Photovoltaic solar cell electroplating device
By introducing a visual monitoring mechanism into the photovoltaic solar cell plating device, the internal situation of the plating tank is monitored in real time, the problems of incomplete bubbles, liquid filling and incomplete electroplating surface during the electroplating process are solved, and the plating quality and production efficiency are improved.
Patent Information
- Application Number
- CN202422016160.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-19
AI Technical Summary
During the electroplating process of photovoltaic solar cells, there are problems such as bubbles, incomplete liquid filling and incomplete electroplating of silicon wafer electroplating surfaces, which leads to the generation of poor electroplating products and affects production efficiency.
A photovoltaic solar cell plating device is designed, including an anode, a cathode, a transport mechanism, an electroplating tank and a visual monitoring mechanism. By setting up a visual monitoring mechanism outside the electroplating tank, using transparent parts to monitor the internal conditions of the electroplating tank in real time, identifying the bubbles, liquid filling conditions and electroplating status, and promptly intervening and solving the problem.
It effectively avoids the occurrence of electroplating defective products, improves the plating quality and production efficiency, and ensures the stability and reliability of the electroplating process.
Smart Images

Figure CN222961585U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating of photovoltaic solar cells, in particular to an electroplating device for photovoltaic solar cells. Background Art
[0002] With the development of the photovoltaic industry, the application of electroplating technology in the solar cell industry has gradually emerged, and electroplating nickel / copper / tin is used to replace silver to reduce costs and increase efficiency. At present, the main hardware structure of silicon wafer electroplating equipment is an electroplating tank, a cathode, an anode and a light source, and electroplating is completed by contacting the silicon wafer with the cathode in the electroplating tank. However, during the electroplating process, problems such as bubbles, incomplete liquid supply, and incomplete electroplating on the electroplated surface of the silicon wafer often occur, resulting in the production of defective electroplated products and affecting production efficiency. Summary of the Utility Model
[0003] The purpose of the utility model is to provide an electroplating device for photovoltaic solar cells, so as to solve the technical problems in the prior art that bubbles, incomplete liquid supply, and incomplete electroplating on the electroplated surface of the silicon wafer occur during the electroplating process, resulting in the production of defective electroplated products and affecting production efficiency.
[0004] An electroplating device for photovoltaic solar cells provided by the utility model is used for electroplating battery wafers and comprises: an anode, a cathode, a conveying mechanism, an electroplating tank and a visual monitoring mechanism;
[0005] The anode is arranged in the electroplating tank, the cathode is arranged on the conveying mechanism and is used for contacting the battery wafer, and the conveying mechanism is used for conveying the battery wafer for electroplating;
[0006] A transparent part is arranged on the tank wall of the electroplating tank, the visual monitoring mechanism is arranged outside the electroplating tank, and obtains an image in the electroplating tank through the transparent part.
[0007] As a further technical solution, the visual monitoring mechanism comprises a camera, an image analysis module and a display module;
[0008] The camera is arranged at the transparent part and is used for obtaining an image in the electroplating tank;
[0009] The image analysis module is used for analyzing the image in the electroplating tank to obtain the state information in the electroplating tank;
[0010] The display module is used for displaying the state information in the electroplating tank.
[0011] As a further technical solution, the display module is further used for displaying the image in the electroplating tank.
[0012] As a further technical solution, the visual monitoring mechanism further includes an alarm module, and the alarm module alarms based on the status information in the electroplating tank.
[0013] As a further technical solution, the electroplating tank includes an inner tank and an outer tank, and the outer tank surrounds the inner tank;
[0014] The anode is arranged in the inner tank, and a liquid inlet and the transparent part are arranged on the bottom wall of the inner tank;
[0015] A liquid discharge port is arranged on the bottom wall of the outer tank, and the outer tank is used for recovering the electroplating solution overflowing from the inner tank.
[0016] As a further technical solution, a circulation pump, a liquid inlet pipe and a liquid return pipe are further included;
[0017] One end of the liquid inlet pipe is communicated with the liquid inlet, and the other end is communicated with the outlet of the circulation pump;
[0018] One end of the liquid return pipe is communicated with the liquid discharge port, and the other end is communicated with the inlet of the circulation pump.
[0019] As a further technical solution, a liquid storage tank is further included, the liquid storage tank is arranged between the liquid return pipe and the circulation pump, and both the liquid return pipe and the circulation pump are communicated with the liquid storage tank.
[0020] As a further technical solution, the electroplating tank includes a tank body;
[0021] The transparent parts are arranged on both the side wall and the bottom wall of the tank body.
