Bone conduction earphone

Abstract

The utility model discloses a bone conduction earphone, and relates to the technical field of earphones. The bone conduction earphone comprises a shell assembly, a touch sensing assembly and a control circuit board, wherein the shell assembly comprises a touch panel; the touch sensing assembly is arranged in the shell assembly and connected with the touch pad, and the touch sensing assembly comprises a capacitance sensing module and a pressure sensing module which are arranged in the thickness direction of the touch pad; the control circuit board is electrically connected with the capacitive sensing module and the pressure sensing module. As the capacitive sensing module and the pressure sensing module for sensing the capacitance change and the pressure change of the touch pad are arranged at the same time, even if water exists on the surface of the touch pad and a touch function is possibly invalid, the control circuit board can control the bone conduction earphone by using a sensing signal of the pressure sensing module, so that the bone conduction earphone is more convenient to use. And therefore, the function adjustment of the product is not influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of earphones, in particular to a bone conduction earphone. Background Art

[0002] During the use of earphones, functions such as power on / off, volume adjustment, and pause need to be adjusted. Therefore, a button structure needs to be set on the earphones to facilitate users to control the earphones. Traditional mechanical buttons usually have physical gaps and poor waterproof and dustproof effects.

[0003] In order to make the earphones have better waterproof and dustproof effects, some earphones replace the traditional mechanical buttons by setting capacitive touch sensors. In this way, there is no need to set holes for installing buttons on the outer shell surface, improving the waterproof and dustproof performance. At the same time, due to the absence of mechanical wear, the durability is relatively better.

[0004] However, when there is water outside the touchpad (such as in a swimming state, with sweat on the hands or in rainy weather, etc.), the capacitive sensor will be difficult to accurately recognize the manipulation of the human hand, resulting in the failure of the touch function and thus the inability of the human hand to control the earphones.

[0005] Therefore, it is necessary to improve the existing technology to overcome the defects in the existing technology. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a bone conduction earphone that can also be controlled when there is water outside the touchpad.

[0007] To achieve the above utility model purpose, the utility model provides a bone conduction earphone, including:

[0008] A housing assembly including a touchpad;

[0009] A touch sensing assembly disposed in the housing assembly and connected to the touchpad, the touch sensing assembly including a capacitive sensing module and a pressure sensing module arranged along the thickness direction of the touchpad; and,

[0010] A control circuit board electrically connected to the capacitive sensing module and the pressure sensing module.

[0011] In a possible implementation manner, the capacitive sensing module is attached to the inner surface of the touchpad, and the pressure sensing module is attached to the capacitive sensing module.

[0012] In a possible implementation, the touch sensing component further includes a flexible circuit board electrically connected to the control circuit board. The flexible circuit board includes a first board portion and a second board portion. The capacitive sensing module is disposed on the first board portion, and the pressure sensing module is disposed on the second board portion. The first board portion is attached to the inner surface of the touch panel.

[0013] In a possible implementation, the flexible circuit board is bent so that the first board portion and the second board portion are disposed opposite to each other. The touch sensing component includes a spacer disposed between the first board portion and the second board portion. The first board portion and the second board portion are respectively attached to two opposite surfaces of the spacer.

[0014] In a possible implementation, the spacer includes at least two grooves spaced apart from each other, and both ends of the grooves penetrate through both ends of the spacer;

[0015] The pressure sensing module includes at least two pressure sensing recognition regions. Each pressure sensing recognition region includes at least one pressure sensor, and at least one of the grooves is correspondingly disposed for each pressure sensing recognition region.

[0016] In a possible implementation, the spacer is in a long strip shape, and the extending direction of the groove is perpendicular to the arrangement direction of the pressure sensing recognition regions;

[0017] The groove is disposed along the width direction of the spacer and penetrates through both ends in the width direction of the spacer. The pressure sensing recognition regions are arranged along the length direction of the spacer.

[0018] In a possible implementation, the thickness range of the spacer is 0.2 mm to 1 mm, the width range of the groove is 0.3 to 2 mm, and the ratio range of the depth of the groove to the thickness of the spacer is 0.2 to 0.8.

[0019] In a possible implementation, the thickness range of the spacer is 0.3 mm to 0.6 mm.

