Die cooling device for copper substrate production

Abstract

The utility model discloses a mould cooling device for copper substrate production, which comprises a copper substrate processing table and a support rod fixedly connected to the bottom of the copper substrate processing table, a cooling box is fixed at the bottom of the support rod, a processing groove is arranged at the top of the cooling box, and the copper substrate processing table is positioned in the processing groove. Four box legs are fixedly connected to the bottom of the cooling box, two ventilation plates are fixedly connected to the inner walls of the two sides of the machining groove correspondingly, one side of each ventilation plate is fixedly connected with a set of air collecting covers, and two fixing devices used for clamping and fixing the copper substrate are arranged at the top of the copper substrate machining table. The mold cooling device for copper substrate production solves the problems that a traditional cooling mode often depends on natural heat dissipation, so that the heat dissipation efficiency is limited, and a large amount of heat generated in the high-strength machining process is difficult to deal with. And the processing quality and efficiency of the copper substrate are greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of copper substrate production, in particular to a mold cooling device for copper substrate production. Background Technique

[0002] In the production and processing of copper substrates, due to the physical properties of the material itself and the requirements of the processing technology, a large amount of heat is generated during processes such as cutting, stamping, and welding of copper substrates. If this heat cannot be dissipated in a timely and effective manner, it will not only cause a sharp rise in the temperature of the processing environment, affecting processing accuracy and stability, but may also cause irreversible damage to the copper substrate material itself, such as thermal stress concentration, deformation, and even burning. Therefore, ensuring effective heat dissipation during the copper substrate processing is a key link in improving product quality and ensuring production efficiency.

[0003] However, in the copper substrate processing devices widely used in the market at present, there are generally deficiencies in the heat dissipation design. Traditional cooling methods often rely on natural heat dissipation, resulting in limited heat dissipation efficiency and being difficult to cope with the large amount of heat generated during high-intensity processing. Especially inside the processing tank, the phenomenon of heat accumulation is more serious, leading to a rapid increase in the temperature in the processing area, thereby reducing the processing quality and efficiency of the copper substrate. Content of the Utility Model

[0004] The purpose of the utility model is to provide a mold cooling device for copper substrate production to solve the problems in copper substrate production mentioned in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A mold cooling device for copper substrate production, including a copper substrate processing table and support rods fixedly connected to the bottom of the copper substrate processing table. The bottom of the support rods is fixed with a cooling box. The top of the cooling box is provided with a processing tank, and the copper substrate processing table is located inside the processing tank. The bottom of the cooling box is fixedly connected with four box legs. Both inner walls of the two sides of the processing tank are fixedly connected with two ventilation plates. One side of each of the two ventilation plates is fixedly connected with a group of air collecting hoods. There are two fixing devices on the top of the copper substrate processing table for clamping and fixing the copper substrate. A cold air device for cooling the copper substrate is arranged inside the cooling box.

[0006] Preferably, the inside of the cooling box is in a hollow state, and a number of round holes are provided corresponding to the inside of the processing tank at the top of the cooling box. Ventilation holes are provided on the surfaces of both ventilation plates, and the ventilation holes on the surfaces of the two ventilation plates are connected to the internal space of the cooling box.

[0007] Preferably, both groups of the air collecting hoods are conical, and each group has six air collecting hoods. The six air collecting hoods are fixedly connected to the ventilation plate in a straight line. The thicker ends of each group of air collecting hoods are fixedly connected to the ventilation plate, and the thinner ends of each group of air collecting hoods are aligned with the top of the copper substrate processing table.

[0008] Preferably, both of the fixing devices include clamping blocks, moving blocks, electric telescopic rods, connecting plates and movable rods. An electric telescopic rod is fixedly connected to one side of the cooling box. The telescopic end of the electric telescopic rod penetrates through the cooling box and is fixedly connected to the moving block. A clamping block is movably connected to one side of the moving block. One end of the clamping block is movably connected to the movable rod. Both ends of the movable rod are fixedly connected to the cooling box through a group of connecting plates.

[0009] Preferably, arc-shaped grooves are formed on both sides of the clamping block. A limiting rod is movably connected to the inside of each of the two arc-shaped grooves, and a moving block is fixedly connected between the two limiting rods.

[0010] Preferably, the cold air device includes a cooling fan, an electric water pump, a connecting pipe, an evaporation pipe and a condensation pipe. A cooling fan is fixedly connected to the bottom of the cooling box. One end of the electric water pump is fixedly connected to the connecting pipe. One end of the connecting pipe is fixedly connected to the evaporation pipe. One end of the evaporation pipe is fixedly connected to the condensation pipe. One end of the condensation pipe is fixedly connected to one end of the electric water pump.

[0011] Preferably, the condensation pipe is a copper pipe, and the condensation pipe is fixedly connected to the inner wall of the cooling box through a group of fixing plates. The condensation pipe is arranged in an S shape between the group of fixing plates, and a refrigerant is filled in the condensation pipe.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] 1. Through the designed cold air device, including a cooling fan, an electric water pump, a connecting pipe, an evaporation pipe and a condensation pipe, the circulating flow of the refrigerant is realized, and combined with the wind generated by the cooling fan, the inside of the cooling box is filled with cold air. This design not only improves the cooling efficiency, but also ensures that the copper substrate can be cooled in a timely and uniform manner during the production and processing process, effectively preventing deformation or quality problems caused by high temperature.

