Probe core for ultrasonic probe and ultrasonic probe

Abstract

The utility model relates to a probe core for an ultrasonic probe and the ultrasonic probe, and belongs to the technical field of ultrasonic sensors. The probe core for the ultrasonic probe comprises a piezoelectric ceramic assembly, an electric connecting piece and an injection molding inner shell, the piezoelectric ceramic assembly and the electric connecting piece are both fixed to the injection molding inner shell, and the electric connecting piece is electrically connected with the piezoelectric ceramic assembly. The injection molding inner shell is formed through injection molding and is connected with the piezoelectric ceramic assembly and the electric connecting piece through injection molding. The utility model further provides an ultrasonic probe comprising the probe core. According to the probe core for the ultrasonic probe and the ultrasonic probe, the structure and the manufacturing process can be simplified, the production cost is reduced, and the production efficiency and the yield are improved.

Description

Technical Field

[0001] The utility model relates to a probe core for an ultrasonic probe and an ultrasonic probe, belonging to the technical field of ultrasonic sensors. Background Art

[0002] An ultrasonic probe is a device that converts electrical energy into sound energy, mainly composed of a piezoelectric ceramic component, an electrical connector, a circuit board, an inner shell, an outer shell, etc. As the core part, the piezoelectric ceramic component is generally formed by connecting a piezoelectric ceramic and a matching layer, which can generate deformation and emit ultrasonic waves under the action of an electric field, and at the same time can also convert the received ultrasonic wave signal back into an electrical signal.

[0003] The assembly process of an ultrasonic probe is generally as follows: First, the electrical connector needs to be welded to the piezoelectric ceramic component to ensure the effective transmission of electrical signals. Then, the combination of the piezoelectric ceramic component and the electrical connector is placed into the inner shell, and is filled and fixed through a dispensing process to ensure the stability of the internal components. After that, the electrical connector is welded to the circuit board, the circuit board is welded to the connector, and is fixed through a dispensing process to form an assembly. Finally, the entire assembly is placed into the outer shell, and UV glue and damping glue are sealed to achieve sealing and shock absorption.

[0004] In the above process, the assembly process of the probe core has many steps, takes a long time in the production process, has a high production cost, and has a complex structure. Moreover, the stability of the items fixed by the dispensing process is generally poor, which will lead to a decrease in the yield rate of ultrasonic probes. Summary of the Utility Model

[0005] One object of the utility model is to provide a probe core for an ultrasonic probe, which can simplify the structure and production process, reduce the production cost, and improve the production efficiency and yield rate.

[0006] Another object of the utility model is to provide an ultrasonic probe including the above probe core.

[0007] To achieve the above object, the utility model provides a probe core for an ultrasonic probe, including a piezoelectric ceramic component, an electrical connector, and an injection-molded inner housing. The piezoelectric ceramic component and the electrical connector are both fixed at the injection-molded inner housing. The electrical connector is electrically connected to the piezoelectric ceramic component. The injection-molded inner housing is formed by injection molding and forms a connection with the piezoelectric ceramic component and the electrical connector through injection molding.

[0008] Further, a first placement groove for fixing the piezoelectric ceramic component is formed at one end of the injection-molded inner housing, and a second placement groove for accommodating the electrical connector is further formed on the side wall of the injection-molded inner housing.

[0009] Further, one end of the injection-molded inner housing opposite to the first placement groove is formed with a third placement groove for fixing the circuit board.

[0010] Further, the piezoelectric ceramic component includes a piezoelectric ceramic and a matching layer which are stacked.

[0011] In particular, the present invention further provides an ultrasonic probe, which includes an outer housing and the probe core described in any one of the above. The outer housing is arranged outside the probe core. Both ends of the outer housing are formed with a receiving port and a circuit port. The diameter of the injection-molded inner housing is not less than the diameter of the receiving port. The receiving port is used to expose the piezoelectric ceramic component, and the circuit port is used to pass through the connector.

[0012] Further, the outer housing is formed by injection molding and is connected to the probe core through injection molding.

[0013] Further, the outer housing is assembled and fixed at the probe core.

