Optical module

Abstract

The utility model discloses an optical module. The optical module comprises a light emitting part and a heat dissipation part. The light emitting component comprises a tube base, a tube cap and a tube body, the tube cap is arranged on the tube base in a covering mode, and the tube body is arranged on the tube cap in a covering mode. The second end of the tube base is provided with an identification recess. And the second end of the pipe body and the second end of the pipe cap define a storage recess. The outer surface of the heat dissipation piece is connected with the heat conduction gasket, and the inner surface of the heat dissipation piece is connected with the light emitting component. A first positioning protrusion and a second positioning protrusion are arranged on the inner surface of the heat dissipation piece, the first positioning protrusion is arranged in the containing recess, and the second positioning protrusion is arranged in the identification recess. In the application, the first positioning bulge and the second positioning bulge are arranged on the inner surface of the heat dissipation piece, the first positioning bulge is arranged in the storage recess, and the second positioning bulge is arranged in the identification recess, so that the position of the heat dissipation piece on the light emitting component can be accurately determined, and the mounting precision of the heat dissipation piece and the light emitting component is further improved.

Description

Technical Field

[0001] This application relates to the field of optical fiber communication technologies, and particularly to an optical module. Background Art

[0002] In a coaxially packaged optical emission component, the optical chip is extremely sensitive to temperature and generates a relatively large amount of heat during its own operation. To stably operate while maintaining its performance, it is necessary to transfer the heat generated by it to the housing of the optical module to dissipate. For a coaxially packaged optical emission component, in some scenarios with harsh application environments, in order to achieve a high heat dissipation efficiency, a heat dissipation component is generally mounted on the outer periphery of the optical emission component, and glue is used in the cooperation between the heat dissipation component and the base of the optical emission component.

[0003] Since the base of the optical emission component is a circular structure, it is very difficult to control the deflection angle of the heat dissipation component when the heat dissipation component is mounted on the optical emission component. Even with the use of a tooling fixture, due to the tolerance fit and other situations between them, the control effect of the deflection angle of the heat dissipation component is not good, which in turn affects the mounting accuracy between the heat dissipation component and the optical emission component. Utility Model Content

[0004] This application provides an optical module to improve the mounting accuracy between the heat dissipation component and the optical emission component.

[0005] An optical module includes:

[0006] A housing;

[0007] An optical emission component, located inside the housing and used for emitting optical signals; a heat conduction gasket is provided between the housing and the optical emission component; the optical emission component includes:

[0008] A base, with a laser chip provided at the first end; the second end of the base has an identification recess;

[0009] Pins, passing through the base;

[0010] A tube cap, covering the base, with a first light passing hole at the first end;

[0011] A tube body, covering the tube cap, with a second light passing hole at the first end, and the second end and the second end of the tube cap enclose a storage recess; the first light passing hole and the second light passing hole are correspondingly arranged so that the optical signal emitted by the laser chip can be emitted;

[0012] A heat dissipation component, located inside the housing, has its outer surface connected to the thermal conductive gasket and its inner surface connected to the optical emission component; the inner surface of the heat dissipation component is provided with a first positioning protrusion and a second positioning protrusion, the first positioning protrusion is placed in the placement recess to define the position of the heat dissipation component in the axial direction of the optical emission component; the second positioning protrusion is placed in the identification recess to define the position of the heat dissipation component on the outer periphery of the optical emission component.

[0013] An optical module, comprising:

[0014] A housing, including an upper housing, and the upper housing includes a cover plate;

[0015] A circuit board, located inside the housing;

[0016] An optical receiving component, located inside the housing, connected to the circuit board, and used for receiving optical signals;

[0017] An optical emission component, located inside the housing, connected to the circuit board, and used for emitting optical signals; a thermal conductive gasket is provided between the cover plate and the optical emission component; the optical emission component includes:

[0018] A socket, with a laser chip provided at the first end; the second end of the socket has an identification recess;

[0019] Pins, passing through the socket;

[0020] A tube cap, covering the socket, and having a first light passing hole at the first end;

[0021] A tube body, covering the tube cap, having a second light passing hole at the first end, and the second end of the tube body and the second end of the tube cap enclose a placement recess; the first light passing hole and the second light passing hole are correspondingly arranged so that the optical signal emitted by the laser chip can be emitted;

[0022] A heat dissipation component, located inside the housing, has its outer surface connected to the thermal conductive gasket and its inner surface connected to the optical emission component; the inner surface of the heat dissipation component is provided with a first positioning protrusion and a second positioning protrusion, the first positioning protrusion is placed in the placement recess to define the position of the heat dissipation component in the axial direction of the optical emission component; the second positioning protrusion is placed in the identification recess with an opening facing the cover plate to define the position of the heat dissipation component on the outer periphery of the optical emission component.

