Pressing water-cooling head and water-cooling temperature control system
By using the liquid-cooling temperature control method of pressed water-cooling head and water-cooling temperature control system in the performance test of GPU chips, the problems of low temperature control accuracy and low testing efficiency in the prior art are solved, high-precision, fast-responsive temperature control and parallel testing of multiple chips are achieved, and the accuracy and efficiency of test results are improved.
Patent Information
- Application Number
- CN202422270811.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-09-14
AI Technical Summary
The prior art has low temperature control accuracy and high noise in GPU chip performance tests, which cannot guarantee a stable temperature environment, affects the accuracy of the test results, and it is difficult to conduct parallel testing of multiple GPU chips at the same time, and the test efficiency is low.
The pressed water cooling head and water cooling temperature control system are adopted to control the temperature of the GPU chip through liquid cooling. The pressed water cooling head includes a first connection plate, a second connection plate, a guide column, a spring and a heat exchange plate, and uses the cooling liquid circulation to achieve high-precision and fast response temperature control.
It improves the temperature control accuracy and testing efficiency during GPU chip testing, can perform performance testing in an optimal and stable temperature environment, reduces the test cycle of a single chip, reduces costs, and supports parallel testing of multiple GPU chips.
Smart Images
Figure CN222994907U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of GPU chip performance testing, and particularly relates to a press-fit water-cooling head for controlling the temperature of a GPU chip and a water-cooling temperature control system including the press-fit water-cooling head. Background Art
[0002] GPU (Graphics Processing Unit) testing plays an important role in aspects such as evaluating performance, verifying hardware, optimizing tuning, compatibility testing, and R & D debugging. It can help users understand and utilize the performance potential of GPU chips, and provide reliable hardware and optimization solutions. Therefore, during the production process of GPU chips, it is necessary to perform performance testing on the GPU chips.
[0003] When performing GPU chip performance testing, the chip temperature is an important factor that needs to be controlled, which directly affects the stability of the GPU chip and the accuracy of the test results. Currently, the industry mainly uses air cooling for temperature control during GPU chip performance testing. However, due to the relatively rapid increase in the power and performance of GPU chips in recent years, generally two or three cooling fans are required to control the temperature of one chip. The air cooling temperature control method: on the one hand, the temperature control accuracy is relatively low and the noise is high, which cannot ensure that the GPU chip performance testing process is carried out in a stable temperature environment, affecting the accuracy of the test results; on the other hand, due to the limited space around the GPU chip test card slot in the test device, it is difficult to install more cooling fans, and multiple GPU chips cannot be tested in parallel simultaneously, resulting in low test efficiency. Summary of the Utility Model
[0004] Aiming at the problems existing in the prior art, the utility model provides a press-fit water-cooling head and a water-cooling temperature control system including the press-fit water-cooling head, which are used to control the temperature of the GPU chip during performance testing, so as to solve the problem of how to improve the temperature control accuracy and test efficiency during the GPU chip testing process.
[0005] In order to achieve the above object, the utility model adopts the following technical solutions:
[0006] A press-fit water block is used for controlling the temperature of a GPU chip. The press-fit water block includes a first connecting plate, a second connecting plate, guide posts, springs, and a heat exchange plate. Among them, the first connecting plate is used to fixedly support the press-fit water block. The guide posts are movably inserted through the first connecting plate. The second connecting plate is located above the first connecting plate and is connected to the first ends of the guide posts. The heat exchange plate is located below the first connecting plate and is connected to the second ends of the guide posts. The springs are located between the heat exchange plate and the first connecting plate and are sleeved on the guide posts. A coolant flow cavity is formed in the heat exchange plate. An inlet connection head and an outlet connection head that are communicated with the coolant flow cavity are arranged on the upper surface of the heat exchange plate facing the first connecting plate. The shape of the lower surface of the heat exchange plate is mutually adapted to the surface shape of the GPU chip.
[0007] Preferably, the heat exchange plate is divided into an intermediate heat exchange part and a peripheral heat exchange part that are isolated from each other. The peripheral heat exchange part surrounds the intermediate heat exchange part on all sides. The intermediate heat exchange part and the peripheral heat exchange part are respectively provided with corresponding coolant flow cavities, as well as an inlet connection head and an outlet connection head. The intermediate heat exchange part is used for heat exchange with the chip body of the GPU chip. The peripheral heat exchange part is used for heat exchange with the wiring area of the GPU chip located around the chip body.
