Semiconductor layer antistatic adhesive tape production device

Abstract

The utility model discloses a semiconductor layer antistatic adhesive tape production device which comprises a first supporting frame, a conveying device and a second supporting frame, one side of the outer surface of the first supporting frame is rotationally connected with a supporting rod, and one side of the outer surface of the supporting rod is fixedly connected with a first rotating wheel. A first motor is fixedly mounted on one side of the outer surface of the first supporting frame, a second rotating wheel is fixedly connected to the output end of the first motor, and a conveying belt is in lap joint with one side of the outer surface of the first rotating wheel. According to the semiconductor layer antistatic adhesive tape production device, through the arrangement of a first supporting frame, a supporting rod, a first rotating wheel, a first motor, a second rotating wheel, a conveying belt and a cleaning brush, when a worker needs to produce a semiconductor layer during use, the first motor is started, the second rotating wheel is driven to rotate through the conveying belt and the first rotating wheel, and the supporting rod is lifted upwards; the position of the cleaning brush is adjusted, and dust on the semiconductor material is cleaned.

Description

Technical Field

[0001] The utility model relates to the technical field of antistatic tape production for semiconductor layers, and particularly relates to an antistatic tape production device for semiconductor layers. Background Art

[0002] The antistatic tape for semiconductor layers is an important material used in the semiconductor industry. It has antistatic properties and can effectively avoid the influence of static electricity on semiconductor products. The production of this special tape requires a dedicated production device to ensure product quality and production efficiency. Such a production device usually includes equipment such as a laminator, a coater, and a curing furnace, and completes the production process of the tape through multiple processes. Among them, the laminator is used to laminate various materials together, and the coater is used to coat antistatic substances.

[0003] In the currently existing production devices, when performing antistatic processing on the semiconductor coating, dust appears on the surface. The surface dust and impurities will cause static electricity on the tape surface, and then adsorb more dust and impurities. The static electricity may damage the semiconductor products and affect the working stability. Moreover, for substrates with specific sizes or shapes, if the height of the coater cannot be adjusted, it may limit the production adaptability. The inability to adjust the height of the coater may result in the inability to coat the required position or surface, affecting the efficiency of semiconductor antistatic processing. Summary of the Utility Model

[0004] The main purpose of the utility model is to provide an antistatic tape production device for semiconductor layers, which can effectively solve the problems in the background art.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0006] An antistatic tape production device for semiconductor layers includes a first support frame, a conveying device, and a second support frame. One side of the outer surface of the first support frame is rotatably connected with a support rod. One side of the outer surface of the support rod is fixedly connected with a first runner. One side of the outer surface of the first support frame is fixedly installed with a first motor. The output end of the first motor is fixedly connected with a second runner. One side of the outer surface of the first runner is lapped with a conveyor belt; the second runner is lapped with the conveyor belt. One side of the inner wall of the support rod is rotatably connected with a cleaning brush.

[0007] In order to have the function of adjusting the position of the coater, as a production device for antistatic tapes for semiconductor layers of the present utility model, one side of the upper surface of the first support frame is fixedly connected with a first support shell. One side of the inner wall of the first support shell is rotatably connected with a threaded rod. One side of the upper surface of the first support shell is fixedly installed with a second motor. The output end of the second motor penetrates through one side of the outer surface of the first support shell and extends to one side of the inner wall of the first support shell. The output end of the second motor is fixedly connected with the threaded rod. One side of the outer surface of the threaded rod is threadedly connected with a first support block. One side of the inner wall of the first support block is fixedly connected with a coater.

[0008] In order to have the effect of providing material support, as a production device for antistatic tapes for semiconductor layers of the present utility model, a coating roll is movably connected to one side of the upper surface of the first support frame.

[0009] In order to have the function of heating, as a production device for antistatic tapes for semiconductor layers of the present utility model, one side of the upper surface of the second support frame is fixedly connected with a heating shell, and one side of the inner wall of the heating shell is fixedly connected with a heating rod.

[0010] In order to have the function of uniform coating, as a production device for antistatic tapes for semiconductor layers of the present utility model, one side of the upper surface of the first support frame is fixedly connected with a first support plate. One side of the inner wall of the first support plate is rotatably connected with a first roller. One side of the inner wall of the first support plate is rotatably connected with a second roller. One side of the outer surface of the first support plate is fixedly installed with a third motor. The output end of the third motor penetrates through one side of the outer surface of the first support plate and extends to one side of the inner wall of the first support plate. The output end of the third motor is fixedly connected with the second roller.

