Simulation load device

Abstract

The utility model relates to a test device of a power supply and a converter thereof, and particularly discloses a simulation load device, the simulation load device comprises a control board, a power board and a heat radiation wind source, the control board comprises a first control board and a second control board, and the first control board and the second control board are arranged at intervals in a manner of being close to each other or being far away from each other. The two control boards are arranged in the simulation load device and connected with the power boards, the two control boards are close to each other or far away from each other, the power boards are arranged between the two control boards or on the two sides of the two control boards, a layout shaped like a Chinese character'fei 'or a Chinese character'mu' is formed, the power boards form a matrix type layout, the layout is more compact, large clearance space does not exist, and the power boards are more compact in structure. The space waste is avoided, and the simulation load power density in the unit volume of the simulation load device can be improved.

Description

Technical Field

[0001] The utility model relates to testing equipment for a power supply and a converter thereof, in particular to a simulated load device. Background Art

[0002] The multi-channel simulated load device is a test device for a power supply and its converter to be tested. It serves as a simulated load for the product to be tested and is used to test the performance of the product to be tested.

[0003] The multi-channel simulated load device has multiple power boards and multiple control boards. The simulated load device also needs to be equipped with a fan for heat dissipation. The power boards and control boards are different in size. The fans are standard square parts. The heat dissipation channels formed by the layout of multiple power boards and multiple control boards need to correspond to the cooling fans of the standard square parts to achieve the desired heat dissipation effect.

[0004] The layout of multiple power boards and multiple control boards in the current simulated load device is unreasonable. In order to adapt to the installation of a fan with standard square parts, there is a large gap space in the DC negative pressure device, resulting in a low load power density per unit volume of the simulated load device; and after the number of channels of the simulated load device increases, it cannot be adapted to the fan with standard square parts, resulting in poor heat dissipation effect. Utility Model Content

[0005] The simulated load device provided by the utility model is used to solve the problems of low load power density and poor heat dissipation effect per unit volume in the simulated load device.

[0006] In one embodiment, a simulated load device is provided, comprising:

[0007] A control board, the control board comprises a first control board and a second control board, the first control board comprises a first circuit board and a first component arranged on the first circuit board, the second control board comprises a second circuit board and a second component arranged on the second circuit board, the first circuit board and the second circuit board are electrically connected; the first circuit board and the second circuit board are arranged close to each other or away from each other, the first circuit board has a first side surface, and the second circuit board has a second side surface;

[0008] A power board, the power board includes a plurality of first power boards and a plurality of second power boards, the first power board includes a third circuit board and third components, and the second power board includes a fourth circuit board and fourth components; a plurality of the third circuit boards are arranged on the first side of the first circuit board and are electrically connected to the first circuit board, and a plurality of first heat dissipation channels are formed between the third circuit boards; a plurality of the fourth circuit boards are arranged on the second side of the second circuit board and are connected to the second circuit board, and a plurality of second heat dissipation channels are formed between the fourth circuit boards; and

[0009] A heat dissipation air source, the heat dissipation air source is located at the same end of a plurality of the first heat dissipation channels and the second heat dissipation channels, and the heat dissipation air source is used to drive the air flow in the first heat dissipation channels and the second heat dissipation channels.

[0010] In one embodiment, it further includes a housing, the control board, the power board and the heat dissipation air source are arranged in the housing, the first control board and the second control board are arranged in parallel in the middle of the housing, and the first side and the second side are arranged back to back.

[0011] In one embodiment, it further includes a housing, the control board, the power board and the heat dissipation air source are arranged in the housing, the first control board and the second control board are arranged in parallel on both sides of the housing, and the first side and the second side are arranged face to face.

[0012] In one embodiment, the third circuit board is perpendicular to the first circuit board, and the fourth circuit board is perpendicular to the second circuit board.

[0013] In one embodiment, a plurality of the third circuit boards and a plurality of the fourth circuit boards are staggered and located in different planes.

[0014] In one embodiment, a plurality of the third circuit boards and a plurality of the fourth circuit boards correspond to the same plane one by one.

[0015] In one embodiment, it further includes a support frame, the support frame is arranged between the first control board and the second control board; the support frame is fixed to the housing, one end of the third circuit board is connected to the housing, and the other end is connected to the support frame, one end of the fourth circuit board is connected to the housing, and the other end is connected to the support frame.