[0014] Further, the ultrasonic probe further includes a circuit board, which is installed at the other end of the injection-molded inner housing opposite to the piezoelectric ceramic component. The circuit board is connected to the electrical connector and is pressed against the injection-molded inner housing when the outer housing is injection-molded.

[0015] Further, the connector and the signal processing element are integrated on the circuit board, and the connector is an integrated interface.

[0016] Further, the circuit board is used to conduct ultrasonic signals and electrical signals. The circuit board is respectively connected to the electrical connector and the wire harness, and the wire harness is used to connect an external device.

[0017] According to the first aspect of the present invention, the probe core for ultrasonic use forms an integrated product of the piezoelectric ceramic component, the electrical connector and the injection-molded inner housing by injection molding. By directly completing the positioning of the piezoelectric ceramic component and the electrical connection on the injection-molded inner housing during the injection molding of the injection-molded inner housing, the process of assembling each component of the probe core one by one is omitted, significantly simplifying and shortening the assembly process flow of the probe core, reducing the production time of the probe core, improving the production efficiency, and reducing the production cost. Further, by means of injection molding, the components of the probe core can be firmly connected, improving the connection stability, and thus improving the yield rate of the probe core product.

[0018] Further, the piezoelectric ceramic component, the circuit board and the electrical connector are positioned by the respective grooves (i.e., the first placement groove, the second placement groove and the third placement groove) formed on the injection-molded inner housing. The positioning structure is simple and can accurately position the piezoelectric ceramic component, the circuit board and the electrical connector.

[0019] According to the second aspect of the present utility model, by controlling the relative position of the injection-molded inner housing and the piezoelectric ceramic component during the injection molding process, the exposure degree of the matching layer can be controlled, thereby obtaining the target sensitivity, that is, the ultrasonic sensitivity of the probe core can be flexibly adjusted according to requirements.

[0020] According to the third aspect of the present utility model, the method of forming the outer housing by injection molding can make the outer housing and the probe core form a connection during injection molding, further reducing the process flow of the ultrasonic probe, which is beneficial to further improving the production efficiency. And through the injection molding to form a tight connection between the outer housing and the inner housing, on the one hand, a stable and reliable connection is formed between the two, and on the other hand, there is no need to use damping glue to seal and fill between the two.

[0021] The above description is only an overview of the technical solution of the present utility model. In order to be able to more clearly understand the technical means of the present utility model and implement it according to the content of the description, the following takes the preferred embodiments of the present utility model and combines the attached drawings to describe in detail as follows. Description of the Drawings

[0022] Figure 1 It is a schematic structural diagram of the probe core shown in an embodiment of the present utility model;

[0023] Figure 2 For Figure 1 It is an exploded schematic diagram of the probe core and the circuit board in the embodiment;

[0024] Figure 3 It is a schematic structural diagram of the ultrasonic probe shown in an embodiment of the present utility model;

[0025] Figure 4 For Figure 3 It is a schematic structural diagram of the ultrasonic probe from another perspective shown;

[0026] Figure 5 For Figure 3 It is an exploded schematic diagram of the ultrasonic probe shown;

[0027] Figure 6 For Figure 3 It is a schematic structural diagram of the outer housing of the ultrasonic probe shown;

[0028] Figure 7 It is a schematic partial structural diagram of the ultrasonic probe shown in another embodiment of the present utility model;

[0029] Reference Signs:

[0030] 100 - Ultrasonic probe, 10 - Probe core, 1 - Electric ceramic component, 11 - Piezoelectric ceramic, 12 - Matching layer, 2 - Circuit board, 3 - Electrical connector, 4 - Injection - molded inner housing, 41 - First placement groove, 42 - Third placement groove, 43 - Second placement groove, 44 - Process hole, 45 - Accommodation cavity, 5 - Outer housing, 51 - Receiving port, 52 - Circuit port, 6 - Connector, 61 - Integrated interface, 62 - Wiring harness. Detailed implementation manners