[0020] In a possible implementation, the control circuit board is disposed within the housing assembly. The flexible circuit board includes a third board portion connected to the first board portion or the second board portion. The third board portion is provided with connection terminals connected to the control circuit board. The touch sensing component further includes a reinforcing board connected to the third board portion. The reinforcing board and the connection terminals are correspondingly disposed and are respectively located on opposite sides of the third board portion.

[0021] In a possible implementation, the capacitance sensing module includes at least two capacitance recognition regions arranged at intervals along the same direction, each capacitance recognition region includes at least one capacitance sensor, the pressure sensing module includes at least two pressure sensing recognition regions arranged at intervals along the same direction, each pressure sensing recognition region includes at least one pressure sensor, the arrangement direction of the capacitance recognition regions is the same as the arrangement direction of the pressure sensing recognition regions, and each capacitance recognition region and each pressure sensing recognition region are electrically connected to the control circuit board;

[0022] The ratio of the projection of the pressure sensing recognition region on the capacitance recognition region to the area of the capacitance recognition region is not less than 40%.

[0023] In a possible implementation, the number of the pressure sensing recognition regions is at least three.

[0024] In a possible implementation, the housing assembly includes a first housing and a second housing connected together, the first housing is provided with a through hole, the touch panel is connected to the first housing and seals the through hole, and part of the touch sensing assembly is arranged in the through hole;

[0025] An installation groove is arranged on the outer surface of the first housing, and the touch panel is arranged in the installation groove.

[0026] In a possible implementation, the bone conduction headset includes a first earphone head, a second earphone head, a control bin, a battery bin, an ear hook and a rear hook. The first earphone head and the control bin are connected by one ear hook, and the second earphone head and the battery bin are connected by one ear hook. The control bin and the battery bin are connected by the rear hook;

[0027] At least one of the first earphone head, the second earphone head, the control bin and the battery bin is provided with the touch panel and the corresponding touch sensing assembly.

[0028] Compared with the prior art, the present utility model has the following beneficial effects: In the present utility model, the bone conduction headset includes a touch sensing assembly connected to the touch panel. The touch sensing assembly includes a capacitance sensing module and a pressure sensing module arranged along the thickness direction of the touch panel. The control circuit board is electrically connected to the capacitance sensing module and the pressure sensing module. Since the capacitance sensing module and the pressure sensing module for sensing the capacitance change and the pressure change of the touch panel are both provided, even if water on the surface of the touch panel may cause the touch function to fail, the control circuit board can use the sensing signal of the pressure sensing module to control the bone conduction headset. Thus, the function adjustment of the product is ensured not to be affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic structural diagram of a control bin in an embodiment of the present utility model.

[0030] Figure 2 is Figure 1 the front view of the control bin shown

[0031] Figure 3 is along Figure 2 the schematic diagram obtained by cutting along the A - A section line in

[0032] Figure 4 is Figure 3 the enlarged view of part I in

[0033] Figure 5 the layout schematic diagram of the capacitance recognition area in an embodiment of the present utility model

[0034] Figure 6 the layout schematic diagram of the pressure - sensing recognition area in an embodiment of the present utility model

[0035] Figure 7 the position schematic diagram of the pressure - sensing recognition area and the capacitance recognition area in an embodiment of the present utility model

[0036] Figure 8 is the sectional view of the control bin in an embodiment of the present utility model

[0037] Figure 9 is Figure 8 the enlarged view of part II in

[0038] Figure 10 the structural schematic diagram of the flexible circuit board in an embodiment of the present utility model

[0039] Figure 11 the schematic diagram when the first board part and the second board part of the flexible circuit board in an embodiment of the present utility model are not bent

[0040] Figure 12 the structural schematic diagram of the first housing in an embodiment of the present utility model

[0041] Figure 13 is Figure 8 the enlarged view of part III in

[0042] Figure 14 the front view of the spacer in an embodiment of the present utility model

[0043] Figure 15 the three - dimensional view of the spacer in an embodiment of the present utility model

[0044] Figure 16 the position schematic diagram of the groove and the pressure - sensing recognition area in an embodiment of the present utility model

[0045] Figure 17It is a schematic structural diagram of a bone conduction headset according to an embodiment. Detailed implementation manners

[0046] To make the above objects, features, and advantages of the present application more apparent and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. It can be understood that the specific embodiments described herein are only for explaining the present application and not for limiting the present application. Additionally, it should be noted that for the sake of convenience of description, only the parts related to the present application rather than all the structures are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0047] The terms "including" and "having" and any variations thereof in the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0048] Referring to "embodiments" herein means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of the present application. The phrase appears at various positions in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0049] The present utility model provides a bone conduction headset, which includes a housing assembly 1, a touch sensing assembly 2, and a control circuit board 3.

