External light source structure suitable for high-speed optical module

Abstract

An external light source structure suitable for a high-speed optical module relates to the technical field of optical communication and comprises a heat conduction base, an inner cavity is arranged in the heat conduction base, the high-speed optical module is arranged at the bottom of the inner cavity of the heat conduction base, a silicon lens is fixedly arranged on one side of the high-speed optical module, and a flexible circuit board positioning block is fixedly arranged in the inner cavity of the heat conduction base. A flexible circuit board is fixedly arranged on the flexible circuit board positioning block, a fixing sleeve is fixedly arranged on the outer portion of the side, close to the silicon lens, of the heat conduction base, a pluggable optical port adapter device is arranged on the outer end side of the fixing sleeve, a pluggable optical fiber sleeve is arranged on the end side of the pluggable optical port adapter device, and optical fibers are arranged in the pluggable optical fiber sleeve. According to the utility model, low-resistance and high-heat-transfer-efficiency connection between the laser light source and the ceramic circuit carrier is realized, the performance of the optical module is improved, the operation safety of the optical module is improved, the optical performance of the optical module is ensured, the service life of the optical module is prolonged, and the maintenance convenience of the optical module is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, and specifically to an external light source structure suitable for high-speed optical modules. Background Art

[0002] In traditional high-speed optical communication systems, 400G DR4 optical modules are one of the key components for realizing high-speed data transmission. These optical modules usually adopt silicon photonics integration technology combined with the COB (Chip on Board) patch wiring process of light sources to improve the integration and performance of the design. However, this integration method has some significant disadvantages.

[0003] Firstly, since the light source chip is tightly integrated with the silicon photonics PIC (Photonic Integrated Circuit), once a failure or defect occurs in the light source structure device, the replacement of the entire optical module becomes complex and costly. This design lacks flexibility and is not conducive to maintenance and upgrading.

[0004] Secondly, the traditional integration method may cause damage to the optical engine device during maintenance or replacement. This is because the connection between the light source chip and the silicon photonics PIC is very tight, and any attempt to remove or replace it may damage the surrounding sensitive optical components.

[0005] In addition, the existing optical module designs also face challenges in heat dissipation management. With the increase in data transmission rate, the heat generated by the optical module increases, and the traditional integration scheme may not be able to effectively export the heat from the key components, thus affecting the performance and stability of the module. Summary of the Utility Model

[0006] Aiming at the deficiencies of the above-mentioned prior art, the technical problem to be solved by the utility model is to provide an external light source structure suitable for high-speed optical modules, aiming to provide higher integration, a more convenient maintenance and upgrading path, and a more effective heat dissipation solution.

[0007] To solve the above technical problems, the utility model provides the following technical solutions:

[0008] An external light source structure applicable to a high-speed optical module, characterized in that: it includes a heat-conducting base, an inner cavity is arranged inside the heat-conducting base, a high-speed optical module is arranged at the bottom of the inner cavity of the heat-conducting base, a silicon lens is fixedly arranged on one side of the high-speed optical module, a flexible circuit board positioning block is fixedly arranged inside the inner cavity of the heat-conducting base, a flexible circuit board is fixedly arranged on the flexible circuit board positioning block, one end of the flexible circuit board extends to the outside of the heat-conducting base, a fixing sleeve is fixedly arranged on the outside of one side of the heat-conducting base close to the silicon lens, the inside of the heat-conducting base is communicated with the inside of the fixing sleeve, a pluggable optical port adapter device is arranged on the outer end side of the fixing sleeve, a pluggable optical fiber sleeve is arranged on the end side of the pluggable optical port adapter device, and an optical fiber is arranged inside the pluggable optical fiber sleeve.

[0009] In a preferred technical solution, the high-speed optical module includes a ceramic base fixedly arranged at the bottom of the inner cavity of the heat-conducting base, a ceramic circuit carrier is fixedly arranged on the upper side of the ceramic base, a side-receiving backlight detector is fixedly arranged at one end of the upper side of the ceramic circuit carrier, and a laser light source is fixedly arranged on the upper side of the ceramic circuit carrier and between the side-receiving backlight detector and the silicon lens.

[0010] In a preferred technical solution, a glue groove is arranged between the silicon lens, the ceramic circuit carrier and the laser light source.

[0011] In a preferred technical solution, a gold-tin solder is preset between the laser light source and the ceramic circuit carrier.

[0012] In a preferred technical solution, a limit bearing groove is arranged on the flexible circuit board positioning block, and one end of the flexible circuit board is clamped inside the limit bearing groove.

[0013] In a preferred technical solution, the pluggable optical port adapter device includes a ceramic ferrule, an optical isolator is fixedly arranged on the inner end side of the ceramic ferrule, a ceramic sleeve is fixedly arranged inside the outer end of the ceramic ferrule, and a limit sleeve is fixedly arranged inside the outer end side of the ceramic ferrule and outside the ceramic sleeve.

[0014] In a preferred technical solution, a cover plate is arranged on the upper side of the heat-conducting base.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] By arranging structures such as a heat-conducting base, a ceramic base and a ceramic circuit carrier, efficient heat dissipation of the high-speed optical module is realized, and the stability and reliability of the optical module during high-speed operation are ensured.