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0032] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0034] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0035] Figure 1 It is a schematic structural diagram of the probe core 10 shown in an embodiment of the present utility model. Figure 2 For Figure 1 The exploded view of the probe core 10 and the circuit board 2 in the embodiment. Figure 3 It is a schematic structural diagram of the ultrasonic probe 100 shown in an embodiment of the present utility model. As Figure 1 shown, it can also be referred to Figure 2, in one embodiment, the probe core 10 of the ultrasonic probe includes a piezoelectric ceramic component 1, an electrical connector 3, and an injection molded inner housing 4. Both the piezoelectric ceramic component 1 and the electrical connector 3 are fixed to the injection molded inner housing 4. The electrical connector 3 forms an electrical connection with the piezoelectric ceramic component 1, which can be the direct contact connection shown in Figure 2 . One end of the electrical connector 3 away from the piezoelectric ceramic component 1 can be connected to a circuit board, or can be connected with a conductive member to be connected to an external device, or can also be formed as a directly exposed electrical connection terminal, which is not limited herein. The injection molded inner housing 4 is formed by injection molding and forms a connection with the piezoelectric ceramic component 1 and the electrical connector 3 through injection molding. That is, during injection molding, by placing the piezoelectric ceramic component 1 and the electrical connector 3 in the mold cavity for injection molding, the piezoelectric ceramic component 1, the electrical connector 3, and the injection molded inner housing 4 form an integrated product after injection molding. As shown in Figure 3 , after the probe core 10 is formed, an outer housing 5 is formed or assembled on the outside of the probe core 10, and the ultrasonic probe 100 can be formed.

[0036] In this embodiment, the probe core 10 for ultrasonic waves forms an integrated product of the piezoelectric ceramic component 1, the electrical connector 3, and the injection molded inner housing 4 by injection molding. By directly fixing the piezoelectric ceramic component 1 and the electrical connector 3 on the injection molded inner housing 4 during the injection molding of the injection molded inner housing 4, the process of assembling each component of the probe core 10 one by one is omitted, significantly simplifying and shortening the assembly process flow of the probe core 10, reducing the production time of the probe core 10, improving the production efficiency, and reducing the production cost. Further, the injection molding method can make each component of the probe core 10 form a stable connection, improve the stability of the connection, and thus improve the yield rate of the probe core 10 products.

[0037] In one embodiment, the piezoelectric ceramic component 1 includes a piezoelectric ceramic 11 and a matching layer 12 which are stacked. The matching layer 12 has an exposed degree matching the ultrasonic sensitivity at the injection-molded inner housing 4. The piezoelectric ceramic 11 and the matching layer 12 can be bonded together with glue. The piezoelectric ceramic 11 can generate deformation and emit ultrasonic waves under the action of an electric field, and at the same time can also convert the received ultrasonic signal into an electric signal. The matching layer 12 can improve the transmission efficiency and signal quality of the ultrasonic signal. By controlling the amount of the matching layer 12 exposed outside the injection-molded inner housing 4, the ultrasonic sensitivity can be adjusted. Therefore, when injection-molding the injection-molded inner housing 4, a shape that can not expose the matching layer 12, partially expose the matching layer 12, or completely expose the matching layer 12 can be formed according to the sensitivity requirement. For example, when the matching layer 12 is completely exposed outside the injection-molded inner housing 4, it is ensured that the receiving surface of the ultrasonic signal will not be covered by the injection-molded inner housing 4, so that the ultrasonic signal can be received without obstruction, and the occurrence of signal attenuation or distortion is minimized to the greatest extent, ensuring the clarity and accuracy of the ultrasonic signal reception. Of course, for the convenience of positioning during injection molding, the piezoelectric ceramic component 1 can be set to be flush with the end face of the injection-molded inner housing 4 or protrude from the end face of the injection-molded inner housing 4.

[0038] In this embodiment, by controlling the relative position between the injection-molded inner housing 4 and the piezoelectric ceramic component 1 during the injection molding process, the exposed degree of the matching layer 12 can be controlled, so as to obtain the target sensitivity, that is, the ultrasonic sensitivity of the probe core 10 can be flexibly adjusted according to the requirement.

