Optical module
By setting a conductive part and a thermally conductive glue in the optical module, the cooling of the photosensitive component is achieved and the welding part is formed by laser spraying, which solves the problem of glue aging in traditional automotive lens modules in strict environments, and improves the thermal stability and dust resistance of the module.
Patent Information
- Application Number
- CN202422096868.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-08-28
AI Technical Summary
In harsh environments such as high temperature durability, high temperature and high humidity, hot and cold impact, the glue aging and brittleness may cause the lens to fall off and affect driving safety.
An optimized active alignment process is designed, by setting a conductive part and a thermally conductive glue in the optical module, the effective cooling of the photosensitive component is achieved, and the welding part is formed by laser spraying tin to enhance the fixity of the component.
It effectively overcomes the problem of glue shrinkage variation, improves the thermal stability and dust resistance of the optical module, improves image quality and equipment reliability, and reduces the need for focus distance adjustment.
Smart Images
Figure CN222994730U_ABST
Abstract
Description
Technical Field
[0001] The present utility model relates to an optical module, and more particularly to an optical module with optimized heat dissipation and dust prevention designs. Background Art
[0002] During the active alignment process of traditional vehicle-mounted lens modules (optical modules), UV light is usually used to pre-cure the glue between the lens assembly and the carrier, and then baking at 85 degrees for two hours is carried out to completely cure it. However, this traditional active alignment technology highly depends on the stability of the manufacturing process. In particular, the shrinkage variation of the glue during the thermal curing process has a significant impact on the final image quality. To overcome the shrinkage variation, a large number of trial production samples are required to obtain experimental data, and then the focus distance is adjusted for compensation. However, in harsh environments such as high-temperature durability, high-temperature and high-humidity, and thermal shock of vehicle-mounted lens modules, the glue will age and embrittle, which may cause the lens to fall off, thus posing a significant threat to driving safety.
[0003] Therefore, an optimized active alignment process is needed to enable the optical module to overcome the above disadvantages and have optimized heat dissipation and dust prevention designs. The present utility model aims to solve these problems and meet other requirements. Summary of the Utility Model
[0004] Embodiments of the present utility model provide an optical module. The optical module includes an optical component, a carrier, a circuit component, and a photosensitive component. The carrier is connected to the optical component. The circuit component is connected to the carrier. The photosensitive component is disposed on the circuit component, and the photosensitive component is aligned with the optical component on the optical axis.
[0005] According to some embodiments of the present utility model, the carrier includes an annular portion and a base portion. The optical component is fixedly disposed in the annular portion.
[0006] According to some embodiments of the present utility model, the carrier further includes a protruding portion. The base portion includes a lower surface facing the circuit component, and the protruding portion protrudes from the lower surface of the base portion.
[0007] According to some embodiments of the present utility model, the protruding portion of the carrier is made of copper, and the surface of the protruding portion is nickel-plated.
[0008] According to some embodiments of the present utility model, the circuit component includes an orifice, and the protruding portion of the carrier passes through the orifice of the circuit component.
[0009] According to some embodiments of the present utility model, the circuit component includes a first surface and a second surface. The photosensitive component is disposed on the first surface, and the first surface faces the optical component, and the second surface faces in the opposite direction to the first surface.
[0010] According to some embodiments of the present utility model, the optical module further includes a soldering portion formed at the orifice of the circuit component by laser solder spraying and covering a part of the protruding portion.
[0011] According to some embodiments of the present utility model, the optical module further includes a thermal conductive adhesive. The circuit component includes a conduction portion surrounding the edge of the first surface of the circuit component. A thermal conductive adhesive is filled between the conduction portion and the lower surface of the base of the carrier.
[0012] According to some embodiments of the present utility model, the base of the carrier includes an accommodation space, and the annular portion includes an opening. The accommodation space communicates with the opening, and the thermal conductive adhesive disposed between the conduction portion and the lower surface of the base fills the accommodation space of the base.
[0013] According to some embodiments of the present utility model, the optical module further includes a connector for connecting to an external circuit, and the connector and the photosensitive component are disposed on opposite sides of the circuit component. Description of the Drawings
[0014] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following detailed description of the specific embodiments of the present utility model is provided in conjunction with the accompanying drawings, wherein:
[0015] Figure 1 A side view showing an optical module according to some embodiments of the present utility model.
[0016] Figure 2A An exploded view showing a part of the optical module according to some embodiments of the present utility model.
[0017] Figure 2B An exploded view showing another perspective of a part of the optical module according to some embodiments of the present utility model.
