Thermal diffusion device and electronic apparatus

Abstract

The utility model relates to a thermal diffusion device and electronic equipment. The heat diffusion device includes: a housing having first and second inner surfaces facing each other in a thickness direction and having an internal space; a working medium sealed in the internal space; and a core provided in the inner space, the core including, in the thickness direction, a first core layer and a second core layer adjacent to the second inner surface side of the first core layer, the first core layer being provided with a first through-hole in the thickness direction, the second core layer being provided with a second through-hole in the thickness direction, and the first core layer being provided with a second through-hole in the thickness direction. A second through-hole is formed in the periphery of the first through-hole, a protruding part close to the first inner surface in the thickness direction is located on the periphery of the second through-hole, the second through-hole overlaps with the first through-hole when viewed from the thickness direction, and the distance between the second inner surface and the end of the protruding part located on the first inner surface side in the thickness direction is set to be A1, when the distance between the second inner surface and the end of the first through hole on the second inner surface side is set as B1, the relationship A1 > = B1 is satisfied.

Description

Technical Field

[0001] The utility model relates to a heat diffusion device and an electronic device. Background Art

[0002] In recent years, due to the high integration and high performance of components, the heat generation has increased. In addition, due to the miniaturization of products, the heat generation density has increased. Such a situation is particularly significant in the field of mobile terminals such as smartphones and tablet computers. In light of this, it has become important to take heat dissipation countermeasures.

[0003] As a component for heat dissipation countermeasures, graphite sheets and the like are mostly used, but their heat transfer amount is not sufficient. Therefore, the use of various heat diffusion devices capable of diffusing heat has been studied.

[0004] As an example of such a heat diffusion device, in Patent Document 1, a heat pipe in which three or more cores are stacked in the internal space of a housing is disclosed.

[0005] Patent Document 1: International Publication No. 2022 / 051958

[0006] In a heat pipe, in order to diffuse more heat, it is required to increase the maximum heat transfer amount. As a method for increasing the maximum heat transfer amount of a heat pipe, for example, it is considered to increase the volume of the liquid flow path through which the working medium in the liquid phase passes in the core, specifically, to increase the cross-sectional area of the region where the liquid flow path penetrates the core.

[0007] On the contrary, in the heat pipe described in Patent Document 1, by stacking cores, the cross-sectional area of the region where the liquid flow path penetrates the entire core is increased. However, in the heat pipe described in Patent Document 1, the interface between adjacent cores does not come into contact with the vapor flow path through which the working medium in the vapor phase passes. Therefore, in the heat pipe described in Patent Document 1, at the interface of the core that does not come into contact with the vapor flow path, it is difficult for the working medium in the liquid phase to evaporate and change into the working medium in the vapor phase. Therefore, in the heat pipe described in Patent Document 1, in the entire core, the driving force for driving the working medium in the liquid phase, which is generated by the change of the working medium in the liquid phase into the working medium in the vapor phase, is likely to become weak, and thus the working medium in the liquid phase may be difficult to move.

[0008] As described above, in the heat pipe described in Patent Document 1, even if the cross-sectional area of the region where the liquid flow path penetrates the core is increased by stacking cores, on the contrary, it becomes difficult for the working medium in the liquid phase to move, so it may be difficult to increase the maximum heat transfer amount.

[0009] In addition, the above problem is not limited to heat pipes, but is a common problem of heat diffusion devices that can diffuse heat through the same structure as heat pipes. Summary of the Utility Model

[0010] The present utility model is completed to solve the above problems, and its purpose is to provide a heat diffusion device that can improve the maximum heat transfer amount in a structure with multiple stacked core layers. Additionally, the purpose of the present utility model is to provide an electronic device having the above heat diffusion device.

[0011] The heat diffusion device of the present utility model is characterized by comprising: a housing having a first inner surface and a second inner surface opposed to each other in a thickness direction and provided with an internal space; a working medium enclosed in the internal space of the housing; and a core provided in the internal space of the housing, the core including a first core layer and a second core layer adjacent to the second inner surface side of the first core layer in the thickness direction. In the first core layer, a first through hole is provided in the thickness direction, and a second through hole is provided in the second core layer. A protrusion close to the first inner surface in the thickness direction is located at the periphery of the second through hole. When viewed from the thickness direction, the second through hole overlaps with the first through hole. In the thickness direction, when the distance between the end of the protrusion on the first inner surface side located at the periphery of the second through hole and the second inner surface is set as A1, and the distance between the end of the first through hole on the second inner surface side and the second inner surface is set as B1, the relationship A1≥B1 is satisfied.

[0012] The electronic device of the present utility model is characterized by comprising the heat diffusion device of the present utility model.

[0013] According to the present utility model, it is possible to provide a heat diffusion device that can improve the maximum heat transfer amount in a structure with multiple stacked core layers. Additionally, according to the present utility model, it is possible to provide an electronic device having the above heat diffusion device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a perspective schematic view showing an example of the heat diffusion device according to Embodiment 1 of the present utility model.

[0015] Figure 2 is a plan schematic view showing an example of the internal structure of the heat diffusion device according to Embodiment 1 of the present utility model.

[0016] Figure 3 is showing Figure 2 a cross-sectional schematic view showing an example of the cross-section along line segment a1 - a2 of the heat diffusion device shown.

[0017] Figure 4 is a cross-sectional schematic view showing an enlarged part of the heat diffusion device shown. Figure 3 a cross-sectional schematic view showing an example of a part of the heat diffusion device shown.

[0018] Figure 5It is a cross-sectional schematic diagram showing an example of the cross-section of the thermal diffusion device according to Embodiment 2 of the present utility model.

[0019] Figure 6 It is an enlarged view showing Figure 5 a cross-section of a part of the thermal diffusion device shown.

[0020] Figure 7 It is a plan view showing an example of the internal structure of the thermal diffusion device according to Embodiment 3 of the present utility model.

[0021] Figure 8 It is showing Figure 7 a cross-sectional schematic diagram showing an example of the cross-section of the thermal diffusion device shown along the line segment b1 - b2.

[0022] Figure 9 It is an enlarged view showing Figure 8 a cross-section of a part of the thermal diffusion device shown.

[0023] Figure 10 It is showing Figure 7 a cross-sectional schematic diagram showing an example of the cross-section of the thermal diffusion device shown along the line segment b3 - b4.

[0024] Figure 11 It is a cross-sectional schematic diagram showing an example of the cross-section of the thermal diffusion device according to Embodiment 4 of the present utility model.

[0025] Figure 12 It is an enlarged view showing Figure 11 a cross-section of a part of the thermal diffusion device shown.

[0026] Figure 13 It is a cross-sectional schematic diagram showing an example of another cross-section of the thermal diffusion device according to Embodiment 4 of the present utility model.

[0027] Figure 14 It is a cross-sectional schematic diagram showing an example of the cross-section of the thermal diffusion device according to Embodiment 5 of the present utility model.

[0028] Figure 15 It is an enlarged view showing Figure 14 a cross-section of a part of the thermal diffusion device shown.

[0029] Figure 16 It is a cross-sectional schematic diagram showing an example of the cross-section of the thermal diffusion device according to Embodiment 6 of the present utility model.

[0030] Figure 17 It is an enlarged view showing Figure 16 a cross-section of a part of the thermal diffusion device shown.

[0031] Figure 18 This is a perspective schematic diagram showing an example of the electronic device of the present utility model.

[0032] Explanation of reference numerals in the drawings

[0033] 1, 2, 3, 4, 5, 6... heat spreader (heat diffusion device); 10... housing; 10a... first inner surface; 10b... second inner surface; 11... first sheet; 12... second sheet; 20... working medium; 30... core; 31... first core layer; 32... second core layer; 33... third core layer; 41... first through-hole; 42... second through-hole; 43... third through-hole; 41A, 41B, 41C, 41D, 42A, 42B, 42C, 42D, 43A, 43B, 43C, 43D... through-holes; 51, 51A, 51C, 51D, 52, 52A, 52C, 52D, 53, 53A, 53C, 53D... protrusions; 52a... end portion on the first inner surface side of the protrusion located at the periphery of the second through-hole in the second core layer; 53a... end portion on the first inner surface side of the protrusion located at the periphery of the third through-hole in the third core layer; 100... electronic device; 110... electronic component; 120... device housing; A1... distance between the end portion on the first inner surface side of the protrusion located at the periphery of the second through-hole in the second core layer and the second inner surface; A2... distance between the end portion on the first inner surface side of the protrusion located at the periphery of the third through-hole in the third core layer and the second inner surface; B1... distance between the end portion on the second inner surface side of the first through-hole in the first core layer and the second inner surface; B2... distance between the end portion on the second inner surface side of the second through-hole in the second core layer and the second inner surface; C1... distance between the end portion on the first inner surface side of the through-hole other than the first through-hole in the first core layer and the second inner surface; C2... distance between the end portion on the first inner surface side of the through-hole other than the second through-hole in the second core layer and the second inner surface; D1... distance between the end portion on the first inner surface side of the first through-hole in the first core layer and the second inner surface; D2... distance between the end portion on the first inner surface side of the second through-hole in the second core layer and the second inner surface; EP... evaporation portion; HS... heat source; L... length direction; P1... end portion on the second inner surface side of the first through-hole in the first core layer; P2... end portion on the second inner surface side of the second through-hole in the second core layer; Q1... end portion on the first inner surface side of the through-hole other than the first through-hole in the first core layer; Q2... end portion on the first inner surface side of the through-hole other than the second through-hole in the second core layer; R1... end portion on the first inner surface side of the first through-hole in the first core layer; R2... end portion on the first inner surface side of the second through-hole in the second core layer; T... thickness direction; W... width direction. Detailed implementation manners

[0034] Hereinafter, the heat dissipation device of the present utility model and the electronic device of the present utility model will be described. In addition, the present utility model is not limited to the following structures, and can also be appropriately changed within the scope not departing from the gist of the present utility model. In addition, the present utility model also includes a structure in which a plurality of the following-described preferred structures are combined.

