Light-emitting module and display device

Abstract

The utility model provides a light-emitting module and a display device, and belongs to the technical field of display. The light-emitting module comprises a light-emitting substrate and a driving assembly, the light-emitting substrate is provided with a plurality of first bonding pads, the driving assembly is provided with a plurality of second bonding pads, and the plurality of first bonding pads and the plurality of second bonding pads are bound and connected in a one-to-one correspondence mode through conductive adhesive layers. The width of the first bonding pad in the first direction is increased, and the orthographic projection of the second bonding pad on the light-emitting substrate is located in the orthographic projection area of the first bonding pad on the light-emitting substrate, so that the area of the overlapping area of the orthographic projection of the first bonding pad and the orthographic projection of the second bonding pad on the light-emitting substrate can be increased; the contact area between the conductive particles in the conductive adhesive layer and the first bonding pad and the contact area between the conductive particles in the conductive adhesive layer and the second bonding pad are increased, so that the bearing upper limit of conduction current between the first bonding pad and the second bonding pad can be increased, and stable conduction of the first bonding pad and the second bonding pad can be realized.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a light-emitting module and a display device. Background Art

[0002] The technology of Mini Light Emitting Diode (Mini LED) integrates a tiny-sized LED array on a chip to form a light-emitting unit, realizing the thin-film, miniaturization, and matrixization of LEDs. A light-emitting module with MiniLED light-emitting chips can directly be used as a display panel for displaying images, or as a backlight panel to provide light sources for a liquid crystal display panel. Due to its advantages such as zoned dimming, low power consumption, and thin form factor, Mini LED light-emitting modules have gradually become a research hotspot in the field of display technologies.

[0003] A light-emitting module generally includes a light-emitting substrate and a driving component. The light-emitting substrate has a plurality of light-emitting units arranged in an array and a plurality of first pads. The plurality of first pads are electrically connected to each column of light-emitting units through signal lines. The driving component has a plurality of second pads, and the plurality of second pads are respectively and correspondingly bonded and connected to the plurality of first pads through a conductive adhesive layer. In this way, the driving component can control the light-emitting units through the plurality of second pads and the plurality of first pads, thereby realizing the light emission and display of the light-emitting substrate.

[0004] In the related art, the currents of a column of light-emitting units are superimposed and then electrically connected to at least one first pad. Since there are many light-emitting units, the superimposed current is large, exceeding the upper limit of the conduction current that can be borne between the first pad and the second pad, resulting in unstable conduction between the first pad and the second pad and prone to abnormal display problems. Summary of the Utility Model

[0005] Embodiments of the present application provide a light-emitting module and a display device. The problem of unstable conduction between the first pad and the second pad in the related art can be solved, and the technical solutions are as follows:

[0006] On the one hand, a light-emitting module is provided, including: a light-emitting substrate and a driving component;

[0007] The light-emitting substrate has a plurality of first pads arranged at intervals along a first direction, the driving component has a plurality of second pads arranged at intervals along the first direction, the plurality of second pads correspond to the plurality of first pads one by one, and are connected through a conductive adhesive layer, and a projection of the first pad on the light-emitting substrate corresponding to the second pad has an overlapping area;

[0008] In the first direction, the width of the first pad is greater than the width of the second pad, and the width of the second pad is equal to the width of the overlapping area.

[0009] Optionally, the width of the first pad in the first direction is: the sum of the width of the overlapping region in the first direction and twice the maximum offset distance of the overlapping region in the first direction.

[0010] Optionally, the maximum offset distance of the overlapping region in the first direction is:

[0011]

[0012] wherein, X3 is the alignment accuracy of the first pad and the second pad in the first direction, X4 is the manufacturing accuracy of the width of the second pad in the first direction, and X5 is the accuracy of the center distance between the second pads at both ends among the plurality of second pads.

[0013] Optionally, in the first direction, the distance between two adjacent first pads is less than the width of the first pad.

[0014] Optionally, in the first direction, the distance between the two adjacent first pads is greater than the minimum pad gap.

[0015] Optionally, the length of the first pad in the second direction is: the sum of the length of the overlapping region in the second direction and the maximum offset distance of the overlapping region in the second direction;

[0016] wherein, the second direction intersects with the first direction, and both the second direction and the first direction are parallel to the plane where the light-emitting substrate is located.