[0018] Figures 3A to 3D A schematic diagram of the process of assembling and actively aligning the optical module.
[0019] The present utility model is susceptible to various modifications and alternative forms. Some representative embodiments have been shown by way of example in the drawings and will be described in detail herein. However, it should be understood that the present utility model is not intended to be limited to the specific forms disclosed. Instead, the present utility model will cover all modifications, equivalents, and alternative forms falling within the spirit and scope of the present utility model as defined by the claims.
[0020] Reference Numerals:
[0021] 1000: Optical module
[0022] 1100: Optical component
[0023] 1200: Carrier
[0024] 1210: Annular part
[0025] 1211: Opening
[0026] 1220: Base part
[0027] 1221: Accommodating space
[0028] 1222: Lower surface
[0029] 1230: Protrusion
[0030] 1300: Circuit component
[0031] 1310: First surface
[0032] 1320: Second surface
[0033] 1330: Orifice
[0034] 1340: Conductive part
[0035] 1400: Photosensitive component
[0036] 1500: Connector
[0037] 1600: Welding part
[0038] 1700: Thermal conductive adhesive
[0039] 1800: Outer shell
[0040] G: Gap
[0041] O: Optical axis Detailed implementation manners
[0042] Multiple embodiments are described with reference to the accompanying drawings, and like reference signs are used throughout the drawings to designate like or equivalent components. The drawings are not drawn to scale, and the drawings are provided only to illustrate the present utility model. It should be understood that many specific details, relationships, and methods are set forth to provide a comprehensive understanding. However, those of ordinary skill in the art will readily conceive that multiple embodiments can be practiced without one or more specific details or in other ways. In other cases, well-known structures or operations are shown in detail to avoid obscuring certain features of multiple embodiments. Multiple embodiments are not limited to the order of actions or events shown, such as some actions can occur in a different order and / or simultaneously with other actions or events. In addition, not all actions or events shown are required for practicing the method according to the present utility model.
[0043] Components and limitations disclosed, for example, in the abstract, the utility model content, and the embodiment paragraphs, but not explicitly set forth in the claims, should not be incorporated into the claims singly or collectively by implication, inference, or otherwise. For the purposes of this embodiment, unless explicitly stated otherwise, the singular includes the plural and vice versa. The term "comprising" means "including but not limited to". In addition, approximate terms such as "about, almost, substantially, approximately" and their like may herein mean, for example, "at", "near, nearly at", "within 3-5% of", "within acceptable manufacturing tolerances", or any logical combination thereof.
[0044] Figure 1 Shows a side view of the optical module 1000 according to some embodiments of the present utility model. Figure 2A Shows an exploded view of a part of the optical module 1000 according to some embodiments of the present utility model. Figure 2B Shows an exploded view of a part of the optical module 1000 from another perspective according to some embodiments of the present utility model.
[0045] Please refer to Figure 1 、 Figure 2A and Figure 2B . The optical module 1000 includes an optical component 1100, a carrier 1200, a circuit member 1300, a photosensitive component 1400, a connector 1500, a welding portion 1600, a thermal conductive adhesive 1700, and a housing 1800.
[0046] According to some embodiments of the present utility model, the optical component 1100 may be a component including a plurality of lenses arranged therein. According to some embodiments of the present utility model, the carrier 1200 is fixedly connected to the optical component 1100. The carrier 1200 includes an annular portion 1210, a base portion 1220, and four protruding portions 1230 ( Figure 2A ).
[0047] According to some embodiments of the present utility model, the annular portion 1210 of the carrier 1200 may be regarded as the part of the carrier 1200 that annularly surrounds the optical component 1100, and the base portion 1220 may be regarded as the part of the carrier 1200 having a rectangular shape and corresponding to the circuit member 1300.
[0048] Specifically, the annular portion 1210 of the carrier 1200 includes an opening 1211. The optical component 1100 is fixedly disposed in the opening 1211 of the annular portion 1210. As Figure 1 shown, the base portion 1220 of the carrier 1200 does not overlap with the annular portion 1210 in the direction of an optical axis O.
[0049] As Figure 2A shown, the base portion 1220 includes a receiving space 1221 and a lower surface 1222. The receiving space 1221 is configured to receive the photosensitive component 1400 ([ Figure 2B ) disposed on the circuit member 1300. The receiving space 1221 communicates with the opening 1211 of the annular portion 1210. The lower surface 1222 of the base portion 1220 faces the circuit member 1300.