[0008] Preferably, a metal heat conducting sheet is arranged on one side surface of the intermediate heat exchange part facing the chip test slot, and a carbon fiber heat conducting pad is arranged on one side surface of the peripheral heat exchange part facing the chip test slot.
[0009] Preferably, the first connecting plate and the second connecting plate are provided with avoidance holes at positions corresponding to the inlet connection head and the outlet connection head.
[0010] Another aspect of the present invention is to provide a water cooling temperature control system, which includes a circulation pipeline, a heat dissipation box, a pump, a flow meter, a temperature sensor, and the press-fit water block as described above. The circulation pipeline connects the heat dissipation box and the press-fit water block and is used for circulating and transmitting coolant between the heat dissipation box and the press-fit water block. The pump and the flow meter are respectively connected to the circulation pipeline. The pump is used for driving the coolant to flow in the circulation pipeline and controlling its flow rate. The flow meter is used for detecting the flow rate of the coolant. The temperature sensor is connected to the heat exchange plate and is used for detecting the temperature of the heat exchange plate. Among them, the pump, the flow meter, and the temperature sensor are respectively electrically connected to a micro control chip.
[0011] Preferably, the circulation pipeline includes a water pipe and a liquid leakage detection rope covering the water pipe. The liquid leakage detection rope is connected to a liquid leakage detection sensor, and the liquid leakage detection sensor is electrically connected to the micro control chip.
[0012] Preferably, the heat dissipation box is provided with a heat dissipation fan, a heat sink, a copper water pipe and a liquid storage mechanism.
[0013] Preferably, the water-cooling temperature control system includes M pressed water-cooling heads, and the M pressed water-cooling heads are connected to the circulation pipeline in parallel through pipeline branches; in the water-cooling temperature control system, one heat sink and one pump drive the M pressed water-cooling heads to realize the circulation of the coolant; M is an integer of 2 to 4.
[0014] The pressed water cooling head and its corresponding water cooling temperature control system provided by the embodiment of the utility model, when testing the GPU chip, the pressed water cooling head is pressed against the surface of the GPU chip for heat exchange, and the temperature of the GPU chip is controlled by liquid cooling. The temperature control has high accuracy and can respond quickly, which can ensure that the performance test process of the GPU chip is carried out in an optimal and stable temperature environment, improve the accuracy of the test results, reduce the test cycle of a single chip, improve the test efficiency, and reduce costs.
[0015] In addition, based on the high efficiency and high precision temperature control of the pressed water cooling head, the water cooling temperature control system can set up multiple pressed water cooling heads to circulate the coolant, thereby simultaneously testing multiple GPU chips in parallel, further improving the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a structural block diagram of the water cooling temperature control system in the embodiment of the utility model;
[0017] Figure 2 It is a three-dimensional diagram of a pressed water cooling head in an embodiment of the utility model;
[0018] Figure 3 is a top view of a pressed water cooling head in an embodiment of the utility model;
[0019] Figure 4 A bottom view of a press-fit water cooling head in an embodiment of the utility model;
[0020] Figure 5 This is a structural diagram of the relative positions of the pressed water cooling head and the GPU chip in an embodiment of the utility model. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical solution and advantages of the utility model clearer, the specific embodiments of the utility model are described in detail below in conjunction with the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the utility model shown in the accompanying drawings and described according to the accompanying drawings are merely exemplary, and the utility model is not limited to these embodiments.
[0022] It should be noted that the same or similar reference numerals in the drawings of the embodiments of the present utility model correspond to the same or similar components; in the description of the present utility model, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.
[0023] Here, it should also be noted that in order to avoid obscuring the present utility model due to unnecessary details, only the structures and / or processing steps closely related to the solution according to the present utility model are shown in the drawings, and other details less related to the present utility model are omitted.
[0024] The embodiments of the present utility model provide a press-fit water-cooling head and a water-cooling temperature control system including the press-fit water-cooling head, mainly for controlling the temperature of the GPU chip during the performance test of the GPU chip.
[0025] Refer to Figure 1 , the water-cooling temperature control system mainly includes a circulation pipeline 1, a heat dissipation box 2, a pump 3, a flowmeter 4, a press-fit water-cooling head 5, and a temperature sensor 6.