[0017] Optionally, the driving component includes a flexible circuit board, and the maximum offset distance of the overlapping region in the second direction is:

[0018]

[0019] wherein, Y3 is the alignment accuracy of the first pad and the second pad in the second direction, and Y4 is the cutting accuracy of the flexible circuit board in the second direction.

[0020] Optionally, the minimum area S of the overlapping region satisfies the following relationship:

[0021] S = I L / σI0

[0022] wherein, the I LFor the conduction current between the first pad and the corresponding second pad, σ is the capture rate of the conductive particles of the conductive adhesive layer, and I0 is the maximum current that can pass through a single conductive particle of the conductive adhesive layer.

[0023] Optionally, the conductive adhesive layer is an anisotropic conductive film ACF.

[0024] Optionally, in the first direction, the width of the first pad is between 15 μm and 400 μm, the width of the second pad is between 10 μm and 300 μm, and the distance between two adjacent first pads is greater than 5 μm.

[0025] Optionally, the light-emitting substrate is a backlight board or a display panel.

[0026] Optionally, the light-emitting substrate includes: a driving backplane, and a plurality of light-emitting units arranged in an array on one side of the driving backplane;

[0027] Wherein, the driving backplane has the plurality of first pads.

[0028] On the other hand, a display device is provided, including: the light-emitting module described in any one of the above.

[0029] The beneficial effects brought by the technical solution provided by the embodiments of the present application at least include:

[0030] Since the width of the first pad in the first direction increases, and the orthographic projection of the second pad on the light-emitting substrate is located within the orthographic projection area of the first pad on the light-emitting substrate, the area of the overlapping region of the orthographic projections of the first pad and the second pad on the light-emitting substrate can be ensured to increase, so that the contact area between the conductive particles in the conductive adhesive layer and the first pad and the second pad increases. In this way, the upper limit of the conduction current that can be borne between the first pad and the second pad can be increased, enabling the first pad and the second pad to achieve stable conduction. In addition, since there is no need to consider the distance between the second pad and the adjacent first pad in the first direction, the distance between two adjacent first pads can be reduced to ensure the normal arrangement of the first pads on the light-emitting substrate. At the same time, no matter how the second pad is offset in the second direction, the area of the overlapping region of the orthographic projections of the second pad and the first pad on the light-emitting substrate meets the required area of the overlapping region, thereby avoiding the adverse phenomenon that the current after superposition exceeds the upper limit of the conduction current that can be borne between the first pad and the second pad due to the small area of the overlapping region, resulting in abnormal display. Description of the Drawings

[0031] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0032] Figure 1 is a schematic diagram of the backlight driving principle of a backlight panel provided by the related art;

[0033] Figure 2 is a cross-sectional schematic diagram of a bonding connection provided by the related art;

[0034] Figure 3 is a cross-sectional schematic diagram of an offset in a bonding connection provided by the related art;

[0035] Figure 4 is a cross-sectional schematic diagram of a bonding connection provided by an embodiment of the present application;

[0036] Figure 5 is a schematic diagram of an overlapping area provided by an embodiment of the present application;

[0037] Figure 6 is another cross-sectional schematic diagram of a bonding connection provided by an embodiment of the present application. Detailed implementation manners

[0038] To make the objectives, technical solutions, and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the accompanying drawings.

[0039] In the related art, a light-emitting module with Mini LED light-emitting chips can be directly used as a display panel for displaying images, or as a backlight panel to provide light sources for a liquid crystal display panel. By using Mini LED backlight technology, zonal control of the lamp beads can be achieved, usually divided into 1 lamp 1 drive, 4 lamps 1 drive, 6 lamps 1 drive, and 9 lamps 1 drive.

[0040] An embodiment of the present application takes a backlight panel in the related art as an example for illustration. Please refer to Figure 1 and Figure 2 , the backlight panel generally includes a light-emitting substrate 10 and a driving component 20. The driving component 20 can include a flexible circuit board or a separate driving chip. The light-emitting substrate 10 and the driving component 20 can be bonded and connected through a conductive adhesive layer 30.

