High-heat insulation heating pad

Abstract

The utility model relates to the technical field of battery pack heat insulation pads, and provides a high-heat insulation pad which comprises a heat insulation plate, two rubber blocking plates and two outer plates, and heat insulation holes are formed in the heat insulation plate; each glue blocking plate comprises a base plate and a sleeve, the two base plates are fixed to the two sides of the heat insulation plate in a gluing mode respectively, the sleeves are fixedly arranged on the sides, close to the heat insulation plate, of the base plates, the sleeves are arranged in the heat insulation holes, and the peripheral sides of the sleeves abut against the inner walls of the heat insulation holes; the two outer plates are fixedly arranged on the sides, away from the heat insulation plate, of the two base plates in an adhesive mode. According to the heat insulation pad, the base plate and the sleeve are arranged, the sleeve abuts against the inner wall of the heat insulation hole, glue between the heat insulation layer and the outer plate can be prevented from permeating into the heat insulation hole, and therefore the heat resistance performance of the heat insulation pad is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of battery pack heat insulation pads, in particular to a high thermal resistance heat insulation pad. Background Technique

[0002] The heat insulation pad is an important component of the battery pack, generally installed between the battery cells and between the battery cells and the end plate, which plays a role in slowing down the heat transfer efficiency between the battery cells and the end plate and between the battery cells, thereby reducing the internal temperature difference of the battery pack system.

[0003] The utility model with the publication number of CN217114554U discloses a heat insulation pad and a battery pack, including a heat insulation layer and outer plates respectively arranged on both sides of the heat insulation layer. The heat insulation layer has at least one heat insulation plate made of ceramic fiber material, and a communication part is arranged on the heat insulation plate and runs through along its thickness direction, and a heat insulation cavity is formed between the communication part and the two outer plates. By arranging a heat insulation plate between the two outer plates, arranging a communication part on the heat insulation plate, and further forming a heat insulation cavity between the communication part and the two outer plates, the heat insulation pad has a good heat insulation effect and a light weight. By using ceramic fiber material to make the heat insulation plate, the heat insulation effect of the heat insulation pad can be enhanced while the cost of the heat insulation pad is reduced.

[0004] In the above technical solution, in order to improve the thermal resistance performance of the heat insulation pad, a heat insulation plate with a communication part is arranged between the two outer plates. However, the outer plate and the heat insulation plate are connected by an adhesive layer. When assembling and processing the outer plate and the heat insulation plate, the glue will penetrate into the communication part, reducing the thermal resistance performance of the heat insulation pad, resulting in a large temperature difference inside the battery pack and affecting the safe operation of the battery pack. Utility Model Content

[0005] In view of this, the utility model provides a high thermal resistance heat insulation pad, which can avoid glue from penetrating into the heat insulation holes and ensure the thermal resistance performance of the heat insulation pad.

[0006] The technical solution of the utility model is realized as follows: The utility model provides a high thermal resistance heat insulation pad, including a heat insulation plate, two glue blocking plates and two outer plates, wherein,

[0007] Heat insulation holes are formed in the heat insulation plate;

[0008] Each glue blocking plate includes a base plate and a sleeve. The two base plates are respectively fixed on both sides of the heat insulation plate by an adhesive method. A sleeve is fixedly arranged on one side of the base plate close to the heat insulation plate. The sleeve is arranged in the heat insulation hole, and the circumferential side of the sleeve is in contact with the inner wall of the heat insulation hole;

[0009] The two outer plates are respectively fixedly arranged on one side of the two substrates away from the heat insulation plate by means of gluing.

[0010] On the basis of the above technical solution, preferably, a receiving groove is formed on one side of the outer plate close to the heat insulation plate, the substrate is located in the receiving groove, and the outer plate and the heat insulation plate are fixedly connected by means of gluing.

[0011] More preferably, the sleeve penetrates through the substrate, and one end of the sleeve away from the heat insulation plate is spaced from one side of the substrate away from the heat insulation plate.

[0012] More preferably, a chamfer is provided on the outer edge of one end of the sleeve away from the heat insulation plate.