[0026] Among them, the press-fit water-cooling head 5 is pressed against the GPU chip to be tested for heat exchange to control the temperature of the GPU chip. The circulation pipeline 1 connects the heat dissipation box 2 and the press-fit water-cooling head 5, and is used for circulating and transporting the coolant between the heat dissipation box 2 and the press-fit water-cooling head 5. Specifically, the coolant is transported from the heat dissipation box 2 to the press-fit water-cooling head 5 for heat exchange with the GPU chip to be tested, and then the heat-exchanged coolant is transported to the heat dissipation box 2 for heat dissipation and cooling.
[0027] Among them, the pump 3 and the flowmeter 4 are respectively connected to the circulation pipeline 1. The pump 3 is used to drive the coolant to flow in the circulation pipeline 1 and control its flow rate, and the flowmeter 4 is used to detect the flow rate of the coolant. The temperature sensor 6 is arranged in the press-fit water-cooling head 5, and the temperature of the GPU chip to be tested is determined by detecting the temperature of the press-fit water-cooling head 5.
[0028] Specifically, the circulation pipeline 1 includes a water pipe and a liquid leakage detection rope (not shown in the drawings) covering the water pipe, and the liquid leakage detection rope is connected to a liquid leakage detection sensor 7.
[0029] Among them, the pump 3, the flowmeter 4, the temperature sensor 6, and the liquid leakage detection sensor 7 are respectively electrically connected to the micro-control chip 8 (as Figure 1 shown by the dotted arrow in the figure). The temperature sensor 6 transmits temperature data to the micro-control chip 8 in real time. The micro-control chip 8 forms a control command based on the comparison between the set temperature and the real-time temperature, controls the rotation speed of the pump 3, and further controls the flow rate of the coolant. The function of the flowmeter 4 is to detect the flow rate of the coolant and feedback it to the micro-control chip 8 in real time. More specifically, through the functional relationship between the temperature sensor 6 and the flowmeter 4, different temperatures correspond to different flowmeter values, enabling the micro-control chip 8 to control the rotation speed of the water pump, thereby achieving rapid temperature control of the GPU chip and meeting the conditions required for testing. Under the action of the liquid leakage detection rope and the liquid leakage detection sensor 7, it is possible to detect in real time whether there is liquid leakage, thereby protecting the product from the harm of liquid leakage in a timely manner and improving the safety and stability of the test.
[0030] Among them, a cooling fan, heat sinks, copper water pipes, a liquid storage mechanism, etc. (not shown in the drawings) are provided in the heat dissipation box 2. Further, the pump 3 and the flowmeter 4 are respectively connected to the circulation pipeline 1 and can be placed in the heat dissipation box 2, so that the structure of the entire system is more compact.
[0031] Refer to Figures 2 to 4 , in this embodiment, the press-fit water-cooled head 5 mainly includes a first connecting plate 52, a second connecting plate 53, a guide post 54, a spring 55, and a heat exchange plate 51. Among them, the first connecting plate 52 is used to fixedly support the press-fit water-cooled head 5. For example, the press-fit water-cooled head 5 is fixedly connected to the GPU chip test bench. The guide post 54 is movably inserted through the first connecting plate 52. The second connecting plate 53 is located above the first connecting plate 52 and is connected to the first end of the guide post 54. The heat exchange plate 51 is located below the first connecting plate 52 and is connected to the second end of the guide post 54. The spring 55 is located between the heat exchange plate 51 and the first connecting plate 52 and is sleeved on the guide post 54. A coolant flow cavity (not shown in the drawings) is provided in the heat exchange plate 51. An inlet connection head 56 and an outlet connection head 57 communicating with the coolant flow cavity are provided on the upper surface of the heat exchange plate 51 facing the first connecting plate 52. The shape of the lower surface of the heat exchange plate 51 is mutually adapted to the surface shape of the GPU chip. Among them, the temperature sensor 6 is connected to the heat exchange plate 51, and the temperature of the GPU chip being tested is determined by detecting the temperature of the heat exchange plate 51.