[0041] As Figure 1As shown in the figure, the light-emitting substrate 10 may include a plurality of light-emitting units 12 arranged in an array and a plurality of first pads 11. Each light-emitting unit 12 may include a light-emitting region 12a and a driving region 12b. The signals of the driving component 20 are transmitted to the light-emitting substrate 10 through the first pads 11. Among them, the VLED signal (a high-level signal) passes through the first pad 11 and then accesses the anode of the light-emitting region 12a of each light-emitting unit 12 through the via 13 to provide voltage for the light-emitting region. The cathode of the light-emitting region 12a is connected to the OUT (output) pin of the driving region 12b of the present light-emitting unit 12. The square wave signal output by the OUT pin determines the output current size, thereby controlling the brightness and darkness of the light-emitting region 12a. The OUT pin of the driving region 12b is simultaneously connected to the DI pin (a pin for inputting an address) of the driving region 12b of the next light-emitting unit 12 to transmit the address. Among the light-emitting units 12 in the even columns close to the first pad 11, the OUT pin of the driving region 12b may be connected to the cathode of the light-emitting region 12a, and the OUT pin may also be connected to the FB (Feedback) signal line, and the output voltage can be stabilized through feedback. Each light-emitting unit 12 is connected to the GND (Ground) signal line. The current of a column of light-emitting units 12 is superimposed through the GND signal line, and the GND signal line is electrically connected to at least one first pad 11.

[0042] There are a plurality of second pads 21 on the driving component 20. The plurality of second pads 21 are electrically connected to the plurality of first pads 11 in one-to-one correspondence through the conductive adhesive layer 30. In this way, the driving component 20 can control the light-emitting units 12 through the electrically connected plurality of second pads 21 and the plurality of first pads 11, thereby realizing the light emission and display of the light-emitting substrate 10.

[0043] As Figure 2 shown, the second pad 21 and the first pad 11 may be electrically connected through the conductive particles F in the conductive adhesive layer 30. The more the number of conductive particles F, the larger the contact area between the conductive particles F and the first pad 11 and the second pad 21, the smaller the conduction impedance between the first pad 11 and the second pad 21, and the larger the conduction current that can be tolerated. Since there are many light-emitting units 12, the current after superimposing a column of light-emitting units 12 is large, exceeding the upper limit of the conduction current that can be tolerated between the first pad 11 and the second pad 21, the conductive particles F are deformed, and the conduction impedance between the first pad 11 and the second pad 21 increases, resulting in an increase in heat and even burning of the pads, so that the first pad 11 and the second pad 21 cannot achieve stable conduction, and it is easy to appear abnormal display.

[0044] The embodiment of the present application provides a light-emitting module, which can ensure stable conduction between the first pad and the second pad.

[0045] As Figure 4As shown in the figure, the light-emitting module includes a light-emitting substrate 10 and a driving component 20. The light-emitting substrate 10 and the driving component 20 can be bonded and connected through a conductive adhesive layer 30. The light-emitting substrate 10 has a plurality of first pads 11 arranged at intervals in a first direction, and the driving component 20 has a plurality of second pads 21 arranged at intervals in the first direction. The plurality of second pads 21 correspond to the plurality of first pads 11 one by one and are electrically connected through conductive particles F in the conductive adhesive layer 30. In this way, the driving component 20 can control the light emission and display of the light-emitting substrate 10 through the electrically connected second pads 21 and first pads 11. Among them, the conductive adhesive layer 30 can preferably be an anisotropic conductive film (ACF).

[0046] As Figure 5 shown, the orthographic projection of the first pad 11 and the corresponding second pad 21 on the light-emitting substrate 10 has an overlapping area. The area of this overlapping area can be a preset value or a value obtained through calculation. X is the width of the overlapping area in the first direction, Y is the length of the overlapping area in the second direction, and the product of X and Y is the area of this overlapping area. In the figure, X0 is the width of the first pad in the first direction, Y0 is the length of the first pad in the second direction, X1 is the distance between two adjacent first pads in the first direction, and X2 is the distance between the second pad and the adjacent first pad in the first direction. Among them, the first direction is the width direction of the pads, and the second direction is the length direction of the pads. The second direction intersects with the first direction, which can include the second direction being orthogonal to the first direction or the second direction being obliquely intersecting with the first direction. In the embodiments of the present application, preferably, the second direction is orthogonal to the first direction, and both the second direction and the first direction are parallel to the plane where the light-emitting substrate 10 is located.