[0050] As Figure 2A shown, the protruding portion 1230 of the carrier 1200 protrudes from the lower surface 1222 of the base portion 1220. In some embodiments of the present invention, the protruding portion 1230 of the carrier 1200 is made of copper, and the surface of the protruding portion 1230 is plated with nickel.
[0051] According to some embodiments of the present invention, the circuit member 1300 is connected to the carrier 1200, and the details will be described in detail later in connection with Figures 3A to 3D . The circuit member 1300 includes a first surface 1310 ([ Figure 2B ), a second surface 1320 ([ Figure 2A ), four apertures 1330 ([ Figure 2B ) and a conduction portion 1340 ([ Figure 2B ).
[0052] As Figure 2B shown, the first surface 1310 of the circuit member 1300 faces the optical component 1100. The photosensitive component 1400 is disposed on the first surface 1310. The second surface 1320 ([ Figure 2A ) faces in a direction opposite to that of the first surface 1310. The four apertures 1330 of the circuit member 1300 are respectively located near the four corners of the circuit member.
[0053] Please refer to Figure 2A and Figure 2B in combination. The protruding portion 1230 of the carrier 1200 ([ Figure 2A ) passes through the apertures 1330 of the circuit member 1300 ([ Figure 2B ) during the assembly and active alignment processes, and the details will be described in detail later in connection with Figures 3A to 3D .
[0054] As Figure 2BAs shown, the conducting portion 1340 of the circuit component 1300 is around the edge of the first surface 1310. According to some embodiments of the present invention, the material of the conducting portion 1340 is bare copper, and the surface of the conducting portion 1340 can have the same height as the first surface 1310, that is to say, the surface of the conducting portion 1340 and the first surface 1310 are in the same plane. In a specific embodiment, the width of the conducting portion 1340 can be from 0.5 mm to 1 mm.
[0055] As Figure 2B shown, the photosensitive component 1400 is disposed on the first surface 1310 of the circuit component 1300. During the assembly and active alignment processes, the photosensitive component 1400 and the optical component 1100 are aligned on the optical axis O to improve the alignment accuracy, improve the image quality, enhance the reliability, and support complex optical designs.
[0056] As Figure 2A shown, the connector 1500 is disposed on the second surface 1320 of the circuit component 1300. The connector 1500 and the photosensitive component 1400 ( Figure 2B ) are disposed on opposite sides of the circuit component 1300. The connector 1500 is used to connect to an external circuit (not shown).
[0057] Please refer to Figure 2A . According to some embodiments of the present invention, during the assembly and active alignment processes, laser solder spraying is performed at the orifice 1330 ( Figure 2B ) of the circuit component 1300 to form a welding portion 1600 on the second surface 1320 of the circuit component 1300, and the welding portion 1600 covers a part of the protrusion 1230 of the carrier 1200, and the details will be described in detail later with respect to Figures 3A to 3D .
[0058] Please refer to Figure 1 , Figure 2A and Figure 2B , a thermal conductive adhesive 1700 ( Figure 2B ) is filled between the conducting portion 1340 ( Figure 2A ) and the lower surface 1222 of the base 1220 ( Figure 1 ), and the thermal conductive adhesive 1700 fills the accommodation space 1221 ( Figure 2A ) of the base 1220.
[0059] In this way, due to the arrangement of the conduction part 1340 and the thermal conductive adhesive 1700 which helps to conduct the heat generated at the photosensitive component 1400 to the carrier 1200, therefore, the optical module 1000 realizes effective cooling of the photosensitive component 1400 through the arrangement of the conduction part 1340 and the thermal conductive adhesive 1700, improves the problem of hot pixels, and further enhances the optical quality of the optical module 1000.
[0060] In addition, since the thermal conductive adhesive 1700 fills the accommodation space 1221 of the base 1220 ( Figure 2A ), this enables the photosensitive component 1400 within the accommodation space 1221 of the base 1220 to be isolated from dust particles, enhancing the optical quality of the optical module 1000.
[0061] As Figure 1 shown, for illustrative purposes, the housing 1800 is shown in dashed lines. The housing 1800 is used to protect the components within its accommodation space (for example, the circuit member 1300, the connector 1500, the soldering part 1600, etc.). The housing 1800 is connected to the carrier 1200 in the last step of assembling the optical module 1000.
[0062] Figures 3A to 3D Schematic diagrams of the processes of assembling and active alignment of the optical module 1000. In the process as Figure 3A shown, the optical component 1100 and the carrier 1200 are components fixed to each other, and the circuit member 1300 carrying the photosensitive component 1400 is positioned at a position corresponding to the carrier 1200.