[0014] 2. Through the fixing device composed of an electric telescopic rod, a moving block, a clamping block, a limiting rod and a movable rod, the accurate clamping and fixing of the copper substrate are realized. This design not only simplifies the operation process, improves the work efficiency, but also ensures the stability of the copper substrate during the processing process, avoiding processing errors caused by shaking or displacement.

[0015] 3. By arranging ventilation plates and air collecting hoods on the inner walls on both sides of the processing groove, introducing cold air into the air collecting hood through ventilation holes, and then concentrating and blowing it onto the copper substrate processing table. This design optimizes the distribution of air flow, enabling the cold air to act on the copper substrate more directly and effectively, further enhancing the cooling effect. Brief Description of the Drawings

[0016] Figure 1 is the overall view of the present utility model;

[0017] Figure 2 is the sectional view of the present utility model;

[0018] Figure 3 is the structural diagram of the fixing device of the present utility model;

[0019] Figure 4 is the structural diagram of the cold air device of the present utility model.

[0020] In the figure: 1. Copper substrate processing table; 2. Support rod; 3. Cooling box; 4. Box leg; 5. Processing groove; 6. Ventilation plate; 7. Air collecting hood; 8. Clamping block; 9. Moving block; 10. Limit rod; 11. Electric telescopic rod; 12. Connecting plate; 13. Movable rod; 14. Heat dissipation fan; 15. Electric water pump; 16. Connecting pipe; 17. Evaporation pipe; 18. Fixed plate; 19. Condensing pipe. Detailed Embodiment

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model.

[0022] Please refer to Figures 1-4 , the present utility model provides a mold cooling device for copper substrate production, including a copper substrate processing table 1 and support rods 2 fixedly connected to the bottom of the copper substrate processing table 1. The bottom of the support rods 2 is fixed with a cooling box 3. The top of the cooling box 3 is provided with a processing groove 5, and the copper substrate processing table 1 is located inside the processing groove 5. The bottom of the cooling box 3 is fixedly connected with four box legs 4. Both inner walls of the processing groove 5 are fixedly connected with two ventilation plates 6. One side of both ventilation plates 6 is fixedly connected with a group of air collecting hoods 7. There are two fixing devices on the top of the copper substrate processing table 1 for clamping and fixing the copper substrate. The inside of the cooling box 3 is provided with a cold air device for cooling the copper substrate.

[0023] Furthermore, the inside of the cooling box 3 is in a hollow state. The top of the cooling box 3 is provided with a number of round holes corresponding to the inside of the processing groove 5. Ventilation holes are provided on the surfaces of both ventilation plates 6, and the ventilation holes on the surfaces of both ventilation plates 6 are connected to the internal space of the cooling box 3.

[0024] Furthermore, the two sets of air collecting covers 7 are both conical, and each set has six air collecting covers 7. The six air collecting covers 7 are fixedly connected to the ventilation plate 6 in a straight line. The thicker ends of each set of air collecting covers 7 are fixedly connected to the ventilation plate 6, and the thinner ends of each set of air collecting covers 7 are aligned with the top of the copper substrate processing table 1.

[0025] Furthermore, the two fixing devices each include a clamping block 8, a moving block 9, an electric telescopic rod 11, a connecting plate 12, and a movable rod 13. One side of the cooling box 3 is fixedly connected to an electric telescopic rod 11. The telescopic end of the electric telescopic rod 11 penetrates through the cooling box 3 and is fixedly connected to a moving block 9. One side of the moving block 9 is movably connected to a clamping block 8. One end of the clamping block 8 is movably connected to a movable rod 13. Both ends of the movable rod 13 are fixedly connected to the cooling box 3 through a set of connecting plates 12.

[0026] Furthermore, arc-shaped grooves are formed on both sides of the clamping block 8. A limiting rod 10 is movably connected to the inside of each of the two arc-shaped grooves, and a moving block 9 is fixedly connected between the two limiting rods 10.

[0027] Furthermore, the cold air device includes a heat dissipation fan 14, an electric water pump 15, a connecting pipe 16, an evaporation pipe 17, and a condensation pipe 19. The bottom of the cooling box 3 is fixedly connected to a heat dissipation fan 14. One end of the electric water pump 15 is fixedly connected to a connecting pipe 16. One end of the connecting pipe 16 is fixedly connected to an evaporation pipe 17. One end of the evaporation pipe 17 is fixedly connected to a condensation pipe 19. One end of the condensation pipe 19 is fixedly connected to one end of the electric water pump 15.

[0028] Furthermore, the condensation pipe 19 is a copper pipe. The condensation pipe 19 is fixedly connected to the inner wall of the cooling box 3 through a set of fixing plates 18. The condensation pipe 19 is arranged in an S shape between the set of fixing plates 18, and a refrigerant is contained inside the condensation pipe 19.

