Optical module

Abstract

The utility model relates to an optical module, comprising an optical device and a PCB, the optical device comprises a device housing, the PCB is provided with a first assembly portion, a first side wall of the device housing is provided with a first assembly groove, the first assembly groove is a non-linear groove, the first assembly portion is clamped in the first assembly groove in a bending manner, and the first assembly portion is clamped in the first assembly groove in a bending manner. And the first assembling part and the device shell are fixedly connected into a whole through glue which is dispensed and solidified in the first assembling groove. According to the utility model, because the first assembling groove on the device housing is designed to be a non-linear groove, the first assembling part of the PCB is clamped in the first assembling groove in a bending manner, and the micro-deformation of the PCB enables the interaction force between the PCB and the first assembling groove, so that the device housing can be pre-fixed on the PCB. In this way, no extra clamp is needed to assist assembly in the dispensing and glue curing process, the assembly process between the optical device and the PCB can be effectively simplified, the assembly efficiency is improved, and the assembly cost is reduced.

Description

Technical Field

[0001] The utility model relates to an optical module. Background Art

[0002] Currently, AI and AI intelligent computing networks are in a rapid development stage, and the market demand for optical modules such as 400G and 800G has surged. Therefore, how to improve the production capacity of optical modules has become crucial.

[0003] As Figure 1 shown, when manufacturing an optical module, it is usually necessary to assemble a device housing 100 onto a PCB board 200, and lasers, optical elements, etc. are bonded inside the device housing 100. As Figure 2 shown, a groove 101 is usually opened on the device housing 100. The width of the groove 101 is slightly larger than the thickness of the PCB board 200 to facilitate the assembly between the device housing 100 and the PCB board 200. The depth of the groove 101 is about 1 cm. During assembly, the groove 101 of the device housing 100 is aligned with the PCB board 200, and the device housing 100 is pushed down until it reaches the bottom. Then, glue is applied at the joint between the device housing 100 and the PCB board 200, and the glue is baked and cured to fix the device housing 100 at the notch position of the PCB board 200.

[0004] In the above solution, when designing the groove 101 on the side of the device housing 100, in order to ensure that the device housing 100 can be smoothly assembled onto the PCB board 200 and considering the tolerance of the thickness of the PCB board 200 (generally about 1 cm), the width of the groove 101 usually needs to be designed to be about 0.05 - 0.2 mm larger than the thickness of the PCB board 200. Therefore, during assembly, after the device housing 100 is assembled onto the PCB board 200 and before the glue is applied for fixation, the device housing 100 is prone to looseness. It is necessary to design a corresponding fixture to pre-fix the relative positions of the device housing 100 and the PCB board 200 to ensure the accuracy of subsequent glue application and fixation. Then, glue is applied and cured to fix the device housing 100 to the PCB board 200. Since this solution requires designing a special fixture to assist in the assembly between the device housing 100 and the PCB, the process is relatively complex, the production efficiency is low, and the production cost is also increased. Summary of the Utility Model

[0005] The utility model relates to an optical module, which can at least solve some defects of the prior art.

[0006] The utility model relates to an optical module, which comprises an optical device and a PCB board. The optical device includes a device housing. The PCB board has a first assembly part. A first assembly groove is provided on a first side wall of the device housing. The first assembly groove is a non-linear groove. The first assembly part is bent and clamped in the first assembly groove, and the first assembly part and the device housing are fixedly connected into a whole by glue solidified by dispensing glue in the first assembly groove.

[0007] As one of the implementation manners, the first assembly groove is an arc groove.

[0008] As one of the implementation manners, the radius of curvature of the first assembly groove is in the range of 200-1000 mm.

[0009] As one of the implementation manners, the groove width of the first assembly groove is greater than the thickness of the first assembly part.

[0010] As one of the implementation manners, the groove width of the first assembly groove is 50-200 um larger than the thickness of the first assembly part.

[0011] As one of the implementation manners, the device housing has two second side walls adjacent to the first side wall. The two second side walls are opposite and are respectively provided with second assembly grooves. The two second assembly grooves are respectively communicated with the first assembly groove. The PCB board is correspondingly provided with two second assembly parts, and the two second assembly parts are respectively clamped in the two second assembly grooves.

[0012] As one of the implementation manners, both of the two second assembly grooves are linear grooves.

[0013] As one of the implementation manners, the second assembly part and the device housing are fixedly connected into a whole by glue solidified by dispensing glue in the second assembly groove.

[0014] The utility model has at least the following beneficial effects:

[0015] In the utility model, since the first assembly groove on the device housing is designed as a non-linear groove, the first assembly part of the PCB board is bent and clamped in the first assembly groove. The micro-deformation of the PCB board can enable it to have an interaction force with the first assembly groove, so that the device housing can be pre-fixed on the PCB board. In this way, no additional fixture is required to assist the assembly during the dispensing and glue solidification processes, which can effectively simplify the assembly process between the optical device and the PCB board, improve the assembly efficiency and reduce the assembly cost. Description of the Drawings

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 Schematic diagram of the assembly of the device housing and the PCB board provided for the background art;

[0018] Figure 2 Schematic diagram of the structure of the device housing provided for the background art;

[0019] Figure 3 and Figure 4 Schematic diagram of the structure of the device housing provided for the embodiment of the present invention;

[0020] Figure 5 Schematic diagram of the assembly of the device housing and the PCB board in the embodiment of the present invention. Detailed implementation manners

[0021] The following clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0022] As Figures 3 - 5 , the embodiment of the present invention provides an optical module, including an optical device and a PCB board 2. The optical device includes a device housing 1. The PCB board 2 has a first assembly portion 21. A first assembly groove 11 is provided on the first side wall of the device housing 1. The first assembly groove 11 is a non-linear groove. The first assembly portion 21 is bent and clamped in the first assembly groove 11, and the first assembly portion 21 and the device housing 1 are fixedly connected into one body by glue that is spot-glued and cured in the first assembly groove 11.