[0011] Compared with the prior art, the present utility model has the following beneficial effects:

[0012] 1. In the present utility model, through the settings of the first support frame, support rod, first runner, first motor, second runner, conveyor belt and cleaning brush, during use, when the staff needs to produce a semiconductor layer, by starting the first motor, through the conveyor belt, the first runner drives the second runner to rotate, lifting the support rod upward to adjust the position of the cleaning brush and clean the dust on the semiconductor material.

[0013] 2. In the present utility model, through the settings of the first support shell, threaded rod, second motor, first support block and coater, during use, the staff uses the coater to apply antistatic to the semiconductor. By starting the second motor, the threaded rod rotates, and the first support block moves up and down through threaded connection to achieve the effect of adjusting the position of the coater up and down. Description of the Drawings

[0014] Figure 1 The front view structural schematic diagram of the embodiment of the present utility model;

[0015] Figure 2 The structural schematic diagram of the paint roll of the embodiment of the present utility model;

[0016] Figure 3 The structural schematic diagram of the cleaning brush of the embodiment of the present utility model;

[0017] Figure 4 The structural schematic diagram of the paint applicator of the embodiment of the present utility model;

[0018] Figure 5 The structural schematic diagram of the conveying device of the embodiment of the present utility model.

[0019] In the figure: 1. The first support frame; 2. The conveying device; 3. The second support frame; 4. The support rod; 5. The first runner; 6. The first motor; 7. The second runner; 8. The conveyor belt; 9. The cleaning brush; 10. The first support shell; 11. The threaded rod; 12. The second motor; 13. The first support block; 14. The paint applicator; 15. The paint roll; 16. The heating shell; 17. The heating rod; 18. The first support plate; 19. The first roller; 20. The second roller; 21. The third motor. Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] Embodiment 1

[0022] As Figures 1-5 shown, a semiconductor layer antistatic tape production device includes a first support frame 1, a conveying device 2, and a second support frame 3. One side of the outer surface of the first support frame 1 is rotatably connected to a support rod 4. One side of the outer surface of the support rod 4 is fixedly connected to a first runner 5. One side of the outer surface of the first support frame 1 is fixedly installed with a first motor 6. The output end of the first motor 6 is fixedly connected to a second runner 7. One side of the outer surface of the first runner 5 is lapped with a conveyor belt 8;

[0023] In this embodiment, the second runner 7 is lapped with the conveyor belt 8. One side of the inner wall of the support rod 4 is rotatably connected to a cleaning brush 9.

[0024] During specific use, when the staff produces the semiconductor layer, by starting the first motor 6, through the conveyor belt 8, the first runner 5 drives the second runner 7 to rotate, lifting the support rod 4 upward to adjust the position of the cleaning brush 9 and clean the dust on the semiconductor.

[0025] In this embodiment, on one side of the upper surface of the first support frame 1, a first support shell 10 is fixedly connected. On one side of the inner wall of the first support shell 10, a threaded rod 11 is rotatably connected. On one side of the upper surface of the first support shell 10, a second motor 12 is fixedly installed. The output end of the second motor 12 penetrates through one side of the outer surface of the first support shell 10 and extends to one side of the inner wall of the first support shell 10. The output end of the second motor 12 is fixedly connected to the threaded rod 11. On one side of the outer surface of the threaded rod 11, a first support block 13 is threadedly connected. On one side of the inner wall of the first support block 13, a coater 14 is fixedly connected.

[0026] During specific use, the staff anti - staticizes the semiconductor through the coater 14. By starting the second motor 12, the threaded rod 11 rotates, and the first support block 13 adjusts its up - and - down movement through threaded connection, achieving the effect of adjusting the up - and - down position of the coater 14.

[0027] In this embodiment, a coating roll 15 is movably connected to one side of the upper surface of the first support frame 1.

[0028] During specific use, the coating on the coating roll 15 is released and transported, achieving the effect of transporting semiconductor coating.

[0029] In this embodiment, on one side of the upper surface of the second support frame 3, a heating shell 16 is fixedly connected, and on one side of the inner wall of the heating shell 16, a heating rod 17 is fixedly connected.

[0030] During specific use, the heating shell 16 is usually an external protective shell for fixing and protecting the heating rod 17. The function of the heating shell 16 is to place the heating rod 17 in a controlled environment to ensure the heating effect and safety.