[0050] The housing assembly 1 is formed by connecting two or more housings. As Figures 1 to 3 shown, the housing assembly 1 includes a first housing 11 and a second housing 12 that are connected to each other. The first housing 11 and the second housing 12 are joined along the thickness direction to seal their respective openings. When the first housing 11 and the second housing 12 are not connected, components can be installed inside the housing through the openings.

[0051] The first housing 11 is provided with a touch panel 100. When the wearable device is worn, the touch panel 100 is located on the outer side of the wearable device and is not close to the human body to prevent being blocked by the human body. The part of the touch panel 100 corresponding to the touch sensing assembly 2 forms a touch area 101. Figure 2 The position of the touch area 101 is schematically shown by a dashed line in

[0052] Figure 1 and Figure 3 In the illustrated embodiment, the touchpad 100 is separately provided from the first housing 11 and can be connected, for example, by gluing. In other embodiments, the touchpad 100 and the first housing 11 can also be integrally injection-molded.

[0053] Referring Figure 3 and Figure 4 , the touch sensing component 2 is disposed within the housing assembly 1 and is connected to the touchpad 100. The touch sensing component 2 includes a capacitive sensing module 26 and a pressure sensing module 25 arranged along the thickness direction Z of the touchpad 100.

[0054] The capacitive sensing module 26 includes a capacitive sensor. When a finger touches the touchpad 100, the electric field distribution and capacitance between the capacitive sensing electrodes of the capacitive sensor will change, and corresponding capacitive signals will be output accordingly.

[0055] The pressure sensing module 25 is used to detect the pressure signal of the touchpad 100. The pressure sensing module 25 includes a pressure sensor. When the touchpad 100 is stressed, the touchpad 100 will be deformed by the force, and the pressure sensor will also be deformed, thereby causing the pressure sensor to generate a corresponding pressure signal. Since the capacitive sensing module 26 and the pressure sensing module 25 are arranged along the thickness direction of the touchpad 100, when a finger operates on the touchpad 100, both the capacitive sensing module 26 and the pressure sensing module 25 can generate sensing signals.

[0056] The control circuit board 3 is electrically connected to the capacitive sensing module 26 and the pressure sensing module 25, and can receive the capacitive signals transmitted by the capacitive sensing module 26 and the pressure signals transmitted by the pressure sensing module 25, and generate corresponding control signals according to the capacitive signals and / or pressure signals.

[0057] Since the touch sensing component 2 can not only detect the capacitance change caused by a finger touching the touchpad 100, but also detect the pressure change, the bone conduction headset can be manipulated even when there is water on the touchpad 100. For example, when there is water on the surface of the touchpad 100, even if the capacitance detection becomes dull or fails, the change in the pressure signal can still be accurately detected, and corresponding control signals can be generated according to the change in the pressure signal. The user can manipulate the bone conduction headset even when swimming or underwater. When the user is in a normal environment (such as a dry environment), both capacitive sensing and pressure sensing can be used to manipulate the bone conduction headset.

[0058] In addition, better control effects can be obtained by changing the utilization modes of the capacitance signal and the voltage signal. In some embodiments, the bone conduction earphone has a water-touch control mode when there is water on the surface of the touchpad 100 and a non-water-touch control mode when there is no water on the surface of the touchpad 100. In the water-touch control mode, corresponding control signals are generated according to the change of the voltage signal to realize the control of the bone conduction earphone underwater or in a rainy environment. In the non-water-touch control mode, corresponding control signals are generated according to the change of the capacitance signal to make the control of the bone conduction earphone more sensitive. Since there are significant differences in the dielectric constants of water and air, the capacitance of the touchpad 100 is different when there is water and when there is no water on its surface. Whether there is water on the surface of the touchpad 100 can be judged according to the capacitance signal sensed by the capacitance sensing module 26, and thus the mode can be automatically switched.