[0032] As described above for the press-fit water-cooled head and the corresponding water-cooled temperature control system, when performing a performance test on a GPU chip, refer to Figure 5, fix the press-fit water-cooled head 5 above the test stage 100. After placing the GPU chip to be tested in the chip test slot 101 of the test stage 100, lift the test stage 100 towards the press-fit water-cooled head 5 (a lifting drive mechanism can be set to drive the test stage 100), so that the heat exchange plate 51 of the press-fit water-cooled head 5 presses against and fits on the surface of the GPU chip. Then, drive the coolant of the water-cooled temperature control system to circulate. The heat exchange plate 51 of the press-fit water-cooled head 5 exchanges heat with the GPU chip, thereby controlling the test temperature of the GPU chip. Thus, the temperature of the GPU chip is controlled in a liquid-cooled manner, with high temperature control accuracy and fast response. It can ensure that the performance test process of the GPU chip is carried out in the best and stable temperature environment, improve the accuracy of the test results, reduce the test cycle of a single chip, improve the test efficiency, and reduce the cost.
[0033] Furthermore, for the press-fit water-cooled head 5 as described above, based on the matching structure of the movable guide post 54 and the spring 55, the heat exchange plate 51 can be pressed towards the first connecting plate 52 and has a certain moving stroke, while the spring 55 is compressed to provide a reverse force. Therefore, when the test stage 100 is driven to press towards the press-fit water-cooled head 5, the GPU chip placed on the test stage 100 presses the heat exchange plate 51 towards the first connecting plate 52, and the reverse force provided by the spring 55 presses the heat exchange plate 51 towards the GPU chip. The lower surface of the heat exchange plate 51 can be closely attached to the upper surface of the GPU chip for heat exchange, which can better control the test temperature of the GPU chip. Moreover, since the heat exchange plate 51 and the GPU chip are pressed against each other based on elastic force, it can avoid excessive pressure from affecting the performance test results of the GPU chip or even causing damage to the GPU chip.
[0034] Among them, as Figure 3 shown, the first connecting plate 52 and the second connecting plate 53 are provided with avoidance holes 58, 59 at positions corresponding to the liquid inlet connector 56 and the liquid outlet connector 57. Thus, the circulation pipeline 1 can pass through the avoidance holes 58, 59 and be connected to the liquid inlet connector 56 and the liquid outlet connector 57 below.
[0035] As a preferred solution, in this embodiment, refer to Figure 2 and Figure 4, the heat exchange plate 51 is divided into an intermediate heat exchange portion 51a and an outer heat exchange portion 51b which are isolated from each other. The outer heat exchange portion 51b surrounds the intermediate heat exchange portion 51a. The intermediate heat exchange portion 51a and the outer heat exchange portion 51b are respectively provided with corresponding cooling liquid flow chambers and liquid inlet connectors 56 and liquid outlet connectors 57. Generally, a GPU chip includes a chip body located in the middle and a wiring area located around the chip body. When the GPU chip is working, the heat generation of these two parts is different, and the heat generation of the chip body is relatively high. Therefore, in the embodiment of the utility model, the heat exchange plate 51 is divided into an intermediate heat exchange portion 51a and an outer heat exchange portion 51b which are isolated from each other and independent. The intermediate heat exchange portion 51a is used to exchange heat with the chip body of the GPU chip, and the outer heat exchange portion 51b is used to exchange heat with the wiring area of the GPU chip. This can better control the temperature of the GPU chip, making the temperature of the GPU chip more balanced and stable.
[0036] Further, see Figure 4 A metal heat conductive sheet 511 is provided on the lower surface of the intermediate heat exchange portion 51a (the surface bonded to the GPU chip), and a carbon fiber heat conductive pad 512 is provided on the lower surface of the peripheral heat exchange portion 51b (the surface bonded to the GPU chip), thereby improving the heat exchange efficiency of the heat exchange plate 51.
[0037] As a preferred solution, the water-cooled temperature control system may include M pressed water cooling heads 5, which are connected in parallel to the circulation pipeline 1 through pipeline branches. Thus, in the water-cooled temperature control system, one heat sink 2 and one pump 3 drive the M pressed water cooling heads 5 to realize the circulation of the coolant, and M is an integer of 2 to 4.
[0038] For example Figure 5 In the embodiment, 4 groups of water-cooling temperature control systems can be set, each group of water-cooling temperature control systems includes 2 (i.e., M=2) pressed water cooling heads 5, and 8 GPU chips can be tested in parallel at the same time. Usually, multiple GPU chips are tested at the same time in the same batch, and the test items are the same. The heat generation of each GPU chip is roughly the same and the temperature to be controlled is also the same. Therefore, multiple GPU chips are arrayed on the test platform 100, and each group of water-cooling temperature control systems includes the same number of pressed water cooling heads 5. The temperature control procedure is simpler, the temperature control is more stable, and the whole machine structure is compact, which effectively utilizes the space of the equipment.
