Integrated semiconductor packaging mold

Abstract

The utility model discloses an integrated semiconductor packaging die which comprises a lower die base, a packaging groove is formed in the upper side of the lower die base, a lifting plate is arranged at the bottom in the packaging groove in an elastic sliding mode through supporting rods and first springs, and transverse telescopic supporting cylinders are arranged on the two sides of the upper end of the lifting plate through supporting plates. A transverse telescopic supporting cylinder is arranged on the upper side of the lifting plate of the packaging groove through a supporting plate, a semiconductor positioning clamping base is arranged at one end of the transverse telescopic supporting cylinder, an upper die cover is clamped in a positioning groove in the upper side of the packaging groove, and elastic positioning protrusions are arranged on the inner side of the positioning groove and clamped in locking grooves in the two sides of the upper die cover. And one end of the transverse telescopic supporting cylinder is provided with the semiconductor positioning clamping seats, and the integrated semiconductor is clamped between the two semiconductor positioning clamping seats for packaging treatment, so that the stability of packaging the semiconductor in a packaging mold is improved, the packaged semiconductor can be prevented from impacting the mold wall to be damaged, and the packaging use safety is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to an integrated semiconductor packaging mold. Background Art

[0002] Nowadays, with the increasing development of electronic technology, various household appliances in life are constantly updated, and there are various semiconductor components in the household appliances. Moreover, the quality of such semiconductor components directly affects the performance and service life of the household appliances. Semiconductor components exist in various different volumes and shapes, and they are all easily damaged. Therefore, semiconductor components need to be externally packaged before being used. However, the current packaging molds on the market are not conducive to installation and disassembly, and the steps are too complex, which causes great trouble to processing and production, has a great impact on the overall processing efficiency, and is not easy to limit and fix the packaging mold.

[0003] In the prior art, an integrated semiconductor packaging mold with the application number of 202122085078.6 includes a bottom box. By setting up devices such as the bottom box, a packaging cover plate, and a threaded rod in cooperation, the device can be easily installed and disassembled, and the packaging cover plate can be quickly removed, which is beneficial for workers to improve processing efficiency; by setting up devices such as a fixed block, a clamping block, and a spring in cooperation, the device can easily clamp and fix the packaging cover plate, avoiding the packaging cover plate from shifting during operation, resulting in an unsatisfactory packaging effect. However, the stability of the semiconductor during packaging in the packaging mold is poor, the semiconductor is easily damaged by colliding with the inner wall of the packaging mold, and it is not easy to disassemble and assemble the semiconductor. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an integrated semiconductor packaging mold to solve the problems in the prior art that the stability of the semiconductor during packaging in the packaging mold is poor, the semiconductor is easily damaged by colliding with the inner wall of the packaging mold, and it is not easy to disassemble and assemble the semiconductor.

[0005] To achieve the above purpose, the utility model provides the following technical solution: An integrated semiconductor packaging mold, including a lower mold base, an encapsulation groove is internally opened on the upper side of the lower mold base, a lifting plate is elastically slidably arranged at the bottom of the encapsulation groove through a support rod and a first spring, horizontal telescopic support cylinders are arranged at both sides of the upper end of the lifting plate through support plates, and a semiconductor positioning clamping seat is arranged at one end of the horizontal telescopic support cylinder. An upper mold cover is clamped in a positioning groove on the upper side of the encapsulation groove, elastic positioning protrusions are arranged inside the positioning groove, and the elastic positioning protrusions are clamped in locking grooves on both sides of the upper mold cover.

[0006] Further, both ends of the lifting plate are slidably sleeved outside the support rod, and the first spring is sleeved outside the lower part of the support rod.

[0007] Further, the support rods are vertically arranged at the bottom of the encapsulation groove, and multiple support rods are arranged in parallel.

[0008] Further, the transverse telescopic support cylinder and the semiconductor positioning card seat are symmetrically arranged with respect to the encapsulation groove, and the semiconductor positioning card seat is arranged as a C-shaped seat.

[0009] Further, the length of the semiconductor positioning card seat is less than the width of the encapsulation groove, and a protective pad is arranged in the inner wall card slot of the semiconductor positioning card seat.

[0010] Further, one end of the elastic positioning protrusion is slidably arranged in the chamber at the upper part of the lower die base through a limiting plate. One end of the limiting plate is provided with a pull rod that slidably penetrates through the lower die base, and a second spring is arranged in the chamber between the pull rod and the limiting plate.

