Headset

Abstract

The utility model discloses a headphone, which comprises a signal transmitting module, a signal isolating module, a head line and a signal receiving module, the input end of the signal isolation module is connected with the output end of the signal transmitting module, and the output end of the signal isolation module is connected with the input end of the signal receiving module through a head-mounted line; and the signal isolation module is used for receiving the first signal transmitted by the signal transmitting module, carrying out signal conversion for suppressing overshoot and undershoot on the first signal to obtain a second signal, and transmitting the second signal to the signal receiving module through the head-mounted line. The radiation value which can be sensed by the outside when the audio signal is transmitted between the left ear and the right ear of the headphone is reduced, so that the headphone after radiation reduction can meet the test requirement, and the use safety of the produced headphone is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of audio equipment, in particular to a pair of head-mounted headphones. Background Art

[0002] With the development of society and the progress of technology, the number of audio electronic products is increasing continuously. When consumers use them, most of them like to wear headphones to increase convenience, practicality and comfort. Currently, most headphones are active noise cancellation (ANC) headphones, which require a relatively large number of microphones for sound pickup, and the microphones and speakers are generally located on the left and right ear sides respectively. Usually, a single chip is used to process the microphone signals and speaker signals of both ears simultaneously.

[0003] For the above signal processing scenario, a relatively large number of headphone wires are often required to transmit the microphone signals and speaker signals of both ears. However, due to the limitation of the headphone size, the above solution is difficult to implement. Currently, the serial digital audio bus protocol (Inter-IC Sound, IIS) is often used to realize the transmission of audio signals between the left and right ears, which has three signal lines: serial clock BCLK, frame clock LRCLK and serial data SDATA. When the headphone wire is long, the signals transmitted in the signal lines often cause relatively high radiation.

[0004] To reduce the radiation so that the headphones meet the production test requirements, the conventional method is to shield and wind the periphery of the headphone wire, and the shielding materials often used are aluminum foil or enameled wire. However, due to the limitation of the diameter size of the headphone elbow, the shielding layer of the headphone wire often cannot be effectively wrapped, resulting in poor shielding effect. At the same time, among the three signal lines corresponding to the IIS protocol, the frequency of the BCLK signal line is relatively high, and the radiation generated by it is very strong. Simple shielding is difficult to effectively solve the problem of excessive radiation, making the produced headphones difficult to meet the test qualified conditions, and thus difficult to meet the production requirements. Summary of the Utility Model

[0005] The utility model provides a pair of head-mounted headphones, which are added with devices for eliminating the radiation of IIS signals. While meeting the accuracy requirements of audio signal transmission, the radiation value that can be perceived by the outside during the transmission of audio signals between the left and right ears of the head-mounted headphones is reduced, so that the head-mounted headphones after reducing the radiation can meet the test requirements and improve the use safety of the produced head-mounted headphones.

[0006] An embodiment of the utility model provides a pair of head-mounted headphones, including: a signal transmitting module, a signal isolation module, a headphone wire and a signal receiving module;

[0007] The input end of the signal isolation module is connected to the output end of the signal transmitting module, and the output end of the signal isolation module is connected to the input end of the signal receiving module through a headband wire;

[0008] The signal isolation module is configured to receive a first signal emitted by the signal transmitting module, perform signal conversion on the first signal to suppress overshoot and undershoot to obtain a second signal, and transmit the second signal to the signal receiving module through the headband wire.

[0009] Optionally, the head-mounted earphone further includes: a filter;

[0010] The output end of the signal isolation module is connected to the input end of the filter, and the output end of the filter is connected to the headband wire;

[0011] The filter is configured to perform filtering adjustment on the second signal and transmit the obtained third signal to the signal receiving module through the headband wire.

[0012] Optionally, the headband wire includes a first signal transmission line, a first shielding layer, and at least one second signal transmission line;

[0013] The first shielding layer is disposed outside the first signal transmission line and each second signal transmission line;

[0014] Wherein, the first signal transmission line is configured to transmit the third signal; each second signal transmission line is configured to transmit signals other than the third signal.

[0015] Optionally, the head-mounted earphone further includes: a bead;

[0016] The bead is connected in series between the output end of the signal transmitting module and the input end of the signal isolation module.

[0017] Optionally, the bead has the minimum impedance at the transmission frequency point of the first signal.