[0016] In one embodiment, the support frame is a support plate located in the middle of the housing, and the support plate is parallel to the first circuit board and the second circuit board.

[0017] In one embodiment, ventilation holes are provided on two opposite sides of the housing, and the heat dissipation air source is installed on one side of the housing having the ventilation holes.

[0018] In one embodiment, the blowing direction of the heat dissipation air source is parallel to the heat dissipation channel; and / or, the heat dissipation air source is a fan.

[0019] According to the simulation load device of the above embodiment, since two control boards are arranged in the simulation load device and connected to a plurality of power boards, the two control boards are arranged close to each other or away from each other, and the plurality of power boards are arranged between the two control boards or on both sides, forming an "inverted L" or "eye" shape layout, and the plurality of power boards form a matrix layout. This layout is more compact, there is no large gap space, avoiding space waste, and can improve the simulation load power density per unit volume of the simulation load device.

[0020] The two control boards and the plurality of power boards are combined into an "inverted L" or "eye" shape layout, which can form a matrix of multiple parallel or approximately parallel heat dissipation channels, and can more easily adapt to the fans of standard square parts, thereby ensuring good heat dissipation effects. Description of the Drawings

[0021] Figure 1 It is a schematic structural diagram of a simulation load device in one embodiment;

[0022] Figure 2 It is a schematic structural diagram of a simulation load device in one embodiment;

[0023] Figure 3 It is a schematic structural diagram of internal components of a simulation load device in one embodiment;

[0024] Figure 4 It is a schematic structural diagram of internal components of a simulation load device in one embodiment;

[0025] Figure 5 It is a schematic electrical connection block diagram of a simulation load device in one embodiment;

[0026] Figure 6 It is a schematic structural diagram of internal components of a simulation load device in one embodiment;

[0027] Figure 7 It is a schematic structural diagram of internal components of a simulation load device in one embodiment;

[0028] Figure 8 It is a schematic structural diagram of internal components of a simulation load device in one embodiment;

[0029] Figure 9 It is a schematic electrical connection block diagram of a simulation load device in one embodiment.

[0030] The accompanying drawing reference numerals are as follows:

[0031] 1 - housing, 11 - first side plate, 12 - second side plate, 13 - third side plate, 14 - fourth side plate, 15 - fifth side plate, 16 - sixth side plate;

[0032] 2 - control board, 21 - first control board, 211 - first circuit board, 212 - first component, 22 - second control board, 221 - second circuit board, 222 - second component;

[0033] 3 - power board, 31 - first power board, 311 - third circuit board, 312 - third component 312, 32 - second power board, 321 - fourth circuit board, 322 - fourth component, 33 - mounting terminal;

[0034] 4 - input interface;

[0035] 5 - output interface;

[0036] 6 - support frame, 61 - vertical plate, 62 - horizontal plate;

[0037] 7 - heat dissipation air source. Detailed implementation manners

[0038] The present utility model will be further described in detail below in conjunction with the accompanying drawings through specific implementation manners. Similar elements in different implementation manners are labeled with related similar reference numerals. In the following implementation manners, many detailed descriptions are provided to enable a better understanding of the present application. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification, which is to avoid the core part of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the descriptions in the specification and the general technical knowledge in the art.

[0039] In addition, the features, operations, or characteristics described in the specification can be combined in any appropriate manner to form various implementation manners. At the same time, the steps or actions in the method description can also be reordered or adjusted in an obvious manner by those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for clearly describing a certain embodiment and do not mean that they are the necessary sequences, unless it is stated that a certain sequence must be followed.

[0040] The serial numbers assigned to components in this text itself, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. And the "connection" and "coupling" mentioned in this application, unless otherwise specified, both include direct and indirect connection (coupling). The "non" or "eye" shape refers to a structure with two vertical plates (circuit boards) in the middle and several horizontal plates (circuit boards) provided between the two vertical plates, and it is not limited that this structure can only have one or two horizontal plates.

[0041] In one embodiment, a simulated load device is provided. This simulated load device is used to test a product to be tested as a simulated load for a power supply and its converter and the like, so as to test the performance such as the output power of the product to be tested. This simulated load device can be a DC simulated load device or an AC simulated load device.

[0042] This simulated load device has re - arranged its internal structure, forming a "non" - shaped or "eye" - shaped layout inside. Multiple power boards form a matrix layout. This component layout makes the internal structure more compact, improves the load power density per unit volume of the simulated load device. At the same time, a matrix - type heat dissipation channel is formed inside the simulated load device, which can be adapted to the fan of a standard square part and has a good heat dissipation effect.

