Actuator for optical image stabilization and camera module including the same
By designing an actuator in the camera module, using the combination of image sensor and heat dissipation member to realize vertical movement of the image sensor, the problem of imprecise driving force control caused by the increase in the weight of the lens module in the camera module is solved, and the optical image stability and heat dissipation performance are improved.
Patent Information
- Application Number
- CN202421909561.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-08-10
- Filing Date
- 2024-08-08
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-08-08
AI Technical Summary
As the performance of the camera module improves, the weight of the lens module increases, making it difficult to accurately control the driving force when moving the lens module for optical image stabilization.
An actuator is designed to realize vertical movement of the image sensor by providing an image sensor on a sensor substrate and overlapping with the image sensor in the optical axis direction, thereby stabilizing the optical image. The actuator includes a fixed frame, a moving frame and a first driver that drives movement of the moving frame and the image sensor by electromagnetic force.
By moving the image sensor to perform optical image stabilization, the driving force can be controlled more accurately, the performance of optical image stabilization can be improved, and the temperature of the image sensor can be effectively reduced through the through-silicon heat dissipation member, and the heat dissipation performance of the camera module can be improved.
Smart Images

Figure CN222981622U_ABST
Abstract
Description
[0001] Cross - reference to related applications
[0002] This application claims the benefit of priority to Korean Patent Application No. 10 - 2023 - 0104547, filed on August 10, 2023, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. Technical field
[0003] The following description relates to an actuator for optical image stabilization and a camera module including the actuator. Background art
[0004] Camera modules are used in mobile communication terminals such as tablet personal computers (PCs), laptops, and smartphones.
[0005] In addition, camera modules used in portable electronic devices are equipped with an autofocus function (AF) and an image stabilization function (OIS) to generate high - resolution images. For example, the camera module performs focusing by moving the lens module in the optical axis (Z - axis) direction, and performs optical image stabilization by moving the lens module in a direction perpendicular to the optical axis (Z - axis) direction.
[0006] However, recent improvements in the performance of camera modules have led to an increase in the weight of the lens module, which in turn has created a problem in that it is difficult to precisely control the driving force when moving the lens module for optical image stabilization.
[0007] The above information is presented as background information only to assist in understanding the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above constitutes prior art with respect to the present disclosure. Summary of the utility model
[0008] The Summary of the utility model section is intended to introduce a selection of concepts in a brief form, which will be further described in the Detailed Description section below. The Summary of the utility model section is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to assist in determining the scope of the claimed subject matter.
[0009] In one general aspect, an actuator for optical image stabilization includes: a fixed frame; a movable frame received in the fixed frame and configured to move relative to the fixed frame in a plane perpendicular to the optical axis; and a sensor substrate on which an image sensor is disposed. The sensor substrate includes a fixed portion coupled to the fixed frame, a movable portion including the image sensor and coupled to the movable frame, and a connecting portion disposed between the movable portion and the fixed portion to support the movement of the movable portion. The movable portion includes a heat dissipation member that dissipates heat generated from the image sensor, and the heat dissipation member includes a substrate having through holes and conductive electrodes filling the through holes.
[0010] The heat dissipation member may overlap the image sensor in the optical axis direction.
[0011] The movable portion may further include: a first layer disposed side by side with the fixed portion and the connecting portion in a direction perpendicular to the optical axis; a second layer having a surface disposed on an upper side of the first layer and an opening penetrating the surface in the optical axis direction; and a third layer disposed between the first layer and the second layer. The heat dissipation member may be disposed in the opening of the second layer.
[0012] Each of the first layer and the third layer may have a surface including an opening, and the opening of each of the first layer and the third layer penetrates the surface of each of the first layer and the third layer in the optical axis direction and overlaps the opening of the second layer.
[0013] The heat dissipation member may further include a first extension portion extending toward the openings of the first layer and the third layer in the optical axis direction.
[0014] The movable portion may further include: a first layer disposed side by side with the fixed portion and the connecting portion in a direction perpendicular to the optical axis; and a second layer disposed on an upper side of the first layer. The image sensor may be disposed on one side of the second layer, and the heat dissipation member may be disposed on the other side of the second layer to overlap the image sensor.
[0015] A part of the heat dissipation member may be disposed between the first layer and the second layer. The first layer and the second layer may be electrically connected through the heat dissipation member disposed between the first layer and the second layer.
[0016] The surface of the first layer may have an opening penetrating the surface of the first layer, and the opening of the first layer is at a position overlapping the image sensor in the optical axis direction.
[0017] The heat dissipation member may further include a first extension portion extending toward the opening of the first layer in the optical axis direction.
[0018] The actuator may further include a base disposed below the sensor substrate. A gap may be formed between the movable portion and the base in the optical axis direction.
[0019] The actuator may further include a first driver, the first driver including a plurality of magnets disposed on a moving frame and a plurality of coils disposed on a fixed frame to face the plurality of magnets.
[0020] In another general aspect, a camera module includes: a lens module including lenses arranged in an optical axis direction; and an actuator for optical image stabilization configured to move an image sensor in a plane perpendicular to the optical axis. The actuator includes: a sensor substrate on which an image sensor is disposed; and a heat dissipation member disposed to overlap the image sensor in the optical axis direction. The heat dissipation member includes a substrate having a through hole and a conductive electrode filling the through hole in a thickness direction.
[0021] The sensor substrate may include: a fixed portion; a moving portion configured to move relative to the fixed portion in a plane perpendicular to the optical axis; and a connecting portion disposed between the fixed portion and the moving portion to support the movement of the moving portion. The moving portion may include an image sensor and a heat dissipation member.