[0018] Optionally, the headband wire includes a first signal transmission line, a second shielding layer, and at least one second signal transmission line;

[0019] The second shielding layer is independently disposed outside the first signal transmission line;

[0020] Wherein, the first signal transmission line is configured to transmit the third signal; each second signal transmission line is configured to transmit signals other than the third signal.

[0021] Optionally, the head-mounted earphone further includes: a common-mode inductor;

[0022] The common-mode inductor is connected in series between the output end of the filter and the headband wire, and is configured to suppress the overshoot radiation of the third signal.

[0023] Optionally, the first pin of the common-mode inductor is connected to the output end of the filter;

[0024] The second pin of the common-mode inductor is connected to the first signal transmission line;

[0025] The third pin of the common-mode inductor is connected to the second shielding layer;

[0026] The fourth pin of the common-mode inductor is grounded.

[0027] Optionally, the first signal is a signal generated by the signal transmitting module based on the driving current.

[0028] An embodiment of the present invention provides a head-mounted earphone, including: a signal transmitting module, a signal isolation module, a head-worn wire, and a signal receiving module; the input end of the signal isolation module is connected to the output end of the signal transmitting module, and the output end of the signal isolation module is connected to the input end of the signal receiving module through the head-worn wire; the signal isolation module is configured to receive a first signal emitted by the signal transmitting module, perform signal conversion for suppressing overshoot and undershoot on the first signal to obtain a second signal, and transmit the second signal to the signal receiving module through the head-worn wire. By adopting the above technical solution, a signal isolation module is added between the signal transmitting module and the head-worn wire, the isolation of the input and output signals is realized through the signal isolation module, and the suppression of the energy radiation overflow caused by overshoot and undershoot in the first signal emitted by the signal transmitting module is achieved, reducing the externally perceivable radiation value when the audio signal is transmitted between the left and right ears of the head-mounted earphone, so that the head-mounted earphone after reducing the radiation can meet the test requirements and improve the use safety of the produced head-mounted earphone.

[0029] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0031] Figure 1 It is a schematic structural diagram of a head-mounted earphone provided by an embodiment of the present invention;

[0032] Figure 2 It is an architecture example diagram of a head-mounted earphone in the prior art;

[0033] Figure 3 It is a schematic structural diagram of another head-mounted earphone provided by an embodiment of the present invention;

[0034] Figure 4 A circuit example diagram of a signal isolation module and a filter provided by an embodiment of the present utility model;

[0035] Figure 5 A structural schematic diagram of another type of head-mounted earphone provided by an embodiment of the present utility model;

[0036] Figure 6 A cross-sectional example diagram of a head-mounted wire provided by an embodiment of the present utility model;

[0037] Figure 7 A structural schematic diagram of another type of head-mounted earphone provided by an embodiment of the present utility model;

[0038] Figure 8 A structural schematic diagram of another type of head-mounted earphone provided by an embodiment of the present utility model;

[0039] Figure 9 A cross-sectional example diagram of a head-mounted wire provided by an embodiment of the present utility model;

[0040] Figure 10 A structural schematic diagram of another type of head-mounted earphone provided by an embodiment of the present utility model;

[0041] Figure 11 A circuit example diagram of a common-mode inductor provided by an embodiment of the present utility model. Specific implementation manners

[0042] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0043] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of the present utility model are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0044] In one embodiment, Figure 1 FIG. 5 is a schematic structural diagram of a headphone provided by an embodiment of the present utility model. This embodiment is applicable to the case of reducing the radiation value of the signal transmitted between the left and right ears of the headphone. The headphone 1 includes: a signal transmitting module 11, a signal isolation module 12, a headband wire 13, and a signal receiving module 14.

[0045] The input end of the signal isolation module 12 is connected to the output end of the signal transmitting module 11, and the output end of the signal isolation module 12 is connected to the input end of the signal receiving module 14 through the headband wire 13;

[0046] The signal isolation module 12 is configured to receive the first signal sent by the signal transmitting module 11, perform signal conversion to suppress overshoot and undershoot on the first signal to obtain a second signal, and transmit the second signal to the signal receiving module 14 through the headband wire 13.

[0047] In this embodiment, the signal transmitting module 11 can be specifically understood as the module in the headphone 1 that needs to send a signal with high radiation to the opposite earphone. The signal isolation module 12 can be specifically understood as the module in the headphone 1 that is used for input-output signal isolation and signal conversion to reduce the radiation intensity of the input signal. Exemplarily, in the embodiment of the present utility model, the signal isolation module 12 can adopt a digital isolation chip. The headband wire 13 can be specifically understood as the connecting wire provided between the left and right ears of the headphone 1 and used for transmitting various signals between the two ears. The signal receiving module 14 can be specifically understood as the module in the headphone 1 that receives the signal with high radiation sent by the opposite earphone.