[0043] The simulated load device in this embodiment can be a multi - channel simulated load device. Multi - channel means that multiple loads can be simulated simultaneously. For example, it can be an eight - channel simulated load device. An eight - channel simulated load device can simulate eight loads simultaneously. The multi - channel simulated loads can also be used in parallel to meet the test requirements of more products to be tested. In this embodiment, an eight - channel simulated load device is taken as an example for illustration. In other embodiments, it can also be a simulated load device with other numbers of channels such as six - channel.

[0044] Please refer to Figures 1 to 5 , the simulated load device of this embodiment mainly includes a housing 1, a control board 2, a power board 3, and a heat dissipation air source 7. The control board 2, the power board 3, and the heat dissipation air source 7 are arranged inside the housing 1, and the housing 1 protects the control board 2, the power board 3, and the heat dissipation air source 7. Among them, the control board 2 and the power board 3 are combined into a simulated load module for simulating the load of the product to be tested.

[0045] The housing 1 can be a square box body. The housing 1 can be surrounded by six side plates. The six side plates can be of sheet metal structure. The six side plates can be fixedly connected by screws or welding and other means. Multiple of the six side plates can be formed by bending a single sheet metal part. For example, the top surface and the rear side plate can be formed by bending a single sheet metal part. The side plates in the housing 1 can be detachably installed with each other to facilitate the maintenance of the components inside the housing 1.

[0046] The housing 1 may include a first side plate 11, a second side plate 12, a third side plate 13, a fourth side plate 14, a fifth side plate 15, and a sixth side plate 16. The first side plate 11 and the second side plate 12 are oppositely arranged, the third side plate 13 and the fourth side plate 14 are opposite, and the fifth side plate 15 and the sixth side plate 16 are opposite. The first side plate 11, the third side plate 13, the second side plate 12, and the fourth side plate 14 are sequentially connected end to end to form a rectangular structure. The fifth side plate 15 and the sixth side plate 16 are connected to both sides of the rectangular structure. The first side plate 11, the second side plate 12, the third side plate 13, the fourth side plate 14, the fifth side plate 15, and the sixth side plate 16 can be fixedly connected to each other by means such as screw connection, snap connection, and welding. Among them, some sides are detachably connected by means such as screw connection to facilitate disassembly and assembly for organizing products and subsequent maintenance. The first side plate 11 is the front side plate. The first side plate 11 is the surface often used by users when using the simulated load device, that is, the side for plugging in the input device. The second side plate 12 is the rear side plate, the third side plate 13 is the left side plate, the fourth side plate 14 is the right side plate, the fifth side plate 15 is the upper side plate, and the sixth side plate 16 is the lower side plate. Among them, the second side plate 12 and the fifth side plate 15 can be bent from a single sheet metal part; any other two side plates can also be bent from sheet metal parts. Such a design can reduce fixed connection structures such as screws and improve the disassembly and assembly effect.

[0047] The simulated load device is provided with eight power boards 3. Four of the eight power boards 3 are arranged on one side inside the housing 1 and connected to a control board 2, and the other four of the eight power boards 3 are arranged on the other side inside the housing 1 and connected to another control board 2. Among them, the number of power boards 3 determines the number of channels of the simulated load device. For example, Figure 3 in this case, since this simulated load device has eight power boards 3, an eight-channel simulated load device is formed. Among them, the eight power boards 3 have the same structural form, and a single power board 3 is made into a standard part. Such a design makes it easier to set up simulated load devices with different numbers of channels according to needs.

[0048] The eight power boards 3 are respectively connected to two control boards 2, and the two control boards 2 are electrically connected to each other. The two control boards 2 can control the eight power boards 3 to be connected to the power converter under test for simulation testing, and the two control boards 2 can control any one or more of the eight power boards 3 to operate independently.

[0049] A control board 2 is provided inside the housing 1. The control board 2 includes a first control board 21 and a second control board 22. The first control board 21 and the second control board 22 are arranged close to each other, and the first control board 21 and the second control board 22 are arranged parallel to each other in the middle of the housing 1. Preferably, the first control board 21 and the second control board 22 are parallel to the third side plate 13 and the fourth side plate 14 of the housing 1.