[0039] In one embodiment, as Figure 2 shown, the injection-molded inner housing 4 has a first placement groove 41 for fixing the piezoelectric ceramic component 1, a third placement groove 42 for accommodating the circuit board, and a second placement groove 43 for fixing the electrical connector 3. The first placement groove 41 and the third placement groove 42 are respectively located at two opposite end faces of the injection-molded inner housing 4. In some embodiments, the center lines of the first placement groove 41 and the third placement groove 42 are aligned with the center line of the injection-molded inner housing 4 and are both circular grooves. As Figure 2 shown, the electrical connector 3 is generally C-shaped, including a lapping portion and extending portions located at both ends of the lapping portion. The lapping portion is connected to the piezoelectric ceramic 11, and one end of each of the two extending portions away from the lapping portion is connected to the circuit board. Correspondingly, the second placement groove 43 is provided on the side surface of the injection-molded inner housing 4 and is in the shape of a circular groove. The lapping portion enters the second placement groove 43 from the first placement groove 41. Of course, in other embodiments not shown, the shapes and installation positions of the first placement groove 41, the third placement groove 42, and the second placement groove 43 can also be other forms. For example, the second placement groove 43 can be a through hole penetrating the injection-molded inner housing 4.

[0040] It should be noted that, as Figure 2As shown, in order to absorb the deformation after injection molding, some process holes 44 are generally provided in the injection-molded inner housing 4 to absorb the deformation amount. Of course, when there are protruding electronic components on the side of the circuit board facing the injection-molded inner housing 4 when the probe core 10 is assembled, some accommodation cavities 45 will also be formed on the surface of the injection-molded inner housing 4 opposite to the circuit board to accommodate the above-mentioned electronic components.

[0041] In this embodiment, the piezoelectric ceramic component 1, the circuit board, and the electrical connector 3 are positioned by the respective grooves (i.e., the first placement groove 41, the third placement groove 42, and the second placement groove 43) formed in the injection-molded inner housing 4. The positioning structure is simple and can accurately position the piezoelectric ceramic component 1, the circuit board, and the electrical connector 3.

[0042] In a further embodiment, a silver sheet (not shown) is provided in the first placement groove 41. The signals generated or received by the piezoelectric ceramic component 1 are transmitted to the electrical connector 3 through the silver sheet. The setting of the silver sheet can improve the signal transmission intensity.

[0043] In one embodiment, the electrical connector 3 is a flexible circuit board. The flexible circuit board can achieve complex wiring and connection requirements in a limited space. At the same time, it can also absorb the small displacements caused by mechanical stress or thermal expansion, reduce the performance degradation or failure caused by connection failure, and can achieve the lightweight of the ultrasonic probe 100 without sacrificing performance, thereby optimizing the overall performance and user experience of the ultrasonic probe 100.

[0044] In another embodiment, the electrical connector 3 is a metal part made of a metal conductive material such as copper or aluminum. The metal conductive material has excellent electrical conductivity and mechanical strength, and can provide a stable and low-impedance electrical signal transmission path, which is particularly important for the ultrasonic probe 100 that needs to operate stably for a long time. In addition, the weldability of the metal conductive material also provides convenience for the manufacture and maintenance of the probe core 10, helping to reduce the production cost and maintenance difficulty.

