Stacked communication module semiconductor packaging piece

Abstract

The utility model relates to a stacked communication module semiconductor package, which belongs to the technical field of semiconductor packages and comprises a substrate, a semiconductor chip is arranged on the upper side of the substrate, pins are fixedly connected to the sides of the substrate, and a mounting component is arranged on the outer side of the semiconductor chip. The mounting assembly comprises a fixing frame and a mounting frame, the fixing frame is fixedly connected to the upper side of the substrate, the mounting frame sleeves the semiconductor chip and is inserted into the inner side of the fixing frame, and a limiting assembly is arranged between the mounting frame and the fixing frame; the limiting assembly comprises a first spring and a push block, and the end, close to the fixing frame, of the first spring is fixedly connected with a supporting piece. The stacked communication module semiconductor packaging piece is convenient to mount and dismount, provides convenience for later maintenance, is high in practicability, and solves the problems that most existing packaging pieces are fixed by welding or screws, so that the packaging pieces are inconvenient to dismount, and later maintenance is inconvenient.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packages, and specifically relates to a stacked communication module semiconductor package. Background Art

[0002] With the development of the electronics industry, it has become possible to manufacture light, small, fast, and high-performance electronic products at low cost. Semiconductor chips can be embedded in semiconductor packages, and the use of semiconductor packages makes it possible to easily use semiconductor chips as part of electronic products. In addition, semiconductor packages provided with semiconductor chips can be used as communication modules. Semiconductor packaging refers to the process of processing wafers that have passed testing according to product models and functional requirements to obtain independent chips. The packaging process is as follows: wafers from the front-end process of the wafer are cut into small chips through a dicing process, and then the cut chips are attached to the islands of the corresponding substrate holder with glue. Then, the bonding pads of the chips are connected to the corresponding pins of the substrate using ultra-fine metal wires or conductive resins to form the required circuit.

[0003] In order to protect the manufactured semiconductor integrated circuit chips, when the semiconductor integrated circuit chips are completed, they will be installed in packages. To avoid affecting the chip operation, a metal plate is installed at the bottom of the inner cavity of the package to connect the chip pins and the package pins. However, most of the existing packages use welding or screw fixation, so they are not easy to disassemble and not convenient for later maintenance and repair. Therefore, a stacked communication module semiconductor package is proposed to solve the problems mentioned above. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a stacked communication module semiconductor package, which has the advantages of being easy to disassemble and repair, and solves the problems that most of the existing packages use welding or screw fixation, so they are not easy to disassemble and not convenient for later maintenance and repair.

[0005] To achieve the above object, the utility model provides the following technical solution: A stacked communication module semiconductor package, including a substrate, a semiconductor chip is arranged on the upper side of the substrate, pins are fixedly connected to the side of the substrate, and an installation component is arranged outside the semiconductor chip;

[0006] The installation component includes a fixed frame and an installation frame. The fixed frame is fixedly connected to the upper side of the substrate. The installation frame is sleeved outside the semiconductor chip and inserted into the inner side of the fixed frame. A limiting component is arranged between the installation frame and the fixed frame;

[0007] The limiting component includes a first spring and a pushing block. One end of the first spring close to the fixed frame is fixedly connected with a supporting piece. The outer side of the supporting piece is fixedly connected with a limiting block extending to the inner side of the fixed frame. One side of the pushing block away from the limiting block is fixedly connected with a pressing plate, and a second spring is further arranged between the pressing plate and the fixed frame.

[0008] Furthermore, both the first spring and the supporting piece are located inside the installation frame, and one end of the first spring away from the supporting piece is fixedly connected with the inner wall of the installation frame.

[0009] Furthermore, the pushing block is located inside the fixed frame, and the pushing block corresponds to the limiting block.

[0010] Furthermore, both the pushing block and the second spring are on the same side of the pressing plate, and the side of the pressing plate away from the pushing block extends to the outside of the fixed frame.

[0011] Furthermore, one end of the second spring is fixedly connected with the pressing plate, and the other end of the second spring is fixedly connected with the inside of the fixed frame.

[0012] Furthermore, an opening is formed in the upper side of the installation frame, and the inner diameter area of the opening is smaller than the surface area of the semiconductor chip.

[0013] Furthermore, a first through hole is formed in the outer wall of the fixed frame, and a second through hole is formed in the outer wall of the installation frame. The number of the first through holes and the second through holes is equal, and each first through hole corresponds to one second through hole.