[0050] The first control board 21 includes a first circuit board 211 and first components 212. The first circuit board 211 is a circuit board with a printed circuit. A number of first components 212 are mounted on the first circuit board 211, and the first components 212 and the printed circuit on the first circuit board 211 form a control circuit. The second control board 22 includes a second circuit board 221 and second components 222. The second circuit board 221 is a circuit board with a printed circuit. A number of second components 222 are mounted on the second circuit board 221, and the second components 222 and the printed circuit on the second circuit board 221 form a control circuit. The first circuit board 211 and the second circuit board 221 can be electrically connected through a cable, and the cable can be routed along the inner surface of the housing 1.

[0051] Among them, the first circuit board 211 and the second circuit board 221 can be arranged parallel to each other, and the first circuit board 211 and the second circuit board 221 are located in the middle of the housing 1. With such a layout, there will be no wasted space gap between the first circuit board 211 and the second circuit board 221, making the spatial layout inside the housing 1 more compact, so as to improve the load power density per unit volume.

[0052] The first circuit board 211 has a first side facing away from the second circuit board 221, and the second circuit board 221 has a second side facing away from the first circuit board 211. The first side and the second side are parallel vertical planes.

[0053] The power board 3 includes a number of first power boards 31 and a number of second power boards 32. For example, the power board 3 includes four first power boards 31 and four second power boards 32. The first power board 31 includes a third circuit board 311 and third components 312. The third circuit board 311 is a circuit board printed with a circuit. A number of third components 312 are mounted on the third circuit board 311, and a number of third components 312 can be mounted on the same side of the third circuit board 311. A number of third components 312 and the printed circuit on the third circuit board 311 form an analog load circuit. The second power board 32 includes a fourth circuit board 321 and fourth components 322. The fourth circuit board 321 is a circuit board printed with a circuit. A number of fourth components 322 are mounted on the fourth circuit board 321, and a number of fourth components 322 can be mounted on the same side of the fourth circuit board 321. A number of fourth components 322 and the printed circuit on the fourth circuit board 321 form an analog load circuit.

[0054] Four third circuit boards 311 are arranged in a group on the first side of the first circuit board 211. The four third circuit boards 311 are parallel to each other and perpendicular to the first circuit board 211. The four third circuit boards 311 form a first heat dissipation channel among them. The four third circuit boards 311 are arranged parallel to each other at equal distances, and multiple first heat dissipation channels of uniform size can be formed, which is beneficial to improving the heat dissipation efficiency.

[0055] Four fourth circuit boards 321 are another group disposed on the second side surface of the second circuit board 221. The four fourth circuit boards 321 are parallel to each other and perpendicular to the second circuit board 221. A second heat dissipation channel is formed among the four fourth circuit boards 321. The four fourth circuit boards 321 are arranged parallel to each other at equal intervals, and multiple second heat dissipation channels of uniform size can be formed, which is beneficial to improving the heat dissipation efficiency.

[0056] Multiple first heat dissipation channels and multiple second heat dissipation channels are parallel to each other, forming a matrix of multiple heat dissipation channels. The first heat dissipation channel and the second heat dissipation channel can dissipate heat along the same direction, which can avoid the collision and cancellation of the air flow between the first heat dissipation channel and the second heat dissipation channel, and is beneficial to improving the heat dissipation efficiency.

[0057] In this embodiment, the four third circuit boards 311 and the four fourth circuit boards 321 can be correspondingly aligned in the same plane, that is, the four third circuit boards 311 and the four fourth circuit boards 321 are aligned in four mutually parallel planes and combined into a "non" shape. The first circuit board 211 and the second circuit board 221 are located in the middle, and the four third circuit boards 311 and the four fourth circuit boards 321 are located on both sides of the first circuit board 211 and the second circuit board 221.

[0058] In other embodiments, the four third circuit boards 311 and the four fourth circuit boards 321 can be arranged in a staggered manner. The third circuit boards 311 and the fourth circuit boards 321 are located in different planes, and the four third circuit boards 311 and the four fourth circuit boards 321 are slightly staggered in the vertical position. This structure is beneficial to the installation of the four third circuit boards 311 and the four fourth circuit boards 321. For example, it is beneficial to connect the four third circuit boards 311 and the four fourth circuit boards 321 to the support frame located in the middle and avoid interference during installation and fixation.

