Low-profile oscillator

Abstract

The utility model provides a low-profile oscillator, which comprises a dielectric substrate, an oscillator surface, a loading sheet and a coaxial line, the first surface of the dielectric substrate is fixedly provided with copper-clad layers which are arranged in an array, and the oscillator surface is fixedly arranged above the dielectric substrate; the loading sheet is fixedly arranged on the periphery of the coaxial line, one end of the coaxial line penetrates through the dielectric substrate and the loading sheet and is fixedly connected with the oscillator plane, and the other end of the coaxial line is connected with a feeder line. According to the utility model, the copper-clad layer is designed to simulate an ideal magnetic conductor boundary for the oscillator surface, and the loading sheet changes the current distribution and equivalent length of the oscillator, thereby breaking through the limitation on the height of the oscillator surface.

Description

Technical Field

[0001] The utility model belongs to the technical field of base station antennas, and particularly relates to a low-profile dipole. Background Art

[0002] In the field of electromagnetic wave propagation, when the electric field direction is parallel to the metal boundary, there will inevitably be a half-wavelength phase loss at the metal boundary. This characteristic leads to the fact that in antenna design, for a conventional half-wave dipole to achieve effective radiation and reception functions, the height of its dipole surface is usually required to be a fixed quarter-wavelength height.

[0003] This fixed size requirement brings significant limitations to antenna design. In the trend of modern technology constantly pursuing miniaturization and integration, this greatly restricts the application and development of antennas in many fields such as mobile communication devices, satellite communication terminals, and Internet of Things devices.

[0004] Taking mobile communication devices as an example, the internal space of them is extremely limited, and the height requirement of traditional half-wave dipoles makes it difficult for antennas to achieve efficient performance in the limited space. At present, with the development of the times, consumers' demands for the lightweight and miniaturization of devices are becoming increasingly urgent, and the fixed height of half-wave dipoles restricts their optimal layout in terminal devices. Similarly, in the rapidly developing Internet of Things field, various sensors and devices require more compact antenna designs to adapt to different application scenarios, but the size limitation of conventional half-wave dipoles has become an obstacle to achieving this goal. Content of the Utility Model

[0005] In order to solve the problem that for a half-wave dipole described in the background art to achieve effective radiation and reception functions, the height of its dipole surface is usually required to be a fixed quarter-wavelength height, which restricts antenna design, the utility model proposes the following technical solutions:

[0006] A low-profile dipole, comprising: a dielectric substrate, a dipole surface, a loading sheet, and a coaxial line; a copper-clad layer arranged in an array is fixedly provided on the first surface of the dielectric substrate, the dipole surface is fixedly arranged above the dielectric substrate; the loading sheet is fixedly arranged on the outer periphery of the coaxial line, one end of the coaxial line passes through the dielectric substrate and the loading sheet and is fixedly connected to the dipole surface, and the other end of the coaxial line is connected to a feeder line.

[0007] Wherein, the low-profile dipole further comprises a groove plate fixedly arranged on the second surface of the dielectric substrate; the dielectric substrate is embedded in the surface of the groove plate, and the thickness of the dielectric substrate is less than the thickness of the groove plate.

[0008] Further, the distance between the dipole surface and the groove plate is less than 25 mm.

[0009] Further, the operating frequency of the dipole surface is 1710 MHz to 2170 MHz.

[0010] Further, the loading sheet is circular, and the area of the loading sheet is smaller than the area of the dipole surface.

[0011] Beneficial effects: In the present utility model, a copper-clad layer is designed as the dipole surface to simulate an ideal magnetic conductor boundary, and the loading sheet changes the current distribution and equivalent length of the oscillator, thereby breaking through the limitation on the height of the oscillator surface. Description of the Drawings

[0012] Figure 1 FIG. is a schematic structural diagram of a low-profile oscillator according to an embodiment of the present utility model;

[0013] Figure 2 FIG. is a schematic structural diagram of the dipole surface and the loading sheet according to an embodiment of the present utility model. Detailed Embodiments

[0014] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present utility model will be further described in detail below with reference to the drawings. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0015] It should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present patent and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present patent.

[0016] Figure 1 FIG. is a schematic structural diagram of a low-profile oscillator according to an embodiment of the present utility model. Figure 2 FIG. is a schematic structural diagram of the dipole surface and the loading sheet according to an embodiment of the present utility model.