[0023] Beneficial effects: The present application provides an optical module, which includes a housing. An optical emission component and a heat dissipation component are arranged inside the housing. The heat dissipation component is fixed to the outer periphery of the optical emission component, and the optical emission component is used to emit optical signals. A thermal conductive gasket is arranged between the housing and the optical emission component, and the thermal conductive gasket is located between the heat dissipation component and the housing. The heat generated by the optical emission component is sequentially conducted to the housing through the heat dissipation component and the thermal conductive gasket, and then dissipated through the housing. The optical emission component includes a base, pins, a tube cap, and a tube body. The pins penetrate through the base, the tube cap covers the base, and the tube body covers the tube cap. A laser chip is arranged at the first end of the base, and an identification recess is provided at the second end of the base. A first light passing hole is provided at the first end of the tube cap. A second light passing hole is provided at the first end of the tube body, and a storage recess is formed by the second end of the tube body and the second end of the tube cap. The first light passing hole and the second light passing hole are correspondingly arranged to enable the optical signal emitted by the laser chip to be emitted. The outer surface of the heat dissipation component is connected to the thermal conductive gasket, and the inner surface of the heat dissipation component is connected to the optical emission component to improve the heat dissipation efficiency. A positioning protrusion is arranged on the inner surface of the heat dissipation component, and the positioning protrusion is placed in the recess to fixedly connect the heat dissipation component and the optical emission component. The positioning protrusion includes a first positioning protrusion and a second positioning protrusion. The first positioning protrusion and the second positioning protrusion are located in two different directions on the inner surface of the heat dissipation component, so as to accurately determine the position of the heat dissipation component on the optical emission component, and further reduce the deflection angle of the heat dissipation component on the optical emission component. The first positioning protrusion is placed in the storage recess to limit the position of the heat dissipation component in the axial direction of the optical emission component. The second positioning protrusion is placed in the identification recess to limit the position of the heat dissipation component on the outer periphery of the optical emission component. In the present application, the outer surface of the heat dissipation component is connected to the thermal conductive gasket, and the inner surface of the heat dissipation component is connected to the optical emission component, so that the heat generated by the optical emission component is sequentially conducted to the housing through the heat dissipation component and the thermal conductive gasket; a first positioning protrusion and a second positioning protrusion are arranged on the inner surface of the heat dissipation component. The first positioning protrusion is placed in the storage recess to limit the position of the heat dissipation component in the axial direction of the optical emission component, and the second positioning protrusion is placed in the identification recess to limit the position of the heat dissipation component on the outer periphery of the optical emission component, so as to accurately determine the position of the heat dissipation component on the optical emission component, and further improve the mounting accuracy of the heat dissipation component and the optical emission component. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 It is a partial structure diagram of an optical communication system provided according to some embodiments;

[0026] Figure 2A partial structure diagram of a host computer provided according to some embodiments;

[0027] Figure 3 A structure diagram of an optical module provided according to some embodiments;

[0028] Figure 4 An exploded view of an optical module provided according to some embodiments;

[0029] Figure 5 A cross-sectional view of an optical module provided according to some embodiments;

[0030] Figure 6 An exploded view of the interior of an optical module provided according to some embodiments;

[0031] Figure 7 A cross-sectional view of the optical emission branch in an optical module provided according to some embodiments;

[0032] Figure 8 An exploded view of the optical emission branch in an optical module provided according to some embodiments;

[0033] Figure 9 An exploded view of an optical emission component and a heat sink provided according to some embodiments;

[0034] Figure 10 An exploded view of an optical emission component provided according to some embodiments;

[0035] Figure 11 A cross-sectional view of an optical emission component provided according to some embodiments;

[0036] Figure 12 An assembly diagram of a socket and pins provided according to some embodiments;

[0037] Figure 13 An assembly diagram of a socket and pins from another perspective provided according to some embodiments;

[0038] Figure 14 A structure diagram of a heat sink provided according to some embodiments;

[0039] Figure 15 An assembly diagram of an optical emission component and a heat sink provided according to some embodiments;

[0040] Figure 16 A cross-sectional view of an optical emission component and a heat sink from another perspective provided according to some embodiments. Detailed implementation manners

[0041] The following will clearly and detailedly describe some embodiments of the present disclosure in conjunction with the accompanying drawings. However, the described embodiments are only some embodiments of the present disclosure, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided by the present disclosure fall within the scope of protection of the present disclosure.

[0042] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted in an open, inclusive sense, i.e., "including, but not limited to"; the terms "first" and "second" cannot be understood as indicating or implying relative importance or an upper limit on quantity; the term "plurality" means two or more; the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the term "adapted to" or "configured to" implies open and inclusive language, which does not exclude devices adapted to or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "identical", "consistent", "flush", etc. do not limit to absolute mathematical theoretical relationships, but also include acceptable error ranges in practice, and also include differences formed due to manufacturing reasons based on the same design concept.

[0043] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and utilize the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When the optical signal is transmitted in an information transmission device, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing devices can recognize and process are electrical signals. Information processing devices generally include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission devices generally include optical fibers and optical waveguides, etc.

[0044] An optical module can implement the mutual conversion between optical signals and electrical signals between an information processing device and an information transmission device. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Since information can be transmitted between multiple information processing devices through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all information processing devices being directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0045] Figure 1 It is a partial structural diagram of an optical communication system according to some embodiments. As Figure 1 shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0046] One end of the optical fiber 101 extends in the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power-loss information transmission.

[0047] The optical communication system can include one or more optical fibers 101, and the optical fiber 101 is detachably or fixedly connected to the optical module 200. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0048] The host computer 100 includes a housing generally in the shape of a cuboid, and an optical module interface 102 provided on the housing. The optical module interface 102 is configured to access the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0049] The host computer 100 further includes an external power interface, which can be connected to an electrical signal network. For example, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect to a network cable 103, so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal sent by the local information processing device 2000 is transmitted into the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000. For example, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal according to the first electrical signal and transmits the fourth electrical signal into the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the above conversion process of optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0050] In addition to including an optical network terminal, the host computer 100 further includes an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, etc.

[0051] Figure 2 It is a partial structure diagram of a host computer provided according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a radiator 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the radiator 107 has raised structures such as fins for increasing the heat dissipation area.