[0059] In this embodiment, the first circuit board 211 and the second circuit board 221 can be directly fixedly connected to the third side plate 13 or the fourth side plate 14 of the housing 1 by means of screws, snap connections, etc. The third circuit boards 311 and the fourth circuit boards 321 can also be directly fixedly connected to the first side plate 11 and the second side plate 12 of the housing 1 by means of screws, snap connections, etc.

[0060] In this embodiment, a group of first electrical connection terminals are provided on the first side surface of the first circuit board 211. The third circuit board 311 is provided with third electrical connection terminals adapted to the first electrical connection terminals. The first electrical connection terminals and the third electrical connection terminals are inserted to realize the electrical connection between the first circuit board 211 and the third circuit board 311. The first electrical connection terminals and the third electrical connection terminals can be a slot and a plug, and the two form a detachable insertion to facilitate the replacement and maintenance of the first power board 31.

[0061] A set of second electrical connection terminals is provided on the second side surface of the second circuit board 221. The fourth circuit board 321 is provided with fourth electrical connection terminals adapted to the second electrical connection terminals. The second electrical connection terminals are plugged into the fourth electrical connection terminals to achieve the electrical connection between the second circuit board 221 and the fourth circuit board 321. The second electrical connection terminals and the fourth electrical connection terminals can be a slot and a plug, and the two form a detachable plug-in connection to facilitate the replacement and maintenance of the second power board 32.

[0062] In this embodiment, the third circuit board 311 is in a long strip structure, and the side surface of the third circuit board 311 along the length direction is parallel to the first circuit board 211. The first power boards 31 are stacked and spaced along the height direction. The first power boards 31 are not stacked in the length direction but are stacked in the shorter height direction; similarly, the fourth circuit board 321 is in a long strip structure, and the side surface of the fourth circuit board 321 along the length direction is parallel to the second circuit board 221. The second power boards 32 are stacked and spaced along the height direction. The second power boards 32 are not stacked in the length direction but are stacked in the shorter height direction. Such a layout makes it so that none of the length, width, and height of the housing 1 is much longer than the other dimensions, and the combined body formed by the two control boards 2 and the multiple power boards 3 is closer to a matrix-shaped square body, forming a matrix-shaped heat dissipation channel, which is beneficial for the fan of the standard direction component to be adapted to improve the heat dissipation effect.

[0063] In this embodiment, the analog load device further includes eight input interfaces 4 and one output interface 5. The number of input interfaces 4 is the same as the number of power boards 3. One power board 3 is correspondingly connected to one input interface 4, that is, each power board 3 has a separate input to achieve the independent operation of a single channel. The input interfaces 4 are installed on the third circuit board 311 and the fourth circuit board 321. All the input interfaces 4 are located on one side of the first side plate 11 and are exposed on the first side plate 11. The input interfaces 4 are used for plugging in the power supply device to be tested. The output interface 5 is installed on the second side plate 12. The output interface 5 is connected to the control board 2. The output interface 5 can be connected to devices such as an inverter. The output interface 5 is used for outputting the recycled electric energy.

[0064] The input interfaces 4 and the output interface 5 are distributed on opposite sides of the analog load device, which is beneficial for the layout of the internal circuit and can also separate the plugged-in input cables and output cables to avoid mutual entanglement.

[0065] In this embodiment, ventilation holes are provided on the first side plate 11 and the second side plate 12 of the housing 1. A plurality of mesh ventilation holes are distributed on the first side plate 11, and the second side plate 12 is provided with a ventilation hole with a relatively large radius. The ventilation hole with a relatively large radius is adapted to the size of the heat dissipation air source 7. The heat dissipation air source 7 is installed on the inner side surface of the second side plate 12, and the heat dissipation air source 7 is aligned with the ventilation hole with a relatively large radius. The heat dissipation air source 7 can be a heat dissipation fan, and the heat dissipation fan is of a standard square structure.

[0066] The heat dissipation air source 7 is located at one end of the matrix-type heat dissipation channel. The heat dissipation air source 7 is located at the same end of a plurality of power boards 3 distributed in a matrix, that is, the heat dissipation air source 7 is located at the same end of the first heat dissipation channel and the second heat dissipation channel. The air outlet direction of the heat dissipation air source 7 is parallel to the matrix-type heat dissipation channel, and the center of the air outlet end surface of the heat dissipation air source 7 is aligned with the center of the "non"-shaped layout. The heat dissipation air source 7 is used to drive the outside air to enter the matrix-type heat dissipation channel through the ventilation hole of the second side plate 12 and then discharge from the ventilation hole of the first side plate 11. During the flow of the air in the matrix-type heat dissipation channel, heat exchange occurs when it contacts the control board 2 and the power board 3, so as to realize the cooling and heat dissipation of the control board 2 and the power board 3. And a plurality of third components 312 and a plurality of fourth components 322 are located in the matrix-type heat dissipation channel. The plurality of third components 312 and the plurality of fourth components 322 are the main heat sources. The heat dissipation air can be in full contact with the plurality of third components 312 and the plurality of fourth components 322 to achieve a better heat dissipation effect.