[0022] As a further technical solution, the conveying mechanism includes a suction cup and a robotic arm, and the suction cup is arranged on the robotic arm;
[0023] The cathode is arranged on the suction cup.
[0024] As a further technical solution, the conveying mechanism includes a plurality of guide rollers arranged in the electroplating tank, and the cathode is arranged on at least one of the guide rollers.
[0025] Compared with the prior art, the technical advantages of a photovoltaic solar cell electroplating device provided by the present utility model are as follows:
[0026] The electroplating device for photovoltaic solar cells provided by the present utility model is used for electroplating cell wafers, and includes: an anode, a cathode, a conveying mechanism, an electroplating tank, and a visual monitoring mechanism; the anode is arranged in the electroplating tank, the cathode is arranged on the conveying mechanism and is used to contact the cell wafers, and the conveying mechanism is used to convey the cell wafers for electroplating; a transparent part is arranged on the tank wall of the electroplating tank, the visual monitoring mechanism is arranged outside the electroplating tank, and obtains the image inside the electroplating tank through the transparent part.
[0027] A visual monitoring mechanism is arranged outside the electroplating tank, and the internal situation of the electroplating tank is monitored in real time through the transparent part on the electroplating tank and the image is obtained. The bubble situation, the liquid supply situation, and the electroplating state of the cell wafers are identified through the internal image of the electroplating tank. If there are problems such as bubbles, incomplete liquid supply, and incomplete electroplating on the electroplating surface of the silicon wafer, timely intervention and solution are carried out to ensure the electroplating quality of the cell wafers, avoid the generation of defective products, and improve production efficiency.
[0028] Other features and advantages of the present utility model will be described in detail in the subsequent specific implementation part. Description of the Drawings
[0029] In order to more clearly illustrate the specific implementation manners of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required to be used in the description of the specific implementation manners or the prior art. Obviously, the drawings in the following description are some implementation manners of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0030] Figure 1 It is a schematic structural diagram of an electroplating device for photovoltaic solar cells in a structural form provided by an embodiment of the present utility model;
[0031] Figure 2 It is a schematic structural diagram of an electroplating device for photovoltaic solar cells in another structural form provided by an embodiment of the present utility model.
[0032] Icons: 1 - cell wafer; 2 - anode; 3 - cathode; 4 - transparent part; 5 - camera; 6 - inner tank; 7 - outer tank; 8 - circulation pump; 9 - liquid inlet pipe; 10 - liquid return pipe; 11 - liquid storage tank; 12 - tank body; 13 - suction cup; 14 - guide roller; 15 - power supply; 16 - computer. Specific Implementation Manner
[0033] The following will clearly and completely describe the technical solutions of the present utility model in combination with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments of the present utility model belong to the scope of protection of the present utility model.
[0034] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0035] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0036] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions appears to be contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0037] The following further describes the present utility model in detail through specific embodiments and in conjunction with the drawings.
[0038] The specific structure is as Figure 1 and Figure 2 shown.
[0039] This embodiment provides a photovoltaic solar cell electroplating device for electroplating a battery cell 1, including: an anode 2, a cathode 3, a conveying mechanism, an electroplating tank, and a visual monitoring mechanism;
[0040] The anode 2 is disposed in the electroplating tank, the cathode 3 is disposed on the conveying mechanism and is used to contact the battery cell 1, and the conveying mechanism is used to convey the battery cell 1 for electroplating;
[0041] A transparent portion 4 is provided on the tank wall of the electroplating tank, and the visual monitoring mechanism is disposed outside the electroplating tank and acquires an image inside the electroplating tank through the transparent portion 4.
[0042] In this embodiment, a visual monitoring mechanism is arranged outside the electroplating tank. The internal situation of the electroplating tank is monitored in real time through the transparent part 4 on the electroplating tank, and an image is obtained. The bubble situation, liquid supply situation, and electroplating state of the solar cell 1 are identified through the internal image of the electroplating tank. When there are problems such as bubbles, incomplete liquid supply, and incomplete electroplating on the electroplating surface of the silicon wafer, timely intervention and solution are carried out to ensure the electroplating quality of the solar cell 1, avoid the generation of defective products, and improve production efficiency.
[0043] In this embodiment, both the cathode 3 and the anode 2 are connected to the power supply 15. The anode 2 is an insoluble anode 2, where the insoluble anode 2 is a titanium anode 2 or a titanium anode 2 with an iridium ruthenium alloy coating on its surface. The cathode 3 is connected to the negative pole of the power supply 15 through a terminal, and the anode 2 is connected to the positive pole of the power supply 15 through a terminal.
