Novel semiconductor packaging equipment

Abstract

The utility model discloses novel semiconductor packaging equipment, and relates to the technical field of packaging equipment. The novel semiconductor packaging equipment comprises a dispensing table, a mounting frame is fixedly connected to the upper side surface of the dispensing table, dispensing equipment is arranged on the mounting frame, an electric sliding table is mounted on the upper side surface of the dispensing table, a dispensing plate is mounted on the upper side surface of the electric sliding table, and a first limiting plate is slidably connected to the upper side surface of the dispensing plate; two mounting plates are fixedly connected to the upper side surface of the dispensing plate, a limiting rod is fixedly connected between the two mounting plates, the outer surface of the limiting rod is slidably sleeved with a second limiting plate, the second limiting plate is arranged to be in a T shape, and an inclined groove is formed in the upper side surface of the first limiting plate. The semiconductor chip can be automatically positioned, so that the dispensing precision is improved, and the situation that the product quality is reduced due to the fact that the dispensing position deviates from the preset position is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging equipment, and particularly relates to a new type of semiconductor packaging equipment. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields.

[0003] For example, the Chinese utility model patent with the patent publication number CN218048691U includes a packaging table, on which a fixed support table is installed, on which a top beam is installed, on which a support table is installed, on which a first electric sliding table is installed, on which a fixed seat is installed, and on which a dispensing device is installed; the dispensing device includes a dispensing tube and a nozzle, and a rubber head cylinder and a lower pressing plate are arranged in the dispensing tube. This patent has the beneficial effect of scraping the nozzle to adjust the flow rate and flow of the glue, but after placing the semiconductor chip, it can only be simply limited by the limiting strip, and the semiconductor chip cannot be positioned during dispensing, so the accuracy of dispensing cannot be guaranteed, and there are certain deficiencies. In view of this, we have proposed a new type of semiconductor packaging equipment. Summary of the Utility Model

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and provide a new type of semiconductor packaging equipment, which can solve the problem that the semiconductor chip cannot be positioned, and thus the accuracy of dispensing cannot be guaranteed.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A new type of semiconductor packaging equipment includes a dispensing table, the upper surface of the dispensing table is fixedly connected with a mounting frame, a dispensing device is arranged on the mounting frame, an electric sliding table is installed on the upper surface of the dispensing table, a dispensing plate is installed on the upper surface of the electric sliding table, a first limiting plate is slidably connected to the upper surface of the dispensing plate, two mounting plates are fixedly connected to the upper surface of the dispensing plate, a limiting rod is fixedly connected between the two mounting plates, a second limiting plate is slidably sleeved on the outer surface of the limiting rod, the second limiting plate is T-shaped, an inclined groove is opened on the upper surface of the first limiting plate, a sliding rod is fixedly connected to the lower surface of the second limiting plate, and the sliding rod is slidably connected inside the inclined groove. Push plates are fixedly connected to the opposite side surfaces of the two second limiting plates respectively, and the left and right side surfaces of the push plates are both inclined surfaces. Grooves are respectively opened on the adjacent side surfaces of the two vertical plates of the mounting frame, and a second push plate is slidably connected inside the grooves.

[0006] Preferably, the opposite side surfaces of the two second push plates respectively slide through the opposite side surfaces of the mounting frame. The upper and lower side surfaces of the second push plates are respectively fixedly connected with second mounting plates, and the opposite side surfaces of the two vertical plates of the mounting frame are respectively fixedly connected with second limiting rods.

[0007] Preferably, the lower second mounting plate is slidably sleeved on the outer surface of the second limiting rod, and threaded rods are respectively rotatably connected to the opposite side surfaces of the two vertical plates of the mounting frame.

[0008] Preferably, the upper second mounting plate is threadedly sleeved on the outer surface of the threaded rod, and two sliding grooves are formed in the upper side surface of the dispensing plate.

[0009] Preferably, third limiting rods are fixedly connected to the inner walls of the two sliding grooves, and the lower side surface of the first limiting plate extends into the interior of the sliding groove and is slidably sleeved on the outer surface of the third limiting rod.

[0010] Preferably, telescopic grooves are respectively formed in the opposite side surfaces of the two first limiting plates, and first springs are fixedly connected to the inner walls of the telescopic grooves.

[0011] Preferably, the other end of the first spring is fixedly connected with a displacement rod, and the end of the displacement rod away from the first spring is fixedly connected with a buffer plate.

