LED lamp bead structure capable of emitting light from two sides
By designing paired conductive disks and mounting disks in the LED lamp bead structure, and combining light-transmitting and opaque colloids, the effect of luminescence on both sides is achieved, solving the problem of two lamp beads required for double-side luminescence in the prior art, reducing design costs and improving production efficiency.
Patent Information
- Application Number
- CN202422127830.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-08-30
AI Technical Summary
In the prior art, the two-sided luminous lamp beads require two sided luminous LED lamp beads, resulting in high design cost and low production efficiency.
Design a double-sided luminous LED lamp bead structure, including LED carrier plate, driver chip, LED chip, light-transmitting colloid and light-transmitting colloid. By setting pairs of conductive pads and mounting pads on the LED carrier board, and setting a driver chip and LED chip on the conductive pads, the combination of light-transmitting and opaque colloids can achieve the effect of luminescence on both sides.
The LED lamp bead structure with double-side luminescence is realized, which reduces design costs and improves production efficiency, and solves the problem that two lamp beads are required for double-side luminescence in the prior art.
Smart Images
Figure CN222980511U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED lamp beads, in particular to an LED lamp bead structure with double-sided light emission. Background Art
[0002] An LED lamp bead is an electronic component that can emit light through an LED chip. In the current design of LED lamp beads, usually only one side can emit light. If two sides need to emit light, two side-emitting LED lamp beads are required. This design has a high cost, low production efficiency, and a complex structure. Summary of the Utility Model
[0003] The purpose of the utility model is to provide an LED lamp bead structure with double-sided light emission, aiming to solve the problem in the prior art that two side-emitting LED lamp beads are required for double-sided light-emitting lamp beads, resulting in a high design cost.
[0004] The utility model is implemented as follows. The utility model provides an LED lamp bead structure with double-sided light emission, including:
[0005] An LED carrier board, a driving chip, a plurality of LED chips, a first colloid, and a second colloid;
[0006] A plurality of conductive pads are arranged on the front surface of the LED carrier board, and a plurality of mounting pads are arranged on the back surface of the LED carrier board, and the conductive pads are electrically connected to the mounting pads in a one-to-one correspondence;
[0007] The driving chip is arranged on one of the conductive pads, and the LED chips are arranged on the remaining conductive pads. The driving chip and the LED chips are both electrically connected to the conductive pads through metal wires;
[0008] The first colloid is covered and arranged on the front surface of the LED carrier board, and covers a plurality of the conductive pads. The shape of the first colloid is a cuboid, and the first colloid is a light-transmitting colloid;
[0009] The second colloid covers the top surface and two opposite side surfaces of the first colloid, and the second colloid is a non-light-transmitting colloid.
[0010] Preferably, both ends of the LED carrier board have fitting connection parts, and the fitting connection parts are used for the LED carrier boards to be fitted and connected to each other, so that a plurality of the LED carrier boards are fitted and connected into a whole.
[0011] Preferably, the second colloid covers the two side surfaces of the first colloid respectively facing the fitting connection parts at both ends of the LED carrier board.
[0012] Preferably, the number of the conductive pads is at least 4.
[0013] Preferably, at least three of the LED chips and one of the driving chips are disposed on each of the conductive pads on the front side of the LED carrier board.
[0014] Preferably, the outer shape of the first colloid can be replaced with an oval shape.
[0015] Preferably, the conductive pads are engaged with each other in a staggered form.
[0016] Preferably, the first colloid and the second colloid are prepared by a molding method or a thermosetting method.
[0017] The utility model provides an LED lamp bead structure with double-sided light emission, which has the following beneficial effects:
[0018] In the utility model, a plurality of pairs of conductive pads and mounting pads are arranged on an LED carrier board, a driving chip and each LED chip are arranged on the conductive pads, a cuboid light-transmitting first colloid is arranged on the front side of the LED carrier board, and an opaque second colloid is covered on the first colloid, so that the second colloid covers the top surface and a pair of side surfaces of the first colloid, thereby enabling the two uncovered side surfaces to guide the light of the LED chips to be diffused, and thus obtaining an LED lamp bead structure with light emission on both sides, and solving the problem in the prior art that two side-emitting LED lamp beads are required for a double-sided light-emitting lamp bead, and the design cost is high. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a schematic structural diagram of an LED lamp bead structure with double-sided light emission provided by an embodiment of the utility model;
[0020] Figure 2 is a schematic wiring structure diagram of an LED lamp bead structure with double-sided light emission provided by an embodiment of the utility model;
[0021] Figure 3 is a schematic back structure diagram of an LED lamp bead structure with double-sided light emission provided by an embodiment of the utility model;
[0022] Figure 4 is a structural diagram of a lamp bead chain obtained by connecting LED lamp bead structures with double-sided light emission provided by an embodiment of the utility model.