[0059] In some embodiments, when generating control signals by using capacitance sensing, the pressure signal is also referred to. For example, only when the pressure is greater than a certain threshold, control signals are generated according to the change of the capacitance signal to prevent misoperation of the bone conduction earphone caused by the change of capacitance due to accidental contact of an external object with the touchpad 100.

[0060] In some embodiments, as Figure 5 and Figure 6 shown, the capacitance sensing module 26 includes at least two capacitance identification regions 260 arranged along the same direction, and the pressure sensing module 25 includes at least two pressure sensing identification regions 250 arranged along the same direction. Each capacitance identification region 260 and each pressure sensing identification region 250 are electrically connected to the control circuit board 3. Each capacitance identification region 260 can independently generate a capacitance signal and transmit it to the control circuit board 3, and each pressure sensing identification region 250 can independently generate a pressure signal and transmit it to the control circuit board 3.

[0061] The arrangement direction of the capacitance identification regions 260 is the same as that of the pressure sensing identification regions 250. When operating on the touch area 101, the capacitance identification regions 260 and the pressure sensing identification regions 250 can simultaneously sense the changes of the capacitance signal and the pressure signal, so as to generate approximately the same signal changes in the capacitance identification regions 260 and the pressure sensing identification regions 250 through the same operation and generate the same control instructions.

[0062] By setting at least two capacitance recognition areas 260 and pressure sensing recognition areas 250, the pressure sensing module 25 and the capacitance sensing module 26 can not only recognize click operations, but also recognize swipe operations. When a click operation is performed on the touch area 101, the capacitance recognition area 260 and the pressure sensing recognition area 250 in the corresponding area will generate single or multiple capacitance and voltage changes. When a swipe operation is performed on the touch area 101, it will cause the capacitance signals of different capacitance recognition areas 260 to change sequentially and the pressure signals of different pressure sensing recognition areas 250 to change sequentially. According to the form of the change of the capacitance signal or the pressure signal, the swipe direction or the number of clicks of the finger on the touch area 101 can be recognized. Furthermore, different control signals can be generated according to different operation methods (such as swiping and double-clicking, etc.), and the control method is more diverse.

[0063] Since the capacitance recognition area 260 is easily affected by the external environment, therefore, the number of it is preferably greater than or equal to 3 to reduce misjudgment. Figure 5 In the illustrated embodiment, the capacitance sensing module 26 includes four capacitance recognition areas 260. When the finger does not touch the touch area 101, the capacitance values sensed by the four capacitance recognition areas 260 are basically equivalent and basically do not change. When the finger swipes on the touch area 101, the capacitance signal of the capacitance recognition area 260 touched by the finger will change, and the change of the capacitance signal has a sequence. According to the sequence of the change of the capacitance signal generated by the capacitance recognition area 260, the swipe direction of the finger can be judged.

[0064] For the convenience of description, Figure 5 The four capacitance recognition areas 260 shown in are respectively labeled as area No. 1, area No. 2, area No. 3, and area No. 4. When it is detected that the capacitance signals of area No. 1, area No. 2, area No. 3, and area No. 4 change sequentially in time order, it can be determined that the finger moves to the right. Of course, because the finger may not touch all areas. For example, the sensor detects that the capacitance of area No. 1, area No. 2, and area No. 3 changes sequentially in time order, or the sensor detects that the capacitance of area No. 2, area No. 3, and area No. 4 changes sequentially in time order, it is also determined that the finger moves to the right. On the contrary, when the sensor detects that the capacitance of area No. 4, area No. 3, area No. 2, and area No. 1 or area No. 4, area No. 3, area No. 2 or area No. 3, area No. 2, and area No. 1 changes sequentially in time order, it is determined that the finger moves to the left. According to the swipe direction of the finger, corresponding control signals can be generated. For example, control signals for increasing or decreasing the volume can be generated. Swiping to the right can be set to increase the volume, and swiping to the left can be set to decrease the volume.