[0047] In the related art, the width of the first pad 11 in the first direction is equal to the width of the second pad 21 in the first direction. When the second pad 21 and the first pad 11 are bonded and connected one by one, the second pad 21 may shift in the first direction relative to the first pad 11, and the second pad 21 may exceed the boundary of the first pad 11, resulting in a reduction in the area of the overlapping area. To ensure stable conduction between the first pad 11 and the second pad 21, it is usually necessary to increase the area of the overlapping area of the orthographic projections of the first pad 11 and the second pad 21 on the light-emitting substrate 10.

[0048] In the embodiments of the present application, please refer to Figure 4, in the first direction, the width of the first pad 11 is greater than the width of the second pad 21, and the width of the second pad 21 is equal to the width of the overlapping region. That is, the orthographic projection of the second pad 21 on the light-emitting substrate 10 is located within the orthographic projection region of the first pad 11 on the light-emitting substrate 10. It should be noted that the width of the second pad 21 in the embodiments of the present application being equal to the width of the overlapping region means that the width of the second pad 21 and the width of the overlapping region are approximately equal. That is, the actual width of the second pad 21 and the actual width of the overlapping region are exactly equal. Of course, the actual width of the second pad 21 may also be slightly greater than the actual width of the overlapping region. For example, the percentage range by which the actual width of the second pad 21 is greater than the actual width of the overlapping region is 0 to 5%. In this way, while increasing the width of the first pad 11 in the first direction, it can be ensured that the second pad 21 does not exceed the boundary of the first pad 11 in the first direction, thereby ensuring an increase in the area of the overlapping region, that is, an increase in the contact area between the conductive particles F in the conductive adhesive layer and the first pad 11 and the second pad 21, thereby increasing the upper limit of the conduction current that can be borne between the first pad 11 and the second pad 21, enabling stable conduction between the first pad 11 and the second pad 21.

[0049] In summary, for the light-emitting module provided by the embodiments of the present application, since the width of the first pad in the first direction is increased, and the orthographic projection of the second pad on the light-emitting substrate is located within the orthographic projection region of the first pad on the light-emitting substrate, it can be ensured that the area of the overlapping region of the orthographic projections of the first pad and the second pad on the light-emitting substrate is increased, then the contact area between the conductive particles in the conductive adhesive layer and the first pad and the second pad is increased, which can increase the upper limit of the conduction current that can be borne between the first pad and the second pad, enabling stable conduction between the first pad and the second pad. Thus, it is possible to avoid the adverse phenomenon of abnormal display easily occurring due to the area of the overlapping region being small, resulting in the current after superposition exceeding the upper limit of the conduction current that can be borne between the first pad and the second pad.

[0050] Due to the alignment accuracy when the second pad 21 is bonded to the first pad 11 and the manufacturing accuracy of the pads, the second pad 21 may shift in the first direction relative to the first pad 11, resulting in a shift of the overlapping region. Therefore, it is necessary to ensure that the second pad 21 never exceeds the boundary of the first pad 11 in the first direction to ensure the area size of the overlapping region. During the process of manufacturing the pads and aligning the pads, it is impossible to ensure the specific shift distance of the overlapping region in the first direction. Therefore, it is necessary to determine the width X0 of the first pad 11 in the first direction according to the maximum shift distance d of the overlapping region in the first direction.

[0051] In the embodiments of the present application, please refer to Figure 6, the width X0 of the first pad 11 in the first direction is: the sum of the width X of the overlapping region in the first direction and twice the maximum offset distance d of the overlapping region in the first direction, while the width X6 of the second pad 21 in the first direction is the width X of the overlapping region in the first direction. In this way, in the first direction, no matter how the second pad 21 is offset, the second pad 21 will not exceed the boundary of the first pad 11, thus effectively ensuring the area of the overlapping region.