[0022] The camera module may further include a base disposed below the sensor substrate. The heat dissipation member may further include an extension portion extending toward the base in the optical axis direction. A gap may be formed between the base and the extension portion.
[0023] The actuator may further include: a fixed frame coupled to the fixed portion; a moving frame coupled to the moving portion; and a first driver separately disposed in the fixed frame and the moving frame and configured to generate a driving force to move the image sensor in a plane perpendicular to the optical axis.
[0024] The camera module may further include a focusing actuator configured to move the lens module in the optical axis direction.
[0025] Other features and aspects will be apparent from the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 is a perspective view of a camera module according to an embodiment of the present disclosure.
[0027] Figure 2 is Figure 1 a schematic exploded perspective view of the camera module of
[0028] Figure 3 is an exploded perspective view of an actuator for optical image stabilization according to an embodiment of the present disclosure.
[0029] Figure 4 is Figure 3Exploded perspective view of the driving part of the actuator for optical image stabilization.
[0030] Figure 5 is Figure 3 Perspective view of the actuator for optical image stabilization.
[0031] Figure 6A is a sectional view taken along Figure 5 the line I-I'.
[0032] Figure 6B is Figure 6A an enlarged view of part A of
[0033] Figure 7A is a sectional view taken along Figure 5 the line II-II'.
[0034] Figure 7B is Figure 7A an enlarged view of part B of
[0035] Figure 8 shows Figure 3 the moving frame of the actuator for optical image stabilization.
[0036] Figure 9 shows Figure 3 the moving frame and the sensor substrate of the actuator for optical image stabilization.
[0037] Figure 10 shows Figure 9 the coupling state of the moving frame and the sensor substrate.
[0038] Figure 11 is an exploded perspective view of the sensor substrate according to an embodiment of the present disclosure.
[0039] Figure 12 is Figure 11 a sectional view of the sensor substrate.
[0040] Figures 13 to 15 is a sectional view of the sensor substrate according to another embodiment of the present disclosure.
[0041] Figure 16 is an exploded perspective view of the focusing actuator according to an embodiment of the present disclosure.
[0042] Figure 17 is Figure 16 the perspective view of the focusing actuator in
[0043] Figure 18 is Figure 16 a side view of the bearing part of the focusing actuator.
[0044] Figure 19 is Figure 16 A perspective view of the housing of the focusing actuator.
[0045] Throughout the drawings and the detailed description, unless otherwise described, the same reference numerals refer to the same elements. For clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, proportions, and depictions of elements in the drawings may be exaggerated. Detailed Description
[0046] Hereinafter, although examples of the present disclosure will be described in detail with reference to the drawings, it should be noted that the examples are not limited thereto.
[0047] The following detailed description is provided to assist the reader in obtaining a comprehensive understanding of the methods, apparatuses, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and / or systems described herein will be apparent after understanding the present disclosure. For example, the order of operations described herein is merely an example and, except for operations that must occur in a specific order, is not limited to the order set forth herein but may be changed, which will be apparent after understanding the present disclosure. Additionally, descriptions of features known in the art may be omitted for greater clarity and conciseness.
[0048] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided only to illustrate some of the many possible ways of implementing the methods, apparatuses, and / or systems described herein that will be apparent after understanding the present disclosure.
[0049] Throughout the specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "coupled to" another element, the element may be directly "on," directly "connected to," or directly "coupled to" the other element, or there may be one or more other elements between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly coupled to" another element, there are no other elements between the element and the other element.
[0050] As used herein, the phrase "and / or" includes any one of the associated listed items and any combination of any two or more of them; likewise, "at least one" includes any one of the associated listed items and any combination of any two or more of them.
[0051] Although terms such as "first", "second", and "third" may be used herein to describe various components, elements, regions, layers, or sections, these components, elements, regions, layers, or sections are not limited by these terms. Rather, these terms are only used to distinguish one component, element, region, layer, or section from another. Thus, a first component, element, region, layer, or section referred to in the examples herein may also be termed a second component, element, region, layer, or section without departing from the teachings of the examples described herein.
[0052] Spatial relative terms such as "above", "upper", "below", "lower", etc. may be used herein for convenience of description to describe the relationship of one element to another as shown in the figures. In addition to covering the orientations depicted in the figures, these spatial relative terms are intended to also cover different orientations of the device during use or operation. For example, if the device in the figures is flipped, an element described as "above" or "upper" relative to another element will be "below" or "lower" relative to that other element. Thus, depending on the spatial orientation of the device, the term "above" covers both the orientations of "above" and "below". The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.
[0053] The terms used herein are for the purpose of describing various examples only and are not intended to limit the disclosure. Unless the context clearly dictates otherwise, the terms "a", "an", and "the" are intended to include the plural forms as well. The terms "comprising", "including", and "having" specify the presence of the stated features, numbers, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, components, elements, and / or combinations thereof.
[0054] Variations in the shapes shown in the figures may occur due to manufacturing techniques and / or tolerances. Thus, the examples described herein are not limited to the specific shapes shown in the figures, but include shape variations that occur during manufacturing.
[0055] It should be noted that, herein, the term "may" is used with respect to an example, e.g., with respect to what an example may include or implement, meaning that there is at least one example in which such a feature is included or implemented, and all examples are not limited thereto.
[0056] The features of the examples described herein can be combined in various ways that will be apparent after understanding the present disclosure. In addition, although the examples described herein have various configurations, other configurations that will be apparent after understanding the present disclosure are also possible.
[0057] Figure 1 is a perspective view of a camera module according to an embodiment of the present disclosure, and Figure 2 is Figure 1 a schematic exploded perspective view of the camera module.