[0045] Figure 4 For Figure 3 the structural schematic diagram of another perspective of the ultrasonic probe 100 shown. Figure 5 For Figure 3 the exploded schematic diagram of the ultrasonic probe 100 shown. Figure 6 For Figure 3 the structural schematic diagram of the outer housing 5 of the ultrasonic probe 100 shown. As Figure 3 shown, the embodiment of the present invention also provides an ultrasonic probe 100. The ultrasonic probe 100 includes an outer housing 5 and the probe core 10 in any of the above embodiments. The outer housing 5 is disposed outside the probe core 10 for forming a protective layer for the probe core 10. The outer housing 5 is provided with a circuit port 52 for passing through a connection head 6 that forms an electrical connection with the electrical connector 3 (see Figure 6), so that the connector 6 is exposed outside the outer housing 5. In this embodiment, the connector 6 is an integrated interface 61 on the circuit board 2. In other embodiments not shown, the connector 6 can also be a connection end formed by the electrical connector 3 itself. This embodiment does not limit the formation method of the outer shell. For example, in one embodiment, the outer housing 5 is formed by injection molding and is connected to the probe core 10 by injection molding, that is, when injection molding, the outer housing 5 covers the probe core 10 equipped with the circuit board 2 on the outside and forms a circuit port 52, so that the probe core 10 is accommodated in the outer housing 5 to form a tight connection. At the same time, the circuit board 2 is pressed against the injection molded inner housing 4, and the connector 6 passes through the circuit port 52. The injection molded outer housing 5 is also provided with a receiving port 51 at one end opposite to the circuit port 52. The diameter of the injection molded inner housing 4 is not less than the diameter of the receiving port 51, so that the probe core 10 enters the inner cavity of the outer housing 5 from the receiving port 51. After injection molding, the cavity of the outer housing 5 can tightly wrap the inner housing of the probe core 10, for example, form an interference connection, and the receiving port 51 can expose the matching layer 12 of the probe core 10. In other embodiments, the outer housing 5 can be assembled and fixed to the probe core 10. For example, the pre-formed outer housing 5 is fixed to the probe core 10 by means of snap connection, interference connection, etc. In this embodiment, as Figure 6 shown, the circuit board of the probe core 10 of the ultrasonic probe 100 is integrated with signal processing elements and an integrated interface 61. The signal processing elements have the functions of signal processing and adjustment, such as amplification, filtering or digitization, so as to optimize the signal transmission effect. The integrated interface 61 can directly and quickly transmit the ultrasonic signals received by the ultrasonic probe 100 to other devices without complex circuit layouts or additional conversion devices.

[0046] The circuit board of the probe core 10 in this embodiment is integrated with rich signal processing functions and is provided with an integrated interface 61, which improves the convenience of product use and the overall integration degree.

[0047] Furthermore, the method of forming the outer housing 5 by injection molding can make the outer housing 5 form a connection with the circuit board 2 and the probe core 10 during injection molding, further reducing the process flow of the ultrasonic probe, which is beneficial to further improving the production efficiency. And through the tight connection of the injection molded outer housing 5 and the injection molded inner housing 4, on the one hand, a stable and reliable connection is formed between the two, and on the other hand, there is no need to use damping glue to seal between the two.

[0048] In order to implement the technical solution that the diameter of the injection-molded inner housing 4 is not less than the diameter of the receiving port 51, generally, the outer housing 5 is divided into two parts for separate injection molding, and then the two parts are combined into a complete outer housing 5 through a mold closing operation. During the mold closing process, the injection-molded inner housing 4 is placed between the two parts, so that the injection-molded inner housing 4 with a diameter not less than the diameter of the receiving port 51 can be installed into the outer housing 5. However, this method has the following problems: In order to place the injection-molded inner housing 4 inside the outer housing 5, the volume of the chamber (not shown) inside the outer housing 5 for placing the injection-molded inner housing 4 must be larger than the volume of the injection-molded inner housing 4. In this way, the injection-molded inner housing 4 will shake inside the chamber, thus affecting the performance of receiving ultrasonic signals. If glue is used to fix the injection-molded inner housing 4, then the operation process is increased and the production cost is increased.

[0049] To solve the above problems, in an embodiment of the present application, the injection-molded inner housing 4 is fixed inside the outer housing 5 when the outer housing 5 is injection-molded, that is, the injection-molded inner housing 4 installed with the piezoelectric ceramic component 1, the circuit board 2, the electrical connector 3 and the connector 6 is directly placed into the injection mold. During the injection molding process of the outer housing 5, the fixing of the injection-molded inner housing 4 and the circuit board 2 is completed at the same time. In this way, both the technical solution that the diameter of the injection-molded inner housing 4 is not less than the diameter of the receiving port 51 is realized, and at the same time, the injection-molded inner housing 4 is firmly fixed inside the outer housing 5 conveniently. Therefore, the solution of fixing the injection-molded inner housing 4 inside the outer housing 5 when the outer housing 5 is injection-molded in this embodiment is a better setting.