[0052] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 fixes the optical module 200, and the heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that a two-way electrical signal connection is established between the optical module 200 and the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that a two-way optical signal connection is established between the optical module 200 and the optical fiber 101.

[0053] Figure 3 It is a structural diagram of an optical module provided according to some embodiments. Figure 4 It is an exploded view of an optical module provided according to some embodiments. As Figure 3 and Figure 4 shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, an optical transmitting component 400, and an optical receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the optical transmitting component 400 and the optical receiving component 500.

[0054] The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form the above-mentioned shell having two openings 204 and 205; the outer contour of the shell generally presents a rectangular body.

[0055] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0056] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to realize the upper shell 201 covering the lower shell 202.

[0057] The direction where the line connecting the two openings 204 and 205 is located may be consistent with the length direction of the optical module 200 or may not be consistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 the right end), and the opening 205 is also located at the end of the optical module 200 ( Figure 3The left end). Alternatively, the opening 204 is located at the end of the optical module 200, while the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port and is configured to access an external optical fiber 101 so that the optical fiber 101 connects the optical transmitting component 400 and the optical receiving component 500 in the optical module 200.

[0058] Adopting the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the optical transmitting component 400, the optical receiving component 500, etc. into the above-mentioned housing, and the upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices. In addition, when assembling the circuit board 300, the optical transmitting component 400 and the optical receiving component 500, etc., it is convenient for the deployment of the positioning components, heat dissipation components and electromagnetic shielding components of these devices, which is beneficial to the automated implementation of production.

[0059] In some embodiments, the upper housing 201 and the lower housing 202 are made of a metal material, which is beneficial to achieve electromagnetic shielding and heat dissipation.

[0060] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0061] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes a latching component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the latching component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the latching component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the latching component and the host computer to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be withdrawn from the cage 106.

[0062] The circuit board 300 includes circuit traces, electronic components, chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, triodes, Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). The chips may include, for example, Microcontroller Units (MCUs), laser driver chips, Transimpedance Amplifiers (TIAs), Limiting Amplifiers (LIAs), Clock and Data Recovery (CDR) chips, power management chips, and Digital Signal Processing (DSP) chips.

[0063] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a bearing function. For example, the rigid circuit board can stably bear the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connectors in the cage 106 of the host computer 100.

[0064] The circuit board 300 also includes a gold finger 301 formed on its end surface. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is electrically connected to the electrical connector in the cage 106. The gold finger 301 can be provided only on the surface of one side of the circuit board 300 (for example Figure 4 the upper surface shown), or can be provided on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions with a large demand for the number of pins. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, Inter-Integrated Circuit (I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board as a supplement to the rigid circuit board.

[0065] At least one of the optical transmitting component 400 or the optical receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0066] In some embodiments, the optical transmitting component 400 and the optical receiving component 500 are physically separated from the circuit board 300 respectively, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors respectively.

[0067] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or on the side of the circuit board 300.

[0068] In a coaxially packaged light emitting component, the optical chip is extremely sensitive to temperature and generates a large amount of heat during its own operation. To operate stably while maintaining its performance, it is necessary to transfer the heat generated by it to the housing of the optical module to dissipate. For a coaxially packaged light emitting component, in some scenarios with harsh application environments, in order to achieve a high heat sink efficiency, a heat sink is generally mounted on the outer periphery of the light emitting component, and glue is used in the cooperation between the heat sink and the base of the light emitting component.

[0069] Since the base of the light emitting component is a circular structure, it is difficult to control the deflection angle of the heat sink when the heat sink is mounted on the light emitting component. Even with the use of tooling jigs, due to the tolerance fit and other conditions between them, the control effect of the deflection angle of the heat sink is not good, which in turn affects the mounting accuracy of the heat sink on the light emitting component. In addition, the size of the deflection angle of the heat sink on the light emitting component will affect the cross-sectional height of the light emitting component, and when the light emitting component is mated with the housing, it will affect the compression amount of the thermal conductive gasket, and then affect the heat dissipation effect of the thermal conductive gasket.

[0070] To solve the above problems, in some embodiments, the light emitting component has a placement recess and a marking recess, and the heat sink has a first positioning protrusion and a second positioning protrusion. The first positioning protrusion is placed in the placement recess to define the position of the heat sink in the axial direction of the light emitting component, and the second positioning protrusion is placed in the marking recess to define the position of the heat sink on the outer periphery of the light emitting component, so as to accurately determine the position of the heat sink on the light emitting component, thereby reducing the deflection angle of the heat sink on the light emitting component, improving the mounting accuracy of the heat sink on the light emitting component, and the heat dissipation effect of the thermal conductive gasket.

[0071] Figure 5 A cross-sectional view of an optical module according to some embodiments is shown. As Figure 4 and Figure 5 shown, in some embodiments, a heat sink 910 may be disposed on the outer periphery of the light emitting component 400. The heat sink 910 may be located between the light emitting component 400 and the housing, so that the heat generated by the light emitting component 400 is conducted to the housing through the heat sink 910 and then dissipated through the housing.

[0072] As Figure 5 shown, in some embodiments, the outer surface of the heat sink 910 may include a first connection surface 914. The first connection surface 914 may be disposed parallel to the thermal conductive gasket 900 to increase the contact area between the thermal conductive gasket 900 and the heat sink 910.

[0073] As Figure 5 shown, in some embodiments, the heat sink 910 may include a first heat sink. The first heat sink may be located between the light emitting component 400 and the cover plate 2011 of the upper housing 201, so that the heat generated by the light emitting component 400 is conducted to the upper housing 201 through the first heat sink, and then dissipated through the upper housing 201.