[0067] In other embodiments, the air outlet direction of the heat dissipation air source 7 can also be slightly inclined relative to the matrix-type heat dissipation channel, and it can still drive the flow of the space in the matrix-type heat dissipation channel to form a certain heat dissipation effect.

[0068] In other embodiments, ventilation holes can also be provided on the second side plate 12, the third side plate 13, the fourth side plate 14, the fifth side plate 15 and the sixth side plate 16 to increase the contact area between the accommodation cavity in the housing 1 and the outside, so as to improve the heat dissipation effect in the housing 1.

[0069] In this embodiment, since two control boards 2 are arranged in the analog load device and connected to a plurality of power boards 3, the two control boards 2 are located on both sides, and the plurality of power boards 3 are arranged on both sides of the two control boards 2. The two control boards and the plurality of power boards are combined into a "non"-shaped layout. This layout is more compact, there is no large gap space, avoiding space waste, and can improve the analog load power density per unit volume of the analog load device. This layout can also form a plurality of matrix-type heat dissipation channels, and it can be relatively easy to adapt to a standard square fan, thereby ensuring a good heat dissipation effect.

[0070] The "non"-shaped layout composed of two control boards 2 and eight power boards 3 is conducive to designing an analog load device with other numbers of channels. Only by increasing or decreasing the number of power boards 3 on both sides of the two control boards 2 can the design of an analog load device with other numbers of channels be achieved.

[0071] The power board 3 is more likely to be damaged than the control board 2. Therefore, multiple power boards 3 are installed relatively independently, enabling the power board 3 to be replaced individually, which facilitates the maintenance of the analog load device.

[0072] Please refer to Figure 6 , in an embodiment, the control board 2 can also be horizontally arranged at the middle position of the accommodating cavity of the housing 1, that is, by Figure 4 flipping the combination of the control board 2 and the power board 3 in the housing 1 by 90°. This structural combination can form a compact layout, improve the load power density per unit volume, and at the same time realize a matrix-type heat dissipation channel.

[0073] In an embodiment, other numbers of power boards 3 can be provided in the housing 1, that is, other numbers of channels are set. For example, four or six power boards 3 are set. Correspondingly, four or six input interfaces 4 are provided to form a four-channel or six-channel analog load device.

[0074] Preferably, an even number of power boards 3 are provided in this analog load device so that the power boards 3 can be in one-to-one correspondence on both sides of the control board 2. In other words, setting an even number of power boards 3 on both sides of the control board 2 can avoid wasting space on one side of the control board 2, achieve a compact layout, improve the load power density per unit volume, and at the same time realize a matrix-type heat dissipation channel. The analog load device can be provided with an even number of corresponding power boards 3 according to the channel number requirement.

[0075] Please refer to Figure 3 and Figure 4 , in an embodiment, a support frame 6 is provided in the middle of the housing 1. The support frame 6 can be a support plate structure. The support frame 6 is arranged at the middle position of the housing 1. The support frame 6 can be a support plate structure. The support frame 6 is located between the first control board 21 and the second control board 22, and the support frame 6 is parallel to the third side plate 13 and the fourth side plate 14. The support frame 6 is perpendicular to the third circuit board 311 and the fourth circuit board 321. The power board 3 can be fixedly connected to the support frame 6 through connection structures such as screws and buckles.

[0076] The support frame 6 can include a vertical plate 61 and a horizontal plate 62. The vertical plate 61 is parallel to the first circuit board 211 and the second circuit board 221. The upper and lower ends of the vertical plate 61 are bent and modified into the horizontal plate 62. The horizontal plate 62 can also be fixedly connected to the vertical plate 61 through welding, screw connection, etc. The horizontal plate 62 can be fixedly connected to the fifth side plate 15 and the sixth side plate 16 through screw connection, welding, etc.