[0048] In this embodiment, the first signal can be specifically understood as the signal directly output by the signal transmitting module 11 with a relatively large radiation intensity. Exemplarily, the first signal can be the BCLK signal output by the signal transmitting module 11. The second signal can be specifically understood as the signal after being processed by the signal isolation module 12, which suppresses the energy radiation caused by overshoot and undershoot in the first signal.

[0049] Exemplarily, Figure 2 FIG. 1 is a schematic diagram of the architecture of a headphone in the prior art. As Figure 2 shown, an audio processing chip is respectively provided in the left and right ears of the headphone. The microphone (MIC) device and the speaker (Speaker) device of the left and right ears are respectively connected to the corresponding audio processing chips. In Figure 2 the right ear of the headphone shown in FIG. 2, a Bluetooth chip is further provided. During the audio signal processing of the headphone, the MIC and Speaker signals of the left ear are processed by the audio data processing chip of the left ear and then transmitted through the headphone cable to the audio processing chip of the right ear as IIS signals. During the transmission of the IIS signals, the Bluetooth chip located in the right ear serves as the Master and provides the BCLK clock signal to the audio processing chip of the left ear. Correspondingly, the Bluetooth chip in the right ear can be understood as the signal transmitting module 11 in the embodiment of the present invention, and the audio processing chip in the left ear can be understood as the signal receiving module 14 in the embodiment of the present invention.

[0050] Specifically, the headphone 1 can be divided into a left ear and a right ear. The left ear and the right ear are connected by a headphone cable 13. The signal transmitting module 11 and the signal isolation module 12 are located at the same end, and the signal receiving module 14 is located at the other end corresponding to the signal transmitting module 11 and the signal isolation module 12. The input end of the signal isolation module 12 is connected to the output end of the signal transmitting module 11, and the output end of the signal isolation module 12 is connected to the input end of the signal receiving module 14 through the headphone cable 13. That is, after the signal transmitting module 11 generates the first signal to be sent to the signal receiving module 14, the first signal can be externally output through the output end of the signal transmitting module 11. The signal isolation module 12 can receive the first signal through its own input end, and perform signal conversion on the first signal after receiving the first signal to suppress the energy radiation caused by signal overshoot and undershoot to obtain the second signal, and externally output the second signal through the output end of the signal isolation module 12, and transmit the second signal to the input end of the signal receiving module 14 through the headphone cable 13 to complete the final transmission of the first signal generated by the signal transmitting module 11.

[0051] An embodiment of the present utility model provides a head-mounted earphone, comprising: a signal transmitting module, a signal isolation module, a head-mounted wire, and a signal receiving module; the input end of the signal isolation module is connected to the output end of the signal transmitting module, and the output end of the signal isolation module is connected to the input end of the signal receiving module through the head-mounted wire; the signal isolation module is configured to receive a first signal emitted by the signal transmitting module, perform signal conversion on the first signal to suppress overshoot and undershoot to obtain a second signal, and transmit the second signal to the signal receiving module through the head-mounted wire. By adopting the above technical solution, a signal isolation module is added between the signal transmitting module and the head-mounted wire, the isolation of the input and output signals is realized through the signal isolation module, and the suppression of the energy radiation overflow caused by overshoot and undershoot in the first signal emitted by the signal transmitting module is achieved, reducing the externally perceivable radiation value when the audio signal is transmitted between the left and right ears of the head-mounted earphone, so that the head-mounted earphone after reducing the radiation can meet the test requirements and improve the use safety of the produced head-mounted earphone.

[0052] In one embodiment, Figure 3 is a schematic structural diagram of another head-mounted earphone provided by an embodiment of the present utility model. The technical solution of the embodiment of the present utility model is further optimized on the basis of the above-mentioned optional technical solutions. As Figure 3 shown, the head-mounted earphone 1 further includes a filter 15.

[0053] The output end of the signal isolation module 12 is connected to the input end of the filter 15, and the output end of the filter 15 is connected to the head-mounted wire 13;

[0054] The filter 15 is configured to perform filtering adjustment on the second signal, and transmit the obtained third signal to the signal receiving module 14 through the head-mounted wire 13.