[0065] It can be understood that when capacitance changes occur successively in any two adjacent capacitance recognition regions 260, the sliding operation of the finger and its direction can be determined. The more capacitance recognition regions 260 in which capacitance changes occur successively, the more accurate the detection of finger sliding. Optionally, when capacitance signals of three or more capacitance recognition regions 260 change successively, a control instruction is generated for the capacitance signal to prevent misjudgment and improve the reliability and accuracy of the operation.

[0066] The method of judging the sliding operation through the pressure sensing module 25 is similar to the method of judging the sliding operation through the capacitance sensing module 26. When the finger slides across each pressure sensing recognition region 250, the pressure sensing recognition region 250 will also generate a change in the pressure signal in sequence. Pressure sensing is less prone to misoperation compared to capacitance sensing. Therefore, setting two pressure sensing recognition regions 250 can reliably determine the direction of sliding touch. Of course, three or more pressure sensing recognition regions 250 can also be set.

[0067] In some embodiments, the capacitance sensing module 26 is attached to the inner surface 1000 of the touchpad 100, and the pressure sensing module 25 and the capacitance sensing module 26 are attached to each other. Since the capacitance sensing module 26 is closer to the touchpad 100, it can more sensitively sense the capacitance change when the finger operates on the touchpad 100. When the touchpad 100 is deformed under pressure, the pressure sensing module 25 will also be driven to deform simultaneously.

[0068] In some embodiments, the total area of the capacitance recognition regions 260 is greater than or equal to the total area of the pressure sensing recognition regions 250, and the projections of the capacitance recognition regions 260 and the pressure sensing recognition regions 250 on the touchpad 100 (such as on the outer surface or the inner surface 1000 of the touchpad 100) at least partially overlap. Figure 7 The overlapping part is shown by cross - hatching. Since pressing on the touchpad 100 can cause deformation in a relatively large area, even if the pressing position is outside the pressure sensing recognition region 250, a certain amount of pressure can still be felt and a pressure signal is generated. Setting the area of the capacitance recognition regions 260 to be greater than or equal to the area of the pressure sensing recognition regions 250, for example, setting the number of pressure sensing recognition regions 250 to be less than the number of capacitance recognition regions 260, can save costs to a certain extent.

[0069] Further optionally, the ratio of the total area of the overlapping portion of the projections of the capacitance recognition area 260 and the pressure sensing recognition area 250 on the touchpad 100 to the total area of the capacitance recognition area 260 is not less than 40%, so that when operating different positions of the touchpad 100, changes in capacitance signals and pressure signals can be reliably generated simultaneously, reducing the risk of only detecting capacitance signals without pressure signals or with too small pressure signals. When it is necessary to output a control signal corresponding to the capacitance signal only when the change value of the pressure signal is greater than the first pressure signal threshold, through the above setting of the area ratio, the control corresponding to finger manipulation can be realized more sensitively. Further, the ratio of the total area of the overlapping portion of the projections of the capacitance recognition area 260 and the pressure sensing recognition area 250 on the touchpad 100 to the total area of the capacitance recognition area 260 is not less than 60%; furthermore, the ratio of the total area of the overlapping portion of the projections of the capacitance recognition area 260 and the pressure sensing recognition area 250 on the touchpad 100 to the total area of the capacitance recognition area 260 is not less than 80%; furthermore, the ratio of the total area of the overlapping portion of the projections of the capacitance recognition area 260 and the pressure sensing recognition area 250 on the touchpad 100 to the total area of the capacitance recognition area 260 is 1.

[0070] Optionally, the pressure sensing recognition area 250 is located between two adjacent capacitance recognition areas 260, and both ends extend to be disposed opposite to the two adjacent capacitance recognition areas 260, for example, it can extend to directly below the two adjacent capacitance recognition areas 260.

[0071] In some embodiments, as Figure 8 and Figure 9 shown, the touch sensing component 2 further includes a flexible circuit board 20 electrically connected to the control circuit board 3. As Figure 10 and Figure 11 shown, the flexible circuit board 20 includes a first board portion 200 and a second board portion 201. The capacitance sensing module 26 is disposed on the first board portion 200, and the pressure sensing module 25 is disposed on the second board portion 201. The first board portion 200 is attached to the inner surface 1000 of the touchpad 100. Since the flexible circuit board 20 has flexibility, the flexible circuit board 20 can be bent so that the first board portion 200 and the second board portion 201 are disposed opposite to each other, thereby facilitating the arrangement of the positions of the capacitance sensing module 26 and the pressure sensing module 25. Figure 11 FIG. shows a schematic diagram of the flexible circuit board 20 before being bent, which shows three pressure sensing recognition areas 250 and four capacitance recognition areas 260. Figure 10 FIG. shows a schematic diagram of the bent flexible circuit board 20. Optionally, the first board portion 200 and the second board portion 201 are parallel. In addition, by connecting the flexible circuit board 20 to the control circuit board 3, the electrical connection between the capacitance sensing module 26 and the pressure sensing module 25 and the control circuit board 3 can be conveniently realized.