[0058] According to Figure 1 the embodiment of the present disclosure shown in, the camera module 1 can be mounted on a portable electronic device. The portable electronic device can be a smart phone, a tablet PC, etc.
[0059] Referring to Figure 2 , the camera module 1 can include a lens module 700, an image sensor S, a first actuator 10, and a second actuator 20. The first actuator 10 can be an optical image stabilization actuator (OIS actuator), and the second actuator 20 can be a focusing actuator (AF actuator).
[0060] The lens module 700 can include one or more lenses and a lens barrel 710 in which the lenses are mounted. When the lens module 700 includes a plurality of lenses, the plurality of lenses can be mounted in the lens barrel 710 in the optical axis direction (Z-axis direction). In addition, the lens module 700 can include a carrier part 730 coupled to the lens barrel 710.
[0061] According to an embodiment of the present disclosure, the lens module 700 can be a moving member configured to move in the optical axis direction (Z-axis direction) during focusing. The lens module 700 can be moved in the optical axis (Z-axis) direction by the second actuator 20 for focusing. At the same time, the lens module 700 can be a fixed member that does not move during optical image stabilization.
[0062] According to an embodiment of the present disclosure, the image sensor S can be a moving member that moves in a direction perpendicular to the optical axis (Z-axis) during optical image stabilization. The image sensor S can be moved in a direction perpendicular to the optical axis (Z-axis) by the first actuator 10 for optical image stabilization. That is, the camera module 1 can perform optical image stabilization by moving the image sensor S instead of the lens module 700. Since the image sensor S is relatively lighter than the lens module 700, the image sensor S can be moved with a smaller driving force, and optical image stabilization can be performed more precisely. Specifically, the image sensor S can be moved in a direction perpendicular to the optical axis (Z-axis) by the first actuator 10, or rotated about the optical axis (Z-axis) as a rotation axis.
[0063] Figure 3 Exploded perspective view of an actuator for optical image stabilization according to an embodiment of the present disclosure; Figure 4 is Figure 3 Exploded perspective view of a driving part of an actuator for optical image stabilization; Figure 5 is Figure 3 Perspective view of an actuator for optical image stabilization; and Figure 8 is Figure 3 View of a moving frame of an actuator for optical image stabilization.
[0064] Referring to Figure 3 , the first actuator 10 may include a fixed frame 100, a moving frame 200, a first driver 300, a sensor substrate 400, and a base 500.
[0065] The fixed frame 100 may have a quadrilateral (e.g., rectangular) box shape and have an opening penetrating in the optical axis (Z-axis) direction. The fixed frame 100 may be a fixed member that does not move during focusing and optical image stabilization. The fixed frame 100 may accommodate the moving frame 200 and the like. In addition, the fixed frame 100 may be coupled to the second actuator 20.
[0066] The moving frame 200 may have a quadrilateral (e.g., rectangular) plate shape and have an opening penetrating in the optical axis (Z-axis) direction. An infrared cut-off filter IRCF may be disposed on the upper side of the moving frame 200, and the sensor substrate 400 may be disposed on the lower side of the moving frame 200.
[0067] The moving frame 200 may be accommodated in a space provided below the fixed frame 100. The moving frame 200 may be a moving member that moves during optical image stabilization. In an embodiment, the moving frame 200 may move in a first axis (X-axis) perpendicular to the optical axis (Z-axis) and a second axis (Y-axis) perpendicular to both the optical axis (Z-axis) and the first axis (X-axis), or may rotate about the optical axis (Z-axis) as a rotation axis. That is, the moving frame 200 may move relative to the fixed frame 100 on a plane perpendicular to the optical axis (Z-axis) while being accommodated in the fixed frame 100.
[0068] Referring to Figure 8 , the moving frame 200 may include a reinforcing plate 250 for strengthening the structural stiffness of the moving frame 200. The reinforcing plate 250 may be integrally formed with the moving frame 200 by insert injection molding. For example, the reinforcing plate 250 may be made of stainless steel or replaced with another material.
[0069] Referring again to Figure 3, the image sensor S can be mounted on the sensor substrate 400. The sensor substrate 400 can include a portion coupled to the fixed frame 100 (hereinafter referred to as the fixed portion 430) and a portion coupled to the movable frame 200 (hereinafter referred to as the movable portion 410), and the image sensor S can be mounted on the movable portion 410. Thus, the image sensor S and the movable portion 410 can move together with the movable frame 200 in a plane perpendicular to the optical axis (Z-axis).
[0070] Referring to Figure 4 , the first actuator 10 can include a first driver 300. The first driver 300 can generate a driving force to move the movable frame 200 in the first axial direction (X-axis direction) and the second axial direction (Y-axis direction), or to rotate the movable frame 200 about the optical axis (Z-axis) as a rotation axis.
[0071] The first driver 300 includes a first sub-driver 310 that generates a driving force in the first axial direction (X-axis direction) and a second sub-driver 330 that generates a driving force in the second axial direction (Y-axis direction).
[0072] The first sub-driver 310 includes a first magnet 311 and a first coil 313 arranged to face each other in the optical axis direction (Z-axis direction), and the second sub-driver 330 includes a second magnet 331 and a second coil 333 arranged to face each other in the optical axis direction (Z-axis direction). The first sub-driver 310 and the second sub-driver 330 can include a number of coils corresponding to the number of magnets included in the first magnet 311 and the second magnet 331. In an embodiment, the first magnet 311 and the second magnet 331 can each include two magnets, and the first coil 313 and the second coil 333 can each include two coils. The first magnet 311 can have a shape magnetized with N and S poles in the first axial direction (X-axis direction), and a neutral zone can be provided between the N and S poles. The second magnet 331 can have a shape magnetized with N and S poles in the second axial direction (Y-axis direction), and a neutral zone can be provided between the N and S poles.