[0011] Further, a sealing and anti-collision layer is arranged on the lower side of the upper die cover, and the sealing and anti-collision layer is made of a rubber cushion layer.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] 1. In the present utility model, since the upper side of the lifting plate of the encapsulation groove is provided with a transverse telescopic support cylinder through a support plate, and one end of the transverse telescopic support cylinder is provided with a semiconductor positioning card seat, the integrated semiconductor is clamped between the two semiconductor positioning card seats for encapsulation processing, which is beneficial to improving the stability of the semiconductor during encapsulation in the encapsulation mold, and at the same time can prevent the encapsulated semiconductor from hitting the mold wall and being damaged, improving the safety of encapsulation use, and having a simple structure and convenient disassembly and assembly.

[0014] 2. Moreover, in the present utility model, the bottom of the encapsulation groove is elastically slidably provided with a lifting plate through a support rod and a first spring, which is convenient for elastically sliding the lifting plate in the encapsulation groove. When the upper die cover is opened, the lifting plate is pushed upward under the action of the spring, so that the semiconductor positioning card seat moves out of the encapsulation groove, facilitating the disassembly, installation and fixing of the semiconductor.

[0015] 3. In the present utility model, an elastic positioning protrusion is arranged inside the positioning groove on the upper side of the encapsulation groove, and the elastic positioning protrusion is clamped in the locking grooves on both sides of the upper die cover, which is beneficial to improving the stability of the upper die cover being clamped and fixed on the upper side of the encapsulation groove, and the upper die cover is convenient, fast to disassemble and assemble. Description of the Drawings

[0016] The drawings are used to provide a further understanding of the present utility model, and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model, and do not constitute a limitation to the present utility model. In the drawings:

[0017] Figure 1 is the overall structural schematic diagram of the present utility model;

[0018] Figure 2It is the front view of the overall structure of the present utility model;

[0019] Figure 3 It is the schematic diagram of the lifting plate structure of the present utility model.

[0020] In the figure: 1, lower die base; 2, positioning groove; 3, upper die cover; 4, encapsulation groove; 5, lifting plate; 6, support rod; 7, first spring; 8, support plate; 9, horizontal telescopic support cylinder; 10, semiconductor positioning card seat; 11, elastic positioning protrusion; 12, chamber; 13, limit plate; 14, second spring; 15, pull rod; 16, locking groove; 17, clamping groove; 18, protective pad; 19, sealing and anti-collision layer. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figure 1 , Figure 2 , Figure 3 , in the embodiments of the present utility model, an integrated semiconductor encapsulation mold includes a lower die base 1. An encapsulation groove 4 is opened inside the upper side of the lower die base 1. The bottom of the encapsulation groove 4 is elastically slidably provided with a lifting plate 5 through a support rod 6 and a first spring 7, which facilitates elastically sliding the lifting plate 5 in the encapsulation groove 4. Moreover, when the upper die cover 3 is opened, the lifting plate 5 is pushed upward under the action of the first spring 7 to move the semiconductor positioning card seat 10 out of the encapsulation groove 4, facilitating the disassembly, installation and fixation of the semiconductor. Both sides of the upper end of the lifting plate 5 are provided with a horizontal telescopic support cylinder 9 through a support plate 8, and a semiconductor positioning card seat 10 is provided at one end of the horizontal telescopic support cylinder 9, which facilitates clamping the integrated semiconductor between the two semiconductor positioning card seats 10 for encapsulation processing, is beneficial to improving the stability of the semiconductor encapsulation in the encapsulation mold, and can prevent the encapsulated semiconductor from hitting the die wall and being damaged, improving the safety of the encapsulation use. Moreover, the structure is simple, the disassembly and installation are convenient. The positioning groove 2 on the upper side of the encapsulation groove 4 is clamped with the upper die cover 3. An elastic positioning protrusion 11 is arranged inside the positioning groove 2, and the elastic positioning protrusion 11 is clamped in the locking grooves 16 on both sides of the upper die cover 3, which is beneficial to improving the stability of the upper die cover 3 being clamped and fixed on the upper side of the encapsulation groove 4, and the disassembly and installation of the upper die cover are convenient and fast.

[0023] Preferably, both ends of the lifting plate 5 are slidably sleeved outside the support rod 6, the first spring 7 is sleeved outside the lower part of the support rod 6, the support rod 6 is vertically arranged at the bottom of the encapsulation groove 4, and a plurality of support rods 6 are arranged in parallel, which is convenient for vertically sliding the lifting plate 5 in the encapsulation groove 4, and the stability of the sliding connection is relatively high.