[0072] In some embodiments, the control circuit board 3 is disposed within the housing assembly 1, and the flexible circuit board 20 includes a third board portion 203 connected to the first board portion 200 or the second board portion 201.

[0073] Optionally, as Figure 9 and Figure 12 shown, the first housing 11 is provided with a through hole 110, the touch panel 100 covers the outer end of the through hole 110, and the touch sensing component 2 is partially disposed within the through hole 110 to reduce the occupation of the internal space of the housing assembly 1. In the illustrated embodiment, the first board portion 200 is relatively close to the outer end of the through hole 110, and the second board portion 201 is relatively close to the inner end of the through hole 110. Preferably, the third board portion 203 is arranged to be connected to the second board portion 201, which is more convenient for reducing the interference of the housing and facilitating the routing of wires. Optionally, the outer surface of the first housing 11 is provided with a mounting groove 111, and the touch panel 100 is disposed within the mounting groove 111 on the surface of the first housing 11.

[0074] As Figure 10 and Figure 13 shown, the end of the third board portion 203 is provided with a connection terminal 24 connected to the control circuit board 3, and the connection terminal 24 can be plugged into the control circuit board 3, making the connection more convenient. The touch sensing component 2 further includes a reinforcing plate 27 connected to the third board portion 203. The reinforcing plate 27 and the connection terminal 24 are correspondingly arranged, and the reinforcing plate 27 and the connection terminal 24 are respectively located on opposite sides of the third board portion 203 to improve the structural strength of the end of the third board portion 203 and the reliability of the connection. The reinforcing plate 27 can be made of, for example, metal or plastic.

[0075] In some embodiments, as Figures 8 to 10 shown, the touch sensing component 2 further includes a spacer 22 disposed between the first board portion 200 and the second board portion 201. The first board portion 200 and the second board portion 201 are respectively attached to two opposite surfaces of the spacer 22, that is, the pressure sensing module 25 and the capacitive sensing module 26 are respectively connected to two opposite surfaces of the spacer 22. By providing the spacer 22, the deformation of the touch panel 101 can be transmitted to the second board portion 201 and sensed by the pressure sensing module 25. The spacer 22 can be made of, for example, materials such as glass fiber, polyester film, polyimide film or polyamide film.

[0076] In some embodiments, as Figure 14 and Figure 15As shown, the spacer 22 includes a plurality of grooves 220 arranged at intervals, and both ends of the grooves 220 penetrate through both ends of the spacer 22. By providing the grooves 220, it is more convenient for the spacer 22 to deform, making the pressure sensing module 25 more sensitive to the pressing of the finger. Optionally, at least one of the grooves 220 is correspondingly provided for each pressure sensing region 250 to further improve the sensitivity of the pressure sensing module 25 to pressure sensing. Figure 16 The situation where a groove 220 is correspondingly provided in the middle of a pressure sensing region 250 is shown. The groove 220 can be provided on the surface of the spacer 22 facing the second plate portion 201, or can be provided on the surface of the spacer 22 facing the first plate portion 200.

[0077] Optionally, the extending direction of the groove 220 is perpendicular to the arrangement direction of the pressure sensing regions 250, so that when a part of the spacer 22 corresponding to a certain groove 220 is stressed, a large deformation occurs at the groove 220, while the deformation of other grooves 220 is small or even no deformation. In this way, only the pressure sensing region 250 corresponding to this groove 220 can recognize a large pressure, and the recognition is more accurate.