[0017] By adopting the pre - setting technology of gold - tin solder, a low - resistance and high - heat - transfer - efficiency connection between the laser light source and the ceramic circuit carrier is achieved, improving the performance of the optical module.

[0018] The setting of the side - light - receiving back - light detector realizes the effective monitoring of the laser light source, improving the operation safety of the optical module.

[0019] The lens and the laser light source are pre - cured by UV through optical coupling, preventing light attenuation caused by excessive glue and ensuring the optical performance of the optical module.

[0020] The design of the soft - circuit - board positioning block and the limit - bearing groove reduces the load formed by too long gold wires, improving the electrical performance of the optical module.

[0021] The design of the plug - in optical port adapter device and the plug - in fiber sleeve facilitates the replacement and maintenance of the light - source structure device, improving the service life and maintenance convenience of the optical module.

[0022] The overall structure is compact and simple, which is conducive to reducing production costs and improving production efficiency. Brief Description of the Drawings

[0023] Figure 1 It is a schematic cross - sectional structure diagram of the present utility model;

[0024] Figure 2 It is an exploded structure diagram of the present utility model;

[0025] Figure 3 It is a schematic structure diagram of the heat - conducting base cooperating with the high - speed optical module of the present utility model;

[0026] Figure 4 It is a schematic structure diagram after the present utility model is unplugged;

[0027] In the figure: 1. Heat - conducting base; 2. High - speed optical module; 3. Silicon lens; 4. Soft - circuit - board positioning block; 5. Soft - circuit board; 6. Limit - bearing groove; 7. Plug - in optical port adapter device; 8. Plug - in fiber sleeve; 9. Fixed sleeve; 11. Cover plate; 21. Side - light - receiving back - light detector; 22. Ceramic circuit carrier; 23. Laser light source; 24. Glue groove; 25. Ceramic base; 71. Optical isolator; 72. Ceramic ferrule; 73. Ceramic sleeve; 74. Limit sleeve; 81. Optical fiber. Detailed Description of the Preferred Embodiment

[0028] The technical solutions of the present application will be further described in detail below in combination with specific embodiments.

[0029] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application.

[0030] As Figure 1 and Figure 2 shown, an external light source structure suitable for a high-speed optical module includes a heat-conducting base. There is an inner cavity inside the heat-conducting base 1. At the bottom of the inner cavity of the heat-conducting base 1, there is a high-speed optical module 2. On one side of the high-speed optical module 2, a silicon lens 3 is fixedly arranged. Inside the inner cavity of the heat-conducting base 1, a flexible circuit board positioning block 4 is fixedly arranged. On the flexible circuit board positioning block 4, a flexible circuit board 5 is fixedly arranged. One end of the flexible circuit board 5 extends to the outside of the heat-conducting base 1. On the outside of one side of the heat-conducting base 1 close to the silicon lens 3, a fixing sleeve 9 is fixedly arranged. The inside of the heat-conducting base 1 is communicated with the inside of the fixing sleeve 9. At the outer end side of the fixing sleeve 9, a pluggable optical port adapter device 7 is arranged. At the end side of the pluggable optical port adapter device 7, a pluggable optical fiber sleeve 8 is arranged. Inside the pluggable optical fiber sleeve 8, there is an optical fiber 81. A cover plate 11 is arranged on the upper side of the heat-conducting base 1. A limiting bearing groove 6 is arranged on the flexible circuit board positioning block 4. One end of the flexible circuit board 5 is clamped inside the limiting bearing groove 6.

[0031] As Figure 1 and Figure 3 shown, the high-speed optical module 2 includes a ceramic base 25 fixedly arranged at the bottom of the inner cavity of the heat-conducting base 1. On the upper side of the ceramic base 25, a ceramic circuit carrier 22 is fixedly arranged. At one end on the upper side of the ceramic circuit carrier 22, a side-receiving backlight detector 21 is fixedly arranged. On the upper side of the ceramic circuit carrier 22 and between the side-receiving backlight detector 21 and the silicon lens 3, a laser light source 23 is fixedly arranged. A glue groove 24 is arranged between the silicon lens 3, the ceramic circuit carrier 22, and the laser light source 23. A gold-tin solder is pre-placed between the laser light source 23 and the ceramic circuit carrier 22.

[0032] As Figure 1 shown, the pluggable optical port adapter device 7 includes a ceramic ferrule 72. An optical isolator 71 is fixedly arranged at the inner end side of the ceramic ferrule 72. A ceramic sleeve 73 is fixedly arranged inside the outer end of the ceramic ferrule 72. A limiting sleeve 74 is fixedly arranged inside the outer end side of the ceramic ferrule 72 and outside the ceramic sleeve 73.