[0074] In some embodiments, the heat sink may include a second heat sink. The second heat sink may be located between the light emitting component 400 and the bottom plate 2021 of the lower housing 202, so that the heat generated by the light emitting component 400 is conducted to the lower housing 202 through the second heat sink, and then dissipated through the lower housing 202.

[0075] As Figure 5 shown, in some embodiments, a thermal conductive gasket 900 may be disposed between the light emitting component 400 and the housing, so that the heat generated by the light emitting component 400 is conducted to the housing through the thermal conductive gasket 900, and then dissipated through the housing.

[0076] As Figure 5 shown, in some embodiments, the thermal conductive gasket 900 may include a first thermal conductive gasket. The first thermal conductive gasket may be located between the light emitting component 400 and the cover plate 2011 of the upper housing 201, so that the heat generated by the light emitting component 400 is conducted to the upper housing 201 through the first thermal conductive gasket, and then dissipated through the upper housing 201.

[0077] In some embodiments, the bottom surface of the first thermal conductive gasket may be in contact connection with the outer periphery of the light emitting component 400.

[0078] In some embodiments, the top surface of the first thermal conductive gasket may be in contact connection with the cover plate 2011.

[0079] The bottom surface of the first thermal conductive gasket may be in contact connection with the outer periphery of the light emitting component 400, and the top surface of the first thermal conductive gasket may be in contact connection with the cover plate 2011, so that the first thermal conductive gasket can be located between the light emitting component 400 and the cover plate 2011.

[0080] In some embodiments, the thermal conductive gasket may include a second thermal conductive gasket. The second thermal conductive gasket may be located between the light emitting component 400 and the bottom plate 2021 of the lower housing 202, so that the heat generated by the light emitting component 400 is conducted to the lower housing 202 through the second thermal conductive gasket, and then dissipated through the lower housing 202.

[0081] In some embodiments, the top surface of the second thermal conductive gasket may be in contact connection with the outer periphery of the light emitting component 400.

[0082] In some embodiments, the bottom surface of the second thermal conductive gasket may be in contact connection with the bottom plate 2021.

[0083] The top surface of the second heat-conducting gasket can be in contact connection with the outer periphery of the optical transmitting component 400, and the bottom surface of the second heat-conducting gasket can be in contact connection with the bottom plate 2021, so that the second heat-conducting gasket can be located between the optical transmitting component 400 and the bottom plate 2021.

[0084] As Figure 5 shown, in some embodiments, the first heat-conducting gasket can be located between the first heat sink and the cover plate 2011, so that the heat generated by the optical transmitting component 400 is conducted to the upper housing 201 through the first heat sink and the first heat-conducting gasket in sequence, and then dissipated through the upper housing 201.

[0085] In some embodiments, the bottom surface of the first heat-conducting gasket can be in contact connection with the first heat sink.

[0086] In some embodiments, the top surface of the first heat-conducting gasket can be in contact connection with the cover plate 2011.

[0087] The bottom surface of the first heat-conducting gasket can be in contact connection with the first heat sink, and the top surface of the first heat-conducting gasket can be in contact connection with the cover plate 2011, so that the first heat-conducting gasket can be located between the first heat sink and the cover plate 2011.

[0088] In some embodiments, the second heat-conducting gasket can be located between the second heat sink and the bottom plate 2021, so that the heat generated by the optical transmitting component 400 is conducted to the upper housing 201 through the second heat sink and the second heat-conducting gasket in sequence, and then dissipated through the upper housing 201.

[0089] In some embodiments, the top surface of the second heat-conducting gasket can be in contact connection with the second heat sink.

[0090] In some embodiments, the bottom surface of the second heat-conducting gasket can be in contact connection with the bottom plate 2021.

[0091] The top surface of the second heat-conducting gasket can be in contact connection with the second heat sink, and the bottom surface of the second heat-conducting gasket can be in contact connection with the bottom plate 2021, so that the second heat-conducting gasket can be located between the second heat sink and the bottom plate 2021.

[0092] Figure 6 is an exploded view inside the optical module provided according to some embodiments. As Figure 6 shown, in some embodiments, the optical transmitting component 400 and the circuit board 300 can be connected through the first flexible circuit board 310. That is, one end of the first flexible circuit board 310 can be connected to one end of the optical transmitting component 400, and the other end of the first flexible circuit board 310 can be connected to the circuit board 300.

[0093] As Figure 6As shown, in some embodiments, the optical receiving component 500 and the circuit board 300 can be connected through the second flexible circuit board 320. That is, one end of the second flexible circuit board 320 can be connected to the optical receiving component 500, and the other end of the second flexible circuit board 320 can be connected to the circuit board 300.

[0094] Figure 7 It is a cross-sectional view of the optical emission branch in the optical module provided according to some embodiments. Figure 8 It is an exploded view of the optical emission branch in the optical module provided according to some embodiments. The optical emission branch is composed of various components through which the optical signal is generated and emitted to the external optical fiber. As Figure 7 and Figure 8 As shown, in some embodiments, the optical emission branch can include an optical emission component 400 and a first optical fiber adapter 700. An optical fiber ferrule 711 can be provided inside the first optical fiber adapter 700 to receive the optical signal emitted by the optical emission component 400.

[0095] An isolator 712 can be provided inside the first optical fiber adapter 700 to prevent the optical signal from returning to the optical emission component 400 again.