[0035] Each of the following embodiments is illustrative, and of course, partial replacement or combination of the structures shown in different embodiments can be performed. After the second embodiment, the description of matters common to the first embodiment is omitted, and mainly the differences are described. In particular, the same effects brought about by the same structure are not mentioned in each embodiment in turn.

[0036] In the following description, without particularly distinguishing each embodiment, it is simply referred to as "the heat dissipation device of the present utility model" and "the electronic device of the present utility model".

[0037] In each of the following embodiments, as an example of the heat dissipation device of the present utility model, a vapor chamber is shown. The heat dissipation device of the present utility model can also be applied to heat dissipation devices such as heat pipes.

[0038] The following figures are schematic diagrams, and their dimensions, scales of aspect ratios, etc. may sometimes be different from those of actual products.

[0039] In this specification, unless otherwise specified, terms indicating the relationship between elements (such as "parallel", "perpendicular", etc.) and terms indicating the shape of elements not only refer to the strict forms as literally described, but also refer to substantially equivalent ranges, for example, ranges including differences of about several percent.

[0040] [Heat Dissipation Device]

[0041] The heat dissipation device of the present utility model is characterized in that it includes: a housing having a first inner surface and a second inner surface facing each other in the thickness direction and provided with an internal space; a working medium enclosed in the internal space of the housing; and a core body disposed in the internal space of the housing. The core body includes a first core layer and a second core layer adjacent to the second inner surface side of the first core layer in the thickness direction. In the first core layer, a first through hole is provided in the thickness direction, and a second through hole is provided in the second core layer. A protrusion close to the first inner surface in the thickness direction is located at the periphery of the second through hole. When viewed from the thickness direction, the second through hole overlaps with the first through hole. In the thickness direction, when the distance between the end on the first inner surface side of the protrusion located at the periphery of the second through hole and the second inner surface is set as A1, and the distance between the end on the second inner surface side of the first through hole and the second inner surface is set as B1, the relationship of A1≥B1 is satisfied.

[0042] <Embodiment 1>

[0043] In the heat dissipation device of Embodiment 1 of the present utility model, the first core layer is located at the position closest to the first inner surface side in the thickness direction among the core bodies, and the second core layer is located at the position closest to the second inner surface side in the thickness direction among the core bodies.

[0044] Figure 1 It is a three-dimensional schematic diagram showing an example of the heat dissipation device of Embodiment 1 of the present utility model.

[0045] Figure 1 The shown heat pipe (heat dissipation device) 1 has a housing 10.

[0046] The housing 10 is sealed in an airtight state and has a hollow structure.

[0047] A heat source HS as a heating element is provided on the outer surface of the housing 10.

[0048] As the heat source HS, for example, electronic components etc. can be cited.

[0049] In this specification, as Figure 1 etc. show, the length direction, the thickness direction, and the width direction are respectively set as the directions defined by L, T, and W. The length direction L, the thickness direction T, and the width direction W are in a mutually perpendicular relationship. In addition, the direction perpendicular to the thickness direction T and including the length direction L and the width direction W is taken as the plane direction.

[0050] The heat pipe 1 is preferably planar as a whole. That is, the housing 10 is preferably planar as a whole.

[0051] In this specification, planar refers to a shape including a plate-like and a sheet-like shape, and a shape in which the dimensions in the length direction and the dimensions in the width direction are relatively large relative to the dimension in the thickness direction, for example, a shape in which the dimensions in the length direction and the dimensions in the width direction are more than 10 times the dimensions in the thickness direction, preferably more than 100 times.

[0052] The size of the heat spreader 1 is not particularly limited.

[0053] The dimensions of the heat spreader 1 in the length direction L and the width direction W are preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and further preferably 50 mm or more and 200 mm or less.

[0054] The dimension of the heat spreader 1 in the longitudinal direction L and the dimension in the width direction W may be the same as or different from each other.

[0055] The dimension of the heat spreader 1 in the thickness direction T is preferably 50 μm or more and 500 μm or less.

[0056] The dimension of the heat spreader 1 in the longitudinal direction L, the dimension in the thickness direction T, and the dimension in the width direction W are defined as the maximum dimensions in the longitudinal direction L, the thickness direction T, and the width direction W, respectively.

[0057] The frame 10 is preferably composed of a first sheet 11 and a second sheet 12 whose outer edges are joined to each other. In this case, the first sheet 11 and the second sheet 12 may be overlapped so that their ends are aligned with each other or may be overlapped so that their ends are offset from each other.

[0058] Examples of methods for joining the outer edges of the first sheet 11 and the second sheet 12 include laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic bonding, and resin sealing. Among them, laser welding, resistance welding, or brazing is preferred.

[0059] The constituent materials of the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for a heat spreader, such as thermal conductivity, strength, softness, flexibility, etc. The constituent materials of the first sheet 11 and the second sheet 12 are preferably metals, such as copper, nickel, aluminum, magnesium, titanium, iron, and alloys containing at least one of these metals as a main component, and copper or aluminum is particularly preferred.

[0060] The constituent materials of the first sheet 11 and the second sheet 12 may be the same as or different from each other.

[0061] When the constituent materials of the first sheet 11 and the second sheet 12 are different from each other, different functions can be exerted by the first sheet 11 and the second sheet 12. Such functions are not particularly limited, and examples thereof include a heat conduction function, an electromagnetic wave shielding function, and the like.

[0062] The shapes of the first sheet 11 and the second sheet 12 are not particularly limited. For example, the first sheet 11 may be in a flat plate shape with a constant size in the thickness direction T, and the second sheet 12 may be in a shape in which the size in the thickness direction T of the outer edge portion is larger than that of the portion other than the outer edge portion. Alternatively, the first sheet 11 may be in a flat plate shape with a constant size in the thickness direction T, and the second sheet 12 may have a constant size in the thickness direction T and a shape in which the portion other than the outer edge portion protrudes outward with respect to the outer edge portion. In this case, a recess is provided at the outer edge portion of the housing 10. Such a recess at the outer edge portion of the housing 10 can be utilized when the heat spreader 1 is mounted. In addition, other components can be arranged in the recess at the outer edge portion of the housing 10.

[0063] The sizes of the first sheet 11 and the second sheet 12 in the thickness direction T are respectively preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and still more preferably 40 μm or more and 60 μm or less.

[0064] The sizes of the first sheet 11 and the second sheet 12 in the thickness direction T may be the same as each other or different from each other.

[0065] The sizes of the first sheet 11 and the second sheet 12 in the thickness direction T may be the same as a whole or different in part.

[0066] The sizes of the first sheet 11 and the second sheet 12 in the thickness direction T are respectively defined as the maximum sizes in the thickness direction T.

[0067] As the planar shape of the housing 10 when viewed from the thickness direction T, for example, polygons such as triangles and rectangles, circles, ellipses, shapes formed by combining them, and the like can be cited. In addition, the planar shape of the housing 10 may also be an L shape, a C shape (U shape), a stepped shape, or the like. In addition, in the housing 10, a through-hole may be provided in the thickness direction T. The planar shape of the housing 10 may also be a shape corresponding to the use of the heat spreader 1, a shape corresponding to the mounting portion of the heat spreader 1, or a shape corresponding to other components existing nearby.

[0068] The size of the housing 10 is not particularly limited.

[0069] The sizes of the housing 10 in the length direction L and the width direction W are respectively preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and still more preferably 50 mm or more and 200 mm or less.

[0070] The dimensions in the length direction L and the width direction W of the housing 10 may be the same as each other or different from each other.

[0071] The dimension in the thickness direction T of the housing 10 is preferably 50 μm or more and 500 μm or less.

[0072] The dimensions in the length direction L, the thickness direction T, and the width direction W of the housing 10 are respectively defined as the maximum dimensions in the length direction L, the thickness direction T, and the width direction W.

[0073] In Figure 1 , a manner in which the housing 10 is composed of two sheets, i.e., the first sheet 11 and the second sheet 12, is illustrated, but the housing 10 may also be composed of one sheet or may be composed of three or more sheets.

[0074] Figure 2 is a plan view showing an example of the internal structure of the heat diffusion device according to Embodiment 1 of the present utility model. Figure 3 is showing Figure 2 a cross-sectional view showing an example of the cross-section along the line segment a1 - a2 of the heat diffusion device shown. Figure 4 is an enlarged cross-sectional view showing Figure 3 a part of the heat diffusion device shown.

[0075] Figure 2 and Figure 3 The heat pipe 1 shown has a housing 10, a working medium 20, and a wick 30.

[0076] As Figure 3 shown, the housing 10 has a first inner surface 10a and a second inner surface 10b facing each other in the thickness direction T.

[0077] In Figure 3 the example shown, the housing 10 is composed of the first sheet 11 and the second sheet 12, and the inner surface of the first sheet 11 corresponds to the first inner surface 10a of the housing 10, and the inner surface of the second sheet 12 corresponds to the second inner surface 10b of the housing 10.