[0044] In this embodiment, a light source is arranged at the bottom or side of the electroplating tank, and the color of the light source is one or several of green light, white light, and red light.
[0045] In an alternative technical solution of this embodiment, the visual monitoring mechanism includes a camera 5, an image analysis module, and a display module;
[0046] The camera 5 is arranged at the transparent part 4 and is used to obtain the image inside the electroplating tank;
[0047] The image analysis module is used to analyze the image inside the electroplating tank and obtain the status information inside the electroplating tank;
[0048] The display module is used to display the status information inside the electroplating tank.
[0049] In this embodiment, the camera 5 is connected to the computer 16. The camera 5 obtains the image inside the electroplating tank through the transparent part 4 and transmits it to the computer 16. The computer 16 includes an image analysis module and a display module (i.e., a monitor). The image analysis module is pre-loaded with a large number of images with problems such as bubbles, incomplete liquid supply, and incomplete electroplating on the electroplating surface of the silicon wafer. The image obtained by the camera 5 is compared with the images pre-loaded in the image analysis module. When the similarity is greater than 95%, it is determined that there is a problem corresponding to the image, and the status information indicating that there is a problem inside the electroplating tank is obtained. Otherwise, the status information indicating that there is no problem inside the electroplating tank is obtained. The status information inside the electroplating tank is displayed through the display module. Through the visual monitoring mechanism, the problem type can be automatically identified, which is convenient for targeted adjustment, has a high degree of automation, saves manpower, and can handle problems faster.
[0050] In an alternative technical solution of this embodiment, the display module is further used to display the image inside the electroplating tank. The display module can not only display the status information inside the electroplating tank, but also display the image inside the electroplating tank, which is convenient for people to observe the situation inside the electroplating tank and improves applicability.
[0051] It should be noted that the visual monitoring mechanism may also include only the camera 5 and the display module. The camera 5 obtains the image inside the electroplating tank through the transparent part 4 and transmits it to the display module for display, and manual observation is carried out to judge whether there are problems.
[0052] In an alternative technical solution of this embodiment, the visual monitoring mechanism further includes an alarm module, and the alarm module alarms based on the status information inside the electroplating tank.
[0053] In this embodiment, when the status information indicating that there are problems inside the electroplating tank is obtained, the alarm module can automatically alarm to remind the staff to solve it in time and avoid losses.
[0054] In an alternative technical solution of this embodiment, it is a structural form of the electroplating tank. The electroplating tank includes an inner tank 6 and an outer tank 7, and the outer tank 7 surrounds the inner tank 6;
[0055] The anode 2 is arranged in the inner tank 6, and the bottom wall of the inner tank 6 is provided with a liquid inlet and the transparent part 4;
[0056] The bottom wall of the outer tank 7 is provided with a liquid discharge port, and the outer tank 7 is used to recover the electroplating solution overflowing from the inner tank 6.
[0057] In this embodiment, the electroplating solution is injected into the inner tank 6 through the liquid inlet. After the electroplating solution in the inner tank 6 overflows, it can enter the outer tank 7 and be discharged through the liquid discharge port, avoiding the leakage of the electroplating solution. The camera 5 is arranged at the bottom of the inner tank 6, and obtains the image inside the inner tank 6 through the transparent part 4 on the bottom wall of the inner tank 6. The overall structure is simple and the electroplating effect is stable.
[0058] In an alternative technical solution of this embodiment, it further includes a circulation pump 8, a liquid inlet pipe 9 and a liquid return pipe 10;
[0059] One end of the liquid inlet pipe 9 is communicated with the liquid inlet, and the other end is communicated with the outlet of the circulation pump 8;
[0060] One end of the liquid return pipe 10 is communicated with the liquid discharge port, and the other end is communicated with the inlet of the circulation pump 8.
[0061] In this embodiment, the electroplating solution is circulated between the inner tank 6 and the outer tank 7 through the circulation pump 8, the liquid inlet pipe 9 and the liquid return pipe 10, and recycling saves costs.
[0062] In an alternative technical solution of this embodiment, it further includes a liquid storage tank 11. The liquid storage tank 11 is arranged between the liquid return pipe 10 and the circulation pump 8, and both the liquid return pipe 10 and the circulation pump 8 are communicated with the liquid storage tank 11.
[0063] In this embodiment, the electroplating solution is buffered by the liquid storage tank 11 to ensure the stability of the electroplating solution circulation.
[0064] In an alternative technical solution of this embodiment, it is another structural form of the electroplating tank, and the electroplating tank includes a tank body 12;
[0065] The transparent parts 4 are provided on the side wall and the bottom wall of the tank body 12.