[0012] Preferably, second telescopic grooves are respectively formed in the left and right side surfaces of the vertical plate of the second limiting plate, displacement plates are slidably connected to the inner walls of the second telescopic grooves, and second springs are fixedly connected between the displacement plates and the second telescopic grooves.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] (1). In the novel semiconductor packaging device, when the second limiting plate moves, the sliding rod will be driven to move synchronously. Since the movement track of the sliding rod is indirectly restricted by the limiting rod, when the sliding rod moves, it will cooperate with the inclined groove to drive the first limiting plate to move horizontally. After the first limiting plate and the second limiting plate move, the semiconductor chip is positioned, so as to facilitate subsequent dispensing. Through the above structure, during the dispensing process of the semiconductor chip, the positioning of the semiconductor chip can be automatically completed, thereby improving the dispensing accuracy and avoiding the product quality decline caused by the deviation of the dispensing position from the predetermined position.

[0015] (2) When it is necessary to adjust the movement range of the first limit plate and the second limit plate of this new semiconductor packaging device, the threaded rod can be rotated. Since the movement trajectory of the second push plate is restricted by the second limit rod, when the threaded rod rotates, it will drive the second push plate to move, thereby adjusting the length of the second push plate extending out in the groove. Through the above structure, not only can a certain buffer distance be provided by the buffer plate and the first spring during the positioning process, but also the movement range of the second limit plate can be adjusted by the movement of the second push plate, thus improving the adaptation range of the overall device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The following further describes the present utility model in conjunction with the drawings and embodiments:

[0017] Figure 1 is a schematic structural diagram of a new semiconductor packaging device of the present utility model;

[0018] Figure 2 is a schematic cross-sectional view of the first limit plate of the present utility model;

[0019] Figure 3 is a schematic diagram of the sliding groove of the present utility model;

[0020] Figure 4 is a schematic diagram of the second push plate of the present utility model;

[0021] Figure 5 is Figure 3 an enlarged view of part A in

[0022] Reference numerals: 1, dispensing table; 2, mounting frame; 3, dispensing device; 4, electric slide table; 5, dispensing plate; 6, first limit plate; 7, mounting plate; 8, limit rod; 9, second limit plate; 10, inclined groove; 11, sliding rod; 12, push plate; 13, groove; 14, second push plate; 15, second mounting plate; 16, second limit rod; 17, threaded rod; 18, sliding groove; 19, third limit rod; 20, telescopic groove; 21, first spring; 22, displacement rod; 23, buffer plate; 24, second telescopic groove; 25, displacement plate; 26, second spring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] This part will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the drawings. The role of the drawings is to supplement the description of the text part of the specification, enabling people to visually and vividly understand each technical feature and the overall technical solution of the present utility model, but it cannot be understood as a limitation on the protection scope of the present utility model.

[0024] Please refer to Figures 1 - 5, the present utility model provides a technical solution: a novel semiconductor packaging device, including a dispensing table 1. The upper surface of the dispensing table 1 is fixedly connected with a mounting frame 2. A dispensing device 3 is arranged on the mounting frame 2. The upper surface of the dispensing table 1 is installed with an electric sliding table 4. The upper surface of the electric sliding table 4 is installed with a dispensing plate 5. The upper surface of the dispensing plate 5 is slidably connected with a first limiting plate 6. Two mounting plates 7 are fixedly connected to the upper surface of the dispensing plate 5. A limiting rod 8 is fixedly connected between the two mounting plates 7. A second limiting plate 9 is slidably sleeved on the outer surface of the limiting rod 8. The second limiting plate 9 is arranged in a T shape. An inclined groove 10 is opened on the upper surface of the first limiting plate 6. A sliding rod 11 is fixedly connected to the lower surface of the second limiting plate 9. The sliding rod 11 is slidably connected inside the inclined groove 10. Push plates 12 are respectively fixedly connected to the opposite side surfaces of the two second limiting plates 9. The left and right side surfaces of the push plate 12 are both provided with inclined surfaces. Grooves 13 are respectively opened on the adjacent side surfaces of the two vertical plates of the mounting frame 2. A second push plate 14 is slidably connected inside the groove 13. The electric sliding table 4 and the dispensing device 3 described in the text are both existing structures, and specific reference can be made to the patent publication number CN218048691U. When dispensing semiconductor chips, the semiconductor chips are placed between the two first limiting plates 6. Subsequently, the electric sliding table 4 is used to drive the dispensing plate 5 to move. When the dispensing plate 5 moves, it will synchronously drive the upper components to move. When the push plate 12 contacts the second push plate 14, the inclined surfaces are used to make the two push plates 12 approach each other. When the push plate 12 moves, it synchronously drives the second limiting plate 9 to move. When the second limiting plate 9 moves, the movement track of the second limiting plate 9 is restricted by the two limiting rods 8. At the same time, when the second limiting plate 9 moves, it will synchronously drive the sliding rod 11 to move. Since the movement track of the sliding rod 11 is indirectly restricted by the limiting rod 8, when the sliding rod 11 moves, it will cooperate with the inclined groove 10 to drive the first limiting plate 6 to move horizontally. After the first limiting plate 6 and the second limiting plate 9 move, the semiconductor chips are positioned, so as to facilitate subsequent dispensing. Through the above structure, it can be ensured that during the dispensing process of semiconductor chips, the positioning of semiconductor chips can be automatically completed, thereby improving the dispensing accuracy and avoiding the decline of product quality caused by the deviation of the dispensing position from the predetermined position.