[0096] As Figure 7 and Figure 8 As shown, the other end of the optical emission component 400 can be connected to the first optical fiber adapter 700 so that the optical signal emitted by the optical emission component 400 can enter the optical fiber in the first optical fiber adapter 700.

[0097] As Figure 7 and Figure 8 As shown, in some embodiments, the optical emission branch can include a lens fixing base 920. The lens fixing base 920 can be located between the optical emission component 400 and the first optical fiber adapter 700. One end of the lens fixing base 920 and the optical emission component 400 can be connected by laser welding. A second placement cavity can be provided inside the lens fixing base 920. A focusing lens 921 can be provided inside the second placement cavity. The focusing lens 921 can couple the optical signal emitted by the optical emission component 400 into the optical fiber of the first optical fiber adapter 700.

[0098] As Figure 7 and Figure 8 As shown, in some embodiments, the optical emission branch can include a focusing ring 930. The focusing ring 930 can be located between the optical emission component 400 and the first optical fiber adapter 700. One end of the focusing ring 930 can cover one end of the first optical fiber adapter 700 facing the optical emission component 400. The other end of the focusing ring 930 can be fixedly connected to the other end of the lens fixing base 920.

[0099] One end of the focusing ring 930 can cover one end of the first optical fiber adapter 700 facing the optical transmitting component 400, and the other end of the focusing ring 930 can be fixedly connected to the other end of the lens fixing base 920, so that the first optical fiber adapter 700 and the lens fixing base 920 are connected through the focusing ring 930. During installation, the relative positions of the first optical fiber adapter 700 and the lens fixing base 920 are fixed by optical coupling, and then the relative positions of the first optical fiber adapter 700 and the lens fixing base 920 are fixed by using the focusing ring 930.

[0100] In some embodiments, the inner surface of one end of the focusing ring 930 is welded to the outer surface of one end of the first optical fiber adapter 700 facing the optical transmitting component 400, so that one end of the focusing ring 930 can cover one end of the first optical fiber adapter 700 facing the optical transmitting component 400.

[0101] In some embodiments, the other end of the focusing ring 930 can be welded to the other end of the lens fixing base 920, so that the other end of the focusing ring 930 can be fixedly connected to the other end of the lens fixing base 920.

[0102] As Figure 8 shown, the front view and top view of the optical transmitting component 400 are both rectangles.

[0103] As Figure 8 shown, the left view and right view of the optical transmitting component 400 are both circles.

[0104] The front view and top view of the optical transmitting component 400 are both rectangles, and the left view and right view of the optical transmitting component 400 are both circles, so that the optical transmitting component 400 is a cylinder, that is, the outer periphery of the optical transmitting component 400 is cylindrical.

[0105] Figure 9 It is an exploded view of the optical transmitting component and the heat sink according to some embodiments. Figure 10 It is an exploded view of the optical transmitting component according to some embodiments. Figure 11 It is a cross-sectional view of the optical transmitting component according to some embodiments. As Figure 9 、 Figure 10 and Figure 11 shown, in some embodiments, the optical transmitting component 400 may include a base 401. A laser chip 451 may be disposed on the base 401, that is, a laser chip 451 may be disposed at the first end of the base 401. The laser chip 451 is used to emit optical signals. The base 401 has a storage jack. The storage jack may extend from the bottom surface of the base 401 to the top surface of the base 401, so that the storage jack penetrates the base 401.

[0106] In some embodiments, a signal connection board 415 may be disposed on the socket 401. One end of the signal connection board 415 may be connected to the EA region of the laser chip 451 to transmit signals to the laser chip 451.

[0107] As Figure 9 , Figure 10 and Figure 11 shown, in some embodiments, the light emitting component 400 may include pins 403. The pins 403 may be placed in the placement through holes of the socket 401 so that the pins 403 penetrate through the socket 401, and further, electrical signals are transmitted from the outside of the light emitting component 400 to the inside of the light emitting component 400. One end of the pin 403 may be connected to the first flexible circuit board 310. The other end of the pin 403 may be connected to a device inside the socket 401. Exemplarily, the other end of the pin 403 may be connected to the laser chip 451 inside the socket 401.

[0108] One end of the pin 403 may be connected to one end of the first flexible circuit board 310, and the other end of the pin 403 may be connected to a device on the socket 401, so that the electrical signals on the circuit board 300 are sequentially transmitted to the device on the socket 401 through the first flexible circuit board 310 and the pin 403.

[0109] In some embodiments, the pin 403 may include a signal pin 431. One end of the signal pin 431 may be connected to the other end of the signal connection board 415. The other end of the signal pin 431 may be connected to the first flexible circuit board 310. The signal pin 431 may transmit high-frequency signals.

[0110] One end of the signal pin 431 may be connected to the other end of the signal connection board 415, and the other end of the signal pin 431 may be connected to the first flexible circuit board 310, so that the high-frequency signals on the first flexible circuit board 310 are transmitted to the signal connection board 415 through the signal pin 431, and then transmitted to the laser chip 451.

[0111] As Figure 9 , Figure 10 and Figure 11 shown, in some embodiments, the light emitting component 400 may include a tube cap 402. The tube cap 402 may cover the socket 401 so that the tube cap 402 and the socket 401 enclose a first placement cavity. A laser chip 451 may be disposed in the first placement cavity. A first lens 452 may be disposed in the first placement cavity. The optical signal emitted by the laser chip 451 is collimated by the first lens 452.

[0112] The laser chip 451 and the first lens 452 form an optical component 405 to emit an optical signal.

