LED lamp bead luminescence test cooling device

Abstract

The utility model discloses an LED lamp bead luminescence test cooling device which comprises a substrate, a plurality of carrying strips are connected to the substrate in a sliding mode, a plurality of lamp holders are arranged on the carrying strips, and the substrate is of a hollow structure with an opening in the top end. A heat dissipation plate is arranged at the top of an inner cavity of the substrate, and relates to the technical field of LED lamp bead testing, the substrate with a cavity is arranged, and an opening in the top of the substrate is sealed through the heat dissipation plate, a sealing ring and a guide rail, so that a cooling cavity is formed in the substrate, cooling liquid passes through the cooling cavity, and heat conducted to the heat dissipation plate by a carrier strip can be taken away; therefore, the heat dissipation of the carrier strip is realized; the guide rail is arranged on the substrate, so that the position of the carrying strip can be adjusted, the test lamp position can be adjusted according to the distance between actual product lamp beads, one set of instrument can adapt to various products, the test result better conforms to the reality, and the lamp beads of different models can be tested.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamp bead testing, in particular to a cooling device for LED lamp bead light emission testing. Background Technique

[0002] The Chinese invention patent with the publication number of CN106443506A discloses an LED aging tester applicable to multiple models of lamp beads, including a substrate. Slide rails are provided on both sides of the substrate, and a number of carrier bars are arranged perpendicular to the slide rails. Both ends of the carrier bars are slidably clamped on the slide rails on both sides. A number of lamp positions are slidably arranged on the carrier bars. The lamp positions include lamp holders and lamp platforms. Tail pins are provided below the lamp platforms, and marbles are provided on both sides of the tail pins. Needle grooves corresponding to the tail pins are provided on the lamp holders, and card slots corresponding to the marbles are provided on both sides of the needle grooves; the lamp platforms are inserted into the lamp holders, and sockets are provided at the upper ends of the lamp platforms. The lamp holders are slidably arranged on the carrier bars; Scales are provided on one side of the carrier bars and on both sides of the substrate where the slide rails are installed; The periphery of the substrate is wrapped with an aluminum alloy frame; Heat dissipation slot chucks are provided around the sockets; The material of the lamp platform is high molecular plastic; The carrier bars are made of stainless steel. The test lamp positions can be adjusted according to the distance between the actual product lamp beads. One set of instrument can adapt to multiple products, making the test results more in line with the actual situation, and can test different models of lamp beads. When the LED lamp beads are tested, the temperature of the carrier bars rises. Therefore, it is necessary to design a device that can dissipate heat during the LED lamp bead test. Content of the Utility Model

[0003] In view of the problems existing in the existing cooling device for LED lamp bead light emission testing, the present utility model is proposed.

[0004] Therefore, the purpose of the present utility model is to provide a cooling device for LED lamp bead light emission testing, which solves the problem that the temperature of the carrier bars rises when the LED lamp beads are tested. Therefore, it is necessary to design a device that can dissipate heat during the LED lamp bead test.

[0005] To solve the above technical problems, according to one aspect of the present utility model, the following technical solutions are provided:

[0006] A cooling device for LED lamp bead light emission testing, including a substrate, a number of carrier bars are slidably connected to the substrate, a number of lamp holders are arranged on the carrier bars, and the substrate is a hollow structure with an open top;

[0007] A heat dissipation plate is arranged at the top of the inner cavity of the substrate. A cooling cavity is formed between the heat dissipation plate and the substrate, and the top of the heat dissipation plate is in contact with the bottom of the carrier bars.

[0008] As a preferred embodiment of an LED lamp bead light emission test cooling device according to the present utility model, wherein: guide rails are installed on the inner walls at both ends of the inner cavity of the substrate, and the guide rails are slidably connected to the carrier strip.

[0009] As a preferred embodiment of an LED lamp bead light emission test cooling device according to the present utility model, wherein: T-shaped sliding grooves are formed on the guide rails, T-shaped sliding blocks are fixedly installed at the bottoms of both ends of the carrier strip, and the T-shaped sliding blocks are slidably connected to the inner walls of the T-shaped sliding grooves.

[0010] As a preferred embodiment of an LED lamp bead light emission test cooling device according to the present utility model, wherein: fixed installation blocks are welded at the bottoms of the guide rails, internal threaded holes are formed at corresponding positions on the fixed installation blocks and the inner wall of the substrate, and the fixed installation blocks are fixed on the inner wall of the substrate by bolts.

[0011] As a preferred embodiment of an LED lamp bead light emission test cooling device according to the present utility model, wherein: a sealing ring is sleeved outside the heat dissipation plate, and the sealing ring realizes the sealing between the guide rail and the heat dissipation plate.

[0012] As a preferred embodiment of an LED lamp bead light emission test cooling device according to the present utility model, wherein: fixed installation pieces are welded at the bottoms of the heat dissipation plates, internal threaded holes are formed at corresponding positions on the fixed installation pieces and the guide rails, and the fixed installation pieces and the guide rails are fixed by bolts.