[0077] The support frame 6 may include two vertical plates 61 which are arranged in parallel between the first circuit board 211 and the second circuit board 221. The two vertical plates 61 may be connected by horizontal plates 62 at the upper and lower ends. The two vertical plates 61 may have the same structure, or they may have different structures. For example, one vertical plate 61 may be a loop-shaped plate to provide sufficient support strength, and the other vertical plate 61 may include a plurality of continuous or discontinuous plates.

[0078] The first circuit board 211 and the second circuit board 221 may be fixedly connected to the vertical plate 61 respectively by means such as screws and snap connections.

[0079] The third circuit board 311 and the fourth circuit board 321 may be respectively provided with mounting terminals 33. The third circuit board 311 and the fourth circuit board 321 are connected to the housing 1 through the mounting terminals 33, and the mounting terminals 33 may be arranged on one or more side edges of the third circuit board 311 and the fourth circuit board 321 so that the third circuit board 311 and the fourth circuit board 321 can be respectively fixedly connected to a plurality of side plates of the housing 1.

[0080] Wherein, the mounting terminals 33 may be arranged on both sides of the input interface 4 to improve the stability of the insertion of the input interface 4. The mounting terminals 33 may also be metal components. The third circuit board 311 and the fourth circuit board 321 may be electrically connected to the housing 1 through the mounting terminals 33. When the housing 1 is placed on the ground or other grounding platforms, the second circuit board 32 can be grounded to achieve grounding protection for the power board 3.

[0081] The support frame 6 arranged in the housing 1 can play a role in fixing and supporting the plurality of power boards 3, improve the stability of the installation of the power boards 3, and also avoid the gravity of the power boards 3 being transferred to the control board 2, thereby avoiding the control board 2 from being stressed, which is beneficial to improving the service life of the control board 2 and the power boards 3.

[0082] In one embodiment, the heat dissipation air source 7 may also be installed on the outer side surface of the second side plate 12. Such a setting can make the two ends of the control board 2 and the power boards 3 in the housing 1 abut against the first side plate 11 and the second side plate 12, realizing a more compact layout and further reducing the volume of the analog load device.

[0083] In one embodiment, the heat dissipation air source 7 may also be arranged on other side surfaces of the housing 1. For example, the heat dissipation air source 7 is arranged on the fifth side plate 15, and there is a certain spacing space between the third circuit board 311 and the fourth circuit board 321. Ventilation holes are provided on the third side plate 13 and the fourth side plate 14, and an L-shaped heat dissipation channel can be formed in the housing 1. Such a structure can also achieve a certain heat dissipation effect on the components inside the housing 1.

[0084] Please refer toFigures 7 to 9 In one embodiment, a simulated load device is provided. The simulated load device of this embodiment is different from any of the above embodiments in that the layout of the first control board 21 and the second control board 22 are different.

[0085] In this embodiment, the first control board 21 and the second control board 22 are arranged far away from each other, and the first control board 21 and the second control board 22 are arranged on two sides of the housing 1 .

[0086] The housing 1 has a first inner side surface and a second inner side surface which are relatively parallel, the first inner side surface is the inner side surface of the third side plate 13, and the second inner side surface is the inner side surface of the fourth side plate 14. The first control board 21 abuts against or is close to the first inner side surface of the housing 1, and the second control board 22 abuts against or is close to the second inner side surface of the housing 1, that is, the first control board 21 and the second control board 22 are arranged in the housing at intervals, and the first control board 21 and the second control board 22 are located at the edge positions of both sides of the housing 1, and a large space is formed between the first control board 21 and the second control board 22, and the space is used to install eight power boards 3.

[0087] Among them, the first circuit board 211 and the second circuit board 221 can be arranged parallel to each other, and the first circuit board 211 is parallel to the first inner side of the housing 1, and the second circuit board 221 is parallel to the second inner side of the housing 1. Such a layout can make the first circuit board 211 directly abut against the first inner side, and there will be no gap between the first circuit board 211 and the first inner side of the housing 1 to waste space, and the second circuit board 221 is directly abut against the second inner side, and there will be no gap between the second circuit board 221 and the second inner side of the housing 1 to waste space, so that the space layout in the housing 1 is more compact. Of course, the first circuit board 211 can be approximately parallel to the first inner side of the housing 1, and the second circuit board 221 can be approximately parallel to the second inner side of the housing 1, and the first circuit board 211 and the second circuit board 221 can be as close to the two sides of the housing 1 as possible, so as to improve the compactness of the layout in the housing 1 and improve the load power density per unit volume.