[0073] The first magnet 311 and the second magnet 331 can be arranged perpendicular to each other on the surface of the movable frame 200 facing the fixed frame 100 in the optical axis direction (Z-axis direction). The first coil 313 and the second coil 333 can be provided on the fixed frame 100 through a first substrate 350. The first coil 313 and the second coil 333 can be provided in through holes 120 formed in the fixed frame 100, and can directly face the first magnet 311 and the second magnet 331 through the through holes 120.
[0074] When power is supplied to the first coil 313, the moving frame 200 can move in the first axis direction (X-axis direction) by the electromagnetic force between the first magnet 311 and the first coil 313. Similarly, when power is supplied to the second coil 333, the moving frame 200 can move in the second axis direction (Y-axis direction) by the electromagnetic force between the second magnet 331 and the second coil 333. Since the first magnet 311 and the second magnet 331 are provided on the moving frame 200, the first magnet 311 and the second magnet 331 are moving members that move together with the moving frame 200 in a plane perpendicular to the optical axis (Z-axis), and since the first coil 313 and the second coil 333 are provided on the fixed frame 100, the first coil 313 and the second coil 333 can be stationary fixed members.
[0075] Meanwhile, the first sub-driver 310 and the second sub-driver 330 can cooperate to generate a driving force that causes the moving frame 200 to rotate about the optical axis (Z-axis). The rotational driving force can be formed by the resultant force or bias of the driving forces generated by the first sub-driver 310 and the second sub-driver 330.
[0076] Referring to Figure 4 , the first actuator 10 (or the first driver 300) can include a position sensor that detects the position of the moving frame 200. For example, the position sensor can be a Hall sensor. The first actuator 10 includes a first position sensor 315 arranged to face the first magnet 311 in the optical axis direction (Z-axis direction) and a second position sensor 335 arranged to face the second magnet 331 in the optical axis direction (Z-axis direction). The first position sensor 315 and the second position sensor 335, together with the first coil 313 and the second coil 333, can be provided on the fixed frame 100 via the first substrate 350. In an embodiment, the second position sensor 335 can include two position sensors arranged to face each of the two magnets included in the second magnet 331 to detect the rotation of the moving frame 200.
[0077] The first ball member B1 can be provided between the moving frame 200 and the fixed frame 100. The first ball member B1 can be arranged to contact the moving frame 200 and the fixed frame 100, respectively. When the moving frame 200 moves relative to the fixed frame 100, the first ball member B1 can support the movement of the moving frame 200 while rolling in the direction in which the driving force is generated.
[0078] The first ball member B1 may include a plurality of balls, and the surfaces of the moving frame 200 and the fixed frame 100 facing each other in the optical axis direction (Z-axis direction) have guide grooves for accommodating a plurality of balls respectively. For example, the lower surface of the fixed frame 100 may include a first guide groove 110, and the upper surface of the moving frame 200 may include a second guide groove 210. The first ball member B1 may be in contact with the first guide groove 110 and the second guide groove 210 respectively. The first guide groove 110 and the second guide groove 210 are formed to be larger than the diameter of the first ball member B1, so that the direction of the rolling movement of the first ball member B1 in a plane perpendicular to the optical axis (Z-axis) may not be restricted.
[0079] Referring to Figure 3 , the first actuator 10 may include a yoke to maintain the contact between the first ball member B1 and the fixed frame 100 and the moving frame 200. For example, the yoke may be made of a magnetic material. The first actuator 10 includes a first yoke 317 and a second yoke 337. The first yoke 317 is arranged to face the first magnet 311 in the optical axis direction (Z-axis direction), and the second yoke 337 is arranged to face the second magnet 331 in the optical axis direction (Z-axis direction). The first yoke 317 and the second yoke 337 may be connected to the fixed frame 100 through a first substrate 350. The first yoke 317 and the second yoke 337 may be arranged on the opposite sides of one side (or the other side) of the first substrate 350 on which the first coil 313 and the second coil 333 are arranged.
[0080] The attractive force may act between the first yoke 317 and the second yoke 337 and the first magnet 311 and the second magnet 331 in the direction in which they face each other, that is, in the optical axis direction (Z-axis direction). Therefore, an attractive force is formed between the fixed frame 100 on which the first yoke 317 and the second yoke 337 are arranged and the moving frame 200 on which the first magnet 311 and the second magnet 331 are arranged, so that the first ball member B1 arranged between the moving frame 200 and the fixed frame 100 can maintain contact with the moving frame 200 and the fixed frame 100.
[0081] Figure 6A is a sectional view taken along the Figure 5 line I-I'; Figure 6B is Figure 6A an enlarged view of part A of Figure 7A is a sectional view taken along the Figure 5 line II-II'; and Figure 7B is Figure 7A an enlarged view of part B of
[0082] As shown in Figure 6A and Figure 7AAs shown, when a driving force is generated in the first axis (X-axis) direction, the moving frame 200 can move in the first axis (X-axis) direction, and when a driving force is generated in the second axis (Y-axis) direction, the moving frame 200 can move in the second axis (Y-axis) direction. In addition, when there is a difference between the magnitude of the driving force generated in the first axis (X-axis) direction and the magnitude of the driving force generated in the second axis (Y-axis) direction, the moving frame 200 can rotate about the optical axis (Z-axis) as a rotation axis. As described above, the moving part 410 of the sensor substrate 400 on which the image sensor S is mounted is coupled to the moving frame 200 such that the image sensor S can move together with the moving frame 200.