[0013] On the basis of the above technical solution, preferably, multiple circles of heat insulation holes are provided, at least one heat insulation hole is provided in each circle, and a plurality of heat insulation holes in the same circle are arranged in a circumferential array around the center point of the substrate;

[0014] A plurality of the sleeves are provided on each substrate, and the sleeves correspond to the heat insulation holes one by one.

[0015] More preferably, a plurality of glue grooves are respectively formed on both sides of the substrate.

[0016] More preferably, the cross section of the glue groove is annular, and its center coincides with the center point of the substrate.

[0017] More preferably, a circle of heat insulation holes is arranged between two adjacent glue grooves on the same side of the substrate.

[0018] More preferably, the glue groove close to the circumferential side of the substrate penetrates through to the circumferential side of the substrate.

[0019] On the basis of the above technical solution, preferably, the cross section of the heat insulation hole is hexagonal.

[0020] A high thermal resistance heat insulation pad of the present utility model has the following beneficial effects compared with the prior art:

[0021] (1) By providing the substrate and the sleeve, and using the abutment between the sleeve and the inner wall of the heat insulation hole, it is possible to prevent the glue between the heat insulation layer and the outer plate from seeping into the heat insulation hole, thereby ensuring the thermal resistance performance of the heat insulation pad;

[0022] (2) By allowing the sleeve to penetrate through the substrate, the processing material of the glue blocking plate can be saved, and the overall weight of the heat insulation pad can be reduced. By providing the chamfer, the blocking performance of the sleeve to the glue can be improved;

[0023] (3) By setting multiple glue grooves, the contact area between the glue and the glue baffle can be increased, thereby enhancing the fixing firmness of each component in this heat insulation pad. Brief Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is an exploded view of a high thermal resistance heat insulation pad of the present invention;

[0026] Figure 2 It is a cross-sectional view of the heat insulation holes in a high thermal resistance heat insulation pad of the present invention;

[0027] Figure 3 It is a three-dimensional view of the glue baffle in a high thermal resistance heat insulation pad of the present invention;

[0028] Figure 4 It is a cross-sectional view of the sleeve in a high thermal resistance heat insulation pad of the present invention.

[0029] Wherein: 1, heat insulation board; 101, heat insulation holes; 2, glue baffle; 21, base plate; 22, sleeve; 201, chamfer; 202, glue groove; 3, outer plate; 301, receiving groove. Detailed Embodiment

[0030] The following will clearly and completely describe the technical solutions in the present invention in combination with the specific embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0031] As Figures 1-4 shown, a high thermal resistance heat insulation pad of the present invention includes a heat insulation board 1, two glue baffles 2 and two outer plates 3, which are used to be installed between two adjacent battery cells in a battery pack or between a battery cell and an end plate. It can not only reduce the heat transfer efficiency between two adjacent battery cells or between a battery cell and an end plate, but also reduce the risk of heat spread when a battery cell is out of control thermally.

[0032] Among them, the heat insulation board 1 is used to improve the heat resistance performance of the heat insulation pad. Heat insulation holes 101 are provided in the heat insulation board 1, and air is filled in the heat insulation holes 101. The heat insulation board 1 is usually made of PU foam, and the thermal conductivity of air is about one-tenth of that of PU foam. Therefore, the heat resistance performance of the heat insulation board 1 provided with the heat insulation holes 101 is stronger than that of the ordinary heat insulation board 1.

[0033] The glue blocking board 2 is used to block the glue and prevent the glue from seeping into the heat insulation holes 101. The glue blocking board 2 includes a substrate 21 and a sleeve 22. The two substrates 21 are respectively fixed on both sides of the heat insulation board 1 by an adhesive method. A sleeve 22 is fixedly arranged on the side of the substrate 21 close to the heat insulation board 1. The sleeve 22 is arranged in the heat insulation hole 101, and the circumferential side of the sleeve 22 is in contact with the inner wall of the heat insulation hole 101; the thermal conductivity of the glue is higher than that of air, and the glue is a fluid. If the glue flows into the heat insulation hole 101, it will improve the thermal conductivity of the heat insulation board 1 and affect the heat resistance performance of the heat insulation pad; when gluing is performed on the surface of the substrate 21 or the heat insulation board 1, the contact between the sleeve 22 and the heat insulation hole 101 can isolate the heat insulation hole 101 from the side surfaces of the substrate 21 and the heat insulation board 1, preventing the glue from flowing into the heat insulation hole 101, thereby ensuring the heat resistance performance of the heat insulation pad.