[0088] The first circuit board 211 has a first side surface facing the second circuit board 221, and the second circuit board 221 has a second side surface facing the first circuit board 211. The first side surface and the second side surface are vertical surfaces parallel to each other. The first circuit board 211 and the second circuit board 221 are located on both sides, and the four third circuit boards 311 and the four fourth circuit boards 321 are located in the space between the first circuit board 211 and the second circuit board 221, and are combined into a "日"-shaped or "目"-shaped structure.

[0089] In this embodiment, since there are two control boards 2 in the simulation load device connected to a plurality of power boards 3, the two control boards 2 are located on both sides, and the plurality of power boards 3 are arranged between the two control boards 2. The two control boards and the plurality of power boards are combined into an "eye" - shaped layout. This layout is more compact, without large gap spaces, avoiding space waste, and can improve the simulation load power density per unit volume of the simulation load device. This layout can also form a matrix of multiple heat dissipation channels, which can more easily adapt to the fans of standard square parts, and thus can ensure good heat dissipation effects.

[0090] The above uses specific examples to elaborate on the present utility model, which is only used to help understand the present utility model and does not limit the present utility model. The present utility model also includes any combination of the above - mentioned embodiments. For those skilled in the technical field to which the present utility model belongs, according to the idea of the present utility model, several simple deductions, deformations or replacements can also be made.

Claims

1. A simulated load device, characterized in that: include: A control board, the control board comprises a first control board and a second control board, the first control board comprises a first circuit board and a first component arranged on the first circuit board, the second control board comprises a second circuit board and a second component arranged on the second circuit board, the first circuit board and the second circuit board are electrically connected; the first circuit board and the second circuit board are arranged close to each other or away from each other, the first circuit board has a first side surface, and the second circuit board has a second side surface; A power board, the power board includes a plurality of first power boards and a plurality of second power boards, the first power board includes a third circuit board and a third component, the second power board includes a fourth circuit board and a fourth component; a plurality of the third circuit boards are arranged on the first side of the first circuit board and are electrically connected to the first circuit board, and a plurality of first heat dissipation channels are formed between the third circuit boards; a plurality of the fourth circuit boards are arranged on the second side of the second circuit board and are connected to the second circuit board, and a plurality of second heat dissipation channels are formed between the fourth circuit boards; as well as A heat dissipation air source is located at the same end of the plurality of first heat dissipation channels and the second heat dissipation channels, and is used to drive the air flow in the first heat dissipation channels and the second heat dissipation channels.

2. The simulated load device according to claim 1, characterized in that: It also includes a shell, the control board, the power board and the heat dissipation air source are arranged in the shell, the first control board and the second control board are arranged parallel to each other in the middle of the shell, and the first side surface and the second side surface are arranged back to back.

3. The simulated load device according to claim 1, characterized in that: It also includes a shell, the control board, the power board and the heat dissipation air source are arranged in the shell, the first control board and the second control board are arranged parallel to each other on both sides of the shell, and the first side surface and the second side surface are arranged face to face.

4. The simulated load device according to claim 2 or 3, characterized in that: The third circuit board is perpendicular to the first circuit board, and the fourth circuit board is perpendicular to the second circuit board.

5. The simulated load device according to claim 4, characterized in that: The plurality of third circuit boards and the plurality of fourth circuit boards are staggered and located in different planes.

6. The simulated load device according to claim 4, characterized in that: The plurality of third circuit boards and the plurality of fourth circuit boards correspond one by one to the same plane.

7. The simulated load device according to claim 2, characterized in that: It also includes a support frame, which is arranged between the first control board and the second control board; the support frame is fixed to the shell, one end of the third circuit board is connected to the shell, and the other end is connected to the support frame, and one end of the fourth circuit board is connected to the shell, and the other end is connected to the support frame.

8. The simulated load device according to claim 7, characterized in that: The support frame is a support plate located in the middle of the shell, and the support plate is parallel to the first circuit board and the second circuit board.

9. The simulated load device according to claim 2, characterized in that: Two opposite sides of the shell are provided with ventilation holes, and the heat dissipation air source is installed on the side of the shell having the ventilation holes.

10. The simulated load device according to claim 9, characterized in that: The blowing direction of the heat dissipation air source is parallel to the heat dissipation channel; and / or the heat dissipation air source is a fan.

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