[0023] Reference numerals: 1-LED carrier board, 2-driving chip, 3-LED chip, 4-first colloid, 5-second colloid, 6-conductive pad, 7-mounting pad, 8-fitting connection part. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0024] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.
[0025] The implementation of the present utility model will be described in detail below in conjunction with specific embodiments.
[0026] Refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, a preferred embodiment is provided for the present utility model.
[0027] The present utility model provides an LED lamp bead structure with double-sided light emission, including:
[0028] An LED carrier board, a driving chip, a plurality of LED chips, a first colloid and a second colloid.
[0029] Specifically, a plurality of conductive pads are provided on the front surface of the LED carrier board, and a plurality of mounting pads are provided on the back surface of the LED carrier board, and the conductive pads and the mounting pads are electrically connected in one-to-one correspondence.
[0030] More specifically, the conductive pads are metal areas for electrical connection. They are usually made of copper and covered with a protective coating such as solder, nickel-gold, etc. to prevent oxidation. They are mainly used to connect the pins of electronic components by soldering, and can provide electrical connection and mechanical support. Conductive pads usually exist in surface mount technology (SMT) and through-hole technology (THT). For example, the pins of surface mount components (such as resistors, capacitors, integrated circuits, etc.) are soldered to the conductive pads on the PCB.
[0031] More specifically, the mounting pads are used to fix the positions of surface mount components (SMDs). These pads usually also have the function of conductive pads, but more emphasis is placed on their role as component fixing positions. The design of the mounting pads needs to consider the shape and size of the components to ensure that the components can be correctly placed and soldered. They are generally made of copper and may be covered with solder or other coatings.
[0032] More specifically, a driving chip is provided on one of the conductive pads, and LED chips are provided on the remaining conductive pads. The driving chip and the LED chips are both electrically connected to the conductive pads through metal wires.
[0033] More specifically, a driving chip is an integrated circuit used to control the working state of an LED. It is mainly responsible for regulating current and voltage to ensure that the LED chip can work under appropriate electrical conditions. In LED lighting applications, the driving chip is usually a constant-current or constant-voltage power driver that can provide a stable current for the LED to prevent damage or performance degradation of the LED caused by current fluctuations. In an LED display, the driving chip also has functions such as data transmission, brightness adjustment, and color control.
[0034] More specifically, an LED chip is a semiconductor component that converts electrical energy into light energy. It is the core part of an LED light-emitting diode. The LED chip emits light by exciting the recombination of electrons and holes in the semiconductor material through current. Different LED chips can produce different light colors and brightnesses. The size, material, and process of the chip will all affect its light output characteristics.
[0035] More specifically, when the driving chip and the LED chip work together, the driving chip adjusts the voltage and current to meet the requirements of the LED chip. The working current of the LED chip is very sensitive, so the driving chip must provide a stable constant-current output to avoid excessive or too small current. The driving chip changes the brightness of the LED by adjusting the magnitude of the current, and usually uses pulse-width modulation (PWM) technology to achieve precise brightness adjustment; the driving chip controls the working states of different color LED chips and generates rich color effects by mixing the three primary colors of red, green, and blue. For example, in an LED display, the driving chip will control the RGB LED chips in each pixel to achieve various image displays.
[0036] It can be understood that the driving chip provides stable working conditions for the LED chip, and at the same time controls the brightness, color, and display effect. The driving chip is responsible for power supply and control, and the LED chip is responsible for emitting light. The collaborative work of the two ensures that the LED device can achieve stable, efficient, and precise light output or display effect.
[0037] More specifically, the first colloid is covered and arranged on the front surface of the LED carrier board and wraps a plurality of conductive pads. The shape of the first colloid is a cuboid, and the first colloid is a light-transmitting colloid; the second colloid is covered and arranged on the top surface and two opposite side surfaces of the first colloid, and the second colloid is a non-light-transmitting colloid.
[0038] More specifically, the main purpose of setting a light-transmitting colloid (also called a packaging colloid or a light-transmitting packaging material) on the LED chip is to improve the optical performance of the LED, protect the chip, and enhance its mechanical strength.