[0113] As Figure 10 andFigure 11 As shown, in some embodiments, the first end of the tube cap 402 may have a first light passing hole 421, so that after the optical signal is collimated by the first lens 452, it is transmitted through the first light passing hole 421 to the outside of the first storage cavity.

[0114] As Figure 11 shown, a light window 424 may be embedded in the inner cavity of the tube cap 402. The optical signal collimated by the first lens 452 passes through the light window 424. The material of the light window 424 may be glass.

[0115] The material of the tube cap 402 is Kovar alloy. Kovar alloy (English name: Cobalt-based alloy) refers to a special alloy composed of elements such as cobalt, chromium, molybdenum, iron, nickel, etc. It is a high-performance material with good high-temperature strength, mechanical properties and corrosion resistance, and is one of the most commonly used high-end industrial materials in the fields of aerospace, aero-engines, automobiles, etc.

[0116] The thermal expansion coefficients of Kovar alloy and glass are relatively close, so that the combination of the tube cap 402 and the light window 424 can be used in different temperature environments.

[0117] As Figure 10 and Figure 11 shown, in some embodiments, the tube cap 402 may include a cap body 423. The cap body 423 may be located at the first end of the tube cap 402. One end of the cap body 423 facing away from the tube base 401 may have a first light passing hole 421.

[0118] In some embodiments, the cap body 423 may include a first cap body. The first cap body may be located at the first end of the cap body 423. The first cap body may be arranged parallel to the tube base 401. The first cap body may have a first light passing hole 421.

[0119] In some embodiments, the cap body 423 may include a second cap body. The second cap body may be located at the second end of the cap body 423. The second cap body may be arranged perpendicular to the tube base 401. The second cap body may be connected to the first cap body so that the first cap body and the second cap body enclose an open-ended cylinder.

[0120] As Figure 11 shown, in some embodiments, the inner cavity of the cap body 423 may be stepped to avoid the devices in the first storage cavity.

[0121] In some embodiments, the inner cavity of the cap body 423 may include a first inner cavity, and the first inner cavity is the first light passing hole 421.

[0122] In some embodiments, the inner cavity of the cap body 423 may have a second inner cavity 4231. A light window 424 may be embedded in the second inner cavity 4231.

[0123] AsFigure 10 and Figure 11 As shown in Figure 11 , in some embodiments, the tube cap 402 may include a brim 422. The brim 422 may be located at the second end of the tube cap 402. The brim 422 may be connected to one end of the cap body 423 facing the tube base 401, that is, the brim 422 may be connected to the second cap body.

[0124] In some embodiments, the inner diameter dimension of the brim 422 is equal to the outer diameter dimension of the cap body 423, so that the brim 422 can be connected to one end of the cap body 423.

[0125] As Figure 9 、 Figure 10 and Figure 11 As shown in Figure 10 and Figure 11 , in some embodiments, the light emitting component 400 may include a tube body 404. The tube body 404 may be disposed over the tube cap 402. The tube body 404 and the tube cap 402 may be fixedly connected by laser welding. A second light passing hole 441 may be provided at one end of the tube body 404 facing away from the tube base 401. The second light passing hole 441 may be correspondingly disposed with the first light passing hole 421, so that the optical signal emitted through the first light passing hole 421 is emitted from the light emitting component 400 through the second light passing hole 441.

[0126] In some embodiments, the radius dimension of the tube body 404 is greater than the radius dimension of the tube cap 402, so as to increase the offset amount of the lens fixing seat 920, and further increase the assembly tolerance between the light emitting component 400 and the lens fixing seat 920, thereby improving the misalignment compatibility of the assembly of the light emitting component 400 and the lens fixing seat 920.

[0127] On the premise of ensuring that the optical signal emitted by the laser chip is emitted, the smaller the radius dimension of the second light passing hole 441 of the tube body 404 is, the better, so as to increase the contact area between the light emitting component 400 and the lens fixing seat 920, and further improve the connection stability between the light emitting component 400 and the lens fixing seat 920.

[0128] In some embodiments, the radius dimension of the second light passing hole 441 is smaller than the radius dimension of the first light passing hole 421.

[0129] The material of the tube body 404 may be stainless steel. Stainless steel is inexpensive, has a moderate carbon content, is relatively suitable for welding, and has good corrosion resistance.

[0130] As Figure 9 、 Figure 10 and Figure 11 As shown in Figure 9 , Figure 10 and Figure 11 , in some embodiments, the outer diameter dimension of the brim 422 is greater than the outer diameter dimension of the cap body 423, so that when the tube body 404 is disposed over the cap body 423, a storage recess 406 is formed between the tube body 404 and the tube cap 402, that is, a storage recess 406 is formed between the second end of the tube cap 402 and the second end of the tube body 404.

[0131] As Figure 9 and Figure 11 shown, the top view of the storage recess 406 can be U-shaped.

[0132] As Figure 9 and Figure 11 shown, the left view of the storage recess 406 can be circular.

[0133] Figure 12 FIG. is an assembly diagram of a socket and pins provided according to some embodiments. Figure 13 FIG. is an assembly diagram of a socket and pins from another perspective provided according to some embodiments. As Figure 12 and Figure 13 shown, in some embodiments, a bearing plate 414 can be provided on the first end of the socket 401. A signal connection plate 415 can be connected to the side of the bearing plate 414 so that the signal connection plate 415 bears against the bearing plate 414. The distance between the bearing plate 414 and the signal pin 431 is less than the distance between the bearing plate 414 and other pins, so that the bearing plate 414 and the signal pin 431 are arranged adjacent to each other.

