OLT (Optical Line Terminal) optical module with high universality
By designing a highly versatile OLT optical module, using TO components, spectroscopic components and other components, the mixing of 2.5G/10G/50G or optical fiber devices at different rates is solved, and the existing optical modules have increased size and errors when expanding channels are achieved, achieving the effect of compact structure and high space utilization.
Patent Information
- Application Number
- CN202421153339.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-05-24
AI Technical Summary
The existing compatible optical modules have increased size and errors when expanding channels, making it difficult to be compatible with 2.5G and 10G networks, and the AWG optical chip is temperature sensitive.
A high-versatile OLT optical module is designed, through the close combination of circuit modules and optical path modules, TO components, spectroscopic components, isolators and other components are used to realize the mixing of 2.5G/10G/50G or optical fiber devices at different rates, and modular structural assembly is achieved through spectroscopic components of different film systems.
It realizes optical modules with compact structure and high space utilization, reduces cumulative errors between channels, is compatible with optical fiber devices at different rates, and improves the flexibility and scalability of the system.
Smart Images

Figure CN222994715U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to optical communication technology and optical communication equipment, and specifically, to an OLT optical module with high versatility. Background Art
[0002] With the development of optical communication technology, the access network rate is continuously increasing. Based on passive optical network (PON), especially the market demand for gigabit passive optical network (GPON) with higher speed is increasing. This system mainly consists of an optical line terminal OLT at the central office, an optical network terminal ONT or an optical network unit ONU at the client side, and a MUX / DEMUX (multiplexing / demultiplexing) optical distribution network ODN (including passive devices such as transmission optical fibers, connectors, and wavelength division multiplexing devices). Currently, most operators need to be compatible with the existing 2.5G network while upgrading the 10G access network. The bandwidth-compatible network has become the mainstream application choice. Similarly, at the optical device design side, it is also necessary to be compatible with 2.5G and 10G.
[0003] Currently, the wavelength division multiplexing components used in existing compatible optical modules are generally beam splitter sets, Z-Block, or AWG optical chips. When using a beam splitter set for wavelength division, since at least one filter is required for each channel wavelength, as the number of integrated channels increases, the size of the beam splitter group structure increases, and the number of independent wavelength division components increases, resulting in cumbersome device mounting, increased cumulative error between channels, and difficulty in expanding to more channels. The Z-Block component usually needs to divide the transceiver signals into two independent optical paths. Although it can simplify the overall optical path, in order to connect the two optical paths, a fiber coiling or other coupling optical path structure needs to be used, resulting in a larger overall size of the optical path and lower space utilization. The AWG optical chip has the disadvantage of being sensitive to temperature, which limits the use environment.
[0004] Therefore, it is necessary to provide an OLT optical module with high versatility to solve the above problems. Summary of the Utility Model
[0005] The purpose of the utility model is to provide an OLT optical module with high versatility, which has a compact structure, high space utilization, and can realize the mixed installation of 2.5G / 10G / 50G or optical fiber devices with different rates.
[0006] The utility model realizes the above purpose through the following technical solutions:
[0007] Technical Solution:
[0008] An OLT optical module with high versatility includes a circuit module and an optical path module;
[0009] The circuit module includes a PCBA, and the PCBA is used in cooperation with a PCBA boost circuit, a PCBA control circuit, and a filtering circuit;
[0010] The optical path module includes a TO component used as a transmitting component, a beam splitting component, a beam splitting film, an isolator, a positioning structure component, and a pigtail fiber;
[0011] Adaptively select the positions of the receiving and transmitting optical components so that the wavelength of the optical signal meets the wavelength requirements of the corresponding beam splitting component. Adaptively select different combinations of beam splitting components to achieve multiplexing and demultiplexing of different wavelength channels, forming a highly versatile OLT optical module structure.
[0012] Furthermore, the circuit module is connected to the optical path module through a flexible board.
[0013] Furthermore, the transmitting component can also be composed of an aspherical tube cap / collimating lens / plane window tube cap, a collimating structure such as a lens, an isolator, an LD chip, and a prefabricated solder pad, and outputs parallel light.
[0014] Furthermore, the optical receiving component includes an aspherical tube cap, other light converging components, a PD chip, a wire routing heat sink, a TIA chip, and a wire bonding capacitor.
[0015] Compared with the prior art, the structure of the present utility model is compact. Two channels share one beam splitting component. The wavelength division multiplexing component can be combined with the collimating component to replace the independent beam splitting film / filter film group. The modular structure is assembled through beam splitting components with different film systems, improving the space utilization rate and reducing the cumulative error between channels. Description of the Drawings
[0016] Figure 1 It is a schematic diagram of the optical path for a single beam splitting component;
[0017] Figure 2 It is a schematic diagram of the optical path for cascaded beam splitting components;
[0018] Figure 3 It is another schematic diagram of the optical path for a single beam splitting component;
[0019] Figure 4 It is yet another schematic diagram of the optical path for cascaded beam splitting components;
[0020] Figure 5 It is a schematic diagram of the optical module assembly;
[0021] Figure 6 It is a schematic diagram of the optical device structure. Detailed Embodiments
[0022] Embodiment:
[0023] This embodiment shows an optical module with a compact structure, high space utilization rate, and capable of realizing the mixed installation of 2.5G / 10G / 50G or optical fiber devices with different rates.