[0055] In this embodiment, the filter 15 can be specifically understood as a filter circuit composed of capacitors, inductors, and / or resistors in the head-mounted earphone 1 for filtering out signals of specific frequencies input thereto. Optionally, in the embodiment of the present utility model, the filter 15 can be specifically an RC filter circuit, including a resistor and a capacitor.

[0056] Specifically, since the signal isolation module 12 may cause a relatively long rising edge time of the finally generated second signal during the process of signal conversion of the first signal to obtain the second signal, that is, it cannot maintain the same waveform state as the first signal. Therefore, in the embodiment of the present utility model, a filter 15 is connected after the signal isolation module 12, so that the filter 15 can receive the second signal through its own input end, perform filtering adjustment on the second signal through itself to obtain a third signal with a square waveform, and transmit the third signal to the input end of the signal receiving module 14 through the head-mounted wire 13 to complete the final transmission of the first signal generated by the signal transmitting module 11.

[0057] Exemplarily, Figure 4 FIG. is a circuit diagram example of a signal isolation module and a filter provided by an embodiment of the present invention. As Figure 4 shown, VCC_1 and VCC_2 are the supply voltages of the signal isolation module 12, C101 - C104 are filter capacitors, and the pin VIA is the input end of the signal isolation module 12 in the above embodiment of the present invention, which is used to receive the first signal sent by the signal transmitting module 11. In Figure 4 it is represented by the BCLK signal. The pin VOA is the output end of the signal isolation module 12 in the above embodiment of the present invention, which is used to output the second signal obtained after signal conversion. In Figure 4 it is still represented by the BCLK signal. At the same time, a filter 15 is added after the pin VOA. In Figure 4 taking the RC filter as an example, the capacitor and resistor in the filter 15 are connected in parallel after the pin VOA. The resistance value and capacitance value in the filter 15 can be set to 100Ω and 100nF respectively, or other parameter settings can be made according to actual needs. The embodiment of the present invention does not limit this.

[0058] In one embodiment, Figure 5 FIG. is a schematic structural diagram of another headphone provided by an embodiment of the present invention. The technical solution of the embodiment of the present invention is further optimized on the basis of the above optional technical solutions. As Figure 5 shown, the headband wire 13 in the headphone 1 includes a first signal transmission line 131, a first shielding layer 132, and at least one second signal transmission line 133. Figure 5 Taking one first signal transmission line 131 and the second signal transmission line 133 as an example. It can be understood that Figure 5 only shows the inclusion relationship between the headband wire 13 and the first signal transmission line 131, the first shielding layer 132, and the second signal transmission line 133, and does not limit their relative positional relationship.

[0059] The first shielding layer 132 is disposed outside the first signal transmission line 131 and each second signal transmission line 133.

[0060] Among them, the first signal transmission line 131 is used to transmit the third signal; each second signal transmission line 133 is used to transmit signals other than the third signal.

[0061] In this embodiment, the first signal transmission line 131 can be specifically understood as the line in the headband line 13 for transmitting a first signal. Exemplarily, the first signal transmission line 131 can be the transmission line in the headband line 13 for transmitting the BCLK clock signal. The first shielding layer 132 can be specifically understood as a shielding layer composed of shielding materials with a radiation shielding effect, which is coated outside the transmission line with radiation spillover. Exemplarily, the shielding material can be aluminum foil, enameled wire, etc., and the embodiments of the present invention do not limit this. The second signal transmission line 133 can be specifically understood as the line in the headband line 13 for transmitting signals other than the first signal. Exemplarily, the second signal transmission line 133 can be the transmission line in the headband for transmitting the LRCLK clock signal and the SDATA signal.

[0062] Exemplarily, Figure 6 is a cross-sectional example diagram of a headband line provided by an embodiment of the present invention. As Figure 6 shown, in the embodiment of the present invention, taking a headband line 13 including seven first signal transmission lines 131 and two second signal transmission lines 133 as an example, it can be clearly shown that the first shielding layer 132 as the shielding layer is located outside each first signal transmission line 131 and each second signal transmission line 133, realizing the coating of all signal transmission lines included in the headband line 13.

[0063] In the embodiment of the present invention, by providing a first shielding layer outside each signal transmission line in the headband line that may radiate externally, the signal transmitted in the first signal transmission line can be subjected to secondary radiation suppression during the transmission process after the pre-radiation reduction treatment, reducing the externally perceivable radiation value when the audio signal is transmitted between the left and right ears of the headphone, so that the headphone after reducing radiation can meet the test requirements and improve the use safety of the produced headphone.