[0134] As Figure 12 and Figure 13 shown, in some embodiments, the socket 401 can include an identification recess. The identification recess can include a first identification recess 411. The first identification recess 411 can be used to locate the orientation of the laser chip 451 during pasting, so that the light-emitting surface of the laser chip 451 faces the first identification recess 411.

[0135] As Figure 12 and Figure 13 shown, in some embodiments, the identification recess can include a second identification recess 412. The second identification recess 412 can be perpendicular to the first identification recess 411.

[0136] As Figure 12 and Figure 13 shown, in some embodiments, the identification recess can include a third identification recess 413. The third identification recess 413 can be perpendicular to the first identification recess 411.

[0137] The second identification recess 412 and the third identification recess 413 are used to locate the light-emitting polarization direction of the laser chip 451, so that the connection line of the second identification recess 412 and the third identification recess 413 is parallel to the polarization direction of the optical signal emitted by the laser chip 451.

[0138] The pasting direction of the laser chip 451 is determined by the first identification recess 411, the second identification recess 412 and the third identification recess 413, so that the optical signal emitted by the laser chip 451 is incident on the first lens 452 perpendicular to the connection line of the second identification recess 412 and the third identification recess 413.

[0139] Figure 14 The structural diagram of the heat dissipation component provided according to some embodiments. As Figure 14 shown, in some embodiments, the inner surface 911 of the heat dissipation component 910 is an arc surface, so that the inner surface 911 of the heat dissipation component 910 is connected to the outer periphery of the light emitting component 400. However, there is a gap between the inner surface 911 and the outer periphery of the light emitting component 400.

[0140] In some embodiments, a glue with a relatively high thermal conductivity is filled in the gap between the heat dissipation component 910 and the light emitting component 400, so that the heat dissipation component 910 and the light emitting component 400 are hermetically connected, thereby improving the heat dissipation effect of the optical module. Exemplarily, the glue with a relatively high thermal conductivity is silver glue.

[0141] As Figure 14 shown, in some embodiments, positioning protrusions may be provided on the inner surface 911. The positioning protrusions may be correspondingly arranged with the depressions of the light emitting component 400. The positioning protrusions are placed in the depressions of the light emitting component 400, so that the heat dissipation component 910 and the light emitting component 400 are fixedly connected.

[0142] In some embodiments, the positioning protrusions may include a first positioning protrusion 912. The first positioning protrusion 912 may be arranged along the inner surface 911 from one side to the other side. The first positioning protrusion 912 may be correspondingly arranged with the placement depression 406.

[0143] In some embodiments, the shape of the first positioning protrusion 912 is arc-shaped, so that the first positioning protrusion 912 and the placement depression 406 can be tightly connected.

[0144] In some embodiments, the positioning protrusions may include a second positioning protrusion 913. The second positioning protrusion 913 may be arranged along the inner surface 911 from one end to the other end, but stops before the first positioning protrusion 912. The second positioning protrusion 913 may be correspondingly arranged with the identification depression.

[0145] The first positioning protrusion 912 and the second positioning protrusion 913 are respectively located in two different directions of the inner surface 911, so as to accurately determine the position of the heat dissipation component 910 on the light emitting component 400, and further reduce the deflection angle of the heat dissipation component 910 on the light emitting component 400, thereby improving the mounting accuracy of the heat dissipation component and the light emitting component.

[0146] Figure 15 The assembly diagram of the light emitting component and the heat dissipation component provided according to some embodiments. As Figure 15As shown, in some embodiments, the second positioning protrusion 913 can be placed in the identification recess of the socket 401 to define the position of the heat dissipation member 910 on the outer periphery of the optical emission component 400. Wherein, the opening of the identification recess faces the housing (i.e., the upper housing or the lower housing) connected to the thermal conductive gasket.

[0147] In some embodiments, the opening of the third identification recess 413 faces the cover plate 2011 to ensure impedance matching. When the opening of the first identification recess 411 faces the cover plate 2011, the layout of the high-frequency signal pads connected to the signal pins 431 on the first flexible circuit board 310 changes, resulting in an increase in the distance between the signal pins 431 and the high-frequency signal pads on the first flexible circuit board 310, resulting in poor impedance matching.

[0148] In some embodiments, the opening of the second identification recess 412 faces the bottom plate 2021.

[0149] As Figure 5 and Figure 15 As shown, in some embodiments, the first thermal conductive gasket is located between the cover plate 2011 and the optical emission component 400, the first heat dissipation member is located between the first thermal conductive gasket and the optical emission component 400, and the second positioning protrusion 913 can be placed in the identification recess with the opening facing the cover plate 2011. Exemplarily, the second positioning protrusion 913 can be placed in the third identification recess 413.

[0150] In some embodiments, the second thermal conductive gasket is located between the bottom plate 2021 and the optical emission component 400, the second heat dissipation member is located between the second thermal conductive gasket and the optical emission component 400, and the second positioning protrusion 913 can be placed in the identification recess with the opening facing the bottom plate 2021. Exemplarily, the second positioning protrusion 913 can be placed in the second identification recess 412.

[0151] Since the distance between the radiator 107 of the cage 106 and the cover plate 2011 is greater than the distance between the radiator 107 of the cage 106 and the bottom plate 2021, therefore, the second positioning protrusion 913 is placed in the identification recess with the opening facing the cover plate 2011 to improve the heat dissipation effect of the optical module 200, and further improve the heat dissipation efficiency of the optical module 200.