[0066] In this embodiment, the transparent parts 4 are provided at both the bottom and the side of the tank body 12, and cameras 5 are provided at the transparent parts 4. The cameras 5 can capture images inside the tank body 12 from the bottom and the side of the tank body 12, improving the accuracy of problem judgment and having a simple overall structure.
[0067] In an alternative technical solution of this embodiment, the conveying mechanism includes a suction cup 13 and a robotic arm, and the suction cup 13 is arranged on the robotic arm;
[0068] The cathode 3 is arranged on the suction cup 13.
[0069] In this embodiment, the robotic arm transports the battery wafers 1 through the suction cup 13, with a high degree of automation and improved electroplating efficiency.
[0070] In an alternative technical solution of this embodiment, the conveying mechanism includes a plurality of guide rollers 14 arranged in the electroplating tank, and the cathode 3 is arranged on at least one of the guide rollers 14.
[0071] In this embodiment, the battery wafers 1 are conveyed through the plurality of guide rollers 14 for electroplating. The movement of the battery wafers 1 is convenient and the electroplating effect is good. Among them, the cathode 3 can be arranged on all the guide rollers 14. Preferably, the guide rollers 14 with the cathode 3 arranged thereon and the guide rollers 14 without the cathode 3 arranged thereon are arranged alternately.
[0072] In this embodiment, the transparent part 4 is formed by a transparent plate, and the transparent plate is hermetically connected to the electroplating tank.
[0073] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A photovoltaic solar cell electroplating device, used for electroplating a cell sheet (1), characterized in that: include: Anode (2), cathode (3), transport mechanism, electroplating tank and visual monitoring mechanism; The anode (2) is arranged in the electroplating tank, the cathode (3) is arranged on the conveying mechanism and is used to contact the battery cell (1), and the conveying mechanism is used to convey the battery cell (1) for electroplating; A transparent portion (4) is provided on the wall of the electroplating tank, the visual monitoring mechanism is provided outside the electroplating tank, and an image inside the electroplating tank is acquired through the transparent portion (4).
2. The photovoltaic solar cell electroplating device according to claim 1, characterized in that: The visual monitoring mechanism comprises a camera (5), an image analysis module and a display module; The camera (5) is arranged at the transparent portion (4) and is used to obtain an image in the electroplating tank; The image analysis module is used to analyze the image in the electroplating tank to obtain the status information in the electroplating tank; The display module is used to display the status information in the electroplating tank.
3. The photovoltaic solar cell electroplating device according to claim 2, characterized in that: The display module is also used to display the image in the electroplating tank.
4. The photovoltaic solar cell electroplating device according to claim 2, characterized in that: The visual monitoring mechanism also includes an alarm module, which alarms based on status information in the electroplating tank.
5. The photovoltaic solar cell electroplating device according to claim 1, characterized in that: The electroplating tank comprises an inner tank (6) and an outer tank (7), and the outer tank (7) surrounds the inner tank (6); The anode (2) is arranged in the inner tank (6), and the bottom wall of the inner tank (6) is provided with a liquid inlet and the transparent portion (4); The bottom wall of the outer tank (7) is provided with a liquid discharge port, and the outer tank (7) is used to recover the electroplating liquid overflowing from the inner tank (6).
6. The photovoltaic solar cell electroplating device according to claim 5, characterized in that: It also includes a circulation pump (8), a liquid inlet pipe (9) and a liquid return pipe (10); One end of the liquid inlet pipe (9) is connected to the liquid inlet, and the other end is connected to the outlet of the circulation pump (8); One end of the liquid return pipe (10) is connected to the liquid discharge port, and the other end is connected to the inlet of the circulation pump (8).
7. The photovoltaic solar cell electroplating device according to claim 6, characterized in that: It also comprises a liquid storage tank (11), which is arranged between the liquid return pipe (10) and the circulation pump (8), and the liquid return pipe (10) and the circulation pump (8) are both in communication with the liquid storage tank (11).
8. The photovoltaic solar cell electroplating device according to claim 1, characterized in that: The electroplating tank comprises a tank body (12); The side wall and the bottom wall of the trough body (12) are both provided with the transparent portion (4).
9. The photovoltaic solar cell electroplating device according to any one of claims 1 to 8, characterized in that: The transport mechanism comprises a suction cup (13) and a mechanical arm, wherein the suction cup (13) is arranged on the mechanical arm; The cathode (3) is arranged on the suction cup (13).
10. The photovoltaic solar cell electroplating device according to any one of claims 1 to 8, characterized in that: The conveying mechanism comprises a plurality of guide rollers (14) arranged in the electroplating tank, and the cathode (3) is arranged on at least one of the guide rollers (14).