Semiconductor package for communication module

Abstract

The utility model relates to a semiconductor package for a communication module, which belongs to the technical field of semiconductor package and comprises a communication module semiconductor package body, a package box arranged on the communication module semiconductor package body and a storage box placed in the package box. Supporting plates are fixedly connected to the left side face and the right side face of the packaging box correspondingly, telescopic rods are fixedly connected to the top faces of the two supporting plates correspondingly, mounting plates are fixedly connected to the top faces of the two telescopic rods correspondingly, and the peripheral walls of the two telescopic rods are sleeved with springs fixedly connected with the mounting plates and the supporting plates correspondingly. According to the semiconductor package for the communication module, a storage box is fixed through clearance fit between limiting rods and limiting holes, the storage box is conveniently fixed, the limiting rods are driven to move under the action of a mounting plate, operation of workers is facilitated, meanwhile, the limiting rods are supported under the action of springs, and the storage box is convenient to use. The stability of the limiting rod is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, and particularly relates to a semiconductor packaging for a communication module. Background Technique

[0002] In the production process of semiconductor devices, after steps such as mounting and fixing devices on a substrate and arranging wires are completed, the devices are often encapsulated, that is, an epoxy resin molding compound is used, and the molding encapsulation material wraps the devices. On the one hand, it isolates the devices from the outside world to prevent impurities in the air from corroding the device circuits and causing a decline in electrical performance. On the other hand, the encapsulated devices are also more convenient for installation and transportation.

[0003] Chinese Patent CN217261596U discloses a semiconductor packaging for a communication module. This patent discloses a technical solution for convenient fixation, which solves the problem that after the existing semiconductor packaging encapsulates the communication module, there is a lack of a fixing component, and during transportation, the communication module is likely to shake and damage the module.

[0004] When this device is in use, the communication module is fixed through a fixing device to protect the communication module. However, when the storage box is fixed through fixing bolts and the storage box needs to be disassembled and assembled, external tools are required to loosen and tighten the fixing bolts, which is not convenient for the staff to disassemble and assemble the storage box. Therefore, a semiconductor packaging for a communication module is proposed to solve the above problems. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides a semiconductor packaging for a communication module, which has the advantage of convenient disassembly and assembly, and solves the problem that when this device is in use, the communication module is fixed through a fixing device to protect the communication module. However, when the storage box is fixed through fixing bolts and the storage box needs to be disassembled and assembled, external tools are required to loosen and tighten the fixing bolts, which is not convenient for the staff to disassemble and assemble the storage box.

[0006] To achieve the above object, the utility model provides the following technical solution: A semiconductor packaging for a communication module, including a semiconductor packaging body for the communication module, a packaging box arranged on the semiconductor packaging body for the communication module, and a storage box placed inside the packaging box. The left side surface and the right side surface of the packaging box are both fixedly connected with support plates.

[0007] The top surfaces of the two support plates are both fixedly connected with telescopic rods. The top surfaces of the two telescopic rods are both fixedly connected with mounting plates. Springs respectively fixedly connected with the mounting plates and the support plates are sleeved on the outer peripheral walls of the two telescopic rods. The top surfaces of the two mounting plates are both fixedly connected with limiting rods. The bottom surface of the storage box is provided with two limiting holes, and the two limiting rods respectively extend into the two limiting holes.

[0008] The storage box is provided with a positioning component for restricting the mounting plate.

[0009] A limiting component is arranged between the two support plates for restricting the positioning component.

[0010] Furthermore, both of the mounting plates are in contact with the storage box, and the limiting rod and the limiting hole are in clearance fit.

[0011] Furthermore, the telescopic rod is composed of a sleeve bin and a moving rod. One end of the moving rod penetrates and extends into the interior of the sleeve bin. A limiting block located inside the sleeve bin is fixedly connected to the outer side of the moving rod. A through hole adapted to the moving rod is formed in one side of the sleeve bin.

[0012] Furthermore, the positioning component includes two limiting plates. The two limiting plates are respectively placed at the bottoms of the two mounting plates. Two mounting holes are formed in the bottom surface of the storage box. One end of a driving rod that penetrates through the two mounting holes and extends to the bottom of the storage box is movably connected to the interior of each of the two mounting holes through a bearing. Linking plates are fixedly connected to the bottom surfaces of the two driving rods. The two linking plates are respectively fixedly connected to the two limiting plates. First rubber rings are fixedly connected to the interiors of the two mounting holes. The two driving rods respectively penetrate through the two first rubber rings.