[0083] Meanwhile, referring to Figure 6B and Figure 7B , the moving frame 200 includes a protrusion 240 protruding toward the sensor substrate 400, and the moving part 410 can be coupled to the protrusion 240. Accordingly, a gap can be formed between the moving frame 200 and the sensor substrate 400 in the optical axis direction (Z-axis direction) in portions other than the protrusion 240 and the moving part 410, and the fixed part 430 of the sensor substrate 400 can be free from interference by the movement of the moving frame 200.
[0084] Figure 11 is an exploded perspective view of a sensor substrate according to an embodiment of the present disclosure. Figure 12 is Figure 11 a cross-sectional view of the sensor substrate of Figures 13 to 15 and is a cross-sectional view of a sensor substrate according to other embodiments of the present disclosure.
[0085] Referring to Figure 11 , the sensor substrate 400 may include a moving part 410, a fixed part 430, and a connecting part 450.
[0086] The moving part 410 may be a moving member that is connected to the lower part of the moving frame 200 and moves together with the moving frame 200 during optical image stabilization. The image sensor S may be mounted on the moving part 410. The fixed part 430 may be a fixed member that is connected to the lower part of the fixed frame 100 and does not move during optical image stabilization. The fixed part 430 may be arranged to surround the moving part 410. The connecting part 450 may be arranged between the moving part 410 and the fixed part 430. For example, the connecting part 450 may be arranged between the moving part 410 and the fixed part 430 in a direction perpendicular to the optical axis (Z-axis). The connecting part 450 may be arranged between the moving part 410 and the fixed part 430 to connect the moving part 410 and the fixed part 430, and may support the movement of the moving part 410. In an embodiment, the sensor substrate 400 may be a rigid-flexible printed circuit board (rigid-flex PCB), the moving part 410 and the fixed part 430 may be rigid printed circuit boards (rigid PCBs), and the connecting part 450 may include a flexible printed circuit board (flexible PCB). Therefore, when the moving part 410 moves, the connecting part 450 may support the movement of the moving part 410 while being bent.
[0087] The connecting part 450 may include a plurality of bridging elements 455 arranged between the moving part 410 and the fixed part 430. The plurality of bridging elements 455 may be parts corresponding to a flexible printed circuit board (flexible PCB) that can be bent when the above-mentioned moving part 410 moves. The plurality of bridging elements 455 may extend along the outer periphery of the moving part 410, and each bridging element may be spaced apart by a slit penetrating in the optical axis direction (Z-axis direction).
[0088] In addition, the connecting part 450 may include a pair of first support parts 451 and a pair of second support parts 453 that face each other in a direction perpendicular to the optical axis (Z-axis). The pair of first support parts 451 face each other in the first axis direction (X-axis direction), may be connected to the fixed part 430 and spaced apart from the moving part 410. The pair of second support parts 453 face each other in the second axis direction (Y-axis direction), may be connected to the moving part 410 and spaced apart from the fixed part 430. With this structure, the moving part 410 may be structurally connected to the fixed part 430 and have mobility.
[0089] In an embodiment, when the moving part 410 moves in the first axis direction (X-axis direction), the plurality of bridging elements 455 connected to the first support part 451 can be bent. When the moving part 410 moves in the second axis (Y-axis) direction, the plurality of bridging elements 455 connected to the second support part 453 can be bent. When the moving part 410 rotates about the optical axis (Z-axis), the plurality of bridging elements 455 connected to the first support part 451 and the second support part 453 can be bent together.
[0090] Referring Figure 11 and Figure 12 , the moving part 410 according to an embodiment of the present disclosure includes a plurality of layers (hereinafter referred to as a first layer 411, a second layer 413, and a third layer 415), an image sensor S, and a heat dissipation member 470.
[0091] The plurality of layers include a first layer 411 arranged side by side with the fixed part 430 and the connection part 450 in a direction perpendicular to the optical axis (Z-axis), and a second layer 413 arranged spaced apart from the first layer 411 on the upper side of the first layer 411. In addition, the plurality of layers may include a third layer 415 provided between the first layer 411 and the second layer 413. The third layer 415 may be used for electrically connecting the first layer 411 and the second layer 413. Additionally, the third layer 415 can be used to separate the moving part 410 and the fixed part 430. Specifically, the second layer 413 can be spaced apart from the fixed part 430 in the optical axis direction (Z-axis direction) through the third layer 415, and thus, when the moving part 410 moves in a plane perpendicular to the optical axis (Z-axis), the second layer 413 and the fixed part 430 can not interfere with each other. The third layer 415 can be optionally provided, and another configuration (e.g., the heat dissipation member 470) can replace the third layer 415. Figure 14 and Figure 15 An embodiment in which the third layer 415 is omitted is shown, which will be described later.
[0092] In an embodiment of the present disclosure, the first layer 411, the second layer 413, and the third layer 415 may each include a first opening 411a, a second opening 413a, and a third opening 415a penetrating in the optical axis direction (Z-axis direction). The first layer 411, the second layer 413, and the third layer 415 may be arranged such that the first opening 411a, the second opening 413a, and the third opening 415a overlap in the optical axis direction (Z-axis direction), and the image sensor S may be arranged to overlap with the first opening 411a, the second opening 413a, and the third opening 415a in the optical axis direction (Z-axis direction).
[0093] The heat dissipation member 470 may be disposed in the second opening 413a. That is, the heat dissipation member 470 may be arranged side by side with the second layer 413 in a direction perpendicular to the optical axis (Z-axis). In addition, the heat dissipation member 470 may be arranged to overlap the image sensor S in the optical axis direction (Z-axis direction). Refer to Figure 12 , the image sensor S may be directly attached to one surface of the heat dissipation member 470 by an adhesive AD. In this way, when the image sensor S is directly attached to the heat dissipation member 470, the heat dissipation member 470 can directly carry away the heat generated by the image sensor S, thereby improving the heat dissipation performance of the camera module 1.
