Welding-free horn

Abstract

The utility model belongs to the technical field of horns, and discloses a welding-free horn, which comprises a basin stand, a magnetic loop is arranged in the basin stand, a voice coil is arranged in the middle of the magnetic loop, a vibrating diaphragm is adhered to the voice coil, the vibrating diaphragm is also arranged in the basin stand, an elastic wave plate is sleeved outside the side wall of the magnetic loop, and the elastic wave plate is sleeved outside the side wall of the magnetic loop. The elastic wave plate is also arranged in the basin stand, a buckle seat is arranged on the lower side of the back surface of the basin stand, a mounting groove is formed in the buckle seat, a buckle elastic sheet is embedded in the mounting groove, and the loudspeaker is electrically connected with the capacitor circuit board through the buckle elastic sheet embedded in the mounting groove of the buckle seat of the basin stand. According to the utility model, through the arrangement of the buckle elastic sheet of the mounting groove of the buckle seat of the basin stand, the buckle elastic sheet and the capacitor circuit board only need to be correspondingly pressed, so that the stable connection between the buckle elastic sheet and the capacitor circuit board can be realized, the convenience of loudspeaker assembly operation is improved, the production period is shortened, and the overall production efficiency and economic benefits are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of speakers, and more specifically, relates to a speaker without soldering. Background Art

[0002] Chinese Patent Application No. 202222927405.2, with the title "Speaker", discloses the following technical solution: "Comprising: a bracket, a U-cup, a magnet, a voice coil and a sounding film. An annular limiting ring is arranged on the first side of the bracket, and each abutting block is evenly arranged on the annular limiting ring. The U-cup is connected to the first side of the bracket, and the outer surface of the U-cup abuts against each abutting block. The U-cup and the bracket are assembled by an interference fit method."

[0003] Chinese Patent Application No. 201110443925.X, with the title "Speaker Assembly", discloses the following technical solution: "Comprising a woofer and a tweeter. The woofer includes a chassis, a voice coil, a diaphragm and a magnetic circuit system. The chassis is combined with the magnetic circuit system, the diaphragm is combined with the chassis, a magnetic gap is formed in the magnetic circuit system, one end of the voice coil is combined with the diaphragm, and the other end extends into the magnetic gap. The speaker assembly further includes a bracket, the outside of the bracket is fixed relative to the top of the chassis, and the inside of the bracket is combined with the tweeter to arrange the tweeter above the diaphragm. The bracket has a plurality of openings for the sound of the woofer to pass through."

[0004] The above two disclosed technical solutions both reflect the common problems in the current audio equipment manufacturing industry: when it comes to the speaker assembly link, generally, the lead wires of the speaker are directly welded to the capacitor circuit board through wiring terminals or terminal boards. Although this connection method ensures the stability and reliability of the electrical connection to a certain extent, it exposes significant drawbacks when facing rework of defective products or upgrade and maintenance during the production process. Specifically, whenever a welding defect is found or a component needs to be replaced, the worker has to manually remove the original welding points, and then perform cumbersome cleaning to remove the welding residues to prepare for re-welding. This process not only takes time and effort, increases the production cycle, but also raises the production cost due to repeated labor and material losses, reducing the overall production efficiency and economic benefits.

[0005] Therefore, the utility model provides a speaker without soldering. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a speaker without soldering to solve the problems raised in the above background art.

[0007] The purpose of the utility model can be achieved by the following technical solutions:

[0008] A soldering-free loudspeaker, comprising a chassis, wherein a magnetic circuit is arranged inside the chassis, a voice coil is arranged in the middle of the magnetic circuit, a diaphragm is adhered to the voice coil, the diaphragm is also placed inside the chassis, a flexure is sleeved on the side wall of the magnetic circuit, and the flexure is also placed inside the chassis;

[0009] A snap seat is arranged on the lower side of the back surface of the chassis, an installation groove is formed in the snap seat, a snap spring piece is embedded in the installation groove, and the loudspeaker is electrically connected to a capacitor circuit board through the snap spring piece embedded in the installation groove of the snap seat of the chassis.

[0010] As a further preferred technical solution of the present invention, the overall shape of the chassis is frustum-shaped, an enlarged opening is arranged on the front side of the chassis, the magnetic circuit is placed behind the enlarged opening of the chassis, the diaphragm is placed on the upper inner diameter of the enlarged opening, an inner step is also arranged on the chassis, the outer edge of the flexure is arranged on the inner step of the chassis, and first installation snaps, second installation snaps and third installation snaps are arranged on the outer edge of the chassis along the circumferential direction, and the loudspeaker is installed and connected to external devices through the first installation snap, the second installation snap and the third installation snap of the chassis.