[0052] The maximum offset distance d of the overlapping region in the first direction is:

[0053]

[0054] Among them, X3 is the alignment accuracy of the first pad 11 and the second pad 21 in the first direction. X4 is the manufacturing accuracy of the width of the second pad 21 in the first direction, and X5 is the accuracy of the center distance of the second pads 21 at both ends among multiple second pads 21. Here, for the manufacturing accuracy X4 of the width of the second pad 21 in the first direction, since in the process of manufacturing the second pad 21, X4 can represent the manufacturing accuracy of the relative two sides of the second pad 21 in the first direction, and during the alignment process of the second pad 21 and the first pad 11, the second pad 21 will only offset towards any one side relative to the first pad 11 in the first direction. Therefore, when considering the maximum offset distance d of the overlapping region in the first direction, half of the manufacturing accuracy X4 of the width of the second pad 21 in the first direction can be taken. Similarly, when considering the maximum offset distance d of the overlapping region in the first direction, half of the accuracy X5 of the center distance of the second pads 21 at both ends among multiple second pads 21 can also be taken.

[0055] Therefore, the width X0 of the first pad 11 in the first direction is:

[0056]

[0057] The width X6 of the second pad 21 in the first direction is:

[0058] X6 = X

[0059] In the related art, in the first direction, the distance X1 between two adjacent first pads 11 is equal to the width X0 of the first pad 11. In order to increase the area of the overlapping region of the positive projections of the first pad 11 and the second pad 21 on the light-emitting substrate 10, after increasing the width X0 of the first pad 11 in the first direction, the distance X1 between two adjacent first pads 11 in the first direction also increases accordingly. Since the width of the light-emitting substrate 10 in the first direction is fixed, when the width X0 of the first pad 11 in the first direction is increased, there may be a problem that the first pads 11 cannot be normally arranged on the light-emitting substrate 10. For this reason, please refer toFigure 6 In the first direction, the distance X1 between two adjacent first pads 11 can be appropriately reduced so as to be less than the width X0 of the first pad 11. In this way, the distance X1 between two adjacent first pads 11 can be reduced to ensure the normal arrangement of the first pads 11 on the light-emitting substrate 10.

[0060] It should be noted that when using the conductive adhesive layer 30 for electrical connection between the first pad 11 and the second pad 21, when the distance between two pads is less than the minimum pad gap e, a short circuit may occur between the two pads. This minimum pad gap e is related to the type of the conductive adhesive layer 30. The adhesive materials and particle types of different types of conductive adhesive layers 30 are different, and the required minimum pad gap e is also different. Preferably, the minimum gap e can be taken as 5 μm.

[0061] As Figure 3 shown, in the related art, the width X6 of the second pad 21 in the first direction is equal to the width X0 of the first pad 11 in the first direction. When the second pad 21 is offset in the first direction, it is easy to exceed the boundary of the first pad 11. At this time, to ensure that no short circuit occurs between the second pad 21 and the adjacent first pad 11, the distance X2 between the second pad 21 and the adjacent first pad 11 in the first direction needs to be greater than the minimum pad gap e, and the distance X1 between two adjacent first pads 11 needs to be greater than the sum of the maximum offset distance d in the first direction of the overlapping area and the minimum pad gap e.

[0062] In the embodiment of the present application, since in the first direction, the second pad 21 does not exceed the boundary of the first pad 11, the distance X2 between the second pad 21 and the adjacent first pad 11 in the first direction does not need to be considered. Therefore, the distance X1 between two adjacent first pads 11 can be reduced. It is only required that the distance X1 between two adjacent first pads 11 is greater than the minimum pad gap e, and no short circuit phenomenon will occur between the pads. In this way, the distance between two adjacent first pads 11 can be effectively reduced, so as to better ensure the normal arrangement of the first pads 11 on the light-emitting substrate 10, and enable stable conduction between the first pad 11 and the second pad 21.

[0063] Due to possible precision problems in pad manufacturing and pad alignment processes, the second pad 21 may also be offset relative to the first pad 11 in the second direction. Therefore, it is necessary to determine the length Y0 of the first pad 11 in the second direction according to the length of the overlapping area corresponding to the required area of the overlapping area in the second direction, as well as the precision of pad manufacturing and the precision of pad alignment.

[0064] Optionally, the length Y0 of the first pad in the second direction can be: the sum of the length Y of the overlapping region in the second direction and the maximum offset distance of the overlapping region in the second direction. In this way, no matter how the second pad 21 is offset in the second direction, the area of the overlapping region of the orthographic projection of the second pad 21 and the first pad 11 on the light-emitting substrate 10 meets the required area of the overlapping region. This avoids the phenomenon that the current after superposition exceeds the upper limit of the conduction current between the first pad and the second pad due to the small area of the overlapping region, which is likely to cause abnormal display.