[0094] Considering the heat dissipation performance, the heat dissipation member 470 is formed such that the surface in contact with the image sensor S has an area capable of covering the entire imaging surface (a plane perpendicular to the optical axis (Z-axis)) of the image sensor S. That is, one side of the heat dissipation member 470 parallel to the imaging surface of the image sensor S may be formed to have an area equal to or larger than the imaging surface, and as the area and volume of the heat dissipation member 470 increase, the heat dissipation effect can be improved.
[0095] According to an embodiment of the present disclosure, the heat dissipation member 470 may have a TSV (Through-Silicon Via) structure. The TSV structure refers to a structure in which a plurality of through holes are drilled in a silicon (Si) substrate 471 and the interiors of the through holes are filled with conductive electrodes 473. For example, the conductive electrode 473 may be made of copper (Cu). Since the heat transfer coefficient of silicon (Si) is 148 W / m·C and the heat transfer coefficient of copper (Cu) is 401 W / m·C, the heat transfer performance of the heat dissipation member 470 can be very excellent. For example, when considering that the heat transfer coefficient of a PCB board on which a conventional image sensor S is provided is 10 W / m·C to 20 W / m·C, the heat dissipation performance can be greatly improved.
[0096] According to other embodiments of the present disclosure, the heat dissipation performance of the camera module 1 may be improved by increasing the volume of the heat dissipation member 470. In an embodiment, the volume of the heat dissipation member 470 may be increased by changing the length and / or height of the heat dissipation member 470.
[0097] According to another embodiment, as Figure 13As shown, the volume of the heat dissipation member 470 can be increased by increasing the thickness of the heat dissipation member 470 (i.e., the length in the optical axis direction (Z-axis direction)). At this time, in order not to interfere with the movement of the moving part 410 by the fixed member, the thickness of the heat dissipation member 470 can be increased within the range of not contacting the base 500, which will be described later. In this embodiment, the heat dissipation member 470 may include an extension portion 470a extending in the optical axis direction (Z-axis direction), and the extension portion 470a may be provided on the third opening 415a and / or the first opening 411a. Even if the thickness of the heat dissipation member 470 is increased, the thickness of the camera module 1 will not increase because the heat dissipation member 470 is provided in the openings 411a, 413a, and 415a of the multilayer.
[0098] In another embodiment, although not specifically shown in the drawings, the length of the heat dissipation member 470 in the first axis direction (X-axis direction) and / or the second axis direction (Y-axis direction) can be increased. For example, this can be the case where one side of the heat dissipation member 470 parallel to the imaging surface of the image sensor S has an area larger than the area of the imaging surface, and the area of the second opening 413a can also be changed according to the area of the heat dissipation member 470. In addition, in this case, the length of the heat dissipation member 470 can be increased to the extent that the movement of the moving part 410 will not be interfered with by the fixed member.
[0099] Meanwhile, as Figure 14 and Figure 15 shown, in the embodiment where the volume of the heat dissipation member 470 is increased, the third layer 415 can be omitted, and the heat dissipation member 470 can replace the third layer 415.
[0100] Referring to Figure 14 and Figure 15 , the moving part 410 includes a first layer 411, a heat dissipation member 470, a second layer 413, and an image sensor S arranged in the optical axis direction (Z-axis direction). The first layer 411 can be arranged side by side with the fixed part 430 and the connecting part 450 in a direction perpendicular to the optical axis (Z-axis), and the second layer 413 can be arranged to be spaced apart from the first layer 411 on the upper side of the first layer 411.
[0101] The heat dissipation member 470 can be provided between the first layer 411 and the second layer 413. The first layer 411 and the second layer 413 can be electrically connected to each other through the heat dissipation member 470 provided therebetween. For example, the first layer 411 and the second layer 413 can be electrically connected through the conductive electrode 473 of the heat dissipation member 470. In addition, the second layer 413 can be spaced apart from the fixed part 430 through the heat dissipation member 470.
[0102] In other embodiments, the first layer 411 may include a first opening 411a that penetrates the first layer 411 in the direction of the optical axis (Z-axis). However, different from the above-described embodiments, the second layer 413 may not include a second opening 413a.
[0103] The image sensor S may be disposed on one side of the second layer 413, and the heat dissipation member 470 may be disposed on the other side of the second layer 413. That is, the image sensor S may overlap with the heat dissipation member 470 in the direction of the optical axis (Z-axis direction), and the second layer 413 may be located between the image sensor S and the heat dissipation member 470, and the heat generated from the image sensor S may be transferred to the heat dissipation member 470 through the second layer 413.
[0104] Also in this embodiment, the heat dissipation performance may be improved by increasing the thickness of the heat dissipation member 470. The heat dissipation member 470 may include an extension portion 470a that extends in the direction of the optical axis (Z-axis direction). The extension portion 470a may be disposed in the first opening 411a, and its thickness may be increased within a range not in contact with the base 500, which will be described later.
[0105] However, since the heat dissipation member 470 is a part of the moving portion 410 that moves in a plane perpendicular to the optical axis (Z-axis), according to Figures 13 to 15 , the increase in the volume of the heat dissipation member 470 affects the optical image stabilization performance. Therefore, when increasing the volume of the heat dissipation member 470, some through holes are filled with silicon (Si) instead of copper (Cu) (copper (Cu) is a material having a relatively high density), or filled with other materials having a density lower than that of copper (Cu).