[0063] In the process as Figure 3B shown, the protrusion 1230 of the carrier 1200 passes through the orifice 1330 of the circuit member 1300, and the optical component 1100 and the photosensitive component 1400 are actively aligned so that the optical component 1100 and the photosensitive component 1400 are aligned on the optical axis O ( Figure 1 ).
[0064] In the process as Figure 3C shown, at the orifice 1330 of the circuit member 1300 ( Figure 3B ), laser soldering is performed to form the soldering part 1600 on the second surface 1320 of the circuit member 1300, and the soldering part 1600 covers a part of the protrusion 1230 of the carrier 1200 ( Figure 3B ), thereby fixing the actively aligned optical component 1100 and the photosensitive component 1400 together.
[0065] As Figure 3CAs shown, a gap G exists between the lower surface 1222 of the carrier 1200 and the first surface 1310 of the circuit component 1300 that are fixed together by laser spray soldering. During the process shown in Figure 3D , the optical module 1000 is inverted to fill the thermal conductive adhesive 1700 into the Figure 3C gap G shown. In the final step of assembling the optical module 1000, the housing 1800 ( Figure 1 ) is fixed to the carrier 1200 to protect the components located in its accommodation space.
[0066] In summary, the active alignment process of the optical module of the present utility model has significant advantages compared with the conventional vehicle lens module that uses UV light for pre-curing the glue between the optical component and the carrier. In the present utility model, the optical component and the carrier are fixed, and high-precision six-axis focusing is performed between the photosensitive component and the carrier during the active alignment process. This not only saves the high cost of using AA glue but also eliminates the plasma surface treatment step of the bonding surface of the carrier surface and the processing time required for thermal curing.
[0067] Although the present utility model has been shown and described with respect to one or more embodiments, equivalents and modifications will occur to those of ordinary skill in the art upon reading and understanding this specification and the drawings. Additionally, although specific features of the present utility model may have been disclosed with respect to only one of several embodiments, such features, as may be desired and advantageous for any given or particular application, may be combined with one or more other features of one or more other embodiments.
[0068] The terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the present utility model. As used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. In addition, the terms "including", "includes", "having", "has", "with" or variations thereof, as used in the embodiments and / or claims, are intended to include in a manner similar to the term "comprising".
[0069] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. In addition, terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant art unless clearly defined herein and will not be interpreted as idealized or overly formal meanings.
[0070] Although the present utility model has been disclosed above with the preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to that defined by the claims.
Claims
1. An optical module, characterized in that: include: an optical component; a carrier connected to the optical component; a circuit member connected to the carrier; and A photosensitive component is arranged on the circuit component, and the photosensitive component is aligned with the optical component on an optical axis.
2. The optical module according to claim 1, wherein: The carrier comprises an annular portion and a base portion, and the optical component is fixedly arranged in the annular portion.
3. The optical module according to claim 2, wherein: The carrier further includes a protruding portion. The base includes a lower surface facing the circuit component, and the protruding portion protrudes from the lower surface of the base.
4. The optical module according to claim 3, wherein: The protrusion of the carrier is made of copper, and the surface of the protrusion is plated with nickel.
5. The optical module according to claim 3, wherein: The circuit component includes an aperture, wherein the protrusion of the carrier passes through the aperture of the circuit component.
6. The optical module according to claim 5, wherein: The circuit component comprises a first surface and a second surface. The photosensitive component is arranged on the first surface, and the first surface faces the optical component, and the second surface faces the opposite direction to the first surface.
7. The optical module according to claim 6, wherein: The invention further comprises a welding part, which is formed at the opening of the circuit component through laser tin spraying and covers a part of the protruding part of the carrier.
8. The optical module according to claim 6, wherein: It further comprises a heat-conducting glue. The circuit component comprises a conducting part. The conducting part surrounds the edge of the first surface of the circuit component. The heat-conducting glue is filled between the conducting part and the lower surface of the base of the carrier.
9. The optical module according to claim 8, wherein: The base of the carrier includes a receiving space, the annular portion includes an opening, the receiving space is communicated with the opening, and the thermal conductive adhesive arranged between the conducting portion and the lower surface of the base fills the receiving space of the base.
10. The optical module according to claim 1, wherein: It further includes a connector, which is used to connect to an external circuit, and the connector and the photosensitive component are arranged on opposite sides of the circuit component.