[0039] More specifically, setting a light-transmitting colloid on the LED chip can improve the light extraction efficiency: When the light emitted by the LED chip propagates between different media (such as semiconductor materials and air), light reflection and refraction will occur due to the difference in refractive index, resulting in part of the light being unable to directly emit from the chip surface. The light-transmitting colloid usually has a relatively high refractive index, which can reduce the light reflection loss and increase the extraction efficiency of light from the inside to the outside of the chip, thereby improving the light output of the LED.
[0040] More specifically, setting a light-transmitting colloid on the LED chip can protect the LED chip: The light-transmitting colloid covers the LED chip, which can effectively protect the chip from the influence of the external environment, such as moisture, dust, chemical corrosion, etc. It can also absorb and disperse mechanical stress to prevent the chip from being damaged due to vibration, thermal expansion or other external forces.
[0041] More specifically, setting a light-transmitting colloid on the LED chip can improve the optical properties: The light-transmitting colloid can optimize the optical properties of the LED by adjusting its material composition and geometric shape. For example, by designing a packaging in the shape of a convex lens, the divergence angle of the light can be controlled to achieve a more concentrated light beam or a more uniform light output. Some light-transmitting colloids can also be added with phosphor to change the light color of the LED. For example, a blue LED chip plus a yellow phosphor can generate a white LED.
[0042] More specifically, setting a light-transmitting colloid on the LED chip can enhance the mechanical strength: The light-transmitting colloid forms a protective film on the chip, enhancing the mechanical strength of the chip, making it more durable and less likely to be damaged during manufacturing, transportation, installation and use.
[0043] More specifically, setting a light-transmitting colloid on the LED chip can improve the thermal management performance: The light-transmitting colloid also has a certain thermal conductivity, which can help dissipate heat, conduct the heat generated by the chip out faster, reduce the working temperature of the chip, and extend the life of the LED.
[0044] More specifically, an opaque second colloid is covered on the first colloid. The second colloid can block the light that is not desired to be scattered, thereby controlling the light output direction. Since the surfaces of the second colloid covering the first colloid are the top surface and a pair of side surfaces, a pair of side surfaces are still left on the first colloid, and these side surfaces can allow light to pass through, thereby achieving the effect of double-sided light emission.
[0045] The utility model provides a double-sided light-emitting LED lamp bead structure, which has the following beneficial effects:
[0046] The utility model provides a structure in which a plurality of pairs of conductive pads and mounting pads are arranged on an LED carrier board. A driving chip and each LED chip are arranged on the conductive pads. A first light-transmitting colloid in the shape of a cuboid is arranged on the front surface of the LED carrier board, and an opaque second colloid is covered on the first colloid, so that the second colloid covers the top surface and a pair of side surfaces of the first colloid, thereby enabling the two uncovered side surfaces to guide the light of the LED chips to diffuse, thus obtaining an LED lamp bead structure with light emission on both sides, which solves the problem in the prior art that two side-emitting LED lamp beads are required for a double-sided light-emitting lamp bead, resulting in a high design cost.
[0047] Preferably, both ends of the LED carrier board are provided with fitting connection parts, which are used for the LED carrier boards to be fitted and connected to each other, so that a plurality of LED carrier boards are fitted and connected into a whole.
[0048] Specifically, the above-mentioned LED lamp bead structure manufactured based on the LED carrier board can be used as a link in a lamp bead chain. That is to say, a plurality of LED lamp bead structures can be connected together to form a whole, thereby generating a lamp bead chain.
[0049] More specifically, the side surfaces at both ends of the LED carrier board are provided with fitting connection parts, and the function of the fitting connection parts is to perform fitting connection processing with another fitting connection part. It should be noted that in some special cases, the fitting connection parts cannot be directly connected to each other, but need to cooperate with an additional connecting fitting one to achieve the connection function.
[0050] Preferably, the two side surfaces of the second colloid covering the first colloid are respectively oriented towards the fitting connection parts at both ends of the LED carrier board.
[0051] It can be understood that when the LED carrier boards are connected to each other as a whole through the fitting connection parts, the covering direction of the second colloid on the first colloid on the LED carrier board determines the light irradiation direction. It is not difficult to see that the direction of the fitting connection part is the extension direction of the lamp bead chain. By covering the two side surfaces of the first colloid with the second colloid respectively towards the fitting connection parts at both ends of the LED carrier board, the two side surfaces of the first colloid not covered by the second colloid are respectively perpendicular to the extension direction of the lamp bead chain. Therefore, the light irradiation direction on the lamp bead chain is also towards the two side directions of the extension direction of the lamp bead chain.