[0011] As a further preferred technical solution of the present invention, the cross section of the snap seat is a kind of right trapezoid, the snap seat is provided with a receiving cavity opening backward, a first snap portion is arranged on the inner side of the receiving cavity, a positioning partition is also arranged on the receiving cavity, only a pair of installation grooves are arranged, the pair of installation grooves are arranged at the upper end of the receiving cavity, the notch of the installation groove is rectangular, and notches are arranged at the upper end and both sides of the installation groove.

[0012] As a further preferred technical solution of the present invention, the snap spring piece is provided with a pair of bending portions and a connecting portion, a protrusion is arranged on the outer side of the bending portion, the protrusion of the bending portion corresponds to the notches on both sides of the installation groove, the snap spring piece is electrically connected to the internal components of the chassis through the connecting portion, and the snap spring piece is electrically connected to the capacitor circuit board through a pair of bending portions.

[0013] As a further preferred technical solution of the present invention, the capacitor circuit board comprises a capacitor and a circuit board, second snap portions are arranged on the pins at the upper end of the capacitor, the second snap portions correspond to the first snap portions, the pins at the upper end of the capacitor penetrate through the second snap portions, the pins at the upper end of the capacitor are buckled between a pair of bending portions of the snap spring piece, second snap portions are also arranged on the pins at the lower end of the capacitor, the second snap portions correspond to the first snap portions, the pins at the lower end of the capacitor penetrate through the second snap portions, the pins at the lower end of the capacitor are electrically connected to the circuit board, and wiring terminals, resistors, diodes and triodes are also arranged on the circuit board.

[0014] As a further preferred technical solution of the present utility model, the buckle elastic sheet is an integral part made of a metal material with ductility and conductivity through stamping and electroplating processes.

[0015] As a further preferred technical solution of the present utility model, the basin frame is an integral part made of a metal material with ductility through stamping or casting processes.

[0016] As a further preferred technical solution of the present utility model, the basin frame is an integral part made of engineering plastic material through injection molding process.

[0017] As a further preferred technical solution of the present utility model, the buckle elastic sheet is an integral part made of copper and its alloys through stamping process and then electroplated with metal nickel or metal tin or metal chromium or metal silver.

[0018] As a further preferred technical solution of the present utility model, the basin frame is an integral part made of iron and its alloys, aluminum and its alloys, or magnesium alloy through stamping or casting processes;

[0019] The basin frame is an integral part made of nylon or polycarbonate through injection molding process.

[0020] As described above, a non-welded loudspeaker provided by the present utility model has the following beneficial effects:

[0021] With the non-welded loudspeaker of the present utility model, compared with the prior art, due to adopting such a structure, the basin frame is provided with a buckle seat, the buckle seat is provided with an installation groove, and a buckle elastic sheet is embedded in the installation groove. Only by correspondingly pressing the capacitor circuit board and the buckle elastic sheet on the basin frame can a firm connection between the two be achieved. During rework, only the buckle needs to be contacted. Changing from high-temperature welding to pressing improves the convenience of the loudspeaker assembly operation, shortens the production cycle, and improves the overall production efficiency and economic benefits.

[0022] The additional aspects and advantages of the present utility model will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1Assembly schematic diagram of the frame and capacitor circuit board of a solderless loudspeaker for this utility model application;

[0025] Figure 2 One of the structural schematic diagrams of the frame of a solderless loudspeaker for this utility model application;

[0026] Figure 3 Another structural schematic diagram of the frame of a solderless loudspeaker for this utility model application;

[0027] Figure 4 Structural schematic diagram of the snap spring of a solderless loudspeaker for this utility model application;

[0028] Figure 5 Structural schematic diagram of the capacitor circuit board of a solderless loudspeaker for this utility model application.

[0029] Summary of reference numerals and their descriptions:

[0030] 100, frame; 110, enlarged opening; 120, inner step; 130, first mounting buckle; 140, second mounting buckle; 150, third mounting buckle; 200, buckle seat; 210, accommodation cavity; 220, first buckle part; 230, positioning partition; 300, mounting groove; 400, snap spring; 410, bending part; 411, protrusion; 420, connecting part; 500, capacitor circuit board; 510, capacitor; 520, circuit board; 530, second buckle part. Detailed implementation manners

[0031] The following specific embodiments illustrate the implementation manners of this utility model. Those familiar with this technology can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0032] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions under which this utility model can be implemented. Therefore, they do not have any technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that this utility model can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in this utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle", and "one" cited in this specification are only for the convenience of description and are not used to limit the scope under which this utility model can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which this utility model can be implemented. The specific structure can be described with reference to the attached drawings of the patent application.