[0078] In some embodiments, the pressure sensing module 25, the capacitance sensing module 26, and the spacer 22 are all strip-shaped, and the length direction X is the same. The groove 220 is provided along the width direction Y of the spacer 22 and penetrates through both ends of the width direction Y of the spacer 22. The capacitance sensing regions 260 and the pressure sensing regions 250 are both arranged along the length direction X. When performing a sliding operation on the touch pad 100, it is also along the length direction X. In this way, the sliding range of the finger is larger, which is more convenient for operation and accurate recognition of gestures.

[0079] Optionally, the thickness D of the spacer 22 ranges from 0.2 to 1 mm, the ratio of the depth H of the groove 220 to the thickness D of the spacer 22 ranges from 0.2 to 0.8, and the width W of the groove 220 ranges from 0.3 to 2 mm, so that the spacer 22 can deform reliably. Further optionally, the thickness D of the spacer 22 ranges from 0.3 mm to 0.6 mm, so that while the spacer 22 reliably transmits the deformation of the touch pad 100, the thickness range is more reasonable and the occupation of the internal space is reduced.

[0080] As Figure 17As shown in the figure, the bone conduction headset includes a first earphone head 40, a second earphone head 41, a control bin 42, a battery bin 43, an ear hook 44 and a rear hook 45. The first earphone head and the control bin 42, as well as the second earphone head 41 and the battery bin 43, are connected by an ear hook 44 respectively, and the control bin 42 and the battery bin 43 are connected by a rear hook 45. Bone conduction vibration units are provided in the first earphone head 40 and the second earphone head 41. During use, the first earphone head 40 and the second earphone head 41 are in contact with the human face skin, and the vibration of the bone conduction vibration unit is transmitted to the human body through the earphone head to achieve bone conduction sound transmission.

[0081] At least one of the first earphone head 40, the second earphone head 41, the control bin 42 and the battery bin 43 is provided with the touchpad 100 and the corresponding touch sensing component 2 described above for touch control of the bone conduction headset. That is, the touchpad 100 and the corresponding touch sensing component 2 can be provided only on one of the components of the first earphone head 40, the second earphone head 41, the control bin 42 and the battery bin 43, or the touchpad 100 and the corresponding touch sensing component 2 can be provided on two or more of the components of the first earphone head 40, the second earphone head 41, the control bin 42 and the battery bin 43.

[0082] As a preferred embodiment, referring to Figures 1 to 3 , the touchpad 100 and the corresponding touch sensing component 2 are provided on the control bin 42. Since the control circuit board 3 of the bone conduction headset is usually provided in the control bin 42, setting the touch sensing component 2 on the control bin 42 can facilitate the wiring of the sensors (i.e., the pressure sensing module 25 and the capacitance sensing module 26 described above) with the control circuit board 3. At the same time, the control bin 42 has a relatively large surface area, which can form a larger touch area 101 for easy operation. It can be understood that when the touchpad 100 and the corresponding touch sensing component 2 are provided on other components, they can be connected to the control circuit board 3 in the control bin 42 through wires to transmit electrical signals, or a separate control circuit board 3 can be established in this component.

[0083] The above is only the specific implementation mode of the present invention, and any improvement made on the premise of the conception of the present invention is regarded as the protection scope of the present invention.

Claims

1. A bone conduction headset, characterized in that: include: A housing assembly (1), comprising a touch panel (100); A touch sensing component (2) is arranged in the housing component (1) and connected to the touch panel (100), wherein the touch sensing component (2) comprises a capacitive sensing module (26) and a pressure sensing module (25) arranged along the thickness direction of the touch panel (100); and A control circuit board (3) is electrically connected to the capacitive sensing module (26) and the pressure sensing module (25).

2. The bone conduction earphone according to claim 1, characterized in that: The capacitive sensing module (26) is in contact with the inner surface (1000) of the touch panel (100), and the pressure sensing module (25) is in contact with the capacitive sensing module (26).

3. The bone conduction earphone according to claim 1, characterized in that: The touch sensing component further comprises a flexible circuit board (20) electrically connected to the control circuit board (3); the flexible circuit board (20) comprises a first board portion (200) and a second board portion (201); the capacitive sensing module (26) is arranged on the first board portion (200); the pressure sensing module (25) is arranged on the second board portion (201); and the first board portion (200) is in contact with an inner surface (1000) of the touch panel (100).