[0013] Furthermore, both of the limiting plates are L-shaped plates, and the two limiting plates are respectively in contact with the two mounting plates.

[0014] Furthermore, the two mounting plates are located between the two limiting plates, and the two first rubber rings are respectively in contact with the two driving rods.

[0015] Furthermore, the limiting component includes two clamping rods. The two clamping rods are respectively fixedly connected to the top surfaces of the two support plates. Clamping holes are formed in the bottom surfaces of the two limiting plates. The two clamping rods respectively extend into the interiors of the two clamping holes. Support rods are fixedly connected to the bottom surfaces of the two mounting plates. Yielding holes are formed in the top surfaces of the two support plates. The two support rods respectively penetrate through the two yielding holes and extend to the bottoms of the support plates. Second rubber rings are fixedly connected to the interiors of the two yielding holes. The two support rods respectively penetrate through the two second rubber rings.

[0016] Furthermore, the clamping rod is an elastic rod, the clamping rod and the clamping hole are in clearance fit, and the support rod and the second rubber ring are in contact with each other.

[0017] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0018] 1. The semiconductor package for the communication module fixes the storage box through the clearance fit between the limit rod and the limit hole, which facilitates the fixing of the storage box. Under the action of the mounting plate, the limit rod is driven to move, which is convenient for the staff to operate. At the same time, under the action of the spring, the limit rod is supported to improve the stability of the limit rod.

[0019] 2. The semiconductor package for the communication module restricts the mounting plate under the action of the limit plate to improve the stability of the mounting plate. Under the action of the driving rod, the limit plate is driven to move, which is convenient for the staff to operate. At the same time, under the action of the first rubber ring, the driving rod is supported to improve the stability of the driving rod, making it more convenient and practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic structural diagram of the present utility model;

[0021] Figure 2 is Figure 1 an enlarged structural diagram of A in

[0022] Figure 3 is Figure 2 an enlarged structural diagram of B in

[0023] Figure 4 It is a top view schematic diagram of the left limit plate in the structure of the present utility model.

[0024] In the figure: 1 semiconductor package body of the communication module, 2 packaging box, 3 storage box, 4 support plate, 5 spring, 6 mounting plate, 7 limit hole, 8 limit rod, 9 clamping rod, 10 support rod, 11 second rubber ring, 12 relief hole, 13 telescopic rod, 14 clamping hole, 15 limit plate, 16 mounting hole, 17 driving rod, 18 first rubber ring, 19 linkage plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0026] Embodiment 1: Please refer to Figures 1-4 , a semiconductor package for a communication module in this embodiment includes a semiconductor package body 1 of the communication module, a packaging box 2 provided on the semiconductor package body 1 of the communication module, and a storage box 3 placed inside the packaging box 2. Support plates 4 are fixedly connected to both the left side and the right side of the packaging box 2.

[0027] The top surfaces of both support plates 4 are fixedly connected with telescopic rods 13. The top surfaces of both telescopic rods 13 are fixedly connected with mounting plates 6. Springs 5 that are respectively fixedly connected with the mounting plates 6 and the support plates 4 are sleeved on the outer peripheral walls of both telescopic rods 13. The top surfaces of both mounting plates 6 are fixedly connected with limit rods 8. Two limit holes 7 are formed in the bottom surface of the storage box 3. The two limit rods 8 respectively extend into the two limit holes 7.

[0028] Among them, both mounting plates 6 are in contact with the storage box 3. The limit rods 8 and the limit holes 7 are in clearance fit. The telescopic rod 13 is composed of a sleeve bin and a moving rod. One end of the moving rod penetrates and extends into the interior of the sleeve bin. A limiting block located inside the sleeve bin is fixedly connected to the outer side of the moving rod. A through hole adapted to the moving rod is formed in one side of the sleeve bin.