[0034] The outer board 3 is used to be in contact with the battery cell or the end plate. The two outer boards 3 are respectively fixedly arranged on the sides of the two substrates 21 away from the heat insulation board 1 by an adhesive method, sandwiching the heat insulation board 1 between the two outer boards 3; among them, the outer board 3 is preferably made of PU foam.

[0035] As Figure 1 shown, a receiving groove 301 is provided on the side of the outer board 3 close to the heat insulation board 1. The substrate 21 is located in the receiving groove 301, and the outer board 3 and the heat insulation board 1 are fixedly connected by an adhesive method, so as to reduce the overall thickness of the heat insulation pad.

[0036] As Figure 2 shown, there can be two connection relationships between the sleeve 22 and the substrate 21 in this application. The first is like the upper substrate 21 and the sleeve 22 in Figure 2 . The substrate 21 is a circular plate-like structure. The sleeve 22 is fixedly arranged on the side of the substrate 21 close to the heat insulation board 1. It has excellent glue blocking performance and better fit with the outer board 3; the other is like the lower substrate 21 and the sleeve 22 in Figure 2 . The sleeve 22 is provided with a perforation, and the sleeve 22 is fixedly arranged in this perforation, that is, the sleeve 22 penetrates through the substrate 21, and one end of the sleeve 22 away from the heat insulation board 1 is spaced from the side of the substrate 21 away from the heat insulation board 1. It can save the processing material of the glue blocking board 2 and reduce the overall weight of the heat insulation pad.

[0037] As Figure 2 and Figure 4As shown, a chamfer 201 is provided on the outer edge of the sleeve 22 at the end away from the heat insulation plate 1, that is, the end of the sleeve 22 away from the heat insulation plate 1 is in a pointed shape, which can better block the glue on the surface of the outer plate 3 outside the sleeve 22.

[0038] As Figure 3 shown, multiple circles of heat insulation holes 101 are provided, with at least one in each circle, and multiple heat insulation holes 101 in the same circle are arranged in a circumferential array around the center point of the substrate 21; correspondingly, multiple sleeves 22 are provided on each substrate 21, so that the sleeves 22 and the heat insulation holes 101 are in one-to-one correspondence, thereby improving the heat resistance performance of the heat insulation plate 1 on the premise of ensuring the structural strength of the heat insulation plate 1.

[0039] As Figure 2 and Figure 3 shown, a plurality of glue grooves 202 are respectively formed on both sides of the substrate 21. When assembling the glue blocking plate 2 and the outer plate 3, the excess glue between the substrate 21 and the heat insulation plate 1 or between the substrate 21 and the outer plate 3 can be squeezed into the glue grooves 202, improving the fitting degree of the glue blocking plate 2 with the heat insulation plate 1 and the outer plate 3. At the same time, the setting of the glue grooves 202 also increases the contact area between the glue and the substrate 21, thereby improving the fixing firmness of the substrate 21.

[0040] As Figure 3 shown, the cross-section of the glue groove 202 is in an annular shape, and its center coincides with the center point of the substrate 21, so that the glue is evenly squeezed into the glue groove 202; at the same time, a circle of heat insulation holes 101 is provided between two adjacent glue grooves 202 on the same side of the substrate 21, that is, multiple circles of heat insulation holes 101 and multiple glue grooves 202 are arranged alternately, so that the two can cooperate well and the glue can be evenly squeezed into the glue groove 202.

[0041] As Figure 3 shown, preferably, the glue groove 202 near the circumferential side of the substrate 21 penetrates to the circumferential side of the substrate 21, so that the excess glue at the outer edge position of the side surface of the substrate 21 can flow to the circumferential side of the substrate 21 for fixing.