[0029] In the use of the embodiment of the present application: When it is necessary to cool the copper substrate to be processed, first place the copper substrate to be processed on the copper substrate processing table 1 for production and processing. Then, by starting the electric telescopic rod 11, the telescopic end of the electric telescopic rod 11 pushes the moving block 9 to move, so that the moving block 9 drives the two limiting rods 10 to slide inside the arc grooves opened on both sides of the clamping block 8. When the two limiting rods 10 slide from the lower end to the upper end of the arc groove, one end of the clamping block 8 will perform a circular motion around the movable rod 13, so that one end of the clamping block 8 moves downward, thereby fixing the copper substrate on the top of the copper substrate processing table 1. Then start the cooling fan 14 to generate wind, and at the same time start the electric water pump 15, so that the refrigerant in the condensation pipe 19 flows through the connecting pipe 16 to the evaporation pipe 17, and then flows back to the condensation pipe 19 to form a circulating flow. When the wind generated by the cooling fan 14 blows to the condensation pipe 19, cold air is generated by the refrigerant in the condensation pipe 19. Then the inside of the cooling box 3 is filled with cold air. Then a part of the cold air blows to the copper substrate processing table 1 through the round holes opened on the cooling box 3 to cool the copper substrate on the copper substrate processing table 1. Then the other part of the cold air blows to the inside of the air collecting hood 7 through the air vents on the two ventilation plates 6, and then blows to the copper substrate on the copper substrate processing table 1 through the thinner end of the air collecting hood 7 for further cooling.

[0030] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A mold cooling device for copper substrate production, comprising a copper substrate processing platform (1) and a support rod (2) fixedly connected to the bottom of the copper substrate processing platform (1), characterized in that: A cooling box (3) is fixed at the bottom of the support rod (2), a processing groove (5) is provided at the top of the cooling box (3), and the copper substrate processing table (1) is located inside the processing groove (5), and four box legs (4) are fixedly connected to the bottom of the cooling box (3), two ventilation plates (6) are fixedly connected to the inner walls on both sides of the processing groove (5), and a group of air collecting hoods (7) are fixedly connected to one side of the two ventilation plates (6), and two fixing devices for clamping and fixing the copper substrate are provided at the top of the copper substrate processing table (1), and a cold air device for cooling the copper substrate is provided inside the cooling box (3).

2. A mold cooling device for copper substrate production according to claim 1, characterized in that: The interior of the cooling box (3) is hollow, and a plurality of circular holes are provided on the top of the cooling box (3) corresponding to the interior of the processing groove (5), and ventilation holes are provided on the surfaces of the two ventilation plates (6), and the ventilation holes on the surfaces of the two ventilation plates (6) are connected to the internal space of the cooling box (3).

3. A mold cooling device for copper substrate production according to claim 1, characterized in that: The two groups of wind collecting covers (7) are both cone-shaped, and each group has six wind collecting covers (7). The six wind collecting covers (7) are fixedly connected to the ventilation plate (6) in a straight line, and the thicker end of each group of wind collecting covers (7) is fixedly connected to the ventilation plate (6), and the thinner end of each group of wind collecting covers (7) is aligned with the top of the copper base plate processing table (1).

4. The mold cooling device for copper substrate production according to claim 1, characterized in that: The two fixing devices both comprise a clamping block (8), a moving block (9), an electric telescopic rod (11), a connecting plate (12) and a movable rod (13); one side of the cooling box (3) is fixedly connected to the electric telescopic rod (11); the telescopic end of the electric telescopic rod (11) passes through the cooling box (3) and is fixedly connected to the moving block (9); one side of the moving block (9) is movably connected to the clamping block (8); one end of the clamping block (8) is movably connected to the movable rod (13); and both ends of the movable rod (13) are fixedly connected to the cooling box (3) via a set of connecting plates (12).

5. A mold cooling device for copper substrate production according to claim 4, characterized in that: Arc grooves are provided on both sides of the clamping block (8), and a limiting rod (10) is movably connected inside each of the two arc grooves, and a moving block (9) is fixedly connected between the two limiting rods (10).

6. The mold cooling device for copper substrate production according to claim 1, characterized in that: The cooling air device comprises a heat dissipation fan (14), an electric water pump (15), a connecting pipe (16), an evaporation pipe (17) and a condensation pipe (19); the bottom of the cooling box (3) is fixedly connected to the heat dissipation fan (14), one end of the electric water pump (15) is fixedly connected to the connecting pipe (16), one end of the connecting pipe (16) is fixedly connected to the evaporation pipe (17), one end of the evaporation pipe (17) is fixedly connected to the condensation pipe (19), and one end of the condensation pipe (19) is fixedly connected to one end of the electric water pump (15).

7. A mold cooling device for copper substrate production according to claim 6, characterized in that: The condenser (19) is a copper tube, and the condenser (19) is fixedly connected to the inner wall of the cooling box (3) through a group of fixing plates (18), and the condenser (19) is arranged in an S shape between the group of fixing plates (18), and the condenser (19) is filled with refrigerant.

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