[0078] An internal space is provided in the housing 10. More specifically, an internal space surrounded by the first inner surface 10a and the second inner surface 10b is provided in the housing 10.

[0079] As Figure 2 shown, the housing 10 preferably has an evaporation portion EP in the internal space.

[0080] The evaporation section EP is a section that evaporates the working medium 20 in a liquid phase described later and changes it into a working medium 20 in a gas phase. More specifically, the evaporation section EP corresponds to the portion near the heat source HS shown in Figure 1 in the internal space of the housing 10, that is, the portion heated by the heat source HS.

[0081] The number of evaporation sections EP corresponds to the number of heat sources HS. As shown in Figure 2 , it can be only one or multiple. That is, only one heat source HS can be provided on the outer surface of the housing 10, or multiple heat sources HS can be provided.

[0082] The heat source HS can be provided on the outer surface of the housing 10 on the side opposite to the first inner surface 10a, which is the outer surface of the first sheet 11 here, or can be provided on the outer surface of the housing 10 on the side opposite to the second inner surface 10b, which is the outer surface of the second sheet 12 here.

[0083] As shown in Figure 2 and Figure 3 , the working medium 20 is sealed in the internal space of the housing 10.

[0084] The working medium 20 is not particularly limited as long as it can cause a gas-liquid phase change in the environment within the housing 10. Examples of the working medium 20 include water, alcohols, and Freon alternatives. The working medium 20 is preferably an aqueous compound, and particularly preferably water.

[0085] As shown in Figure 2 and Figure 3 , the core 30 is provided in the internal space of the housing 10.

[0086] The core 30 has a capillary structure capable of moving the working medium 20 in a liquid phase by capillary force.

[0087] As the capillary structure of the core 30, a known structure used in existing heat diffusion devices (heat pipes, etc.) can be used. Examples of such a capillary structure include a fine structure having irregularities such as pores, grooves, and protrusions, such as a porous structure, a fibrous structure, a groove structure, and a mesh structure.

[0088] The core 30 functions as a liquid delivery section that sucks up and delivers the working medium 20 in a liquid phase by capillary force.

[0089] When viewed from the thickness direction T, the core 30 is preferably continuously provided in the internal space of the housing 10. For example, when viewed from the thickness direction T, the core 30 can be provided in the entire internal space of the housing 10, or can be provided in a part of the internal space of the housing 10.

[0090] The core 30 is preferably made of a porous body.

[0091] Examples of the porous body include sintered compacts, non-woven fabrics, meshes, etched porous plates, fiber bundles, etc.

[0092] Examples of the sintered compact include a metal porous sintered compact, a ceramic porous sintered compact, etc. Among them, a metal porous sintered compact is preferred, and a porous sintered compact of copper or nickel is more preferred.

[0093] Examples of the non-woven fabric include a metal non-woven fabric, etc. When the core 30 is made of a non-woven fabric, it can be manufactured at low cost.

[0094] Examples of the mesh include a metal mesh, a resin mesh, these meshes with a surface coating, etc. Among them, a copper mesh, a stainless steel (SUS) mesh, or a polyester mesh is preferred. When the core 30 is made of a mesh, it can be manufactured at low cost.

[0095] The etched porous plate is manufactured, for example, by etching a flat metal plate. When the core 30 is made of the etched porous plate manufactured in this way, the flatness is excellent.

[0096] The fiber bundle is manufactured, for example, by bundling a plurality of fibers into a linear shape. The fiber bundle functions as a liquid holding part that sucks up and holds the working medium 20 in a liquid phase using capillary force, and also functions as a liquid transport part that transports the sucked-up working medium 20 in a liquid phase.

[0097] When the core 30 is made of a fiber bundle, it is preferably made of a braided fiber bundle. In a braided fiber bundle in which a plurality of fibers are braided, irregularities are likely to exist on the surface. Therefore, when the core 30 is made of a braided fiber bundle, it is easy to transport the working medium 20 in a liquid phase.

[0098] Examples of the fiber constituting the fiber bundle include metal wires such as copper, aluminum, and stainless steel, and non-metal wires such as carbon fibers and glass fibers. Among them, metal wires are preferred because of their high thermal conductivity. For example, a fiber bundle can be formed by bundling about 200 copper wires with a diameter of about 0.03 mm.

[0099] The size of the core 30 in the thickness direction T is preferably 2 μm or more and 200 μm or less, more preferably 5 μm or more and 100 μm or less, and still more preferably 10 μm or more and 40 μm or less.

[0100] The size of the core 30 in the thickness direction T may be the same throughout or may be different in part.

[0101] As Figure 3As shown, the core body 30 includes a first core body layer 31 and a second core body layer 32 adjacent to the second inner surface 10b side of the first core body layer 31 in the thickness direction T. In this way, the core body 30 has a structure in which a plurality of core body layers including the first core body layer 31 and the second core body layer 32 are stacked in the thickness direction T.

[0102] As Figure 3 shown, the first core body layer 31 is located at the position closest to the first inner surface 10a side in the thickness direction T among the core body 30. In addition, as Figure 3 shown, the second core body layer 32 is located at the position closest to the second inner surface 10b side in the thickness direction T among the core body 30. That is, in the heat pipe 1, the core body 30 has a structure in which two core body layers, the first core body layer 31 and the second core body layer 32, are stacked in the thickness direction T.

[0103] As Figure 3 shown, the region between the first core body layer 31 and the second inner surface 10b constitutes a liquid flow path of the working medium 20 mainly containing a liquid phase.

[0104] As long as the liquid flow path is a region where it can be said that the working medium 20 mainly exists in a liquid phase, it may also include the working medium 20 in a gas phase.

[0105] As described above, in the heat pipe 1, the capillary force with respect to the working medium 20 in the liquid phase is exhibited by the core body 30, and a liquid flow path of the working medium 20 in the liquid phase is formed, whereby the conveyance of the working medium 20 in the liquid phase can be controlled.

[0106] In the internal space of the housing 10, the region other than the liquid flow path constitutes a vapor flow path mainly containing the working medium 20 in a gas phase. In Figure 3 the example shown, the region between the core body 30 and the first inner surface 10a, specifically, the region between the first core body layer 31 and the first inner surface 10a constitutes a vapor flow path mainly containing the working medium 20 in a gas phase.

[0107] As long as the vapor flow path is a region where it can be said that the working medium 20 mainly exists in a gas phase, it may also include the working medium 20 in a liquid phase.

[0108] As Figure 3 shown, in the thickness direction T, the distance between the core body 30 and the first inner surface 10a is preferably greater than the distance between the core body 30 and the second inner surface 10b. That is, in the thickness direction T, the distance between the core body layer closest to the first inner surface 10a side among the core body 30 and the first inner surface 10a is preferably greater than the distance between the core body layer closest to the second inner surface 10b side among the core body 30 and the second inner surface 10b. In Figure 3In the example shown, in the thickness direction T, the distance between the first core layer 31 and the first inner surface 10a is greater than the distance between the second core layer 32 and the second inner surface 10b. Thus, if in the thickness direction T, the distance between the core 30 and the first inner surface 10a is greater than the distance between the core 30 and the second inner surface 10b, the region between the core 30 and the first inner surface 10a is likely to function as a vapor flow path.

[0109] Hereinafter, the details of each core layer constituting the core 30 will be described.

[0110] As Figure 3 and Figure 4 shown, in the first core layer 31, first through-holes 41 are provided in the thickness direction T.

[0111] The first through-holes 41 exhibit a capillary force with respect to the working medium 20. That is, the working medium 20 moves inside the first through-holes 41 by capillary force.

[0112] As the cross-sectional shape of the first through-holes 41 when observing a cross-section perpendicular to the thickness direction T, there is no particular limitation, and for example, polygons such as triangles and rectangles, circles, ellipses, shapes formed by combining them, etc. can be cited.

[0113] In Figure 3 the example shown, a plurality of first through-holes 41 are provided, but when observing a cross-section perpendicular to the thickness direction T, the cross-sectional shapes of the plurality of first through-holes 41 may be the same as each other, may be different from each other, or may be partially different.

[0114] The cross-sectional shape of the first through-holes 41 when observing a cross-section along the thickness direction T is not particularly limited. For example, as Figure 3 and Figure 4 shown, it may be a shape in which the diameter of the first through-holes 41 (the dimension in the width direction W in Figure 3 and Figure 4 becomes smaller as it approaches the first inner surface 10a, or it may be a shape in which the diameter of the first through-holes 41 becomes larger. In addition, the cross-sectional shape of the first through-holes 41 when observing a cross-section along the thickness direction T may also be a shape in which the diameter of the first through-holes 41 is constant as it approaches the first inner surface 10a.

[0115] In Figure 3 the example shown, a plurality of first through-holes 41 are provided, but when observing a cross-section along the thickness direction T, the cross-sectional shapes of the plurality of first through-holes 41 may be the same as each other, may be different from each other, or may be partially different.

[0116] The size of the first through-hole 41 is not particularly limited. For example, the size of the first through-hole 41 in the plane direction (e.g., the length direction L or the width direction W) is not particularly limited.

[0117] In Figure 3 the example shown, a plurality of first through-holes 41 are provided, but the sizes of the plurality of first through-holes 41 may be the same as each other, may be different from each other, or may be partially different. For example, the sizes of the plurality of first through-holes 41 in the plane direction (e.g., the length direction L or the width direction W) may be the same as each other, may be different from each other, or may be partially different.