[0031] In this embodiment, on one side of the upper surface of the first support frame 1, a first support plate 18 is fixedly connected. On one side of the inner wall of the first support plate 18, a first roller 19 is rotatably connected. On one side of the inner wall of the first support plate 18, a second roller 20 is rotatably connected. On one side of the outer surface of the first support plate 18, a third motor 21 is fixedly installed. The output end of the third motor 21 penetrates through one side of the outer surface of the first support plate 18 and extends to one side of the inner wall of the first support plate 18. The output end of the third motor 21 is fixedly connected to the second roller 20.

[0032] During specific use, when the coating is evenly applied, by dropping the anti-static coating onto the semiconductor layer, starting the third motor 21 to rotate the second roller 20, passing the semiconductor coating through the first roller 19, and rotating the second roller 20, the anti-static material is evenly coated on the surface of the semiconductor layer to achieve the purpose of improving the anti-static performance of the tape.

[0033] Working principle: During use, the coating on the coating roll 15 is released and conveyed. The heating shell 16 is usually an external protective shell for fixing and protecting the heating rod 17. The function of the heating shell 16 is to place the heating rod 17 in a controlled environment to ensure the heating effect. Start the first motor 6, and through the conveyor belt 8, the first runner 5 drives the second runner 7 to rotate, lifting the support rod 4 upward to adjust the position of the cleaning brush 9 to clean the dust on the semiconductor. The staff applies anti-static treatment to the semiconductor through the coater 14. By starting the second motor 12, the threaded rod 11 rotates, and the first support block 13 moves up and down through threaded connection to adjust the position of the coater 14 up and down, dropping the coating material onto the semiconductor layer. Start the third motor 21 to rotate the second roller 20, pass the semiconductor coating through the first roller 19, and rotate the second roller 20 to evenly coat the anti-static material on the surface of the semiconductor layer to improve the anti-static performance of the tape. Through the conveying device 2, the anti-static tape of the semiconductor layer is manually packed to complete the use of the device.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor layer antistatic tape production device, comprising a first support frame (1), a conveying device (2) and a second support frame (3), characterized in that: A support rod (4) is rotatably connected to one side of the outer surface of the first support frame (1); a first rotating wheel (5) is fixedly connected to one side of the outer surface of the support rod (4); a first motor (6) is fixedly installed on one side of the outer surface of the first support frame (1); an output end of the first motor (6) is fixedly connected to a second rotating wheel (7); a conveyor belt (8) is overlapped on one side of the outer surface of the first rotating wheel (5); the second rotating wheel (7) overlaps the conveyor belt (8); and a cleaning brush (9) is rotatably connected to one side of the inner wall of the support rod (4).

2. The semiconductor layer antistatic tape production device according to claim 1, characterized in that: A first support shell (10) is fixedly connected to one side of the upper surface of the first support frame (1), a threaded rod (11) is rotatably connected to one side of the inner wall of the first support shell (10), a second motor (12) is fixedly installed to one side of the upper surface of the first support shell (10), an output end of the second motor (12) passes through one side of the outer surface of the first support shell (10) and extends to one side of the inner wall of the first support shell (10), the output end of the second motor (12) is fixedly connected to the threaded rod (11), a first support block (13) is threadedly connected to one side of the outer surface of the threaded rod (11), and a coating device (14) is fixedly connected to one side of the inner wall of the first support block (13).

3. The semiconductor layer antistatic tape production device according to claim 1, characterized in that: A coating roll (15) is movably connected to one side of the upper surface of the first support frame (1).

4. The semiconductor layer antistatic tape production device according to claim 1, characterized in that: A heating shell (16) is fixedly connected to one side of the upper surface of the second support frame (3), and a heating rod (17) is fixedly connected to one side of the inner wall of the heating shell (16).

5. The semiconductor layer antistatic tape production device according to claim 1, characterized in that: A first support plate (18) is fixedly connected to one side of the upper surface of the first support frame (1); a first roller (19) is rotatably connected to one side of the inner wall of the first support plate (18); a second roller (20) is rotatably connected to one side of the inner wall of the first support plate (18); a third motor (21) is fixedly installed on one side of the outer surface of the first support plate (18); an output end of the third motor (21) passes through one side of the outer surface of the first support plate (18) and extends to one side of the inner wall of the first support plate (18); and the output end of the third motor (21) is fixedly connected to the second roller (20).

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