200; a plurality of chips 200 are provided, and the plurality of chips 200 are arranged at intervals on one side of the substrate 100, and a first interval 600 exists between two adjacent chips 200;

[0046] S3: Covering the fluorescent film 300; a plurality of fluorescent films 300 are provided, and the plurality of fluorescent films 300 are arranged one-to-one with the plurality of chips 200 on a side of the plurality of chips 200 away from the substrate 100, and a second interval 700 exists between two adjacent fluorescent films 300;

[0047] S4: forming a barrier; the barrier comprises a reflective layer 400 located within the first interval 600 and a barrier layer 500 located within the second interval 700 .

[0048] Specifically, in one implementation of the present embodiment, step S4 specifically includes step S41: filling the reflective layer 400 within the first spacing 600, and the reflective layer 400 is a white reflective layer 400. Step S3 is specifically step S31: after forming the reflective layer 400, covering the chip 200 and the reflective layer 400 on the side away from the substrate 100 with the fluorescent film 300. Step S4 specifically also includes step S42: after covering the fluorescent film 300, filling the barrier layer 500 within the second spacing 700, and the barrier layer 500 is a black light-absorbing layer. In the present embodiment, the specific step sequence of the light source packaging method is: step S1, step S2, step S41, step S31 and step S42. For example, first, as Figure 3 As shown, on a substrate 100 designed with a circuit, a plurality of chips 200 are flip-chip-bonded in a dense manner, and a first spacing 600 is provided between two adjacent chips 200; then, as shown in FIG. Figure 4 As shown, the reflective layer 400 is filled in the first spacing 600 by dispensing or molding; then, as shown Figure 5 As shown, the side of the chip 200 away from the substrate 100 is covered with a fluorescent film 300, and a second spacing 700 is provided between two adjacent fluorescent films 300; finally, as shown in FIG. Figure 1 As shown, the barrier layer 500 is filled in the second spacing 700 by dispensing or molding. The reflective layer 400 is, for example, white glue, and the barrier layer 500 is, for example, black glue. This arrangement can improve the reflectivity while preventing the light emitted by the chip 200 from crosstalking with each other, thereby improving the practicality of the light source packaging structure 10.

[0049] Further, in another implementation of this embodiment, step S3 is specifically step S32: covering the fluorescent film 300 on the side of the chip 200 away from the substrate 100. Step S4 is specifically: coating the side of the chip 200 and the fluorescent film 300 with a reflective layer 400 and a barrier layer 500, and the reflective layer 400 and the barrier layer 500 are metal film layers or distributed Bragg reflector layers. In this implementation, the specific step sequence of the light source packaging method is: step S1, step S2, step S32 and step S4. For example, if Fig.10 As shown, first, on the substrate 100 designed with the circuit, a plurality of chips 200 are flip-chipped in a dense manner, with a first spacing of 600 between two adjacent chips 200; then, a fluorescent film 300 is covered on the side of the chip 200 away from the substrate 100, with a second spacing of 700 between two adjacent fluorescent films 300; then, as shown in FIG. Fig.11 As shown, a reflective layer 400 and a barrier layer 500 are plated on the sides of the chip 200 and the fluorescent film 300, wherein the reflective layer 400 and the barrier layer 500 are, for example, a metal film layer or a distributed Bragg reflector layer; finally, as shown Figure 2As shown, in the accommodation space 800 formed by the reflective layer 400 and the barrier layer 500, a white reflective layer is filled by dispensing or molding. Of course, a black light absorbing layer can also be filled by dispensing or molding in the accommodation space 800, which is not limited here. This setting can prevent the light emitted by the chip 200 from crosstalking with each other while improving the reflectivity, thereby improving the practicality of the light source packaging structure 10.

[0050] In the embodiment of the utility model, a reflective layer 400 is arranged between the chips 200, and a barrier layer 500 is arranged between the fluorescent films 300. The reflective layer 400 is used to reflect the light emitted by the chip 200, and the barrier layer 500 is used to prevent the light emitted by the chips 200 from crosstalking with each other. This arrangement can improve the reflectivity while preventing the light emitted by the chips 200 from crosstalking with each other, thereby improving the practicality of the light source packaging structure 10.

[0051] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A light source packaging structure (10), characterized in that: include: substrate(100); A plurality of chips (200) are provided, wherein the plurality of chips (200) are arranged at intervals on one side of the substrate (100), and a first spacing (600) exists between two adjacent chips (200); A plurality of fluorescent film sheets (300) are provided, and the plurality of fluorescent film sheets (300) are arranged on a side of the plurality of chips (200) away from the substrate (100) in a one-to-one correspondence with the plurality of chips (200), and a second spacing (700) exists between two adjacent fluorescent film sheets (300); a reflective layer (400), located within the first spacing (600), and used to reflect light emitted by the chip (200); The blocking layer (500) is located within the second spacing (700) and is used to prevent the lights emitted by the chips (200) from crosstalking with each other.

2. The light source packaging structure (10) according to claim 1, characterized in that: The first spacing (600) is greater than the second spacing (700).

3. The light source packaging structure (10) according to claim 1, characterized in that: The reflective layer (400) comprises one or more of a white reflective layer, a metal film layer or a distributed Bragg reflector layer.

4. The light source packaging structure (10) according to claim 1, characterized in that: The barrier layer (500) is a black light-absorbing layer.

5. The light source packaging structure (10) according to claim 4, characterized in that: The reflective layer (400) has a recessed portion (410) on a side away from the substrate (100), and the barrier layer (500) has a protruding portion (520) on a side close to the substrate (100) corresponding to the recessed portion (410), and the protruding portion (520) is located in the recessed portion (410).

6. The light source packaging structure (10) according to claim 4, characterized in that: In a direction extending from the substrate (100) toward the fluorescent film (300), the maximum height of the barrier layer (500) is greater than the thickness of the fluorescent film (300).

7. The light source packaging structure (10) according to claim 6, characterized in that: The barrier layer (500) has a protrusion (510) on a side away from the substrate (100), and the protrusion (510) has a first surface (511). The fluorescent film (300) has a second surface (310) on a side close to the substrate (100), and the distance from the first surface (511) to the second surface (310) is greater than the thickness of the fluorescent film (300).

8. The light source packaging structure (10) according to claim 1, characterized in that: The reflective layer (400) and the barrier layer (500) are metal film layers or distributed Bragg reflector layers, and the reflective layer (400) and the barrier layer (500) cover the sides of the chip (200) and the fluorescent film (300).

9. The light source packaging structure (10) according to claim 8, characterized in that: The reflective layer (400) and the barrier layer (500) enclose a containing space (800), and a white reflective layer is arranged in the containing space (800).

10. A matrix vehicle lamp, characterized in that: include: The light source packaging structure (10) as claimed in any one of claims 1 to 9.

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