[0013] As a preferred embodiment of an LED lamp bead light emission test cooling device according to the present utility model, wherein: a liquid inlet and a liquid outlet communicating with the inner cavity are formed on the substrate.

[0014] As a preferred embodiment of an LED lamp bead light emission test cooling device according to the present utility model, wherein: a plurality of partition strips are arranged at equal intervals in the inner cavity of the substrate, the plurality of partition strips are arranged staggeredly, and the tops of the partition strips are in contact with the bottom of the heat dissipation plate.

[0015] As a preferred embodiment of an LED lamp bead light emission test cooling device according to the present utility model, wherein: convex strips are arranged at equal intervals at the bottom of the heat dissipation plate.

[0016] Compared with the prior art:

[0017] 1. By providing a substrate with a cavity and using a heat dissipation plate, a sealing ring and a guide rail to seal the top opening of the substrate, a cooling cavity is formed on the substrate, so that the coolant passes through the cooling cavity, and thus the heat conducted from the carrier strip to the heat dissipation plate can be taken away, thereby realizing the heat dissipation of the carrier strip;

[0018] 2. By setting guide rails on the substrate, the position of the carrier strip can be adjusted, so that the test lamp positions can be adjusted according to the actual distance between the lamp beads of the product. One set of instruments can be adapted to multiple products, making the test results more in line with the actual situation, and capable of testing different types of lamp beads. Description of the Drawings

[0019] Figure 1 Schematic structural diagram provided by Embodiment 1 of the present invention;

[0020] Figure 2 Provided by Embodiment 1 of the present invention Figure 1 Cross-sectional view;

[0021] Figure 3 Provided by Embodiment 1 of the present invention Figure 2 Enlarged view at A in;

[0022] Figure 4 Provided by Embodiment 2 of the present invention Figure 1 Cross-sectional view;

[0023] Figure 5 Top view of the substrate provided by Embodiment 2 of the present invention;

[0024] Figure 6 Provided by Embodiment 3 of the present invention Figure 1 Cross-sectional view.

[0025] In the figure: substrate 1, guide rail 2, T-shaped chute 21, fixed mounting block 22, sealing ring 3, liquid outlet 4, carrier strip 5, T-shaped slider 51, lamp socket 6, heat dissipation plate 7, fixed mounting piece 71, partition strip 72, raised strip 73, liquid pump 8, liquid inlet 9. Detailed Description of the Embodiments

[0026] To make the objectives, technical solutions, and advantages of the present invention clearer, the following will further describe the embodiments of the present invention in detail with reference to the accompanying drawings.

[0027] Embodiment 1:

[0028] The present invention provides an LED lamp bead light-emitting test cooling device. Please refer to Figure 1-3 , which includes a substrate 1. A plurality of carrier strips 5 are slidably connected to the substrate 1. A plurality of lamp sockets 6 are arranged on the carrier strips 5. The substrate 1 is a hollow structure with an open top;

[0029] A heat dissipation plate 7 is provided at the top of the inner cavity of the substrate 1. A cooling cavity is formed between the heat dissipation plate 7 and the substrate 1. The substrate 1 is provided with a liquid inlet 9 and a liquid outlet 4 communicating with its inner cavity. The liquid inlet 9 is connected to a liquid pump 8 through a conduit. The input end of the liquid pump 8 is connected to a coolant tank through a conduit, and the top of the heat dissipation plate 7 is in contact with the bottom of the carrier strip 5. A sealing ring 3 is sleeved outside the heat dissipation plate 7, and the sealing ring 3 realizes the sealing between the guide rail 2 and the heat dissipation plate 7.

[0030] Guide rails 2 are installed on the inner walls at both ends of the inner cavity of the substrate 1, and the guide rails 2 are slidably connected to the carrier strip 5.

[0031] The guide rail 2 is provided with a T-shaped chute 21. T-shaped sliders 51 are fixedly installed at the bottoms of both ends of the carrier strip 5, and the T-shaped sliders 51 are slidably connected to the inner wall of the T-shaped chute 21. The guide rail 2 is in close contact with the inner wall of the substrate 1, and the guide rail 2 and the inner wall of the substrate 1 are sealed with sealant, so that the heat dissipation plate 7, the sealing ring 3 and the guide rail 2 effectively realize the sealing of the top opening of the heat dissipation plate 7.

[0032] A fixed mounting block 22 is welded to the bottom of the guide rail 2. Inner threaded holes are provided at corresponding positions on the fixed mounting block 22 and the inner wall of the substrate 1, and the fixed mounting block 22 is fixed to the inner wall of the substrate 1 by bolts.

[0033] A fixed mounting piece 71 is welded to the bottom of the heat dissipation plate 7. Inner threaded holes are provided at corresponding positions on the fixed mounting piece 71 and the guide rail 2, and the fixed mounting piece 71 and the guide rail 2 are fixed by bolts.