[0017] Refer to Figure 1 and Figure 2 , a low-profile oscillator according to an embodiment of the present utility model includes: a dielectric substrate 1, a dipole surface 2, a loading sheet 3, and a coaxial cable 4. The first surface of the dielectric substrate 1 is fixedly provided with a copper-clad layer 11 arranged in an array, and the dipole surface 2 is fixedly arranged above the dielectric substrate 1. The loading sheet 3 is fixedly arranged on the outer periphery of the coaxial cable 4. One end of the coaxial cable 4 passes through the dielectric substrate 1 and the loading sheet 3 and is fixedly connected to the dipole surface 2, and the other end of the coaxial cable 4 is connected to a feeder line.

[0018] Specifically, each copper-clad layer 11 disposed on the surface of the dielectric substrate 1 has the same area and the same shape. There are slits between each copper-clad layer 11, and the array formed by each copper-clad layer 11 simulates the ideal magnetic conductor boundary, so as to achieve the working frequency range of 1710 MHz to 2170 MHz for the entire oscillator.

[0019] Furthermore, in another embodiment, the low-profile oscillator further includes a slot plate 5 fixedly disposed on the second surface of the dielectric substrate 1. The dielectric substrate 1 is embedded in the surface of the slot plate 5, and the thickness of the dielectric substrate 1 is less than the thickness of the slot plate 5. The distance between the oscillator surface 2 and the slot plate 5 is less than 25 mm. One end of the coaxial line 4 passes through the slot plate 5 and the dielectric substrate 1 and is fixedly connected to the oscillator surface 2. The loading sheet 3 is welded and fixed on the coaxial line 4 below the oscillator surface 2. During the installation process, the standing wave isolation of the oscillator can be adjusted by adjusting the distance between the loading sheet 3 and the oscillator surface 2. Preferably, the loading sheet 3 is circular and the area of the loading sheet 3 is smaller than the area of the oscillator surface 2.

[0020] In summary, the present utility model simulates the ideal magnetic conductor boundary by designing the copper-clad layer as the oscillator surface, and the loading sheet changes the current distribution and equivalent length of the oscillator, thereby breaking through the limitation on the height of the oscillator surface.

[0021] The specific embodiments of the utility model have been described above. Other embodiments are within the scope of the appended claims.

[0022] The terms "exemplary", "example" and the like used throughout this specification mean "serving as an example, instance or illustration", and do not mean "preferred" or "advantageous" over other embodiments. For the purpose of providing an understanding of the described technology, the detailed description includes specific details. However, these technologies can be implemented without these specific details. In some instances, well-known structures and devices are shown in block diagram form to avoid obscuring the concepts of the described embodiments.

[0023] The optional embodiments of the embodiments of the present utility model have been described in detail above with reference to the drawings. However, the embodiments of the present utility model are not limited to the specific details in the above embodiments. Within the scope of the technical concept of the embodiments of the present utility model, various simple modifications can be made to the technical solutions of the embodiments of the present utility model, and these simple modifications all fall within the protection scope of the embodiments of the present utility model.

[0024] The foregoing description of the content of this specification is provided to enable any person of ordinary skill in the art to make or use the content of this specification. Various modifications to the content of this specification will be apparent to those of ordinary skill in the art, and the general principles defined herein can also be applied to other variations without departing from the scope of protection of the content of this specification. Therefore, the content of this specification is not limited to the examples and designs described herein, but is consistent with the broadest scope that conforms to the principles and novel features disclosed herein.

Claims

1. A low profile vibrator, characterized in that: include: A dielectric substrate (1), an array surface (2), a loading plate (3), and a coaxial line (4); a first surface of the dielectric substrate (1) is fixedly provided with an array-arranged copper clad layer (11); the array surface (2) is fixedly provided above the dielectric substrate (1); the loading plate (3) is fixedly provided on the outer periphery of the coaxial line (4); one end of the coaxial line (4) passes through the dielectric substrate (1) and the loading plate (3) and is fixedly connected to the array surface (2); and the other end of the coaxial line (4) is connected to a feeder line.

2. A low profile vibrator according to claim 1, characterized in that: The low-profile oscillator further comprises a slot plate (5) fixedly arranged on the second surface of the dielectric substrate (1); the dielectric substrate (1) is embedded in the surface of the slot plate (5), and the thickness of the dielectric substrate (1) is less than the thickness of the slot plate (5).

3. A low profile vibrator according to claim 2, characterized in that: The distance between the array surface (2) and the slot plate (5) is less than 25 mm.

4. A low profile vibrator according to claim 2, characterized in that: The operating frequency of the array surface (2) is 1710 MHz to 2170 MHz.

5. A low profile vibrator according to any one of claims 1 to 4, characterized in that: The loading plate (3) is circular, and the area of ​​the loading plate (3) is smaller than the area of ​​the array surface (2).

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