4. The bone conduction earphone according to claim 3, characterized in that: The flexible circuit board (20) is bent until the first board portion (200) and the second board portion (201) are arranged opposite to each other, and the touch sensing component (2) comprises a spacer (22) arranged between the first board portion (200) and the second board portion (201), and the first board portion (200) and the second board portion (201) are respectively attached to two oppositely arranged surfaces of the spacer (22).

5. The bone conduction earphone according to claim 4, characterized in that: The spacer (22) comprises at least two grooves (220) arranged at intervals, and two ends of the groove (220) pass through two ends of the spacer (22); The pressure sensing module (25) comprises at least two pressure sensing identification areas (250), each of the pressure sensing identification areas (250) comprises at least one pressure sensor, and each of the pressure sensing identification areas (250) is correspondingly provided with at least one of the grooves (220).

6. The bone conduction earphone according to claim 5, characterized in that: The extending direction of the groove (220) is perpendicular to the arrangement direction of the pressure sensing identification area (250); The spacer (22) is in the shape of an elongated strip, the groove (220) is arranged along the width direction of the spacer (22) and passes through both ends of the spacer (22) in the width direction, and the pressure sensing recognition area (250) is arranged along the length direction of the spacer (22).

7. The bone conduction earphone according to claim 5, characterized in that: The thickness of the spacer (22) ranges from 0.2 mm to 1 mm.

8. The bone conduction earphone according to claim 5, characterized in that: The width of the groove (220) is in the range of 0.3 to 2 mm, and the ratio of the depth of the groove (220) to the thickness of the spacer (22) is in the range of 0.2 to 0.

8.

9. The bone conduction earphone according to claim 7, characterized in that: The thickness of the spacer (22) ranges from 0.3 mm to 0.6 mm.

10. The bone conduction earphone according to claim 3, characterized in that: The control circuit board (3) is arranged in the housing component (1); the flexible circuit board (20) includes a third board portion (203) connected to the first board portion (200) or the second board portion (201); the third board portion (203) is provided with a connecting terminal (24) connected to the control circuit board (3); the touch sensing component (2) also includes a reinforcing plate (27) connected to the third board portion (203); the reinforcing plate (27) and the connecting terminal (24) are arranged correspondingly and are respectively located on opposite sides of the third board portion (203).

11. The bone conduction earphone according to claim 1, characterized in that: The capacitive sensing module (26) comprises at least two capacitive identification areas (260) arranged at intervals along the same direction, each of the capacitive identification areas (260) comprising at least one capacitive sensor, the pressure sensing module (25) comprises at least two pressure sensing identification areas (250) arranged at intervals along the same direction, each of the pressure sensing identification areas comprising at least one pressure sensor, the arrangement direction of the capacitive identification areas (260) is the same as the arrangement direction of the pressure sensing identification areas (250), and each of the capacitive identification areas (260) and each of the pressure sensing identification areas (250) are electrically connected to the control circuit board (3); The ratio of the projection of the pressure-sensing recognition area (250) on the capacitance recognition area (260) to the area of ​​the capacitance recognition area (260) is not less than 40%.

12. The bone conduction earphone according to claim 11, characterized in that: The number of the pressure sensing recognition areas (250) is at least three.

13. The bone conduction earphone according to any one of claims 1 to 12, characterized in that: The housing component (1) comprises a first housing (11) and a second housing (12) connected to each other, the first housing (11) being provided with a through hole (110), the touch panel (100) being connected to the first housing (11) and sealing the through hole (110), and the touch sensing component (2) being partially disposed in the through hole (110); The outer surface of the first shell (11) is provided with a mounting groove (111), and the touch panel (100) is arranged in the mounting groove (111).

14. The bone conduction earphone according to any one of claims 1 to 12, characterized in that: The bone conduction earphone comprises a first earphone head (40), a second earphone head (41), a control compartment (42), a battery compartment (43), an ear hook (44) and a back hook (45); the first earphone head (40) and the control compartment (42) as well as the second earphone head (41) and the battery compartment (43) are connected via an ear hook (44); and the control compartment (42) and the battery compartment (43) are connected via the back hook (45); At least one of the first earphone head (40), the second earphone head (41), the control compartment (42) and the battery compartment (43) is provided with the touch panel (100) and the corresponding touch sensing component (2).

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