[0118] The size, shape, number, arrangement, etc. of the first through-hole 41 may also be different from the Figure 3 example shown in an actual product.

[0119] As Figure 3 and Figure 4 shown, it is preferable that the protruding portion 51 close to the first inner surface 10a in the thickness direction T is located at the periphery of the first through-hole 41.

[0120] The protruding portion 51 is preferably located at the entire periphery of the first through-hole 41.

[0121] In addition, the protruding portion 51 may also be located at a part of the periphery of the first through-hole 41.

[0122] In Figure 3 the example shown, a plurality of first through-holes 41 are provided, and accordingly there are a plurality of protruding portions 51, but it is preferable that all of the plurality of protruding portions 51 are located at the entire periphery of the first through-hole 41. It is also possible that a part of the plurality of protruding portions 51 is located at the entire periphery of the first through-hole 41. In this way, at least a part of the plurality of protruding portions 51 may be located at the entire periphery of the first through-hole 41.

[0123] As Figure 3 shown, it is preferable that the protruding portion 51 does not contact the first inner surface 10a in the thickness direction T. That is, the protruding portion 51 is preferably separated from the first inner surface 10a in the thickness direction T.

[0124] In addition, the protruding portion 51 may also contact the first inner surface 10a in the thickness direction T.

[0125] In Figure 3 the example shown, there are a plurality of protruding portions 51, but it is preferable that all of the plurality of protruding portions 51 are separated from the first inner surface 10a in the thickness direction T. It is also possible that a part of the plurality of protruding portions 51 is separated from the first inner surface 10a in the thickness direction T. In this way, at least one of the plurality of protruding portions 51 may be separated from the first inner surface 10a in the thickness direction T.

[0126] When observing the cross-sectional shape of the protrusion 51 along the thickness direction T, there is no particular limitation, such as Figure 3 and Figure 4 as shown, it can be a shape in which the distance between the inner surfaces of the protrusion 51 (the distance in the width direction W in Figure 3 and Figure 4 ) decreases as it approaches the first inner surface 10a, or it can be a shape in which the distance between the inner surfaces of the protrusion 51 increases. In addition, the cross-sectional shape of the protrusion 51 can also be a shape in which the distance between the inner surfaces of the protrusion 51 is constant as it approaches the first inner surface 10a.

[0127] At the end of the protrusion 51 on the side of the first inner surface 10a, it can bend toward the first through-hole 41 side (inside), or it can bend toward the side opposite to the first through-hole 41 (outside).

[0128] In Figure 3 the example shown, there are multiple protrusions 51, but when observing the cross-sectional shape along the thickness direction T, the cross-sectional shapes of the multiple protrusions 51 can be the same as each other, can be different from each other, or can be partially different.

[0129] There is no particular limitation on the size of the protrusion 51. For example, the dimension of the protrusion 51 in the thickness direction T can be larger than the dimension of the surface direction (e.g., the length direction L or the width direction W) of the first through-hole 41, can be smaller than the dimension of the surface direction of the first through-hole 41, or can be the same as the dimension of the surface direction of the first through-hole 41.

[0130] In Figure 3 the example shown, there are multiple protrusions 51, but the sizes of the multiple protrusions 51 can be the same as each other, can be different from each other, or can be partially different. For example, the dimensions of the multiple protrusions 51 in the thickness direction T can be the same as each other, can be different from each other, or can be partially different.

[0131] The dimensions, shapes, arrangements, etc. of the protrusion 51 can also be different from those in the example Figure 3 shown in actual products.

[0132] In addition, the protrusion may not be located at the periphery of the first through-hole 41. Specifically, a protrusion that is close to the first inner surface 10a or the second inner surface 10b in the thickness direction T may not be located at the periphery of the first through-hole 41.

[0133] As Figure 3 and Figure 4 shown, in the first core layer 31, in addition to the first through-hole 41, a through-hole 41A that does not overlap with the second through-hole 42 described later when observed from the thickness direction T may also be provided.

[0134] As Figure 3 and Figure 4 shown, the protrusion 51A close to the second inner surface 10b in the thickness direction T may also be located at the periphery of the through hole 41A.

[0135] The protrusion 51A is preferably located at the entire periphery of the through hole 41A.

[0136] In addition, the protrusion 51A may also be located at a part of the periphery of the through hole 41A.

[0137] In Figure 3 the example shown, a plurality of through holes 41A are provided, and there are a plurality of protrusions 51A accordingly. However, it is preferable that all of the plurality of protrusions 51A are located at the entire periphery of the through hole 41A. It is also possible that a part of the plurality of protrusions 51A are located at the entire periphery of the through hole 41A. Thus, at least a part of the plurality of protrusions 51A may be located at the entire periphery of the through hole 41A.

[0138] The cross-sectional shape of the protrusion 51A when observing the cross-section along the thickness direction T is not particularly limited. As Figure 3 and Figure 4 shown, it may be a shape in which the distance between the inner surfaces of the protrusion 51A (the distance in the width direction W in Figure 3 and Figure 4 becomes smaller as it approaches the second inner surface 10b, or it may be a shape in which the distance between the inner surfaces of the protrusion 51A becomes larger. In addition, the cross-sectional shape of the protrusion 51A may be a shape in which the distance between the inner surfaces of the protrusion 51A is constant as it approaches the second inner surface 10b.

[0139] At the end of the protrusion 51A on the second inner surface 10b side, it may bend toward the through hole 41A side (inside), or it may bend toward the side opposite to the through hole 41A (outside).

[0140] In Figure 3 the example shown, there are a plurality of protrusions 51A. However, when observing the cross-section along the thickness direction T, the cross-sectional shapes of the plurality of protrusions 51A may be the same as each other, may be different from each other, or may be partially different.

[0141] The size of the protrusion 51A is not particularly limited. For example, the dimension of the protrusion 51A in the thickness direction T may be larger than the dimension of the through hole 41A in the plane direction (e.g., the length direction L or the width direction W), may be smaller than the dimension of the through hole 41A in the plane direction, or may be the same as the dimension of the through hole 41A in the plane direction.

[0142] In Figure 3In the example shown, there are multiple protrusions 51A. The sizes of the multiple protrusions 51A can be the same as each other, different from each other, or some can be different. For example, the dimensions in the thickness direction T of the multiple protrusions 51A can be the same as each other, different from each other, or some can be different.

[0143] The size, shape, configuration, etc. of the protrusion 51A can also be different from those in the Figure 3 example shown in the actual product.

[0144] As Figure 3 and Figure 4 shown, in the first core layer 31, in addition to the first through-hole 41, a through-hole 41B that does not overlap with the second through-hole 42 described later when viewed in the thickness direction T can also be provided.

[0145] As Figure 3 and Figure 4 shown, the protrusion may not be located at the periphery of the through-hole 41B. Specifically, the protrusion close to the first inner surface 10a or the second inner surface 10b in the thickness direction T may not be located at the periphery of the through-hole 41B.

[0146] As Figure 3 and Figure 4 shown, in the second core layer 32, a second through-hole 42 is provided in the thickness direction T.

[0147] The second through-hole 42 exhibits capillary force with respect to the working medium 20. That is, the working medium 20 moves inside the second through-hole 42 by capillary force.

[0148] Other features of the second through-hole 42 are the same as those of the first through-hole 41.

[0149] As Figure 3 and Figure 4 shown, the protrusion 52 close to the first inner surface 10a in the thickness direction T is located at the periphery of the second through-hole 42.

[0150] The protrusion 52 is preferably located at the entire periphery of the second through-hole 42.

[0151] In addition, the protrusion 52 can also be located at a part of the periphery of the second through-hole 42.

[0152] In Figure 3In the example shown, a plurality of second through holes 42 are provided, and accordingly there are a plurality of protrusions 52. However, it is preferable that all of the plurality of protrusions 52 are located on the entire circumference of the second through hole 42. It is also possible that a part of the plurality of protrusions 52 are located on the entire circumference of the second through hole 42. In this way, at least a part of the plurality of protrusions 52 can be located on the entire circumference of the second through hole 42.

[0153] As Figure 3 shown, the protrusion 52 preferably does not contact the first inner surface 10a in the thickness direction T. That is, the protrusion 52 is preferably separated from the first inner surface 10a in the thickness direction T.

[0154] In addition, the protrusion 52 may also contact the first inner surface 10a in the thickness direction T.

[0155] In Figure 3 the example shown, there are a plurality of protrusions 52. However, it is preferable that all of the plurality of protrusions 52 are separated from the first inner surface 10a in the thickness direction T. It is also possible that a part of the plurality of protrusions 52 are separated from the first inner surface 10a in the thickness direction T. In this way, at least one of the plurality of protrusions 52 can be separated from the first inner surface 10a in the thickness direction T.

[0156] The cross-sectional shape of the protrusion 52 when observing the cross-section along the thickness direction T is not particularly limited. As Figure 3 and Figure 4 shown, it may be a shape in which the distance between the inner surfaces of the protrusion 52 (the distance in the width direction W in Figure 3 and Figure 4 becomes smaller as it approaches the first inner surface 10a, or it may be a shape in which the distance between the inner surfaces of the protrusion 52 becomes larger. In addition, the cross-sectional shape of the protrusion 52 may also be a shape in which the distance between the inner surfaces of the protrusion 52 is constant as it approaches the first inner surface 10a.

[0157] At the end of the protrusion 52 on the side of the first inner surface 10a, it may bend toward the second through hole 42 side (inside), or it may bend toward the side opposite to the second through hole 42 (outside).