[0029] Specifically, pull the mounting plate 6. The mounting plate 6 drives the limit rod 8 to move, squeezes the telescopic rod 13 and the spring 5, so that the telescopic rod 13 and the spring 5 contract. Push the storage box 3 so that the storage box 3 enters the interior of the packaging box 2. The limit rods 8 and the limit holes 7 are on the same center line. Release the mounting plate 6. Under the action of the spring 5, push the limit rod 8 to reset. The limit rod 8 is inserted into the limit hole 7. Through the clearance fit between the limit rod 8 and the limit hole 7, the storage box 3 is fixed.

[0030] Embodiment Two: Please refer to Figures 1-4 , in this embodiment, on the basis of Embodiment One, the storage box 3 is provided with a positioning component. The positioning component includes two limit plates 15. The two limit plates 15 are respectively placed at the bottom of the two mounting plates 6. Two mounting holes 16 are formed in the bottom surface of the storage box 3. One end of a driving rod 17 that penetrates the two mounting holes 16 and extends to the bottom of the storage box 3 is movably connected through bearings in the two mounting holes 16. The bottom surfaces of the two driving rods 17 are fixedly connected with a linkage plate 19. The two linkage plates 19 are respectively fixedly connected with the two limit plates 15. First rubber rings 18 are fixedly connected in the two mounting holes 16. The two driving rods 17 respectively penetrate the two first rubber rings 18.

[0031] Among them, both limit plates 15 are L-shaped plates. The two limit plates 15 are respectively in contact with the two mounting plates 6. The two mounting plates 6 are located between the two limit plates 15. The two first rubber rings 18 are respectively in contact with the two driving rods 17.

[0032] Specifically, rotate the driving rod 17. The driving rod 17 drives the limit plate 15 to rotate through the linkage plate 19, so that the limit plate 15 and the mounting plate 6 are in contact. Through the contact between the first rubber ring 18 and the driving rod 17, the driving rod 17 is supported to improve the stability of the driving rod 17.

[0033] Embodiment 3: Please refer to Figures 1-4 , in this embodiment, on the basis of Embodiment 1 and Embodiment 2, a limiting component is provided between two support plates 4. The limiting component includes two clamping rods 9, and the two clamping rods 9 are respectively fixedly connected to the top surfaces of the two support plates 4. Clamping holes 14 are formed in the bottom surfaces of the two limiting plates 15, and the two clamping rods 9 respectively extend into the two clamping holes 14. Support rods 10 are fixedly connected to the bottom surfaces of the two mounting plates 6, and through holes 12 are formed in the top surfaces of the two support plates 4. The two support rods 10 respectively penetrate through the two through holes 12 and extend to the bottom of the support plate 4. Second rubber rings 11 are fixedly connected to the interiors of the two through holes 12, and the two support rods 10 respectively penetrate through the two second rubber rings 11.

[0034] Wherein, the clamping rod 9 is an elastic rod, the clamping rod 9 and the clamping hole 14 are in clearance fit, and the support rod 10 and the second rubber ring 11 are in contact.

[0035] Specifically, the mounting plate 6 drives the support rod 10 to move. Through the clearance fit between the support rod 10 and the through hole 12, the mounting plate 6 is supported. Through the contact between the support rod 10 and the second rubber ring 11, the support rod 10 is supported, improving the stability of the support rod 10. Push the clamping rod 9, the limiting plate 15 squeezes the clamping rod 9, causing the clamping rod 9 to deform. The clamping rod 9 is inserted into the interior of the clamping hole 14. Through the clearance fit between the clamping rod 9 and the clamping hole 14, the limiting plate 15 is fixed.

[0036] The working principle of the above embodiment is as follows:

[0037] Pull the mounting plate 6, the mounting plate 6 drives the limiting rod 8 to move, squeezing the telescopic rod 13 and the spring 5, causing the telescopic rod 13 and the spring 5 to contract. The mounting plate 6 drives the support rod 10 to move. Through the clearance fit between the support rod 10 and the through hole 12, the mounting plate 6 is supported. Through the contact between the support rod 10 and the second rubber ring 11, the support rod 10 is supported, improving the stability of the support rod 10. Push the storage box 3, so that the storage box 3 enters the interior of the packaging box 2. The limiting rod 8 and the limiting hole 7 are on the same center line. Release the mounting plate 6. Under the action of the spring 5, the limiting rod 8 is pushed back to its original position. The limiting rod 8 is inserted into the interior of the limiting hole 7. Through the clearance fit between the limiting rod 8 and the limiting hole 7, the storage box 3 is fixed. Then rotate the driving rod 17. The driving rod 17 drives the limiting plate 15 to rotate through the linkage plate 19, so that the limiting plate 15 and the mounting plate 6 are in contact. Push the clamping rod 9, the limiting plate 15 squeezes the clamping rod 9, causing the clamping rod 9 to deform. The clamping rod 9 is inserted into the interior of the clamping hole 14. Through the clearance fit between the clamping rod 9 and the clamping hole 14, the limiting plate 15 is fixed. Through the contact between the first rubber ring 18 and the driving rod 17, the driving rod 17 is supported, improving the stability of the driving rod 17.