[0050] It should be noted that the injection molding methods of the injection-molded inner housing 4 and the outer housing 5 both adopt the existing technology. Generally, for example, the integrated piezoelectric ceramic component 1, the circuit board 2, the electrical connector 3, and the connector 6 (that is, the piezoelectric ceramic component 1 and the circuit board 2 are arranged parallel and opposite to each other and are electrically connected to the electrical connector 3, and the connector 6 is electrically connected to the circuit board 2) are placed in the inner housing mold, and then the injection molding process is implemented to form the injection-molded inner housing 4. The injection-molded inner housing 4 fixed with the piezoelectric ceramic component 1, the circuit board 2 and the electrical connector 3 is placed in the outer housing mold, and then the injection molding process is implemented to form the outer housing 5, and no detailed description is given here. In addition, the inner housing mold and the outer housing mold are designed according to the structures of the injection-molded inner housing 4 and the outer housing 5, and no detailed description is given here.

[0051] Figure 7 Partial structural schematic diagram of the ultrasonic probe 100 shown in another embodiment of the present utility model. As Figure 7As shown, in another embodiment, the circuit board 2 is used to conduct ultrasonic signals and electrical signals. The circuit board 2 is connected to the wire harness 62, and the wire harness 62 is used to connect to an external device. That is to say, the circuit board 2 in this embodiment does not include electronic components for signal processing, but only conducts signals to the wire harness 62, and the other end of the wire harness 62 is connected to an external device. The external device can be an ultrasonic electrical signal generator, a signal processor, etc. The outer housing 5 in this embodiment can also be connected to the probe core 10 by injection molding or assembly, or in other ways of connecting to the probe core 10, which is not limited here.

[0052] The wire harness 62 of this embodiment can select a specific connection length according to different application requirements and spatial layouts, so as to adapt to various complex installation environments, making the ultrasonic probe 100 easier to be compatible with various other devices and meet the specific requirements of different users and application scenarios.

[0053] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0054] The above-described embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A probe core for an ultrasonic probe, characterized in that: It includes a piezoelectric ceramic component, an electrical connector and an injection-molded inner shell, wherein the piezoelectric ceramic component and the electrical connector are both fixed to the injection-molded inner shell, the electrical connector is electrically connected to the piezoelectric ceramic component, and the injection-molded inner shell is formed by injection molding and is connected to the piezoelectric ceramic component and the electrical connector by injection molding.

2. The probe core for an ultrasonic probe according to claim 1, characterized in that: A first placement groove for fixing the piezoelectric ceramic component is formed at one end of the injection-molded inner shell, and a second placement groove for accommodating the electrical connector is also formed on the side wall of the injection-molded inner shell.

3. The probe core for an ultrasonic probe according to claim 2, characterized in that: A third placement groove for fixing a circuit board is formed at one end of the injection-molded inner housing opposite to the first placement groove.

4. The probe core for an ultrasonic probe according to claim 1, characterized in that: The piezoelectric ceramic component includes a piezoelectric ceramic and a matching layer which are stacked.

5. An ultrasonic probe, characterized in that: It comprises an outer shell and a probe core as described in any one of claims 1 to 4, wherein the outer shell is arranged on the outside of the probe core, a receiving port and a circuit port are formed at both ends of the outer shell, the diameter of the injection-molded inner shell is not less than the diameter of the receiving port, the receiving port is used to expose the piezoelectric ceramic component, and the circuit port is used to pass a connector.

6. The ultrasonic probe according to claim 5, characterized in that: The outer shell is formed by injection molding and connected with the probe core by injection molding.

7. The ultrasonic probe according to claim 5, characterized in that: The outer shell is assembled and fixed on the core probe.

8. The ultrasonic probe according to any one of claims 5 to 7, characterized in that: It also includes a circuit board installed at the other end of the injection-molded inner shell opposite to the piezoelectric ceramic component. The circuit board is connected to the electrical connector and is pressed against the injection-molded inner shell during injection molding of the outer shell.

9. The ultrasonic probe according to claim 8, characterized in that: The connector and the signal processing element are integrated on the circuit board, and the connector is an integrated interface.

10. The ultrasonic probe according to claim 8, characterized in that: The circuit board is used for conducting ultrasonic signals and electrical signals. The circuit board is connected to the electrical connector and the wiring harness respectively. The wiring harness is used for connecting external devices.

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