[0158] In Figure 3 the example shown, there are a plurality of protrusions 52. However, when observing the cross-section along the thickness direction T, the cross-sectional shapes of the plurality of protrusions 52 may be the same as each other, may be different from each other, or may be partially different.

[0159] The size of the protruding portion 52 is not particularly limited. For example, the dimension in the thickness direction T of the protruding portion 52 may be larger than the dimension in the plane direction (e.g., the length direction L or the width direction W) of the second through-hole 42, may be smaller than the dimension in the plane direction of the second through-hole 42, or may be the same as the dimension in the plane direction of the second through-hole 42.

[0160] In Figure 3 In the example shown, there are a plurality of protruding portions 52, but the sizes of the plurality of protruding portions 52 may be the same as each other, may be different from each other, or may be partially different. For example, the dimensions in the thickness direction T of the plurality of protruding portions 52 may be the same as each other, may be different from each other, or may be partially different.

[0161] The size, shape, arrangement, etc. of the protruding portion 52 may also be different from those in the Figure 3 example shown in actual products.

[0162] As Figure 3 and Figure 4 shown, in the second core layer 32, in addition to the second through-hole 42, a through-hole 42A that does not overlap with the first through-hole 41 when viewed in the thickness direction T may also be provided.

[0163] As Figure 3 and Figure 4 shown, the protruding portion 52A that is close to the second inner surface 10b in the thickness direction T may also be located on the periphery of the through-hole 42A.

[0164] As Figure 3 shown, the protruding portion 52A preferably contacts the second inner surface 10b in the thickness direction T. In this case, the core 30 is supported by the protruding portion 52A.

[0165] When the protruding portion 52A contacts the second inner surface 10b in the thickness direction T, the protruding portion 52A may be fixed or not fixed relative to the second inner surface 10b. For example, the protruding portion 52A may be joined to the second inner surface 10b or may not be joined. As a joining method of the protruding portion 52A and the second inner surface 10b, for example, diffusion bonding, ultrasonic bonding, spot welding, etc. may be cited.

[0166] In Figure 3 the example shown, there are a plurality of protruding portions 52A, but it is preferable that all of the plurality of protruding portions 52A contact the second inner surface 10b in the thickness direction T. It is also possible that a part of the plurality of protruding portions 52A contact the second inner surface 10b in the thickness direction T. In this way, at least one of the plurality of protruding portions 52A can contact the second inner surface 10b in the thickness direction T.

[0167] In the case where the plurality of protrusions 52A are in contact with the second inner surface 10b in the thickness direction T, at least one of the plurality of protrusions 52A can be fixed to the second inner surface 10b. For example, at least one of the plurality of protrusions 52A can be joined to the second inner surface 10b. More specifically, all of the plurality of protrusions 52A can be joined to the second inner surface 10b, or a part of the protrusions 52A can be joined to the second inner surface 10b.

[0168] In addition, the protrusion 52A may not be in contact with the second inner surface 10b in the thickness direction T. That is, the protrusion 52A may be separated from the second inner surface 10b in the thickness direction T.

[0169] Other features of the protrusion 52A are the same as those of the protrusion 51A.

[0170] When viewed from the thickness direction T, the through-hole 42A can overlap with the through-hole 41A.

[0171] In addition, when viewed from the thickness direction T, the through-hole 42A may not overlap with the through-hole 41A.

[0172] Other features of the through-hole 42A are the same as those of the through-hole 41A.

[0173] As Figure 3 and Figure 4 shown, in the second core layer 32, in addition to the second through-hole 42, a through-hole 42B that does not overlap with the first through-hole 41 when viewed from the thickness direction T may also be provided.

[0174] As Figure 3 and Figure 4 shown, the protrusion may not be located on the periphery of the through-hole 42B. Specifically, the protrusion close to the first inner surface 10a or the second inner surface 10b in the thickness direction T may not be located on the periphery of the through-hole 42B.

[0175] When viewed from the thickness direction T, the through-hole 42B can overlap with the through-hole 41B.

[0176] In addition, when viewed from the thickness direction T, the through-hole 42B may not overlap with the through-hole 41B.

[0177] Other features of the through-hole 42B are the same as those of the through-hole 41B.

[0178] As Figure 3 and Figure 4 shown, in each core layer, there is a flat portion between the through-holes (including the first through-hole 41, the second through-hole 42, etc.).

[0179] When viewed from the thickness direction T, the second through hole 42 overlaps with the first through hole 41.

[0180] As Figure 3 and Figure 4 shown, in the thickness direction T, when the distance between the end 52a on the first inner surface 10a side of the protrusion 52 located on the periphery of the second through hole 42 and the second inner surface 10b is set as A1, and the distance between the end P1 on the second inner surface 10b side of the first through hole 41 and the second inner surface 10b is set as B1, the relationship of A1≥B1 is satisfied. In Figure 3 and Figure 4 the example shown, the relationship of A1>B1 is satisfied.

[0181] In other words, when defining the height with the second inner surface 10b as the reference in the thickness direction T, as Figure 3 and Figure 4 shown, in the thickness direction T, the end 52a on the first inner surface 10a side of the protrusion 52 located on the periphery of the second through hole 42 is located at the same height as the end P1 on the second inner surface 10b side of the first through hole 41, or is located at a height closer to the first inner surface 10a side than the end P1 on the second inner surface 10b side of the first through hole 41. In Figure 3 and Figure 4 the example shown, in the thickness direction T, the end 52a on the first inner surface 10a side of the protrusion 52 is located at a height closer to the first inner surface 10a side than the end P1 on the second inner surface 10b side of the first through hole 41.

[0182] In the heat pipe 1, since the first core layer 31 is in contact with the vapor flow path formed by the region between the first core layer 31 and the first inner surface 10a, the liquid-phase working medium 20 contained in the first core layer 31, preferably the liquid-phase working medium 20 contained in the region between the first core layer 31 and the second core layer 32, can evaporate (also referred to as transpiration) and change into the gas-phase working medium 20 and move to the vapor flow path.

[0183] On the other hand, in the heat pipe 1, a second core layer 32 is further laminated with respect to the first core layer 31 and is adjacent to the second inner surface 10b side of the first core layer 31. Here, in an existing heat pipe in which only a plurality of core layers are laminated, a core layer far from the vapor flow path is structured such that it does not contact the vapor flow path at the interface with an adjacent core layer. Therefore, in an existing heat pipe in which a plurality of core layers are laminated, the liquid-phase working medium contained in the core layer far from the vapor flow path is difficult to evaporate and change into a gas-phase working medium. Therefore, in an existing heat pipe in which a plurality of core layers are laminated, in the core layer far from the vapor flow path, the driving force for driving the liquid-phase working medium, which is generated by the change of the liquid-phase working medium into a gas-phase working medium, easily becomes weak, and thus the liquid-phase working medium may be difficult to move.

[0184] In contrast, in the heat pipe 1, the second through-hole 42 provided in the second core layer 32 far from the vapor flow path overlaps with the first through-hole 41 provided in the first core layer 31 in contact with the vapor flow path in such a manner as to satisfy the above distance (height) relationship, whereby the second through-hole 42 is connected to the first through-hole 41. Therefore, in the heat pipe 1, the liquid-phase working medium 20 contained in the second core layer 32, preferably the liquid-phase working medium 20 contained in the region between the second core layer 32 and the second inner surface 10b, easily passes through the second through-hole 42, and then through the first through-hole 41 connected to the second through-hole 42, evaporates and changes into a gas-phase working medium 20 and moves toward the vapor flow path.

[0185] Thereby, in the heat pipe 1, not only in the first core layer 31 but also in the second core layer 32, it is possible to ensure the driving force for driving the liquid-phase working medium 20 generated by the change of the liquid-phase working medium 20 into a gas-phase working medium 20. Therefore, in the heat pipe 1, even when the first core layer 31 and the second core layer 32 are laminated, the function of moving the liquid-phase working medium 20 by capillary force is not easily impaired in the first core layer 31 and is also not easily impaired in the second core layer 32. Therefore, in the heat pipe 1, by laminating the first core layer 31 and the second core layer 32, the cross-sectional area of the region where the liquid flow path penetrates the core 30 becomes larger, and accordingly, the maximum heat transfer amount is easily increased.

[0186] As described above, according to the heat pipe 1, it is possible to realize a heat diffusion device capable of increasing the maximum heat transfer amount in a structure in which a plurality of core layers are laminated.

[0187] In the heat pipe 1, a structure in which the first through-hole 41 and the second through-hole 42 overlap in a manner that satisfies the above-described distance (height) relationship is achieved, for example, by adjusting the positional relationship between the first core layer 31 and the second core layer 32 in the core 30 having a structure in which the first core layer 31 and the second core layer 32 are laminated in the thickness direction T, such that after the first through-hole 41 and the second through-hole 42 overlap, stamping is performed simultaneously from both the first core layer 31 side and the second core layer 32 side. The method for achieving a structure in which the first through-hole 41 and the second through-hole 42 overlap in a manner that satisfies the above-described distance (height) relationship is not limited to the above-described stamping method.

[0188] As Figure 3 and Figure 4 shown, in the first core layer 31, in addition to the first through-hole 41, when there is a through-hole 41A or a through-hole 41B that does not overlap with the second through-hole 42 when viewed in the thickness direction T, preferably in the thickness direction T, when the distance between the end Q1 on the first inner surface 10a side of the through-hole 41A or the through-hole 41B other than the first through-hole 41 of the first core layer 31 and the second inner surface 10b is set to C1, the relationship A1≥C1 is satisfied. In Figure 3 and Figure 4 the example shown, the relationship A1>C1 is satisfied.