[0106] Meanwhile, the base 500 may be disposed below the sensor substrate 400. The base 500 may be disposed at the bottom of the sensor substrate 400 to completely cover the sensor substrate 400, and may prevent impurities and the like from entering the gap between the moving portion 410 and the fixed portion 430.
[0107] Figure 9 is a diagram showing Figure 3 the moving frame and the sensor substrate of the optical image stabilization, and Figure 10 is a diagram showing Figure 9 the coupling state of the moving frame and the sensor substrate.
[0108] Meanwhile, referring to Figure 9 and Figure 10, the moving frame 200 includes a first escape hole 260 and a second escape hole 270 that penetrate the moving frame 200 in the optical axis direction (Z-axis direction). When the moving frame 200 is coupled to the sensor substrate 400, a fixed portion 430 of the sensor substrate 400 and a part of the connecting portion 450 (e.g., the second support portion 453) may be exposed through the first escape hole 260 and the second escape hole 270. Due to this structure, the moving portion 410 of the sensor substrate 400 may have fluidity after being coupled to the moving frame 200. Specifically, the sensor substrate 400 is coupled to the moving frame 200 in a state where the moving portion 410 has no fluidity, and then may have fluidity by cutting the first escape hole 260 and the second escape hole 270 to expose a part of the second support portion 453.
[0109] Figure 16 is an exploded perspective view of a focusing actuator according to an embodiment of the present disclosure; Figure 17 is Figure 16 the perspective view of the focusing actuator in Figure 18 is Figure 16 the side view of the carrier part of the focusing actuator of Figure 19 is Figure 16 the perspective view of the housing of the focusing actuator of
[0110] Referring to Figure 16 , the second actuator 20 may include a housing 600, an outer shell 630, a carrier part 730, and a second driver 800.
[0111] The housing 600 has an internal space and may be formed in a quadrilateral (e.g., rectangular) box shape having an opening penetrating in the optical axis direction (Z-axis direction). The carrier part 730 may be disposed in the internal space of the housing 600. As described above, the lens barrel 710 may be coupled to the carrier part 730, and the lens barrel 710 and the carrier part 730 may move in the optical axis direction (Z-axis direction). In addition, the housing 600 may be coupled to the fixed frame 100, and similar to the fixed frame 100, may be a fixed member that does not move during focusing and optical image stabilization.
[0112] The outer shell 630 may be coupled to the housing 600 to cover the internal space of the housing 600. The outer shell 630 may include a protrusion that protrudes toward the internal space on its lower surface. The protrusion may function as a buffer member while adjusting the movement range of the second ball member B2 to be described later.
[0113] The second driver 800 may generate a driving force for moving the carrier part 730 in the optical axis direction (Z-axis direction).
[0114] The second driver 800 may include a third magnet 810 and a third coil 830 arranged to face each other in a direction perpendicular to the optical axis (Z-axis). The third magnet 810 may be provided on one side of the carrier 730, and a rear yoke may be provided between the carrier 730 and the third magnet 810 to prevent magnetic flux leakage. The third coil 830 may be provided on one side of the housing 600 through the second substrate 890. The third coil 830 may be disposed in a through hole formed in the housing 600 and may directly face the third magnet 810 through the through hole.
[0115] The third magnet 810 may have a shape magnetized with N and S poles in the optical axis direction (Z-axis direction), and a neutral zone may be provided between the N and S poles.
[0116] When power is supplied to the third coil 830, the carrier 730 may move in the optical axis direction (Z-axis direction) by the electromagnetic force between the third magnet 810 and the third coil 830. Since the third magnet 810 is provided on the carrier 730, the third magnet 810 may be a moving member that moves together with the carrier 730 in the optical axis direction (Z-axis direction), and since the third coil 830 is provided on the housing 600, the third coil 830 may be a fixed member that does not move.
[0117] Referring to Figure 16 , the second actuator 20 (or the second driver 800) may include a third position sensor 850 that detects the position of the carrier 730. For example, the third position sensor 850 may be a Hall sensor. The third position sensor 850 may be provided in the housing 600 through the second substrate 890 to face the third magnet 810 in a direction perpendicular to the optical axis (Z-axis).
[0118] The second ball member B2 may be provided between the carrier 730 and the housing 600. The second ball member B2 may be arranged to contact the carrier 730 and the housing 600, respectively. When the carrier 730 moves relative to the housing 600 in the optical axis direction (Z-axis direction), the second ball member B2 may support the movement of the carrier 730 while rolling in the optical axis direction (Z-axis direction).
[0119] The second ball member B2 may include a plurality of balls arranged in the optical axis direction (Z-axis direction), and the surfaces of the bearing portion 730 and the housing 600 that face each other in a direction perpendicular to the optical axis (Z-axis) may include guide grooves for accommodating the plurality of balls. For example, one side of the bearing portion 730 may include a third guide groove 731, and one side of the housing 600 that faces the said side of the bearing portion 730 may include a fourth guide groove 610. The third guide groove 731 and the fourth guide groove 610 may be formed to extend in the optical axis direction (Z-axis direction), and the second ball member B2 may be disposed between the third guide groove 731 and the fourth guide groove 610.
[0120] The second ball member B2 may include a first ball group BG1 and a second ball group BG2 that are spaced apart in a direction perpendicular to the optical axis (Z-axis). The first ball group BG1 and the second ball group BG2 may include different numbers of balls, for example, two balls and three balls respectively.
[0121] The third guide groove 731 includes a first groove g1 and a second groove g2, and the fourth guide groove 610 includes a third groove g3 facing the first groove g1 and a fourth groove g4 facing the second groove g2. The first ball group BG1 may be disposed between the first groove g1 and the third groove g3, and the second ball group BG2 may be disposed between the second groove g2 and the fourth groove g4.