[0039] In summary, the device for GPU chip performance testing provided by the embodiment of the utility model controls the temperature of the GPU chip in a liquid cooling manner. The temperature control has high precision and can respond quickly, which can ensure that the performance test process of the GPU chip is carried out in an optimal and stable temperature environment, improve the accuracy of the test results, reduce the test cycle of a single chip, improve the test efficiency, and reduce costs. In addition, based on the high efficiency and high precision temperature control of the pressed water cooling head, the water cooling temperature control system can set multiple pressed water cooling heads to circulate the coolant, thereby simultaneously testing multiple GPU chips in parallel, further improving the test efficiency.
[0040] The above is only a specific implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.
Claims
1. A pressed water cooling head for controlling the temperature of a GPU chip, characterized in that: The pressed water cooling head comprises a first connecting plate, a second connecting plate, a guide column, a spring and a heat exchange plate; wherein, the first connecting plate is used to fix and support the pressed water cooling head, the guide column can be movably passed through the first connecting plate, the second connecting plate is located above the first connecting plate and connected to the first end of the guide column, the heat exchange plate is located below the first connecting plate and connected to the second end of the guide column, the spring is located between the heat exchange plate and the first connecting plate and is sleeved on the guide column; a cooling liquid flow cavity is provided in the heat exchange plate, and a liquid inlet connector and a liquid outlet connector connected to the cooling liquid flow cavity are provided on the upper surface of the heat exchange plate facing the first connecting plate, and the shape of the lower surface of the heat exchange plate is adapted to the surface shape of the GPU chip.
2. The press-fit water cooling head according to claim 1, characterized in that: The heat exchange plate is divided into an intermediate heat exchange portion and a peripheral heat exchange portion which are isolated from each other. The peripheral heat exchange portion surrounds the intermediate heat exchange portion. The intermediate heat exchange portion and the peripheral heat exchange portion are respectively provided with corresponding coolant flow cavities and liquid inlet connectors and liquid outlet connectors; the intermediate heat exchange portion is used for exchanging heat with the chip body of the GPU chip, and the peripheral heat exchange portion is used for exchanging heat with the wiring area of the GPU chip located around the chip body.
3. The press-fit water cooling head according to claim 2, characterized in that: A metal heat conducting sheet is arranged on a surface of the middle heat exchange part facing the chip test slot, and a carbon fiber heat conducting pad is arranged on a surface of the peripheral heat exchange part facing the chip test slot.
4. The press-fit water cooling head according to any one of claims 1 to 3, characterized in that: The first connecting plate and the second connecting plate are provided with avoidance holes at positions corresponding to the liquid inlet connector and the liquid outlet connector.
5. A water-cooling temperature control system, characterized in that: It comprises a circulation pipeline, a heat sink, a pump, a flow meter, a temperature sensor and a pressed water cooling head as described in any one of claims 1 to 4; the circulation pipeline connects the heat sink and the pressed water cooling head and is used for circulating cooling liquid between the heat sink and the pressed water cooling head; the pump and the flow meter are respectively connected to the circulation pipeline, the pump is used for driving the cooling liquid to flow in the circulation pipeline and controlling its flow rate, and the flow meter is used for detecting the flow rate of the cooling liquid; the temperature sensor is connected to the heat exchange plate and is used for detecting the temperature of the heat exchange plate; wherein the pump, the flow meter and the temperature sensor are respectively connected to the electrical signals of a microcontroller chip.
6. The water-cooling temperature control system according to claim 5, characterized in that: The circulation pipeline includes a water pipe and a liquid leakage detection rope covering the water pipe, the liquid leakage detection rope is connected to a liquid leakage detection sensor, and the liquid leakage detection sensor is connected to the microcontroller chip by electrical signals.
7. The water-cooling temperature control system according to claim 5, characterized in that: The heat dissipation box is provided with a heat dissipation fan, a heat sink, a copper water pipe and a liquid storage mechanism.
8. The water cooling temperature control system according to any one of claims 5 to 7, characterized in that: The water-cooling temperature control system includes M pressed water-cooling heads, and the M pressed water-cooling heads are connected to the circulation pipeline in parallel through pipeline branches; in the water-cooling temperature control system, one heat sink and one pump drive the M pressed water-cooling heads to realize the circulation of the coolant; M is an integer of 2 to 4.