[0189] In other words, as Figure 3 and Figure 4 shown, in the first core layer 31, in addition to the first through-hole 41, when there is a through-hole 41A or a through-hole 41B that does not overlap with the second through-hole 42 when viewed in the thickness direction T, in the thickness direction T, the end 52a on the first inner surface 10a side of the protruding portion 52 located at the periphery of the second through-hole 42 preferably lies at the same height as the end Q1 on the first inner surface 10a side of the through-hole 41A or the through-hole 41B of the first core layer 31, or at a height closer to the first inner surface 10a side than the end Q1 on the first inner surface 10a side of the through-hole 41A or the through-hole 41B of the first core layer 31. In Figure 3 and Figure 4 the example shown, in the thickness direction T, the end 52a on the first inner surface 10a side of the protruding portion 52 lies at a height closer to the first inner surface 10a side than the end Q1 on the first inner surface 10a side of the through-hole 41A or the through-hole 41B.

[0190] In the heat pipe 1, the second through hole 42 overlaps with the first through hole 41 in such a manner as to satisfy the above-described distance (height) relationship. As a result, the working medium 20 in the liquid phase contained in the second core layer 32, preferably the working medium 20 in the liquid phase contained in the region between the second core layer 32 and the second inner surface 10b, more easily passes through the second through hole 42, and then through the first through hole 41, evaporates to change into the working medium 20 in the gas phase, and moves toward the vapor flow path. Therefore, in the heat pipe 1, the function of moving the working medium 20 in the liquid phase by capillary force is less likely to be impaired in the second core layer 32. As a result, the maximum heat transfer amount is more easily increased.

[0191] In Figure 3 and Figure 4 In the example shown, the distance between the end on the first inner surface 10a side of the through hole 41A and the second inner surface 10b and the distance between the end on the first inner surface 10a side of the through hole 41B and the second inner surface 10b are the distance C1 and are the same as each other. In other words, in Figure 3 and Figure 4 In the example shown, the ends on the first inner surface 10a side of the through hole 41A and the through hole 41B are the ends Q1 and are located at the same height.

[0192] In addition, the distance between the end on the first inner surface 10a side of the through hole 41A and the second inner surface 10b and the distance between the end on the first inner surface 10a side of the through hole 41B and the second inner surface 10b may be different from each other. In other words, the ends on the first inner surface 10a side of the through hole 41A and the through hole 41B may also be located at different heights. In this case, the end on the first inner surface 10a side of the through hole 41A may be located at a height closer to the first inner surface 10a than the end on the first inner surface 10a side of the through hole 41B, or may be located at a height closer to the second inner surface 10b than the end on the first inner surface 10a side of the through hole 41B.

[0193] In the case where the ends on the first inner surface 10a side of the through hole 41A and the through hole 41B are located at different heights, in the thickness direction T, the end 52a on the first inner surface 10a side of the protruding portion 52 may also be located at the same height as the end on the first inner surface 10a side of the through hole 41A, or may be located at a height closer to the first inner surface 10a than the end on the first inner surface 10a side of the through hole 41A. Alternatively, in the thickness direction T, the end 52a on the first inner surface 10a side of the protruding portion 52 may also be located at the same height as the end on the first inner surface 10a side of the through hole 41B, or may be located at a height closer to the first inner surface 10a than the end on the first inner surface 10a side of the through hole 41B.

[0194] As Figure 3 and Figure 4As shown, at least a part of the inner surface of the protruding portion 51 located on the periphery of the first through hole 41 preferably contacts at least a part of the outer surface of the protruding portion 52 located on the periphery of the second through hole 42. In Figure 3 and Figure 4 In the example shown, a part of the inner surface of the protruding portion 51 contacts a part of the outer surface of the protruding portion 52.

[0195] When at least a part of the inner surface of the protruding portion 51 contacts at least a part of the outer surface of the protruding portion 52, the first core layer 31 and the second core layer 32 are joined to each other by being riveted by the protruding portion 51 and the protruding portion 52, for example. Thereby, the positional relationship between the first core layer 31 and the second core layer 32 is not easily deviated.

[0196] In addition, the inner surface of the protruding portion 51 may not contact the outer surface of the protruding portion 52.

[0197] The heat pipe 1 operates as follows, for example.

[0198] In the heat pipe 1, the working medium 20 in the liquid phase evaporates by absorbing heat from the heat source HS in the core 30 and the liquid flow path in the region near the evaporation section EP, and changes into the working medium 20 in the gas phase. Then, the working medium 20 in the gas phase generated in the evaporation section EP moves through the vapor flow path to a region away from the evaporation section EP, for example, to the periphery of the end portion on the side opposite to the evaporation section EP in the length direction L of the vapor flow path, and is cooled in this end portion periphery and changes into the working medium 20 in the liquid phase. Hereinafter, the portion where the working medium 20 in the gas phase is condensed and changed into the working medium 20 in the liquid phase is referred to as the condensation section. The condensation section is likely to be located in a region away from the evaporation section EP, for example, at the periphery of the end portion on the side opposite to the evaporation section EP in the length direction L of the internal space of the housing 10. Then, the working medium 20 in the liquid phase generated in the condensation section is recovered into the core 30 and the liquid flow path and then transported to the evaporation section EP.

[0199] In the heat pipe 1, by repeating the above process, the working medium 20 undergoes a gas-liquid phase change and circulates. At this time, the heat from the heat source HS is absorbed as the latent heat of vaporization for changing the working medium 20 in the liquid phase into the working medium 20 in the gas phase in the evaporation section EP, and is released as the latent heat of condensation for changing the working medium 20 in the gas phase into the working medium 20 in the liquid phase in the condensation section (for example, in a region away from the evaporation section EP in the length direction L). In this way, the heat pipe 1 operates independently without external power, and furthermore, by utilizing the latent heat of vaporization and the latent heat of condensation of the working medium 20, the heat from the heat source HS can be diffused two-dimensionally and at high speed.

[0200] <Embodiment 2>

[0201] In the heat dissipation device according to Embodiment 2 of the present utility model, the core further includes a third core layer adjacent to the second inner surface side of the second core layer in the thickness direction.

[0202] In the heat dissipation device according to Embodiment 2 of the present utility model, the first core layer is located at the position closest to the first inner surface side in the thickness direction among the cores, and the third core layer is located at the position closest to the second inner surface side in the thickness direction among the cores.

[0203] The heat dissipation device according to Embodiment 2 of the present utility model is the same as the heat dissipation device according to Embodiment 1 of the present utility model except for the above point.

[0204] Figure 5 It is a cross-sectional schematic diagram showing an example of the cross-section of the heat dissipation device according to Embodiment 2 of the present utility model. Figure 6 It is an enlarged view showing Figure 5 a cross-sectional schematic diagram of a part of the heat dissipation device shown.

[0205] In addition, Figure 5 it represents Figure 3 a cross-section at the position corresponding to

[0206] In Figure 5 the heat pipe 2 shown, the core 30 further includes a third core layer 33 adjacent to the second inner surface 10b side of the second core layer 32 in the thickness direction T.

[0207] As Figure 5 shown, the first core layer 31 is located at the position closest to the first inner surface 10a side in the thickness direction T among the cores 30. In addition, as Figure 5 shown, the third core layer 33 is located at the position closest to the second inner surface 10b side in the thickness direction T among the cores 30. That is, in the heat pipe 2, the core 30 has a structure in which the three core layers of the first core layer 31, the second core layer 32, and the third core layer 33 are stacked in the thickness direction T.

[0208] As Figure 5 and Figure 6 shown, in the third core layer 33, preferably, third through holes 43 are provided in the thickness direction T.

[0209] The third through holes 43 exhibit capillary force with respect to the working medium 20. That is, the working medium 20 moves inside the third through holes 43 by capillary force.

[0210] Other features of the third through holes 43 are the same as those of the first through holes 41 and the second through holes 42.

[0211] As Figure 5 and Figure 6As shown, the protrusion 53 preferably located closer to the first inner surface 10a in the thickness direction T is positioned at the periphery of the third through-hole 43.

[0212] The protrusion 53 is preferably located at the entire periphery of the third through-hole 43.

[0213] In addition, the protrusion 53 may also be located at a part of the periphery of the third through-hole 43.

[0214] In the case where multiple third through-holes 43 are provided and there are multiple protrusions 53 accordingly, it is preferable that all of the protrusions 53 among the multiple protrusions 53 are located at the entire periphery of the third through-hole 43. It is also possible that a part of the protrusions 53 among the multiple protrusions 53 are located at the entire periphery of the third through-hole 43. In this way, at least a part of the protrusions 53 among the multiple protrusions 53 can be located at the entire periphery of the third through-hole 43.

[0215] As Figure 5 shown, the protrusion 53 is preferably not in contact with the first inner surface 10a in the thickness direction T. That is, the protrusion 53 is preferably separated from the first inner surface 10a in the thickness direction T.

[0216] In addition, the protrusion 53 may also be in contact with the first inner surface 10a in the thickness direction T.

[0217] In the case where there are multiple protrusions 53, it is preferable that all of the protrusions 53 among the multiple protrusions 53 are separated from the first inner surface 10a in the thickness direction T. It is also possible that a part of the protrusions 53 among the multiple protrusions 53 are separated from the first inner surface 10a in the thickness direction T. In this way, at least one of the protrusions 53 among the multiple protrusions 53 can be separated from the first inner surface 10a in the thickness direction T.