[0065] The maximum offset distance of the overlapping region in the second direction is:

[0066]

[0067] where Y3 is the alignment accuracy of the first pad 11 and the second pad 21 in the second direction. The driving component 20 can include a flexible circuit board or a driving chip. When the driving component 20 includes a flexible circuit board, Y4 is the cutting accuracy of the flexible circuit board in the second direction.

[0068] Therefore, the length Y0 of the first pad 11 in the second direction is:

[0069]

[0070] To ensure stable conduction between the first pad 11 and the second pad 21, it is necessary to ensure the area S0 of the overlapping region of the orthographic projection of the first pad 11 and the second pad 21 on the light-emitting substrate 10. The minimum area S of the overlapping region can be calculated according to the conduction current between the first pad 11 and the second pad 21 and the type of the conductive adhesive layer 30.

[0071] Exemplarily, there are n rows of light-emitting units 12 arranged in an array. The current of one light-emitting unit 12 is I, then the current after superposition of a column of light-emitting units 12 is nI. Assuming that the current after superposition is electrically connected to a first pads 11 through the GND line, the conduction current I L between one first pad 11 and the corresponding second pad 21 is:

[0072] I L = nI / a

[0073] According to the type of the conductive adhesive layer 30, the capture rate of the conductive particles F of the conductive adhesive layer 30 is σ, and the number of conductive particles F captured in the overlapping region is σS0. Then the current passing through one conductive particle F is I L / σS0, and this current should be less than the maximum current I0 that can pass through a single conductive particle F of the conductive adhesive layer 30. Then this current satisfies the following relationship:

[0074] I L / σS0 < I0

[0075] After transforming the formula, it can be obtained that the area S0 of the overlapping region satisfies:

[0076] S0 > I L / σI0

[0077] Then the minimum area S of the overlapping region is:

[0078] S = I L / σI0

[0079] The area S0 of the overlapping region is the product of the width X in the first direction and the length Y in the second direction of the overlapping region. Then XY satisfies:

[0080] XY > S

[0081] When the area of the overlapping region is greater than the minimum area S, it can effectively ensure the stable conduction between the first pad 11 and the second pad 21.

[0082] According to different application scenarios, in the first direction, the width X0 of the first pad 11 is usually between 15 μm and 400 μm, the width X6 of the second pad 21 is usually between 10 μm and 300 μm, and the distance X1 between two adjacent first pads 11 is usually greater than 5 μm.

[0083] Optionally, the light-emitting substrate 10 can be a backlight board or a display panel. When the light-emitting substrate 10 is a backlight board, the driving component 20 can control the backlight board to emit light through the electrically connected second pad 21 and the first pad 11, providing a backlight source for the liquid crystal display panel. When the light-emitting substrate 10 is a display panel, the driving component 20 can also control the display panel to display images through the electrically connected second pad 21 and the first pad 11.

[0084] The light-emitting substrate 10 generally includes: a driving backplane, and a plurality of light-emitting units 12 arranged in an array on one side of the driving backplane. Among them, the driving backplane has a plurality of first pads 11, and the plurality of first pads 11 are electrically connected to the light-emitting units 12 through signal lines. The driving backplane can be divided into a display area and a non-display area. The non-display area can include a bonding area. The plurality of light-emitting units 12 are located in the display area, and the plurality of first pads 11 are located in the bonding area. The light-emitting unit 12 can include a light-emitting area 12a and a driving area 12b. The driving area 12b in each light-emitting unit 12 can independently control the light-emitting area 12a in this light-emitting unit 12, thereby realizing the zonal control of the light-emitting unit 12. The driving area 12b can also be outside the light-emitting unit 12. The driving area 12b can be located outside the driving backplane and is electrically connected to the light-emitting area 12a in the light-emitting unit 12 through a signal line.