[0033] This utility model provides a solderless loudspeaker. Please refer toFigures 1 to 5 As shown, it includes a speaker frame 100. Inside the speaker frame 100, there is a magnetic circuit. In the middle of the magnetic circuit, there is a voice coil. The voice coil is adhered with a diaphragm, and the diaphragm is also placed inside the speaker frame 100. Outside the side wall of the magnetic circuit, there is a spider, and the spider is also placed inside the speaker frame 100;

[0034] On the lower side of the back of the speaker frame 100, there is a buckle seat 200. An installation groove 300 is provided on the buckle seat 200, and a buckle spring piece 400 is embedded in the installation groove 300. The speaker is electrically connected to the capacitor circuit board 500 through the buckle spring piece 400 embedded in the installation groove 300 of the buckle seat 200 of the speaker frame 100.

[0035] It should be noted that: the speaker frame 100 is provided with a buckle seat 200, the buckle seat 200 is provided with an installation groove 300, and a buckle spring piece 400 is embedded in the installation groove 300. Just press the capacitor circuit board 500 against the buckle spring piece 400 on the speaker frame 100, and a stable connection between the two can be achieved. During rework, only the buckle needs to be contacted. Changing from high-temperature welding to pressing improves the convenience of the speaker assembly operation, shortens the production cycle, and improves the overall production efficiency and economic benefits.

[0036] Specifically, the specific structure of the speaker frame 100 is as follows. Combining Figure 1 、 Figure 2 and Figure 3 As shown, the overall shape of the speaker frame 100 is frustum-shaped. The front side of the speaker frame 100 is provided with an enlarged opening 110. The magnetic circuit is placed behind the enlarged opening 110 of the speaker frame 100. The diaphragm is placed on the upper inner diameter of the enlarged opening 110. The speaker frame 100 is also provided with an inner step 120. The outer edge of the spider is arranged on the inner step 120 of the speaker frame 100. Along the circumferential direction, the outer edge of the speaker frame 100 is provided with a first installation buckle 130, a second installation buckle 140, and a third installation buckle 150. The speaker is installed and connected to external devices through the first installation buckle 130, the second installation buckle 140, and the third installation buckle 150 of the speaker frame 100.

[0037] Specifically, the specific structure of the buckle seat 200 is as follows. Combining Figure 1 and Figure 3As shown, the cross-section of the buckle seat 200 is a right trapezoid of a certain type. The buckle seat 200 is provided with a receiving cavity 210 opening backward. A first buckle portion 220 is arranged on the inner side of the receiving cavity 210. A positioning partition 230 is also arranged on the receiving cavity 210. The positioning partition 230 is used to support the capacitor circuit board 500. Only a pair of mounting grooves 300 are provided. The pair of mounting grooves 300 are arranged at the upper end of the receiving cavity 210. The notch of the mounting groove 300 is rectangular. Notches are opened at the upper end and both sides of the mounting groove 300. The notches on both sides of the mounting groove 300 are used to clamp the buckle elastic piece 400.

[0038] Specifically, the specific structure of the buckle elastic piece 400 is as follows. In combination with Figure 3 and Figure 4 As shown, the buckle elastic piece 400 is provided with a pair of bending portions 410 and a connecting portion 420. A protrusion 411 is arranged on the outer side of the bending portion 410. The protrusion 411 of the bending portion 410 corresponds to the notches on both sides of the mounting groove 300. The buckle elastic piece 400 is electrically connected to the internal components of the speaker frame 100 through the connecting portion 420. The buckle elastic piece 400 is electrically connected to the capacitor circuit board 500 through a pair of bending portions 410.

[0039] Specifically, the specific structure of the capacitor circuit board 500 is as follows. In combination with Figure 1 and Figure 5 As shown, the capacitor circuit board 500 includes a capacitor 510 and a circuit board 520. A second buckle portion 530 is arranged on the lead at the upper end of the capacitor 510. The second buckle portion 530 corresponds to the first buckle portion 220. The lead at the upper end of the capacitor 510 passes through the second buckle portion 530. The lead at the upper end of the capacitor 510 is buckled between a pair of bending portions 410 of the buckle elastic piece 400. A second buckle portion 530 is also arranged on the lead at the lower end of the capacitor 510. The second buckle portion 530 corresponds to the first buckle portion 220. The lead at the lower end of the capacitor 510 passes through the second buckle portion 530. The lead at the lower end of the capacitor 510 is electrically connected to the circuit board 520. Wiring terminals, resistors, diodes and triodes are also arranged on the circuit board 520.