[0218] When observing the cross-sectional shape of the protrusion 53 along the thickness direction T, there is no particular limitation. As Figure 5 and Figure 6 shown, it may be a shape in which the distance between the inner surfaces of the protrusion 53 (the distance in the width direction W in Figure 5 and Figure 6 ) becomes smaller as it approaches the first inner surface 10a, or it may be a shape in which the distance between the inner surfaces of the protrusion 53 becomes larger. In addition, the cross-sectional shape of the protrusion 53 may also be a shape in which the distance between the inner surfaces of the protrusion 53 remains constant as it approaches the first inner surface 10a.

[0219] At the end of the protrusion 53 on the side of the first inner surface 10a, it may bend toward the third through-hole 43 side (inside), or it may bend toward the side opposite to the third through-hole 43 (outside).

[0220] In the case where there are a plurality of protrusions 53, when observing a cross section along the thickness direction T, the cross-sectional shapes of the plurality of protrusions 53 may be the same as each other, may be different from each other, or may be partially different.

[0221] The size of the protrusion 53 is not particularly limited. For example, the dimension of the protrusion 53 in the thickness direction T may be larger than the dimension of the third through hole 43 in the plane direction (for example, the length direction L or the width direction W), may be smaller than the dimension of the third through hole 43 in the plane direction, or may be the same as the dimension of the third through hole 43 in the plane direction.

[0222] In the case where there are a plurality of protrusions 53, the sizes of the plurality of protrusions 53 may be the same as each other, may be different from each other, or may be partially different. For example, the dimensions of the plurality of protrusions 53 in the thickness direction T may be the same as each other, may be different from each other, or may be partially different.

[0223] The dimensions, shapes, arrangements, etc. of the protrusion 53 may also be different from those in the Figure 5 illustrated example in an actual product.

[0224] As Figure 5 and Figure 6 illustrated, in the third core layer 33, in addition to the third through hole 43, a through hole 43A may also be provided in the thickness direction T.

[0225] As Figure 5 and Figure 6 illustrated, the protrusion 53A close to the second inner surface 10b in the thickness direction T may also be located at the periphery of the through hole 43A.

[0226] As Figure 5 illustrated, the protrusion 53A preferably contacts the second inner surface 10b in the thickness direction T. In this case, the core 30 is supported by the protrusion 53A.

[0227] In addition, the protrusion 53A may not contact the second inner surface 10b in the thickness direction T. That is, the protrusion 53A may be separated from the second inner surface 10b in the thickness direction T.

[0228] Other features of the protrusion 53A are the same as those of the protrusion 51A and the protrusion 52A.

[0229] When observing from the thickness direction T, the through hole 43A may overlap with the first through hole 41, may overlap with the second through hole 42, may overlap with the through hole 41A, or may overlap with the through hole 42A.

[0230] In addition, when observing from the thickness direction T, the through hole 43A may not overlap with the first through hole 41, the second through hole 42, the through hole 41A, and the through hole 42A.

[0231] The other features of the through-hole 43A are the same as those of the through-holes 41A and 42A.

[0232] As Figure 5 and Figure 6 shown, in the third core layer 33, in addition to the third through-hole 43, a through-hole 43B may also be provided in the thickness direction T.

[0233] As Figure 5 and Figure 6 shown, the protruding portion may not be located on the periphery of the through-hole 43B. Specifically, the protruding portion close to the first inner surface 10a or the second inner surface 10b in the thickness direction T may not be located on the periphery of the through-hole 43B.

[0234] When viewed from the thickness direction T, the through-hole 43B may overlap with the through-hole 41B or may overlap with the through-hole 42B.

[0235] In addition, when viewed from the thickness direction T, the through-hole 43B may not overlap with the through-holes 41B and 42B.

[0236] The other features of the through-hole 43B are the same as those of the through-holes 41B and 42B.

[0237] When viewed from the thickness direction T, the third through-hole 43 preferably overlaps with the second through-hole 42.

[0238] As Figure 5 and Figure 6 shown, preferably in the thickness direction T, when the distance between the end portion 53a on the first inner surface 10a side of the protruding portion 53 located on the periphery of the third through-hole 43 and the second inner surface 10b is set as A2, and the distance between the end portion P2 on the second inner surface 10b side of the second through-hole 42 and the second inner surface 10b is set as B2, the relationship A2≥B2 is satisfied. In Figure 5 and Figure 6 the example shown, the relationship A2>B2 is satisfied.

[0239] In other words, as Figure 5 and Figure 6 shown, preferably in the thickness direction T, the end portion 53a on the first inner surface 10a side of the protruding portion 53 located on the periphery of the third through-hole 43 is located at the same height as the end portion P2 on the second inner surface 10b side of the second through-hole 42, or is located at a height closer to the first inner surface 10a than the end portion P2 on the second inner surface 10b side of the second through-hole 42. In Figure 5 and Figure 6In the example shown, in the thickness direction T, the end portion 53a on the first inner surface 10a side of the protruding portion 53 is located at a height closer to the first inner surface 10a than the end portion P2 on the second inner surface 10b side of the second through hole 42.

[0240] In the heat pipe 2, the third through hole 43 provided in the third core layer 33 overlaps the second through hole 42 provided in the second core layer 32 closer to the vapor flow path than the third core layer 33 in such a manner as to satisfy the above-described distance (height) relationship, whereby the third through hole 43 is connected to the second through hole 42. Further, in the heat pipe 2, similarly to the heat pipe 1, the second through hole 42 provided in the second core layer 32 overlaps the first through hole 41 provided in the first core layer 31 in contact with the vapor flow path, whereby the second through hole 42 is connected to the first through hole 41. That is, in the heat pipe 2, the third through hole 43 is connected to the first through hole 41 through the second through hole 42. Therefore, in the heat pipe 2, the working medium 20 in the liquid phase contained in the third core layer 33, preferably the working medium 20 in the liquid phase contained in the region between the third core layer 33 and the second inner surface 10b, easily passes through the third through hole 43, the second through hole 42 connected to the third through hole 43, and further through the first through hole 41 connected to the second through hole 42, evaporates and changes into the working medium 20 in the gas phase, and moves toward the vapor flow path.

[0241] Thereby, in the heat pipe 2, not only in the first core layer 31 and the second core layer 32, but also in the third core layer 33, it is possible to ensure the driving force for driving the working medium 20 in the liquid phase generated by changing the working medium 20 in the liquid phase into the working medium 20 in the gas phase. Therefore, in the heat pipe 2, even when the first core layer 31, the second core layer 32, and the third core layer 33 are stacked, the function of moving the working medium 20 in the liquid phase by capillary force is not easily impaired in the first core layer 31 and the second core layer 32, and is also not easily impaired in the third core layer 33. Therefore, in the heat pipe 2, by stacking the first core layer 31, the second core layer 32, and the third core layer 33, the cross-sectional area of the region of the liquid flow path passing through the core body 30 becomes larger, and accordingly, the maximum heat transfer amount is easily increased.

[0242] As Figure 5 and Figure 6 shown, in the second core layer 32, in addition to the second through hole 42, a through hole 42A that does not overlap the third through hole 43 when viewed from the thickness direction T may be provided.

[0243] As Figure 5 and Figure 6 shown, the protruding portion 52A close to the second inner surface 10b in the thickness direction T may also be located at the periphery of the through hole 42A.

[0244] Figure 5 and Figure 6 the other features of the through hole 42A and the protrusion 52A shown in are respectively the same as those of the through hole 42A and the protrusion 52A shown in Figure 3 and Figure 4 the through hole 42A and the protrusion 52A shown in

[0245] As Figure 5 and Figure 6 shown, in the second core layer 32, in addition to the second through hole 42, a through hole 42B that does not overlap with the third through hole 43 when viewed in the thickness direction T may also be provided

[0246] As Figure 5 and Figure 6 shown, the protrusion may not be located on the periphery of the through hole 42B. Specifically, the protrusion close to the first inner surface 10a or the second inner surface 10b in the thickness direction T may not be located on the periphery of the through hole 42B

[0247] Figure 5 and Figure 6 the other features of the through hole 42B shown in are the same as those of the through hole 42B shown in Figure 3 and Figure 4 the through hole 42B shown in

[0248] As Figure 5 and Figure 6 shown, in the second core layer 32, when in addition to the second through hole 42, a through hole 42A or a through hole 42B that does not overlap with the third through hole 43 when viewed in the thickness direction T is provided, preferably in the thickness direction T, when the distance between the end Q2 on the first inner surface 10a side of the through hole 42A or the through hole 42B other than the second through hole 42 of the second core layer 32 and the second inner surface 10b is set to C2, the relationship A2≥C2 is satisfied. In the examples shown in Figure 5 and Figure 6 the relationship A2>C2 is satisfied

[0249] In other words, as Figure 5 and Figure 6 shown, in the second core layer 32, when in addition to the second through hole 42, a through hole 42A or a through hole 42B that does not overlap with the third through hole 43 when viewed in the thickness direction T is provided, in the thickness direction T, the end 53a on the first inner surface 10a side of the protrusion 53 located on the periphery of the third through hole 43 preferably lies at the same height as the end Q2 on the first inner surface 10a side of the through hole 42A or the through hole 42B of the second core layer 32, or at a height closer to the first inner surface 10a side than the end Q2 on the first inner surface 10a side of the through hole 42A or the through hole 42B of the second core layer 32. In the examples shown in Figure 5 and Figure 6In the example shown, in the thickness direction T, the end portion 53a on the first inner surface 10a side of the protruding portion 53 is located at a height closer to the first inner surface 10a side than the end portion Q2 on the first inner surface 10a side of the through hole 42A or the through hole 42B.