[0064] In one embodiment, Figure 7 is a schematic structural diagram of another headphone provided by an embodiment of the present invention. The technical solution of the embodiment of the present invention is further optimized on the basis of the above optional technical solutions. As Figure 7 shown, the headphone 1 further includes a magnetic bead 16.

[0065] The magnetic bead 16 is connected in series between the output end of the signal transmitting module 11 and the input end of the signal isolation module 12.

[0066] Among them, the magnetic bead 16 has the smallest impedance at the transmission frequency point of the first signal.

[0067] Specifically, to minimize the impact of the radiation spillover of the first signal emitted by the signal transmitting module 11 on the production test of the head-mounted earphone 1, that is, it is desired to reduce the radiation of the first signal as much as possible. In the embodiment of the present invention, a magnetic bead 16 is connected in series between the output end of the signal transmitting module 11 and the input end of the signal isolation module 12, so that the first signal is subjected to a radiation reduction process in advance before entering the signal isolation module 12 for signal conversion, so that the second signal output by the signal isolation module 12 can have a lower radiation value. In order to ensure the integrity of the first signal, when selecting the magnetic bead 16, it is necessary to select one that matches the first signal, so that its impedance is as low as possible at the signal transmission frequency point of the first signal. Exemplarily, if the first signal is 4.9 MHz, the impedance of the selected magnetic bead 16 at this frequency point should be as small as possible to avoid affecting the integrity of the first signal.

[0068] In the embodiment of the present invention, by providing a magnetic bead that exists independently and matches the first signal between the signal transmitting module and the signal isolation module, the first signal is subjected to a radiation reduction process before entering the signal isolation module, so that the second signal output by the signal isolation module after signal conversion can have a lower radiation value, reducing the externally perceivable radiation value when the audio signal is transmitted between the left and right ears of the head-mounted earphone, so that the head-mounted earphone after radiation reduction can meet the test requirements and improve the use safety of the produced head-mounted earphone.

[0069] In one embodiment, Figure 8 is a schematic structural diagram of another head-mounted earphone provided by the embodiment of the present invention. The technical solution of the embodiment of the present invention is further optimized on the basis of the above-mentioned optional technical solutions, such as Figure 8 As shown, the head-mounted wire 13 in the head-mounted earphone 1 includes a first signal transmission line 131, a second shielding layer 134, and at least one second signal transmission line 133. Figure 8 Taking one first signal transmission line 131 and one second signal transmission line 133 as an example. It can be understood that Figure 8 only shows the inclusion relationship between the head-mounted wire 13 and the first signal transmission line 131, the second shielding layer 134, and the second signal transmission line 133, and does not limit their relative positional relationship.

[0070] The second shielding layer 134 is independently arranged outside the first signal transmission line 131.

[0071] Among them, the first signal transmission line 131 is used to transmit the third signal; each second signal transmission line 133 is used to transmit signals other than the third signal.

[0072] In this embodiment, the second shielding layer 134 can be specifically understood as a shielding layer composed of a shielding material with a radiation shielding effect that independently wraps around the first signal transmission line 131 for the first signal transmission in the headphone cable 13.

[0073] Exemplarily, Figure 9 FIG. is a cross-sectional view example of a headphone cable provided by an embodiment of the present invention. As Figure 9 shown, in the embodiment of the present invention, taking a headphone cable 13 including seven first signal transmission lines 131 and two second signal transmission lines 133 as an example, it can be clearly shown that the second shielding layer 134 as the shielding layer is respectively located outside each first signal transmission line 131, realizing independent wrapping of the first signal transmission line 131 for transmitting the first signal in the headphone cable 13.

[0074] In the embodiment of the present invention, by providing a second shielding layer outside the first signal transmission line that mainly generates radiation outside the headphone cable, the signal transmitted in the first signal transmission line can be subjected to secondary radiation suppression during transmission after pre-radiation reduction processing, reducing the radiation value that can be perceived by the outside world when the audio signal is transmitted between the left and right ears of the headphone, so that the headphone after reducing radiation can meet the test requirements and improve the use safety of the produced headphone.

[0075] In one embodiment, Figure 10 FIG. is a schematic structural diagram of another headphone provided by an embodiment of the present invention. The technical solution of the embodiment of the present invention is further optimized on the basis of the above optional technical solutions. As Figure 10 shown, the headphone 1 further includes a common-mode inductor 17.