[0034] During specific use, the lamp beads to be detected are installed on the lamp socket 6. The heat generated by the carrier strip 5 is conducted to the heat dissipation plate 7. The coolant enters through the liquid inlet 9. The coolant is in full contact with the heat dissipation plate 7, so as to take away the heat of the heat dissipation plate 7, and the coolant flows out from the liquid outlet 4.

[0035] Embodiment 2:

[0036] Refer to the appendix Figure 4-5 , which is different from Embodiment 1 in that: A plurality of partition strips 72 are equidistantly arranged in the inner cavity of the substrate 1, and the plurality of partition strips 72 are arranged in a staggered manner. The top ends of the partition strips 72 are in contact with the bottom of the heat dissipation plate 7. At this time, each partition strip 72 divides the inner cavity of the substrate 1 into an S-shaped flow channel, so that the coolant can be in full contact with the heat dissipation plate 7, thereby achieving better heat dissipation.

[0037] During specific use, the lamp beads to be detected are installed on the lamp socket 6. The heat generated by the carrier strip 5 is conducted to the heat dissipation plate 7. The coolant enters through the liquid inlet 9. The coolant is in full contact with the heat dissipation plate 7, so as to take away the heat of the heat dissipation plate 7, and the coolant flows out from the liquid outlet 4.

[0038] Embodiment 3:

[0039] Referring to the attached Figure 6 , different from Embodiment 1: Raised strips 73 are equidistantly arranged at the bottom of the heat dissipation plate 7; by arranging the raised strips 73 on the heat dissipation plate 7, the surface area is increased, so that heat dissipation can be better carried out.

[0040] During specific use, the light-emitting diode to be detected is installed on the lamp socket 6, the heat generated by the carrier strip 5 is conducted to the heat dissipation plate 7, the coolant enters through the liquid inlet 9, the coolant is in full contact with the heat dissipation plate 7, so as to take away the heat dissipation of the heat dissipation plate 7, and the coolant flows out from the liquid outlet 4.

[0041] Although the present invention has been described above with reference to the embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention can be combined with each other in any way, and the exhaustive description of these combinations is omitted in this specification only for the consideration of saving space and resources. Therefore, the present invention is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A cooling device for testing the lighting of LED lamp beads, comprising a base plate (1), a plurality of carrier bars (5) being slidably connected to the base plate (1), a plurality of lamp holders (6) being arranged on the carrier bars (5), characterized in that: The substrate (1) is a hollow structure with an open top; A heat sink (7) is provided at the top of the inner cavity of the substrate (1), a cooling cavity is formed between the heat sink (7) and the substrate (1), and the top of the heat sink (7) is in contact with the bottom of the carrier strip (5).

2. The LED lamp bead luminescence test cooling device according to claim 1, characterized in that: Guide rails (2) are installed on the inner walls at both ends of the inner cavity of the substrate (1), and the guide rails (2) are slidably connected to the carrier strip (5).

3. The LED lamp bead luminescence test cooling device according to claim 2, characterized in that: The guide rail (2) is provided with a T-shaped slide groove (21), and the bottoms of both ends of the carrier bar (5) are fixedly mounted with T-shaped sliders (51), and the inner wall of the T-shaped slide groove (21) is slidably connected to the T-shaped sliders (51).

4. The LED lamp bead luminescence test cooling device according to claim 2 or 3, characterized in that: A fixed mounting block (22) is welded to the bottom of the guide rail (2), internal threaded holes are provided at corresponding positions of the fixed mounting block (22) and the inner wall of the base plate (1), and the fixed mounting block (22) is fixed to the inner wall of the base plate (1) by means of bolts.

5. The LED lamp bead luminescence test cooling device according to claim 4, characterized in that: A sealing ring (3) is sleeved on the outer side of the heat dissipation plate (7), and the sealing ring (3) realizes sealing between the guide rail (2) and the heat dissipation plate (7).

6. A cooling device for LED lamp bead luminescence test according to claim 4 or 5, characterized in that: A fixed mounting plate (71) is welded to the bottom of the heat sink (7), internal thread holes are provided at corresponding positions of the fixed mounting plate (71) and the guide rail (2), and the fixed mounting plate (71) and the guide rail (2) are fixed by bolts.

7. The LED lamp bead luminescence test cooling device according to claim 5 or 6, characterized in that: The substrate (1) is provided with a liquid inlet (9) and a liquid outlet (4) which are connected to the inner cavity thereof.

8. The LED lamp bead luminescence test cooling device according to claim 7, characterized in that: A plurality of spacers (72) are arranged at equal distances in the inner cavity of the substrate (1), the plurality of spacers (72) are arranged in a staggered manner, and the top ends of the spacers (72) are in contact with the bottom of the heat dissipation plate (7).

9. The LED lamp bead luminescence test cooling device according to claim 7, characterized in that: The bottom of the heat dissipation plate (7) is provided with raised strips (73) at equal intervals.

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