[0023] For the above optical device, generally, a laser, an optical element, etc. are provided in the device housing 1.

[0024] In the above solution, since the first assembly groove 11 on the device housing 1 is designed as a non-linear groove, the first assembly portion 21 of the PCB board 2 is bent and clamped in the first assembly groove 11. The micro-deformation of the PCB board 2 can cause an interaction force between it and the first assembly groove 11, so that the device housing 1 can be pre-fixed on the PCB board 2. In this way, no additional fixture is required to assist the assembly during the dispensing and glue curing processes, which can effectively simplify the assembly process between the optical device and the PCB board 2, improve the assembly efficiency, and reduce the assembly cost.

[0025] Preferably, as Figure 3 and Figure 4 , the first assembly groove 11 is an arc groove, which can better adapt to the bending deformation of the PCB board 2, reduce the interaction force between the first assembly portion 21 and the first assembly groove 11, and better protect the PCB board 2; the first assembly groove 11 is further preferably a circular arc groove, which has a better protection effect on the PCB board 2.

[0026] Optionally, the radius of curvature of the first assembly groove 11 is in the range of 200 - 1000 mm, which can reduce the bending degree of the PCB board 2 while achieving the effect of pre-fixing the device housing 1.

[0027] Preferably, the groove width of the first assembly groove 11 is greater than the thickness of the first assembly portion 21, which is convenient for the insertion of the PCB board 2 and subsequent dispensing operations. Optionally, the groove width of the first assembly groove 11 is 50 - 200 um larger than the thickness of the first assembly portion 21.

[0028] In one embodiment, as Figure 3 and Figure 4 , the device housing 1 has two second side walls adjacent to the first side wall. The two second side walls are opposite and are respectively provided with second assembly grooves 12. The two second assembly grooves 12 are respectively communicated with the first assembly groove 11; the PCB board 2 is correspondingly provided with two second assembly portions 22, and the two second assembly portions 22 are respectively clamped in the two second assembly grooves 12.

[0029] Wherein, the two ends of the first assembly portion 21 are respectively connected to the two second assembly portions 22. The first assembly portion 21 and the two second assembly portions 22 correspondingly enclose a groove-shaped notch on the PCB board 2 for the device housing 1 to be inserted.

[0030] Wherein, preferably, both of the second assembly grooves 12 are linear grooves, which can not only reduce the bent part of the PCB board 2, but also, when the first assembly portion 21 is bent, the two second assembly grooves 12 cooperate with the two second assembly portions 22 for limiting, and can better achieve the effect of generating a pre-fixing force between the device housing 1 and the PCB board 2.

[0031] Preferably, the second assembly part 22 and the device housing 1 are integrally fixed by glue that is dispensed and cured in the second assembly groove 12, which can improve the assembly reliability between the device housing 1 and the PCB board 2.

[0032] The above optical module can be products such as 400G and 800G optical modules.

[0033] The assembly process of the above optical module includes:

[0034] Such as Figure 5 , align the two second assembly grooves 12 of the device housing 1 with the two second assembly parts 22 of the PCB board 2 respectively, and make the device housing 1 and the PCB board 2 move relative to each other (it can be that the PCB board 2 does not move and the device housing 1 is pushed towards the PCB board 2, or the device housing 1 does not move and the PCB board 2 is pushed towards the device housing 1), so that the two second assembly parts 22 are respectively snapped into the two second assembly grooves 12; at this time, since the shape of the first assembly part 21 does not match that of the first assembly groove 11, the first assembly part 21 cannot be snapped into the first assembly groove 11 temporarily;

[0035] Gently push the back of the PCB board 2 to cause slight deformation of the first assembly part 21 of the PCB board 2, and then make the device housing 1 and the PCB board 2 move relative to each other so that the first assembly part 21 is snapped into the first assembly groove 11;

[0036] Dispense glue into the first assembly groove 11 and the second assembly groove 12, and put the PCB board 2 together with the device housing 1 into an oven to bake and cure the glue;

[0037] The assembly of the device housing 1 is completed.

[0038] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An optical module, comprising an optical device and a PCB board, wherein the optical device comprises a device housing, and the PCB board has a first assembly portion, characterized in that: A first assembly groove is provided on the first side wall of the device housing. The first assembly groove is a non-linear groove. The first assembly portion is bent and clamped in the first assembly groove. The first assembly portion and the device housing are fixedly connected as a whole by glue that is dispensed and cured in the first assembly groove.

2. The optical module according to claim 1, wherein: The first assembly groove is an arc-shaped groove.

3. The optical module according to claim 2, wherein: The curvature radius of the first assembly groove is in the range of 200-1000 mm.

4. The optical module according to claim 1, wherein: A groove width of the first assembly groove is greater than a thickness of the first assembly portion.

5. The optical module according to claim 4, wherein: The width of the first assembly groove is 50-200 um greater than the thickness of the first assembly portion.

6. The optical module according to any one of claims 1 to 5, characterized in that: The device housing has two second side walls adjacent to the first side wall, the two second side walls are opposite to each other and are respectively provided with second assembly grooves, and the two second assembly grooves are respectively connected with the first assembly grooves; the PCB board is matched with two second assembly parts, and the two second assembly parts are respectively clamped in the two second assembly grooves.

7. The optical module according to claim 6, wherein: Both of the second assembly grooves are linear grooves.

8. The optical module according to claim 6, wherein: The second assembly portion and the device housing are fixedly connected as a whole by glue dispensed and cured in the second assembly groove.

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