[0025] Further, the opposite side surfaces of the two second push plates 14 respectively slide through the opposite side surfaces of the mounting frame 2. The upper and lower side surfaces of the second push plates 14 are respectively fixedly connected with second mounting plates 15. The opposite side surfaces of the two vertical plates of the mounting frame 2 are respectively fixedly connected with second limiting rods 16. The lower second mounting plate 15 is slidably sleeved on the outer surface of the second limiting rod 16. The opposite side surfaces of the two vertical plates of the mounting frame 2 are respectively rotatably connected with threaded rods 17. The upper second mounting plate 15 is threadedly sleeved on the outer surface of the threaded rod 17. The upper side surface of the dispensing plate 5 is provided with two sliding grooves 18. The inner walls of the two sliding grooves 18 are respectively fixedly connected with third limiting rods 19. The lower side surface of the first limiting plate 6 extends into the interior of the sliding groove 18 and is slidably sleeved on the outer surface of the third limiting rod 19. The adjacent side surfaces of the two first limiting plates 6 are respectively provided with telescopic grooves 20. The inner wall of the telescopic groove 20 is fixedly connected with a first spring 21. The other end of the first spring 21 is fixedly connected with a displacement rod 22. The end of the displacement rod 22 away from the first spring 21 is fixedly connected with a buffer plate 23. The left and right side surfaces of the vertical plate of the second limiting plate 9 are respectively provided with second telescopic grooves 24. A displacement plate 25 is slidably connected to the inner wall of the second telescopic groove 24. A second spring 26 is fixedly connected between the displacement plate 25 and the second telescopic groove 24. When the first limiting plate 6 moves, its movement track is restricted by the third limiting rod 19. At the same time, when the first limiting plate 6 moves, it will synchronously drive the buffer plate 23 to move. After the buffer plate 23 moves, it contacts the semiconductor chip, and a certain buffer distance is provided by the first spring 21. And when the first limiting plates 6 approach each other, they will drive the displacement plate 25 to contract into the interior of the second telescopic groove 24. When the displacement plate 25 moves, it will synchronously compress the second spring 26. When it is necessary to adjust the movement range of the first limiting plate 6 and the second limiting plate 9, the threaded rod 17 can be rotated. Since the movement track of the second push plate 14 is restricted by the second limiting rod 16, when the threaded rod 17 rotates, it will drive the second push plate 14 to move, thereby adjusting the length of the second push plate 14 extending out of the groove 13. Through the above structure, not only can a certain buffer distance be provided by the buffer plate 23 and the first spring 21 during the positioning process, but also the movement range of the second limiting plate 9 can be adjusted by the movement of the second push plate 14, thereby improving the adaptation range of the overall device.

[0026] Working principle: When dispensing glue on a semiconductor chip, the semiconductor chip is placed between two first limiting plates 6. Subsequently, the electric sliding table 4 is used to drive the glue dispensing plate 5 to move. When the glue dispensing plate 5 moves, it will synchronously drive the components above it. When the push plate 12 contacts the second push plate 14, the inclined surface of the second push plate 14 causes the two push plates 12 to approach each other. When the push plate 12 moves, it synchronously drives the second limiting plate 9 to move. When the second limiting plate 9 moves, the two limiting rods 8 are used to limit its movement trajectory. At the same time, when the second limiting plate 9 moves, it will synchronously drive the sliding rod 11 to move. Since the movement trajectory of the sliding rod 11 is indirectly limited by the limiting rod 8, when the sliding rod 11 moves, it will cooperate with the inclined groove 10 to drive the first limiting plate 6 to move horizontally. After the first limiting plate 6 and the second limiting plate 9 move, they position the semiconductor chip, thus facilitating subsequent glue dispensing. When the first limiting plate 6 moves, the third limiting rod 19 is used to limit its movement trajectory. At the same time, when the first limiting plate 6 moves, it will synchronously drive the buffer plate 23 to move. After the buffer plate 23 moves, it contacts the semiconductor chip and provides a certain buffer distance with the help of the first spring 21. And when the first limiting plates 6 approach each other, they will drive the displacement plate 25 to contract into the second telescopic groove 24. When the displacement plate 25 moves, it will synchronously compress the second spring 26. When it is necessary to adjust the movement range of the first limiting plate 6 and the second limiting plate 9, the threaded rod 17 can be rotated. Since the movement trajectory of the second push plate 14 is limited by the second limiting rod 16, when the threaded rod 17 rotates, it will drive the second push plate 14 to move, thereby adjusting the length of the second push plate 14 extending out of the groove 13.