[0024] The technical solution is as follows:
[0025] Circuit part:
[0026] The circuit part includes a PCBA, a PCBA boost circuit, a PCBA control circuit, and a filtering circuit. The circuit part is connected to the optical path part through a flexible circuit board;
[0027] Optical path part 100:
[0028] The optical path part 100 includes a TO component 1 used as a transmitting component, a beam splitting component 2, a beam splitting film 3, an isolator 4, a positioning structure component 5, and an optical fiber pigtail 6. Please refer to Figure 5 , Figure 6 .
[0029] The beam splitting component is as Figure 1 shown. The incident optical signal (λ1…λn) enters the beam splitting component through an optical fiber, is collimated into a parallel beam through a spherical surface A (a broadband antireflection coating includes λ1…λn), and passes through a beam splitting interface B (λ1,λ2 are reflected). The beam is divided into two parts, λ1,λ2 and λ3,λ4…λn. λ1,λ2 are reflected at the beam splitting interface B and reach an interface C (λ2 antireflection coating). λ1 is reflected at the interface C and passes through an interface D (λ1 antireflection coating) and is received by an optical receiving component and converted into an electrical signal for output. λ2 passes through the interface C, is deflected by a reflecting sheet M1, and is perpendicularly incident on the optical receiving component. λ3,λ4…λn pass through an interface E (broadband antireflection coating) and are emitted into the next-stage beam splitting component or optical device.
[0030] Among them, the spherical surface A can be replaced with other optical components with similar functions such as a collimating lens or a collimating optical fiber.
[0031] Cascaded beam splitting components can be added according to the required number of channels. As Figure 2 shown, after passing through the beam splitting component 1, λ3,λ4…λn pass through an interface F (broadband antireflection coating) and enter the beam splitting component 2. The optical signal λ3 is reflected on the surface of an interface G (λ5,λ6…λn antireflection coating), reaches an interface I (λ3 antireflection coating), is refracted, and the optical path is deflected by a reflecting sheet M2 and enters the optical receiving component.
[0032] The optical signal of the transmitting component can be combined through the beam splitting component and enter the optical fiber pigtail. The optical signal λ4 of the transmitting optical component passes through an interface J (λ4 antireflection coating), is reflected at the interface I, is combined with λ3, and is reflected again at the interface G and enters the main optical path until it is output through the optical fiber pigtail.
[0033] Replace the positions of the receiving and transmitting optical components at different positions according to requirements, as long as the wavelength of the optical signal meets the wavelength requirements of the corresponding beam splitting component.
[0034] Select different combinations of beam splitting components according to requirements to achieve multiplexing and demultiplexing of different wavelength channels. Place the corresponding beam splitting components into the positioning structure component according to requirements to achieve rapid assembly of the wavelength division multiplexing component.
[0035] The transmitting component can also be other optical devices that output collimated light and are composed of a non-spherical tube cap / collimating lens / plane window tube cap + lens and other collimating structures, an isolator, an LD chip, and a prefabricated solder pad. The optical signal of the transmitting optical component is multiplexed by the multiplexing component and enters the main optical path to achieve the multiplexing process;
[0036] The optical receiving component includes a non-spherical tube cap, other light-converging components, a PD chip, a wire routing heat sink, a TIA chip, and a wire bonding capacitor. The received optical signal is demultiplexed by the wavelength division multiplexing component and enters the corresponding optical receiving channel, and is converted into an electrical signal output through the PD chip.
[0037] The structure of this embodiment is compact. Two channels share one multiplexing component. The wavelength division multiplexing component can be combined with the collimating component to replace the independent demultiplexing filter / filter set. The modular structure assembly is realized through the multiplexing components with different film systems, improving the space utilization rate and reducing the cumulative error between channels.
[0038] The above are only some embodiments of the present invention. For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention.
Claims
1. A highly versatile OLT optical module, characterized by: It includes a circuit module and an optical path module; The circuit module includes PCBA, which is used in conjunction with PCBA boost circuit, PCBA control circuit and filter circuit; The optical path module includes a TO component used as a transmitting component, a light splitting component, a light splitter, an isolator, a positioning structure component, and a pigtail; Select the positions of receiving and transmitting optical components so that the wavelength of the optical signal meets the wavelength requirements of the corresponding optical splitter components. Select different combinations of optical splitters to achieve wavelength combination and demultiplexing of different wavelength channels, forming a highly versatile OLT optical module structure. The incident light signal λ1…λn enters the spectroscopic component through the optical fiber, is collimated into a parallel light beam by the spherical surface A, and is reflected by the spectroscopic interface Bλ1,λ2. The light beam is divided into two parts λ1,λ2 and λ3,λ4…λn; λ1,λ2 is reflected at the spectroscopic interface B and reaches the anti-reflection film at the interface Cλ2; λ1 is reflected from interface C and passes through the anti-reflection film of interface Dλ1, and is received by the light receiving component and converted into an electrical signal for output; λ2 passes through interface C and is deflected by the reflector M1, and vertically enters the light receiving component; λ3, λ4…λn are emitted through interface E and enter the next-level spectroscopic component or optical device; The circuit module is connected to the optical path module through a flexible board; The transmitting assembly is composed of an aspherical tube cap / a collimating lens / a flat window tube cap, an isolator, an LD chip, and a prefabricated solder pad.
2. The highly versatile OLT optical module according to claim 1, characterized in that: The transmitting component outputs parallel light.
3. The highly versatile OLT optical module according to claim 2, characterized in that: The optical receiving component includes an aspherical tube cap, a PD chip, a wiring heat sink, a TIA chip, and a bonding capacitor.