[0042] Preferably, the cross-section of the heat insulation hole 101 is in a hexagonal shape, so as to prevent rotation between the sleeve 22 and the heat insulation hole 101, and to ensure the assembly quality and assembly aesthetics of the heat insulation pad.

[0043] The assembly method of a high heat resistance heat insulation pad of the present utility model is as follows:

[0044] First, place the heat insulation plate 1 on the assembly station. Then, take out one of the glue blocking plates 2, apply glue to the lower side of the substrate 21 in this glue blocking plate 2, press and fix this glue blocking plate 2 against the upper side of the heat insulation plate 1, and insert the sleeve 22 into the heat insulation hole 101 at the corresponding position. Next, apply glue to the upper side of this substrate 21 and the edge of the upper side of the heat insulation plate 1, and press and fix one of the outer plates 3 against the upper sides of the heat insulation plate 1 and the glue blocking plate 2. Finally, turn over the assembled heat insulation plate 1, glue blocking plate 2, and outer plate 3, and repeat the above steps to sequentially bond and fix the other glue blocking plate 2 and the other outer plate 3 on the heat insulation plate 1.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high heat barrier thermal insulation pad, characterized in that: It comprises a heat insulation board (1), two rubber baffle boards (2) and two outer boards (3), wherein: The heat insulation board (1) is provided with a heat insulation hole (101); The rubber baffle (2) comprises a base plate (21) and a sleeve (22); the two base plates (21) are respectively fixed to two sides of the heat insulation plate (1) by gluing; the sleeve (22) is fixedly arranged on one side of the base plate (21) close to the heat insulation plate (1); the sleeve (22) is arranged in the heat insulation hole (101), and the peripheral side of the sleeve (22) is in contact with the inner wall of the heat insulation hole (101); The two outer panels (3) are respectively fixedly arranged on the side of the two base panels (21) away from the heat insulation panel (1) by gluing.

2. A high heat barrier thermal insulation pad as claimed in claim 1, characterized in that: A receiving groove (301) is provided on a side of the outer plate (3) close to the heat insulation plate (1), the base plate (21) is located in the receiving groove (301), and the outer plate (3) and the heat insulation plate (1) are fixedly connected by gluing.

3. A high heat barrier thermal insulation pad as claimed in claim 2, characterized in that: The sleeve (22) passes through the base plate (21), and an end of the sleeve (22) away from the heat insulation board (1) is spaced apart from a side of the base plate (21) away from the heat insulation board (1).

4. A high heat barrier thermal insulation pad as claimed in claim 3, characterized in that: The outer edge of the sleeve (22) at one end away from the heat insulation board (1) is provided with a chamfer (201).

5. The high heat barrier thermal insulation pad according to claim 1, characterized in that: The heat-insulating holes (101) are arranged in a plurality of circles, each circle is provided with at least one heat-insulating hole, and the plurality of heat-insulating holes (101) in the same circle are arranged in a circular array around the center point of the substrate (21); A plurality of the sleeves (22) are provided on each of the substrates (21), and the sleeves (22) correspond one-to-one to the heat insulation holes (101).

6. A high heat barrier thermal insulation pad as claimed in claim 5, characterized in that: A plurality of glue grooves (202) are respectively formed on two sides of the base plate (21).

7. A high heat barrier thermal insulation pad as claimed in claim 6, characterized in that: The cross section of the glue groove (202) is in the shape of a ring, and the center of the circle coincides with the center point of the substrate (21).

8. A high heat barrier thermal insulation pad as claimed in claim 7, characterized in that: A circle of heat insulation holes (101) is provided between two adjacent glue grooves (202) located on the same side of the substrate (21).

9. A high heat barrier thermal insulation pad as claimed in claim 8, characterized in that: The glue groove (202) close to the peripheral side of the substrate (21) penetrates the peripheral side of the substrate (21).

10. The high heat barrier thermal insulation pad according to claim 1, characterized in that: The cross section of the heat insulation hole (101) is hexagonal.

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