[0024] Preferably, the transverse telescopic support cylinder 9 and the semiconductor positioning card seat 10 are symmetrically arranged with respect to the encapsulation groove 4. The transverse telescopic support cylinder 9 includes a first support cylinder and a second support cylinder provided therein, and one end of the second support cylinder is elastically slidably arranged in the first support cylinder through a limiting plate and a spring, which is used for performing a transverse elastic sliding setting process on one end of the semiconductor positioning card seat 10. The semiconductor positioning card seat 10 is arranged as a U-shaped seat, the length of the semiconductor positioning card seat 10 is less than the width of the encapsulation groove 4, and a protective pad 18 is arranged in the inner wall card slot 17 of the semiconductor positioning card seat 10, so that it is convenient to perform a clamping and positioning process on the semiconductor in the coming year, and the stability of the clamping and fixing is relatively high.

[0025] Preferably, one end of the elastic positioning protrusion 11 is slidably arranged in the chamber 12 on the upper part of the lower die base 1 through a limiting plate 13. One end of the limiting plate 13 is provided with a pull rod 15 that slidably penetrates the lower die base 1, and a second spring 14 is arranged in the chamber 12 between the pull rod 15 and the limiting plate 13, so that it is convenient to elastically slide one end of the elastic positioning protrusion 11 on the inner wall of the positioning groove 2, and it is convenient to better perform a clamping and positioning process on both sides of the upper die cover 3.

[0026] Preferably, a sealing and anti-collision layer 19 is arranged on the lower side of the upper die cover 3, and the sealing and anti-collision layer 19 is made of a rubber cushion layer, which is convenient for improving the sealing performance of the lower side of the upper die cover 3 when it is clamped on the upper part of the encapsulation groove 4.

[0027] The working principle and usage process of the present utility model: When in use, open the upper die cover 3, the lifting plate 5 is jacked up under the action of the first spring 7, so that the semiconductor positioning card seat 10 moves out of the encapsulation groove 4, the integrated semiconductor is clamped between the two semiconductor positioning card seats 10 for encapsulation processing, cover the upper die cover 3 and press the fixed semiconductor downward into the encapsulation groove 4 for storage, thereby completing the encapsulation of the semiconductor. The stability of the semiconductor encapsulated in the encapsulation mold is relatively high, and at the same time, it can prevent the encapsulated semiconductor from hitting the mold wall and being damaged, improving the safety of the encapsulation use, and the structure is simple and convenient to disassemble and assemble.

[0028] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An integrated semiconductor packaging mold, comprising a lower mold base (1), characterized in that: A packaging groove (4) is provided inside the upper side of the lower mold base (1); a lifting plate (5) is elastically slidably provided at the bottom of the packaging groove (4) through a support rod (6) and a first spring (7); transverse telescopic support tubes (9) are provided on both sides of the upper end of the lifting plate (5) through a support plate (8); and a semiconductor positioning seat (10) is provided at one end of the transverse telescopic support tube (9); an upper mold cover (3) is clamped in the positioning groove (2) on the upper side of the packaging groove (4); an elastic positioning protrusion (11) is provided inside the positioning groove (2), and the elastic positioning protrusion (11) is clamped in the locking grooves (16) on both sides of the upper mold cover (3).

2. The integrated semiconductor packaging mold according to claim 1, characterized in that: The two ends of the lifting plate (5) are slidably sleeved on the outside of the support rod (6), and the first spring (7) is sleeved on the outside of the lower part of the support rod (6).

3. The integrated semiconductor packaging mold according to claim 2, characterized in that: The support rod (6) is vertically arranged at the bottom of the packaging groove (4), and a plurality of support rods (6) are arranged in parallel.

4. The integrated semiconductor packaging mold according to claim 1, characterized in that: The transverse telescopic support tube (9) and the semiconductor positioning card seat (10) are symmetrically arranged with respect to the packaging slot (4), and the semiconductor positioning card seat (10) is arranged in a U-shaped seat.

5. The integrated semiconductor packaging mold according to claim 4, characterized in that: The length of the semiconductor positioning card seat (10) is smaller than the width of the packaging slot (4), and a protective pad (18) is provided in the inner wall slot (17) of the semiconductor positioning card seat (10).

6. The integrated semiconductor packaging mold according to claim 1, characterized in that: One end of the elastic positioning protrusion (11) is slidably arranged in the cavity (12) at the upper part of the lower mold base (1) through a limiting plate (13); one end of the limiting plate (13) is provided with a pull rod (15) which slides through the lower mold base (1), and a second spring (14) is provided in the cavity (12) between the pull rod (15) and the limiting plate (13).

7. The integrated semiconductor packaging mold according to claim 1, characterized in that: A sealing anti-collision layer (19) is provided on the lower side of the upper mold cover (3), and the sealing anti-collision layer (19) adopts a rubber cushion layer.

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