[0085] In summary, for the light-emitting module provided in the embodiment of the present application, since the width of the first pad in the first direction is increased, and the orthographic projection of the second pad on the light-emitting substrate is located within the orthographic projection area of the first pad on the light-emitting substrate, the area of the overlapping region of the orthographic projections of the first pad and the second pad on the light-emitting substrate can be ensured to increase. Then, the contact area between the conductive particles in the conductive adhesive layer and the first pad and the second pad increases, which can increase the upper limit of the conduction current that can be borne between the first pad and the second pad, enabling the first pad and the second pad to achieve stable conduction. In addition, since there is no need to consider the distance between the second pad and the adjacent first pad in the first direction, the distance between two adjacent first pads can be reduced to ensure the normal arrangement of the first pads on the light-emitting substrate. At the same time, regardless of how the second pad is offset in the second direction, the area of the overlapping region of the orthographic projections of the second pad and the first pad on the light-emitting substrate meets the required area of the overlapping region, thus avoiding the adverse phenomenon of abnormal display easily occurring due to the small area of the overlapping region, resulting in the current after superposition exceeding the upper limit of the conduction current that can be borne between the first pad and the second pad.

[0086] The embodiment of the present application also provides a display device. The display device can be: any product or component with a display function such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc. The display device may include: any one of the above-mentioned light-emitting modules, and the light-emitting module includes a light-emitting substrate 10 and a driving component 20. The light-emitting substrate 10 can be a backlight board or a display panel, and the driving component 20 can include a flexible circuit board or a separate driving chip. A plurality of first pads 11 are provided on the light-emitting substrate 10, and a plurality of second pads 21 are provided on the driving component 20. The plurality of first pads 11 and the plurality of second pads 21 can be connected in a one-to-one correspondence by a conductive adhesive layer 30.

[0087] As described above, when the width X0 of the first pad 11 in the first direction is equal to the width X6 of the second pad 21 in the first direction, there will be a problem that the conduction current between the first pad 11 and the second pad 21 is too large and stable conduction cannot be achieved.

[0088] In the case of a known conduction current, by selecting a suitable conductive adhesive layer 30, the first pad 11 and the second pad 21 that can achieve stable conduction can be designed.

[0089] Set the conduction current between the first pad 11 and the corresponding second pad 21 to be I L , according to the model of the conductive adhesive layer 30, the capture rate of the conductive particles F in the conductive adhesive layer 30 is σ. Then, the number of conductive particles F captured in the overlapping region with an area of S0 is σS0, and the current passed by one conductive particle F is I L / σS0, this current should be less than the maximum current I0 that a single conductive particle F of the conductive adhesive layer 30 can pass through, so this current satisfies the following relationship:

[0090] I L / σS0 < I0

[0091] After transforming the formula, it can be obtained that the area S0 of the overlapping region satisfies:

[0092] S0 > I L / σI0

[0093] Then the minimum area S of the overlapping region is:

[0094] S = I L / σI0

[0095] The width X0 of the first pad 11 in the first direction and the length Y0 in the second direction satisfy:

[0096]

[0097] Wherein, X is the width of the overlapping region in the first direction, Y is the length of the overlapping region in the second direction, X3 is the alignment accuracy of the first pad and the second pad in the first direction, X4 is the manufacturing accuracy of the width of the second pad in the first direction, X5 is the accuracy of the center distance between the two end second pads among multiple second pads, Y3 is the alignment accuracy of the first pad and the second pad in the second direction, and Y4 is the cutting accuracy of the flexible circuit board in the second direction.

[0098] The area S0 of the overlapping region is the product of the width X of the overlapping region in the first direction and the length Y in the second direction, so XY satisfies:

[0099] XY > S

[0100] Expressing X in terms of X0 and Y in terms of Y0, then it can be obtained:

[0101]

[0102] The distance X1 between two adjacent first pads 11 satisfies:

[0103]

[0104] Wherein, e is the minimum pad gap, which is related to the type of the conductive adhesive layer 30. Preferably, the minimum gap e can be taken as 5μm.

[0105] According to the formula, the ranges of X0, Y0, and X1 can be obtained. Within these ranges, X0 and Y0 can be adjusted. Usually, according to the border design requirements, Y0 is determined first, and then X0 is determined. Similarly, the value of X1 can also be selected within the range to design the first pad 11.

[0106] When the design of the first pad 11 is determined, the values of X and Y can be obtained, and thus the area S0 of the overlapping region can be calculated. By working backward, I L can be obtained, that is, the upper limit of the conduction current between a first pad 11 and the corresponding second pad 21 can be obtained.