[0033] As Figure 1 , Figure 2 Figure 3 and Figure 4 shown

[0034] The utility model is applicable to the PCBA optical module packaging; the external light source structure includes a laser light source 23. A gold-tin solder is preset between the laser light source 23 and the ceramic circuit carrier 22, and is heated to the alloy eutectic point in a certain protective atmosphere to be melted, so as to fully fill the gap between the laser light source 23 and the ceramic circuit carrier 22. At the same time, a small amount of the alloy on the back surface of the laser light source 23 and the surface of the ceramic circuit carrier 22 will enter the molten solder. After cooling, an atomic bond between the alloy solder and the gold layer will be formed, thus completing the welding of the chip and the ceramic circuit carrier. It realizes small connection resistance, high heat transfer efficiency, and uniform heat dissipation. The ceramic circuit carrier 22 is connected to the heat conduction base 1 through the ceramic base 25 to allow the heat source to flow out. The cover plate 11 and the ceramic base 2 are provided as a sealing structure.

[0035] The side-light-receiving backlight detector 21 is arranged on the surface of the ceramic circuit carrier 22, and its function is to effectively monitor the laser light source 23. The silicon lens 3 and the laser light source 23 are UV pre-cured through optical coupling. A glue groove 24 is arranged above the ceramic base 25 and between the ceramic circuit carrier 22 and the silicon lens; the purpose is to prevent the glue from overflowing and extending upward to the optical area of the silicon lens, causing light attenuation.

[0036] A limit bearing groove 6 for positioning and limiting the flexible printed circuit board 5 is preset in the center of the flexible printed circuit board positioning block 4 of the utility model. Its characteristic purpose is to reduce the load formed by the overlong gold wire. The adjacent distance between the flexible printed circuit board 5 and the laser light source 23 is 100um; however, the structure connecting the laser light source 23 and the flexible printed circuit board 5 of the utility model is not limited to this.

[0037] The pluggable optical port adapter device 7 of the utility model and the heat conduction base 1 adopt a laser coupling welding process, and the fixing sleeve 9 is used as the connecting main body. The pluggable optical port adapter device 7 and the pluggable optical fiber device 8 are used as the application main bodies of the pluggable optical fiber docking structure. When the light source structure device of the main body needs to be replaced, the docking section between the flexible printed circuit board 5 and the PCBA can be disassembled to replace the new light source structure device.

[0038] The above has described the preferred embodiments of the present application in detail, but the present application is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes can be made without departing from the purpose of the present application.

Claims

1. An external light source structure suitable for a high-speed optical module, characterized in that: The invention comprises a heat-conducting base, wherein an inner cavity is arranged inside the heat-conducting base (1), a high-speed optical module (2) is arranged at the bottom of the inner cavity of the heat-conducting base (1), a silicon lens (3) is fixedly arranged on one side of the high-speed optical module (2), a soft circuit board positioning block (4) is fixedly arranged inside the inner cavity of the heat-conducting base (1), a soft circuit board (5) is fixedly arranged on the soft circuit board positioning block (4), one end of the soft circuit board (5) extends to the outside of the heat-conducting base (1), a fixing sleeve (9) is fixedly arranged on the outside of the heat-conducting base (1) on one side close to the silicon lens (3), the inside of the heat-conducting base (1) is communicated with the inside of the fixing sleeve (9), a pluggable optical port adapter device (7) is arranged on the outer end side of the fixing sleeve (9), a pluggable optical fiber sleeve (8) is arranged on the end side of the pluggable optical port adapter device (7), and an optical fiber (81) is arranged inside the pluggable optical fiber sleeve (8).

2. The external light source structure suitable for a high-speed optical module according to claim 1, characterized in that: The high-speed optical module (2) comprises a ceramic base (25) fixedly arranged at the bottom of the inner cavity of the heat-conducting base (1); a ceramic circuit carrier (22) is fixedly arranged on the upper side of the ceramic base (25); a side-light-collecting backlight detector (21) is fixedly arranged at one end of the upper side of the ceramic circuit carrier (22); and a laser light source (23) is fixedly arranged on the upper side of the ceramic circuit carrier (22) and between the side-light-collecting backlight detector (21) and the silicon lens (3).

3. The external light source structure suitable for a high-speed optical module according to claim 2, characterized in that: A glue groove (24) is provided between the silicon lens (3), the ceramic circuit carrier (22) and the laser light source (23).

4. The external light source structure suitable for a high-speed optical module according to claim 2, characterized in that: Gold-tin solder is pre-placed between the laser light source (23) and the ceramic circuit carrier (22).

5. The external light source structure suitable for a high-speed optical module according to claim 1, characterized in that: A limit bearing groove (6) is provided on the flexible circuit board positioning block (4), and one end of the flexible circuit board (5) is engaged inside the limit bearing groove (6).

6. The external light source structure suitable for a high-speed optical module according to claim 1, characterized in that: The pluggable optical port adapter device (7) comprises a ceramic ferrule (72), an optical isolator (71) is fixedly arranged on the inner end side of the ceramic ferrule (72), a ceramic sleeve (73) is fixedly arranged inside the outer end of the ceramic ferrule (72), and a limiting sleeve (74) is fixedly arranged inside the outer end side of the ceramic ferrule (72) and outside the ceramic sleeve (73).

7. The external light source structure suitable for a high-speed optical module according to claim 1, characterized in that: A cover plate (11) is provided on the upper side of the heat-conducting base (1).

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