[0052] Preferably, the number of conductive pads is at least 4.
[0053] Preferably, at least three LED chips and one driving chip are arranged on each conductive pad on the front surface of the LED carrier board.
[0054] Specifically, among the respective conductive pads, one is used to set the driving chip, and the rest can be used to set the LED chips. The number of LED chips set on each conductive pad can be one or more.
[0055] Preferably, the outer shape of the first colloid can be replaced with an oval shape.
[0056] Specifically, the outer shape of the first colloid can be a cuboid, or other shapes similar to a cuboid, such as an oval shape.
[0057] Preferably, the respective conductive pads are engaged with each other in a staggered form.
[0058] Specifically, the outer shape of the conductive pads is designed to be in a form that can be engaged with each other in a staggered manner, so that the respective conductive pads are engaged with each other in a staggered form to enhance the stability between the conductive pads.
[0059] Preferably, the first colloid and the second colloid are prepared by a molding method or a thermosetting method.
[0060] Specifically, the first colloid and the second colloid can be prepared by a molding method or a thermosetting method.
[0061] More specifically, the method for preparing the LED lamp bead structure can include the following examples:
[0062] Method 1: The LED carrier board is composed of several LED carrier boards, and each LED carrier board is regularly arrayed. After molding the colloid for the entire LED carrier board, the colloid between the LED lamp beads in the same row is connected together, and the colloid between rows is separated and not connected. First, the entire bonded carrier board is molded with the first colloid (translucent colloid). After the first colloid molding is completed, the second colloid (opaque colloid) is then molded. The second colloid covers the periphery of the first colloid. After molding, the two colloids are thermally cured. After curing is completed, the entire board of lamp boards is cut. After cutting is completed, the translucent colloid is exposed on the two adjacent sides of each LED lamp bead in the same row, forming an effect of transparency on both sides.
[0063] Method 2: The LED carrier board is composed of several LED carrier boards, and each LED carrier board is regularly arrayed. After molding the entire board of LED lamp boards, the colloid between each LED is in a non-connected structure. First, the entire bonded carrier board is molded with the first colloid (translucent colloid). After the first colloid molding is completed, the second colloid (opaque colloid) is then molded. The second colloid covers three sides of the first colloid and exposes the two opposite translucent sides. After molding, the two colloids are thermally cured. After curing is completed, the entire board of lamp boards is cut into single LED lamps.
[0064] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A double-side emitting LED lamp bead structure, characterized in that: include: LED carrier board, driver chip, several LED chips, first colloid and second colloid; The front side of the LED carrier is provided with a plurality of conductive pads, the back side of the LED carrier is provided with a plurality of mounting pads, and the conductive pads are electrically connected to the mounting pads in a one-to-one correspondence; The driving chip is arranged on one of the conductive pads, and the LED chip is arranged on the other conductive pads, and the driving chip and the LED chip are both electrically connected to the conductive pads through metal wires; The first colloid is covered on the front of the LED carrier and covers a plurality of the conductive pads. The first colloid has a rectangular shape and is a light-transmitting colloid. The second colloid covers the top surface and two opposite side surfaces of the first colloid, and the second colloid is a non-light-transmitting colloid.
2. The double-side-emitting LED lamp bead structure according to claim 1, characterized in that: Both ends of the LED carrier board have an interlocking connection portion, and the interlocking connection portion is used for the LED carrier boards to be interlocked and connected with each other, so that a plurality of the LED carrier boards are interlocked and connected into a whole.
3. The double-side-emitting LED lamp bead structure as claimed in claim 2, characterized in that: The second colloid covers the two side surfaces of the first colloid respectively facing the embedded connection parts at two ends of the LED carrier board.
4. The double-side-emitting LED lamp bead structure according to claim 1, characterized in that: The number of the conductive pads is at least 4.
5. The double-side-emitting LED lamp bead structure according to claim 1, characterized in that: At least three LED chips and one driving chip are arranged on each of the conductive pads on the front side of the LED carrier board.
6. The double-side-emitting LED lamp bead structure according to claim 1, characterized in that: The outer shape of the first colloid can be replaced by an ellipse.
7. The double-side-emitting LED lamp bead structure according to claim 1, characterized in that: The conductive pads are interlocked with each other.
8. The double-side-emitting LED lamp bead structure according to claim 1, characterized in that: The first colloid and the second colloid are prepared by molding or thermosetting.