[0040] The buckle elastic piece 400 is an integral part made of a metal material with ductility and conductivity through stamping and electroplating processes. Specifically, the buckle elastic piece 400 is an integral part made of copper and its alloys through stamping and then electroplating with metal nickel or metal tin or metal chromium or metal silver.

[0041] The basin stand 100 is an integral part made of malleable metal material through stamping or casting processes. Specifically, the basin stand 100 is an integral part made of iron and its alloys, aluminum and its alloys, or magnesium alloy material through stamping or casting processes;

[0042] The basin stand 100 is an integral part made of engineering plastic material through injection molding processes. Specifically, the basin stand 100 is an integral part made of nylon or polycarbonate material through injection molding processes.

[0043] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be encompassed by the present utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A welding-free speaker, comprising a basin frame, a magnetic loop is arranged inside the basin frame, a voice coil is arranged in the middle of the magnetic loop, a diaphragm is adhered to the voice coil, and the diaphragm is also arranged inside the basin frame, and a damper is arranged on the side wall of the magnetic loop, and the damper is also arranged inside the basin frame; Features: A snap seat is arranged on the lower side of the back of the basin frame, a mounting groove is opened on the snap seat, a snap spring piece is embedded in the mounting groove, and the speaker is electrically connected to the capacitor circuit board through the snap spring piece embedded in the mounting groove of the snap seat of the basin frame.

2. The solder-free speaker according to claim 1, characterized in that: The overall shape of the basin is truncated cone-shaped, and an enlarged opening is provided on the front side of the basin, the magnetic return is placed behind the enlarged opening of the basin, the diaphragm is placed on the upper inner diameter of the enlarged opening, and an inner step is also provided on the basin. The outer edge of the elastic wave plate is provided on the inner step of the basin, and the outer edge of the basin is provided with a first mounting buckle, a second mounting buckle and a third mounting buckle along the circumferential direction. The speaker is installed and connected to an external device through the first mounting buckle, the second mounting buckle and the third mounting buckle of the basin.

3. A solder-free speaker according to claim 1 or 2, characterized in that: The cross-section of the buckle seat is a right-angled trapezoid, and the buckle seat is provided with a accommodating cavity opening backward. A first buckle portion is provided on the inner side of the accommodating cavity, and a positioning partition is also provided on the accommodating cavity. Only one pair of mounting grooves is provided, and the pair of mounting grooves is placed at the upper end of the accommodating cavity. The notch of the mounting groove is rectangular, and a notch is provided on the upper end and both sides of the mounting groove.

4. The solder-free speaker according to claim 3, characterized in that: The snap-on spring piece is provided with a pair of bent portions and a connecting portion, a protrusion is provided on the outer side of the bent portion, the protrusion of the bent portion corresponds to the notches on both sides of the mounting groove, the snap-on spring piece is electrically connected to the internal components of the basin frame through the connecting portion, and the snap-on spring piece is electrically connected to the capacitor circuit board through a pair of bent portions.

5. The solder-free speaker according to claim 4, characterized in that: The capacitor circuit board includes a capacitor and a circuit board. A second snap-on portion is provided on the pin at the upper end of the capacitor, the second snap-on portion corresponds to the first snap-on portion, the pin at the upper end of the capacitor passes through the second snap-on portion, the pin at the upper end of the capacitor is pressed between a pair of bent portions of the snap spring sheet, a second snap-on portion is also provided on the pin at the lower end of the capacitor, the second snap-on portion corresponds to the first snap-on portion, the pin at the lower end of the capacitor passes through the second snap-on portion, the pin at the lower end of the capacitor is electrically connected to the circuit board, and wiring terminals, resistors, diodes and transistors are also provided on the circuit board.

6. The solder-free speaker according to claim 4, characterized in that: The buckle spring is an integral piece made of a ductile and conductive metal material through stamping and electroplating processes.

7. The solder-free speaker according to claim 2, characterized in that: The basin frame is an integral part made of ductile metal material by stamping or casting process.

8. The solder-free speaker according to claim 2, characterized in that: The basin frame is an integral part made of engineering plastic material by injection molding.

9. The solder-free speaker according to claim 6, characterized in that: The buckle spring is an integrated piece made of copper or its alloy through a stamping process and then electroplated with metal nickel, metal tin, metal chromium or metal silver.

10. A solder-free speaker according to claim 7 or 8, characterized in that: The basin frame is an integral part made of iron and its alloys, aluminum and its alloys, or magnesium alloys by stamping or casting; The basin frame is an integral piece made of nylon or polycarbonate by injection molding.

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