[0038] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor package for a communication module, comprising a communication module semiconductor package body (1), a package box (2) arranged on the communication module semiconductor package body (1), and a storage box (3) placed inside the package box (2), characterized in that: The left side and the right side of the packaging box (2) are both fixedly connected with a support plate (4); The top surfaces of the two support plates (4) are fixedly connected with telescopic rods (13), the top surfaces of the two telescopic rods (13) are fixedly connected with mounting plates (6), the outer peripheral walls of the two telescopic rods (13) are respectively provided with springs (5) fixedly connected to the mounting plates (6) and the support plates (4), the top surfaces of the two mounting plates (6) are fixedly connected with limiting rods (8), the bottom surface of the storage box (3) is provided with two limiting holes (7), and the two limiting rods (8) extend to the inside of the two limiting holes (7) respectively; A positioning component is provided on the storage box (3), and a limiting component is provided between the two support plates (4).

2. A semiconductor package for a communication module according to claim 1, characterized in that: The two mounting plates (6) are both fitted with the storage box (3), and the limiting rod (8) and the limiting hole (7) are clearance-matched.

3. A semiconductor package for a communication module according to claim 2, characterized in that: The telescopic rod (13) is composed of a sleeve and a moving rod, one end of the moving rod penetrates and extends into the sleeve, the outer side of the moving rod is fixedly connected to a limiting block located inside the sleeve, and one side of the sleeve is provided with a through hole adapted to the moving rod.

4. The semiconductor package for a communication module according to claim 1, characterized in that: The positioning assembly comprises two limit plates (15), the two limit plates (15) are respectively placed at the bottom of the two mounting plates (6), the bottom surface of the storage box (3) is provided with two mounting holes (16), the inside of the two mounting holes (16) are both movably connected to a driving rod (17) having one end penetrating the mounting hole (16) and extending to the bottom of the storage box (3) through a bearing, the bottom surfaces of the two driving rods (17) are both fixedly connected to linkage plates (19), the two linkage plates (19) are respectively fixedly connected to the two limit plates (15), the inside of the two mounting holes (16) are both fixedly connected to a first rubber ring (18), and the two driving rods (17) respectively penetrate the two first rubber rings (18).

5. The semiconductor package for a communication module according to claim 4, characterized in that: The two limiting plates (15) are both L-shaped plates, and the two limiting plates (15) are respectively fitted with the two mounting plates (6).

6. The semiconductor package for a communication module according to claim 5, characterized in that: The two mounting plates (6) are located between the two limiting plates (15), and the two first rubber rings (18) are respectively fitted with the two driving rods (17).

7. The semiconductor package for a communication module according to claim 4, characterized in that: The limiting assembly comprises two clamping rods (9), the two clamping rods (9) are respectively fixedly connected to the top surfaces of the two support plates (4), the bottom surfaces of the two limiting plates (15) are provided with clamping holes (14), the two clamping rods (9) respectively extend to the inside of the two clamping holes (14), the bottom surfaces of the two mounting plates (6) are respectively fixedly connected with support rods (10), the top surfaces of the two support plates (4) are provided with clearance holes (12), the two support rods (10) respectively penetrate the two clearance holes (12) and extend to the bottom of the support plate (4), the insides of the two clearance holes (12) are respectively fixedly connected with second rubber rings (11), and the two support rods (10) respectively penetrate the two second rubber rings (11).

8. The semiconductor package for a communication module according to claim 7, characterized in that: The clamping rod (9) is an elastic rod, the clamping rod (9) and the clamping hole (14) are clearance-matched, and the support rod (10) and the second rubber ring (11) are in close contact.

Images