[0014] Furthermore, a sliding block is fixedly connected to the outer side of the pressing plate, a sliding groove is formed in the inside of the fixed frame, and the sliding block is slidably connected to the inside of the sliding groove.

[0015] Compared with the prior art, the present utility model provides a stacked communication module semiconductor package, which has the following beneficial effects:

[0016] 1. For this stacked communication module semiconductor package, the position of the limiting block is elastically adjusted by the first spring, so that the installation frame can be docked with the fixed frame. The installation frame is fixed through the cooperation of the limiting block and the fixed frame, and the semiconductor chip is fixed under the cooperation of the installation frame and the fixed frame. When it is necessary to disassemble and repair the semiconductor chip, by pressing the pressing plate to drive the pushing block to move, the pushing block will push the limiting block to separate from the fixed frame, so that the installation frame can be separated from the fixed frame, and then the semiconductor chip can be removed. The installation and disassembly are convenient, which provides convenience for later maintenance and repair, and has high practicability, solving the problem that most of the existing packages are fixed by welding or screws, so they are not easy to disassemble and not convenient for later maintenance and repair.

[0017] 2. The stacked communication module semiconductor package has an opening for ventilation and heat dissipation at the top of the semiconductor chip, and the first through-hole and the second through-hole are provided for ventilation and heat dissipation on the side of the semiconductor chip, which is beneficial to improving the heat dissipation performance. Description of the Drawings

[0018] Figure 1 It is a cross-sectional view of the structure of the present invention;

[0019] Figure 2 For the present invention Figure 1 An enlarged schematic structural view of A shown;

[0020] Figure 3 It is a front view of the structure of the present invention;

[0021] Figure 4 It is a schematic structural view of the semiconductor chip and the mounting frame of the present invention.

[0022] In the figure: 1. Substrate; 2. Pin; 3. Semiconductor chip; 4. Fixed frame; 5. Mounting frame; 6. First spring; 7. Support piece; 8. Limiting block; 9. Pushing block; 10. Pressing plate; 11. Second spring; 12. Opening; 13. First through-hole; 14. Second through-hole; 15. Slide block; 16. Slide groove. Detailed Embodiment

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] Embodiment 1:

[0025] Please refer to Figures 1-4 , a stacked communication module semiconductor package in this embodiment includes a substrate 1, a semiconductor chip 3 is arranged on the upper side of the substrate 1, and pins 2 are fixedly connected to the side of the substrate 1.

[0026] In this embodiment, an installation component is arranged outside the semiconductor chip 3. The installation component includes a fixed frame 4 and a mounting frame 5. The fixed frame 4 is fixedly connected to the upper side of the substrate 1, and the mounting frame 5 is sleeved outside the semiconductor chip 3 and inserted inside the fixed frame 4.

[0027] In this embodiment, a limiting component is provided between the mounting frame 5 and the fixed frame 4. The limiting component includes a first spring 6 and a pushing block 9. One end of the first spring 6 close to the fixed frame 4 is fixedly connected to a support piece 7. Both the first spring 6 and the support piece 7 are located inside the mounting frame 5. The other end of the first spring 6 away from the support piece 7 is fixedly connected to the inner wall of the mounting frame 5. A limiting block 8 extending to the inside of the fixed frame 4 is fixedly connected to the outside of the support piece 7. Among them, the pushing block 9 is located inside the fixed frame 4, and the pushing block 9 corresponds to the limiting block 8. A pressing plate 10 is fixedly connected to the side of the pushing block 9 away from the limiting block 8. A second spring 11 is also provided between the pressing plate 10 and the fixed frame 4. Both the pushing block 9 and the second spring 11 are on the same side of the pressing plate 10. The side of the pressing plate 10 away from the pushing block 9 extends to the outside of the fixed frame 4. One end of the second spring 11 is fixedly connected to the pressing plate 10, and the other end of the second spring 11 is fixedly connected to the inside of the fixed frame 4.

[0028] It can be understood that the cooperation between the limiting block 8 and the fixed frame 4 facilitates the fixation of the mounting frame 5. The mounting frame 5 is used to fix the semiconductor chip 3 conveniently, which is convenient for installation. At the same time, the cooperation between the pressing plate 10 and the pushing block 9 facilitates the adjustment of the position of the limiting block 8, which is convenient for disassembling the mounting frame 5, and further convenient for disassembling the semiconductor chip 3 for maintenance.

[0029] It should be added that a sliding block 15 is fixedly connected to the outside of the pressing plate 10, and a sliding groove 16 is opened inside the fixed frame 4. The sliding block 15 is slidably connected to the inside of the sliding groove 16.