[0076] The common-mode inductor 17 is connected in series between the output end of the filter 15 and the headphone cable 13 for suppressing the overshoot radiation of the third signal.

[0077] In this embodiment, the common-mode inductor 17 can be specifically understood as an electromagnetic compatibility component for suppressing common-mode interference signals, and is used in the embodiment of the present invention to suppress the energy radiation caused by the overshoot of the third signal passing through it.

[0078] Exemplarily, Figure 11 FIG. is a circuit example diagram of a common-mode inductor provided by an embodiment of the present invention. As Figure 11 shown, the common-mode inductor 17 has four pins. Among them, the first pin 171 of the common-mode inductor 17 is connected to the output end of the filter 15; the second pin 172 of the common-mode inductor 17 is connected to the first signal transmission line 131; the third pin 173 of the common-mode inductor 17 is connected to the second shielding layer 134; the fourth pin 174 of the common-mode inductor 17 is grounded.

[0079] In this embodiment, by adding a common-mode inductor between the filter and the first signal transmission line of the headphone cable, the third signal can be subjected to overshoot radiation suppression again before being transmitted through the headphone cable, so that the signal in the first signal transmission line of the headphone cable has a lower radiation value, enabling the radiation to be better shielded by the second shielding layer, reducing the externally perceivable radiation value during the transmission of the audio signal between the left and right ears of the headphone, enabling the headphone after radiation reduction to meet the test requirements, and improving the use safety of the produced headphone.

[0080] Optionally, since the first signal is a signal generated by the signal transmission module 11 based on the driving current input thereto, and the driving current input to the signal transmission module 11 can be configured, and the stronger the driving current, the more severe the overshoot of the generated first signal at the rising edge or falling edge. Therefore, when the integrity of the first signal is satisfied, the driving current of the signal transmission module 11 can be appropriately reduced to reduce the overshoot of the first signal and achieve the purpose of reducing the radiation energy. That is, in the embodiment of the present invention, the driving current corresponding to the signal transmission module 11 can be minimized as much as possible under the condition of the integrity of the first signal to achieve the best reduction effect.

[0081] The above specific embodiments do not limit the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A headset, characterized in that: include: Signal transmitting module, signal isolating module, headset cable and signal receiving module; The input end of the signal isolation module is connected to the output end of the signal transmission module, and the output end of the signal isolation module is connected to the input end of the signal receiving module through the headset wire; The signal isolation module is used to receive the first signal sent by the signal transmission module, and convert the first signal into a second signal by suppressing overshoot and undershoot, and transmit the second signal to the signal receiving module through the headset wire.

2. The headset according to claim 1, characterized in that: Also includes: filter; The output end of the signal isolation module is connected to the input end of the filter, and the output end of the filter is connected to the headset wire; The filter is used to filter and adjust the second signal, and transmit the obtained third signal to the signal receiving module through the headset wire.

3. The headset according to claim 2, characterized in that: The headset cable includes a first signal transmission line, a first shielding layer and at least one second signal transmission line; The first shielding layer is arranged outside the first signal transmission line and each of the second signal transmission lines; The first signal transmission line is used to transmit the third signal; and each of the second signal transmission lines is used to transmit a signal other than the third signal.

4. The headset according to claim 3, characterized in that: Also includes: Magnetic beads; The magnetic beads are connected in series between the output end of the signal transmitting module and the input end of the signal isolating module.

5. The headset according to claim 4, characterized in that: The impedance of the magnetic bead is minimum at the transmission frequency point of the first signal.

6. The headset according to claim 2, characterized in that: The headset cable includes a first signal transmission line, a second shielding layer and at least one second signal transmission line; The second shielding layer is independently arranged outside the first signal transmission line; The first signal transmission line is used to transmit the third signal; and each of the second signal transmission lines is used to transmit a signal other than the third signal.

7. The headset according to claim 6, characterized in that: Also includes: Common mode inductor; The common mode inductor is connected in series between the output end of the filter and the headset cable to suppress overshoot radiation of the third signal.

8. The headset according to claim 7, characterized in that: The first pin of the common mode inductor is connected to the output end of the filter; The second pin of the common mode inductor is connected to the first signal transmission line; The third pin of the common mode inductor is connected to the second shielding layer; The fourth pin of the common mode inductor is grounded.

9. The headset according to any one of claims 1 to 8, characterized in that: The first signal is a signal generated by the signal transmitting module based on the driving current.

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