[0122] In an embodiment, the first ball group BG1 may contact the first groove g1 and the third groove g3 at 1 point (2 points) and 2 points (1 point) respectively, and may be used as an auxiliary guide. The second ball group BG2 may contact the second groove g2 and the fourth groove g4 at two points respectively, and may be used as a main guide.
[0123] According to an embodiment of the present disclosure, optical image stabilization is performed by moving the image sensor S to precisely control the driving force. In addition, by disposing the heat dissipation member 470 having a through-silicon via (TSV) structure below the image sensor S, the temperature of the image sensor S can be effectively reduced.
[0124] The actuator and the camera module for optical image stabilization may have improved optical image stabilization performance and heat dissipation performance.
[0125] While specific examples have been shown and described above, it will be apparent after understanding the present disclosure that various changes in form and detail can be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for purposes of limitation. The description of the features or aspects in each example should be considered applicable to similar features or aspects in other examples. Appropriate results can still be achieved if the described techniques are performed in a different order, and / or if the described components in the system, architecture, device, or circuit are combined in a different way and / or replaced or supplemented by other components or their equivalents. Accordingly, the scope of the present disclosure is not limited by the specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in the present disclosure.
Claims
1. An actuator for optical image stabilization, characterized in that The actuator comprises: Fixed frame; a moving frame received in the fixed frame and configured to move relative to the fixed frame in a plane perpendicular to the optical axis; and a sensor substrate on which an image sensor is disposed, the sensor substrate comprising: a fixed portion coupled to the fixed frame; a moving portion including the image sensor and coupled to the moving frame; and a connecting portion disposed between the moving portion and the fixed portion to support movement of the moving portion, wherein the moving portion includes a heat dissipation member that dissipates heat generated from the image sensor, and Wherein, the heat dissipation component includes a substrate having a through hole and a conductive electrode filling the through hole.
2. The actuator according to claim 1, characterized in that The heat dissipation member overlaps the image sensor in an optical axis direction.
3. The actuator according to claim 2, characterized in that The mobile part also includes: a first layer, arranged side by side with the fixing portion and the connecting portion in a direction perpendicular to the optical axis; a second layer having a surface provided on an upper side of the first layer and an opening penetrating the surface in the optical axis direction; and a third layer, disposed between the first layer and the second layer, Wherein, the heat dissipation component is arranged in the opening of the second layer.
4. The actuator according to claim 3, characterized in that Each of the first layer and the third layer has a surface including an opening, and the opening of each of the first layer and the third layer penetrates the surface of each of the first layer and the third layer in the optical axis direction and overlaps with the opening of the second layer.
5. The actuator according to claim 4, characterized in that The heat dissipation member further includes a first extending portion extending in the optical axis direction toward the openings of the first layer and the third layer.
6. The actuator according to claim 2, characterized in that: The mobile part also includes: a first layer arranged side by side with the fixing portion and the connecting portion in a direction perpendicular to the optical axis; and a second layer, disposed on an upper side of the first layer, The image sensor is disposed on one side of the second layer, and the heat dissipation member is disposed on the other side of the second layer to overlap with the image sensor.
7. The actuator according to claim 6, characterized in that A portion of the heat dissipation member is disposed between the first layer and the second layer, and The first layer and the second layer are electrically connected via the heat dissipation member disposed between the first layer and the second layer.
8. The actuator according to claim 6, characterized in that A surface of the first layer has an opening penetrating the surface of the first layer, the opening of the first layer being at a position overlapping with the image sensor in the optical axis direction.
9. The actuator according to claim 8, characterized in that The heat dissipation member further includes a first extending portion extending in the optical axis direction toward the opening of the first layer.
10. The actuator according to claim 1, characterized in that The actuator further includes a base disposed below the sensor substrate, A gap is formed between the moving part and the base in the optical axis direction.
11. The actuator according to claim 1, characterized in that The actuator further includes a first driver including a plurality of magnets disposed on the moving frame and a plurality of coils disposed on the fixed frame to face the plurality of magnets.
12. A camera module, characterized in that The camera module comprises: a lens module including lenses arranged in an optical axis direction; and An actuator according to any one of claims 1 to 11.
13. A camera module, characterized in that The camera module comprises: a lens module including lenses arranged in an optical axis direction; and An actuator for optical image stabilization, configured to move an image sensor in a plane perpendicular to an optical axis, The actuator includes: a sensor substrate on which the image sensor is disposed; and a heat dissipation member disposed so as to overlap with the image sensor in the optical axis direction, and The heat dissipation component includes a substrate having a through hole and a conductive electrode filling the through hole in a thickness direction.
14. The camera module according to claim 13, characterized in that: The sensor substrate comprises: Fixed part; a moving portion configured to move relative to the fixed portion on the plane perpendicular to the optical axis; and a connecting portion, disposed between the fixed portion and the moving portion to support the movement of the moving portion, Wherein, the moving part includes the image sensor and the heat dissipation component.
15. The camera module according to claim 14, characterized in that: The camera module further includes a base disposed below the sensor substrate. Wherein, the heat dissipation component further includes an extension portion extending toward the base in the direction of the optical axis, and Wherein a gap is formed between the base and the extension portion.
16. The camera module according to claim 14, characterized in that: The actuator further comprises: a fixed frame coupled to the fixed portion; a moving frame coupled to the moving portion; and A first driver is separately provided in the fixed frame and the moving frame and is configured to generate a driving force to move the image sensor on the plane perpendicular to the optical axis.
17. The camera module according to claim 13, characterized in that: The camera module further includes a focus actuator configured to move the lens module in the optical axis direction.
Citation Information
Patent Citations
Apparatus for management of microgrid
KR1020230104547A