[0030] Embodiment Two:

[0031] Please refer to Figures 3-4 , on the basis of Embodiment One, an opening 12 is opened on the upper side of the mounting frame 5. The inner diameter area of the opening 12 is smaller than the surface area of the semiconductor chip 3. At the same time, a first through hole 13 is opened on the outer wall of the fixed frame 4, and a second through hole 14 is opened on the outer wall of the mounting frame 5. The number of the first through holes 13 and the second through holes 14 is set to be equal, and each first through hole 13 corresponds to a second through hole 14 respectively. The opened opening 12 facilitates the ventilation and heat dissipation of the top of the semiconductor chip 3, and the opened first through holes 13 and second through holes 14 facilitate the ventilation and heat dissipation of the side of the semiconductor chip 3, which is beneficial to improving the heat dissipation performance.

[0032] The working principle of the above embodiment is:

[0033] When the utility model is in use, the position of the limit block 8 is elastically adjusted by the first spring 6, so that the installation frame 5 can be docked with the fixed frame 4. The installation frame 5 is fixed through the cooperation of the limit block 8 and the fixed frame 4. The semiconductor chip 3 is fixed under the cooperation of the installation frame 5 and the fixed frame 4. When the semiconductor chip 3 needs to be disassembled and repaired, by pressing the pressing plate 10 to drive the push block 9 to move, the push block 9 will push the limit block 8 to separate from the fixed frame 4, so that the installation frame 5 can be separated from the fixed frame 4, and the semiconductor chip 3 can be removed.

[0034] The installation method, connection method or setting method disclosed in this embodiment are all common mechanical methods, and any method that can achieve its beneficial effects can be implemented. It should be noted that in this article, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0035] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "including a..." does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0036] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A stacked communication module semiconductor package, comprising a substrate (1), a semiconductor chip (3) being arranged on the upper side of the substrate (1), and a lead (2) being fixedly connected to the side of the substrate (1), characterized in that: A mounting component is arranged on the outer side of the semiconductor chip (3); The mounting assembly comprises a fixing frame (4) and a mounting frame (5); the fixing frame (4) is fixedly connected to the upper side of the substrate (1); the mounting frame (5) is sleeved on the outside of the semiconductor chip (3) and plugged into the inside of the fixing frame (4); a limiting assembly is provided between the mounting frame (5) and the fixing frame (4); The limiting assembly comprises a first spring (6) and a push block (9); one end of the first spring (6) close to the fixed frame (4) is fixedly connected to a support sheet (7); the outer side of the support sheet (7) is fixedly connected to a limiting block (8) extending to the inner side of the fixed frame (4); the side of the push block (9) away from the limiting block (8) is fixedly connected to a pressing plate (10); and a second spring (11) is further provided between the pressing plate (10) and the fixed frame (4).

2. The stacked communication module semiconductor package according to claim 1, characterized in that: The first spring (6) and the support sheet (7) are both located inside the installation frame (5), and one end of the first spring (6) away from the support sheet (7) is fixedly connected to the inner wall of the installation frame (5).

3. The stacked communication module semiconductor package according to claim 1, characterized in that: The push block (9) is located inside the fixed frame (4), and the push block (9) corresponds to the limit block (8).

4. The stacked communication module semiconductor package according to claim 1, characterized in that: The push block (9) and the second spring (11) are both located on the same side of the pressing plate (10), and the side of the pressing plate (10) away from the push block (9) extends to the outside of the fixed frame (4).

5. The stacked communication module semiconductor package according to claim 1, characterized in that: One end of the second spring (11) is fixedly connected to the pressing plate (10), and the other end of the second spring (11) is fixedly connected to the inside of the fixing frame (4).

6. The stacked communication module semiconductor package according to claim 1, characterized in that: An opening (12) is provided on the upper side of the installation frame (5), and the inner diameter area of ​​the opening (12) is smaller than the surface area of ​​the semiconductor chip (3).

7. The stacked communication module semiconductor package according to claim 1, characterized in that: A first through hole (13) is provided on the outer wall of the fixing frame (4), and a second through hole (14) is provided on the outer wall of the installation frame (5). The first through holes (13) and the second through holes (14) are arranged in equal numbers, and each of the first through holes (13) corresponds to one of the second through holes (14).

8. The stacked communication module semiconductor package according to claim 1, characterized in that: A sliding block (15) is fixedly connected to the outer side of the pressing plate (10), a sliding groove (16) is provided inside the fixing frame (4), and the sliding block (15) is slidably connected to the inner side of the sliding groove (16).

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