[0027] The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the knowledge scope of those of ordinary skill in the art in the said technical field, various changes can be made without departing from the purpose of the present invention.

Claims

1. A novel semiconductor packaging device, comprising a dispensing station (1), characterized in that: The upper surface of the dispensing platform (1) is fixedly connected to a mounting frame (2), a dispensing device (3) is arranged on the mounting frame (2), an electric slide (4) is installed on the upper surface of the dispensing platform (1), a dispensing plate (5) is installed on the upper surface of the electric slide (4), a first limit plate (6) is slidably connected to the upper surface of the dispensing plate (5), two mounting plates (7) are fixedly connected to the upper surface of the dispensing plate (5), a limit rod (8) is fixedly connected between the two mounting plates (7), a second limit plate (9) is slidably sleeved on the outer surface of the limit rod (8), and the second limit plate (9) is slidably sleeved on the outer surface of the limit rod (8). The plate (9) is arranged in a T-shape, an oblique groove (10) is provided on the upper surface of the first limiting plate (6), a sliding rod (11) is fixedly connected to the lower surface of the second limiting plate (9), the sliding rod (11) is slidably connected inside the oblique groove (10), the opposite side surfaces of the two second limiting plates (9) are respectively fixedly connected to push plates (12), the left and right side surfaces of the push plates (12) are both arranged as inclined surfaces, and grooves (13) are respectively provided on the side surfaces of the two vertical plates of the mounting frame (2), and the second push plates (14) are slidably connected inside the grooves (13).

2. A novel semiconductor packaging device according to claim 1, characterized in that: The opposite side surfaces of the two second push plates (14) slide through the opposite side surface of the mounting frame (2), the upper and lower side surfaces of the second push plates (14) are respectively fixedly connected to the second mounting plates (15), and the opposite side surfaces of the two vertical plates of the mounting frame (2) are respectively fixedly connected to the second limiting rods (16).

3. A novel semiconductor packaging device according to claim 2, characterized in that: The second mounting plate (15) at the lower side is slidably sleeved on the outer surface of the second limiting rod (16), and the surfaces of the two opposite sides of the two vertical plates of the mounting frame (2) are rotatably connected with threaded rods (17).

4. A novel semiconductor packaging device according to claim 3, characterized in that: The second mounting plate (15) on the upper side is threadedly sleeved on the outer surface of the threaded rod (17), and two sliding grooves (18) are provided on the upper surface of the dispensing plate (5).

5. A novel semiconductor packaging device according to claim 4, characterized in that: The inner walls of the two sliding grooves (18) are fixedly connected to a third limiting rod (19), and the lower surface of the first limiting plate (6) extends into the interior of the sliding groove (18) and is slidably sleeved on the outer surface of the third limiting rod (19).

6. A novel semiconductor packaging device according to claim 1, characterized in that: A telescopic groove (20) is respectively formed on the adjacent side surfaces of the two first limiting plates (6), and a first spring (21) is fixedly connected to the inner wall of the telescopic groove (20).

7. A novel semiconductor packaging device according to claim 6, characterized in that: The other end of the first spring (21) is fixedly connected to a displacement rod (22), and one end of the displacement rod (22) away from the first spring (21) is fixedly connected to a buffer plate (23).

8. The novel semiconductor packaging device according to claim 1, characterized in that: The left and right side surfaces of the vertical plate of the second limit plate (9) are respectively provided with second telescopic grooves (24); the inner wall of the second telescopic groove (24) is slidably connected with a displacement plate (25); and a second spring (26) is fixedly connected between the displacement plate (25) and the second telescopic groove (24).

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