[0152] Figure 16 A cross-sectional view of the optical emission component and the heat dissipation member according to some embodiments is provided from another perspective. As Figure 16 As shown, in some embodiments, the first positioning protrusion 912 can be placed in the placement recess 406 to define the position of the heat dissipation member 910 in the axial direction of the optical emission component 400.

[0153] The first positioning protrusion is placed in the placement recess to define the position of the heat dissipation component in the axial direction of the light emitting component, and the second positioning protrusion is placed in the marking recess to define the position of the heat dissipation component on the outer periphery of the light emitting component, so as to accurately determine the position of the heat dissipation component relative to the light emitting component, thereby improving the mounting accuracy of the heat dissipation component and the light emitting component.

[0154] Those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and practicing the disclosure of the present invention herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this application and include known common knowledge or conventional technical means in the technical field not disclosed in this application. The specification and examples are only illustrative, and the true scope and spirit of this application are pointed out by the content of the claims.

[0155] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: case; A light emitting component, located in the housing, for emitting light signals; A heat-conducting pad is provided between the housing and the light-emitting component; The light emitting component comprises: A tube base, a laser chip is arranged at the first end; and a marking recess is arranged at the second end of the tube base; A tube pin, passing through the tube seat; A tube cap, which is covered on the tube base and has a first light-through hole at a first end; A tube body, which is covered on the tube cap, has a second light-through hole at the first end, and the second end and the second end of the tube cap form a placement recess; the first light-through hole and the second light-through hole are arranged correspondingly to allow the optical signal emitted by the laser chip to be emitted; The heat sink is located in the shell, with its outer surface connected to the thermal pad and its inner surface connected to the light emitting component; the inner surface of the heat sink is provided with a first positioning protrusion and a second positioning protrusion, the first positioning protrusion is placed in the placement recess to limit the axial position of the heat sink on the light emitting component; the second positioning protrusion is placed in the identification recess to limit the position of the heat sink on the periphery of the light emitting component.

2. The optical module according to claim 1, characterized in that: The shell comprises an upper shell, a first thermally conductive gasket is arranged between the cover plate of the upper shell and the light emitting component, the first thermally conductive gasket is connected to the heat sink, and the second positioning protrusion is placed in the identification recess with an opening facing the cover plate.

3. The optical module according to claim 1, characterized in that: The housing comprises a lower housing, a second thermally conductive pad is arranged between the bottom plate of the lower housing and the light emitting component, the second thermally conductive pad is connected to the heat sink, and the second positioning protrusion is placed in the identification recess with an opening toward the bottom plate.

4. The optical module according to claim 1, characterized in that: The inner surface of the heat sink is an arc surface, so that the inner surface of the heat sink is connected to the outer periphery of the light emitting component; the shape of the first positioning protrusion is an arc, so that the first positioning protrusion is connected to the storage recess.

5. The optical module according to claim 1, characterized in that: The outer surface of the heat sink comprises a first connection surface, and the first connection surface is arranged in parallel with the thermal conductive pad to increase the contact area between the thermal conductive pad and the heat sink.

6. The optical module according to claim 1, characterized in that: The size of the first light-through hole is greater than or equal to the size of the second light-through hole, and the size of the first positioning protrusion is less than or equal to the size of the placement recess.

7. The optical module according to claim 1, characterized in that: The pipe cap comprises a cap body and a cap brim, wherein the cap body is covered on the pipe body, the first light-through hole is arranged at the first end of the cap body, the second end of the cap body is connected to the cap brim, and the radius of the cap brim is greater than the radius of the cap body, so that the second end of the pipe body and the second end of the pipe cap form the object placement recess; The inner cavity of the cap body is stepped to avoid components of the tube seat.

8. The optical module according to claim 1, characterized in that: The identification recess includes a first identification recess, a second identification recess and a third identification recess. The first identification recess is used to locate the orientation of the laser chip patch, and the second identification recess and the third identification recess are used to locate the polarization direction of the light emitted by the laser chip. The second identification recess and the third identification recess are both arranged perpendicular to the first identification recess.

9. The optical module according to claim 1, characterized in that: It also includes an optical fiber adapter, wherein the optical fiber adapter is connected to the light emitting component via a lens fixing seat; The size of the first light-through hole is greater than that of the second light-through hole.

10. An optical module, characterized in that: include: A housing, comprising an upper housing, wherein the upper housing comprises a cover plate; A circuit board is located in the housing; A light receiving component, located in the housing and connected to the circuit board, for receiving light signals; A light emitting component, located in the housing and connected to the circuit board, for emitting light signals; A heat-conducting pad is provided between the cover plate and the light-emitting component; The light emitting component comprises: A tube base, a laser chip is arranged at the first end; and a marking recess is arranged at the second end of the tube base; A tube pin, passing through the tube seat; A tube cap, which is covered on the tube base and has a first light-through hole at a first end; A tube body, which is covered on the tube cap, has a second light-through hole at the first end, and the second end and the second end of the tube cap form a placement recess; the first light-through hole and the second light-through hole are arranged correspondingly to allow the optical signal emitted by the laser chip to be emitted; The heat sink is located in the shell, with its outer surface connected to the thermal pad and its inner surface connected to the light emitting component; the inner surface of the heat sink is provided with a first positioning protrusion and a second positioning protrusion, the first positioning protrusion is placed in the placement recess to limit the axial position of the heat sink on the light emitting component; the second positioning protrusion is placed in the identification recess with an opening toward the cover plate to limit the position of the heat sink on the periphery of the light emitting component.

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