[0107] When the design of the first pad 11 is determined, the area S0 of the overlapping region can be calculated. When the conduction current I L between a first pad 11 and the corresponding second pad 21 is also known, then σI0 can be calculated through S0 and I L so as to select a suitable type of conductive adhesive layer 30.

[0108] In the related art, the current passing through the pads is small, and the current-carrying capacity of the pads does not need to be considered. However, in Mini LED products or components, since there are many light-emitting units and the superimposed current is large, it is easy to exceed the upper limit of the conduction current between the first pad and the second pad, and abnormal display phenomena are likely to occur. Therefore, the width and length of the pads need to be designed to ensure that the upper limit of the conduction current between the first pad and the second pad is increased, so that stable conduction between the first pad and the second pad can be achieved.

[0109] It should be noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it can be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be an intermediate layer. Additionally, it can be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or there may be more than one intermediate layer or element. Further, it can be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Like reference numerals throughout the specification indicate like elements.

[0110] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise clearly defined.

[0111] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A light emitting module, characterized in that: include: Light-emitting substrate and driving assembly; The light-emitting substrate has a plurality of first pads arranged at intervals along a first direction, the driving component has a plurality of second pads arranged at intervals along the first direction, the plurality of second pads correspond to the plurality of first pads one by one and are connected through a conductive adhesive layer, and the orthographic projections of the first pads and the corresponding second pads on the light-emitting substrate have an overlapping area; In the first direction, the width of the first pad is greater than the width of the second pad, and the width of the second pad is equal to the width of the overlapped area.

2. The light emitting module according to claim 1, characterized in that: The width of the first pad in the first direction is: the sum of the width of the overlap region in the first direction and twice the maximum offset distance of the overlap region in the first direction.

3. The light emitting module according to claim 2, characterized in that: The maximum offset distance of the overlapped area in the first direction is: Among them, X3 is the alignment accuracy between the first pad and the second pad in the first direction, X4 is the manufacturing accuracy of the width of the second pad in the first direction, and X5 is the accuracy of the center distance between the second pads at both ends of the multiple second pads.

4. The light emitting module according to claim 1, characterized in that: In the first direction, a distance between two adjacent first pads is smaller than a width of the first pad.

5. The light emitting module according to claim 4, characterized in that: In the first direction, a distance between the two adjacent first pads is greater than a minimum pad gap.

6. The light emitting module according to claim 1, characterized in that: The length of the first pad in the second direction is: the sum of the length of the overlapped area in the second direction and the maximum offset distance of the overlapped area in the second direction; The second direction intersects with the first direction, and the second direction and the first direction are both parallel to the plane where the light-emitting substrate is located.

7. The light emitting module according to claim 6, characterized in that: The driving assembly includes a flexible circuit board, and the maximum offset distance of the overlap area in the second direction is: Wherein, the Y3 is the alignment accuracy between the first pad and the second pad in the second direction, and the Y4 is the cutting accuracy of the flexible circuit board in the second direction.

8. The light emitting module according to claim 1, characterized in that: The minimum area S of the overlapped region satisfies the following relationship: S=I L / σI0 Among them, the I L is the conduction current between the first pad and the corresponding second pad, σ is the capture rate of the conductive particles of the conductive adhesive layer, and I0 is the maximum current that a single conductive particle of the conductive adhesive layer can pass.

9. The light emitting module according to any one of claims 1 to 8, characterized in that: The conductive adhesive layer is an anisotropic conductive film ACF.

10. The light emitting module according to any one of claims 1 to 8, characterized in that: In the first direction, the width of the first pad is between 15 μm and 400 μm, the width of the second pad is between 10 μm and 300 μm, and the distance between two adjacent first pads is greater than 5 μm.

11. The light emitting module according to any one of claims 1 to 8, characterized in that: The light-emitting substrate is a backlight panel or a display panel.

12. The light emitting module according to any one of claims 1 to 8, characterized in that: The light-emitting substrate comprises: a driving backplane, and a plurality of light-emitting units located on one side of the driving backplane and arranged in an array; Wherein, the driving backplane has the plurality of first pads.

13. A display device, characterized in that: include: The light-emitting module according to any one of claims 1 to 12.

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