[0250] In the heat pipe 2, the third through hole 43 overlaps with the second through hole 42 in such a manner as to satisfy the above-described distance (height) relationship. As a result, the working medium 20 in the liquid phase contained in the third core layer 33, preferably the working medium 20 in the liquid phase contained in the region between the third core layer 33 and the second inner surface 10b, more easily passes through the third through hole 43, the second through hole 42, and then through the first through hole 41, evaporates to change into the working medium 20 in the gas phase, and moves toward the vapor flow path. Therefore, in the heat pipe 2, the function of moving the working medium 20 in the liquid phase by capillary force is less likely to be impaired in the third core layer 33. As a result, the maximum heat transfer amount is more easily increased.

[0251] In Figure 5 and Figure 6 In the example shown, the distance between the end portion on the first inner surface 10a side of the through hole 42A and the second inner surface 10b and the distance between the end portion on the first inner surface 10a side of the through hole 42B and the second inner surface 10b are the distance C2 and are the same as each other. In other words, in Figure 5 and Figure 6 In the example shown, the end portions on the first inner surface 10a side of the through hole 42A and the through hole 42B are the end portion Q2 and are located at the same height.

[0252] In addition, the distance between the end portion on the first inner surface 10a side of the through hole 42A and the second inner surface 10b and the distance between the end portion on the first inner surface 10a side of the through hole 42B and the second inner surface 10b may be different from each other. In other words, the end portions on the first inner surface 10a side of the through hole 42A and the through hole 42B may be located at different heights. In this case, the end portion on the first inner surface 10a side of the through hole 42A may be located at a height closer to the first inner surface 10a side than the end portion on the first inner surface 10a side of the through hole 42B, or may be located at a height closer to the second inner surface 10b side than the end portion on the first inner surface 10a side of the through hole 42B.

[0253] When the ends on the first inner surface 10a side of the through holes 42A and 42B are at different heights, in the thickness direction T, the end 53a on the first inner surface 10a side of the protruding portion 53 may also be at the same height as the end on the first inner surface 10a side of the through hole 42A, or may be at a height closer to the first inner surface 10a side than the end on the first inner surface 10a side of the through hole 42A. Alternatively, in the thickness direction T, the end 53a on the first inner surface 10a side of the protruding portion 53 may also be at the same height as the end on the first inner surface 10a side of the through hole 42B, or may be at a height closer to the first inner surface 10a side than the end on the first inner surface 10a side of the through hole 42B.

[0254] As Figure 5 and Figure 6 shown, it is preferable to satisfy the relationship A2≥B1. In Figure 5 and Figure 6 the example shown, the relationship A2>B1 is satisfied.

[0255] In other words, as Figure 5 and Figure 6 shown, in the thickness direction T, the end 53a on the first inner surface 10a side of the protruding portion 53 located on the periphery of the third through hole 43 is preferably at the same height as the end P1 on the second inner surface 10b side of the first through hole 41, or is at a height closer to the first inner surface 10a side than the end P1 on the second inner surface 10b side of the first through hole 41. In Figure 5 and Figure 6 the example shown, in the thickness direction T, the end 53a on the first inner surface 10a side of the protruding portion 53 is at a height closer to the first inner surface 10a side than the end P1 on the second inner surface 10b side of the first through hole 41.

[0256] In the heat pipe 2, the third through hole 43 overlaps with the second through hole 42 in such a way as to satisfy the above-mentioned distance (height) relationship, and further overlaps with the first through hole 41. As a result, the liquid-phase working medium 20 contained in the third core layer 33, preferably the liquid-phase working medium 20 contained in the region between the third core layer 33 and the second inner surface 10b, is more likely to pass through the third through hole 43, the second through hole 42, and then through the first through hole 41, evaporate and change into the gaseous working medium 20 and move to the vapor flow path. As a result, in the heat pipe 2, the maximum heat transfer amount is more likely to be increased.

[0257] As Figure 5 and Figure 6As shown, in the first core layer 31, in the case where, in addition to the first through-hole 41, there is provided a through-hole 41A or a through-hole 41B that does not overlap with the second through-hole 42 when viewed from the thickness direction T, preferably in the thickness direction T, when the distance between the end Q1 on the first inner surface 10a side of the through-hole 41A or the through-hole 41B other than the first through-hole 41 of the first core layer 31 and the second inner surface 10b is set to C1, the relationship A2≥C1 is satisfied. In Figure 5 and Figure 6 In the example shown, the relationship A2>C1 is satisfied.

[0258] In other words, as Figure 5 and Figure 6 shown, in the first core layer 31, in the case where, in addition to the first through-hole 41, there is provided a through-hole 41A or a through-hole 41B that does not overlap with the second through-hole 42 when viewed from the thickness direction T, in the thickness direction T, the end 53a on the first inner surface 10a side of the protrusion 53 located on the periphery of the third through-hole 43 preferably lies at the same height as the end Q1 on the first inner surface 10a side of the through-hole 41A or the through-hole 41B of the first core layer 31, or at a height closer to the first inner surface 10a side than the end Q1 on the first inner surface 10a side of the through-hole 41A or the through-hole 41B of the first core layer 31. In Figure 5 and Figure 6 In the example shown, in the thickness direction T, the end 53a on the first inner surface 10a side of the protrusion 53 lies at a height closer to the first inner surface 10a side than the end Q1 on the first inner surface 10a side of the through-hole 41A or the through-hole 41B.

[0259] In the heat pipe 2, the third through-hole 43 overlaps with the second through-hole 42 in such a manner as to satisfy the above distance (height) relationship, and further overlaps with the first through-hole 41. As a result, the liquid-phase working medium 20 contained in the third core layer 33, preferably the liquid-phase working medium 20 contained in the region between the third core layer 33 and the second inner surface 10b, more easily passes through the third through-hole 43, the second through-hole 42, and then through the first through-hole 41, evaporates to become the gaseous-phase working medium 20, and moves toward the vapor flow path. As a result, in the heat pipe 2, it is easier to increase the maximum heat transfer amount.

[0260] As Figure 5 and Figure 6 shown, at least a part of the inner surface of the protrusion 52 located on the periphery of the second through-hole 42 preferably contacts at least a part of the outer surface of the protrusion 53 located on the periphery of the third through-hole 43. In Figure 5 and Figure 6 In the example shown, a part of the inner surface of the protrusion 52 contacts a part of the outer surface of the protrusion 53.

[0261] When at least a part of the inner surface of the protrusion 52 comes into contact with at least a part of the outer surface of the protrusion 53, the second core layer 32 and the third core layer 33 are joined to each other by being riveted by the protrusions 52 and 53, for example. Thus, the positional relationship between the second core layer 32 and the third core layer 33 is not likely to deviate.

[0262] In addition, the inner surface of the protrusion 52 may not be in contact with the outer surface of the protrusion 53.

[0263] <Embodiment 3>

[0264] In the heat diffusion devices of Embodiments 1 and 2 of the present utility model, a manner in which a flat portion exists between through holes (including the first through hole, the second through hole, the third through hole, etc.) in the core is shown, but a flat portion may not exist between the through holes, and for example, a bent portion may exist between the through holes.

[0265] In the heat diffusion device of Embodiment 3 of the present utility model, similar to the heat diffusion device of Embodiment 1 of the present utility model, the core has a structure in which two core layers, a first core layer and a second core layer, are laminated in the thickness direction.

[0266] In the heat diffusion device of Embodiment 3 of the present utility model, different from the heat diffusion device of Embodiment 1 of the present utility model, a bent portion exists between the through holes.

[0267] Figure 7 It is a plan view showing an example of the internal structure of the heat diffusion device of Embodiment 3 of the present utility model. Figure 8 It shows Figure 7 It is a cross-sectional view showing an example of the cross-section of the heat diffusion device shown along the line segment b1 - b2. Figure 9 It is an enlarged cross-sectional view showing Figure 8 a part of the heat diffusion device shown. Figure 10 It shows Figure 7 It is a cross-sectional view showing an example of the cross-section of the heat diffusion device shown along the line segment b3 - b4.

[0268] In Figure 7 , Figure 8 and Figure 10 In the heat spreader 3 shown, the core 30 has a structure in which two core layers, a first core layer 31 and a second core layer 32, are laminated in the thickness direction T.

[0269] As Figure 8 and Figure 9 shown, in the first core layer 31, a first through hole 41 is provided in the thickness direction T.

[0270] As Figure 8and Figure 9 As shown in Figure 9 , preferably, the protrusion 51 that is close to the first inner surface 10a in the thickness direction T is located at the periphery of the first through hole 41.

[0271] Figure 8 and Figure 9 The other features of the first through hole 41 and the protrusion 51 shown in Figure 9 are the same as those of the first through hole 41 and the protrusion 51 shown in Figure 3 and Figure 4 As shown in Figure 4 .

[0272] As shown in Figure 8 and Figure 9 In the first core layer 31, in addition to the first through hole 41, a through hole 41C that does not overlap with the second through hole 42 described later when viewed in the thickness direction T may be provided.

[0273] As shown in Figure 8 and Figure 9 The protrusion 51C that is close to the first inner surface 10a in the thickness direction T may also be located at the periphery of the through hole 41C.

[0274] Preferably, the protrusion 51C is located at the entire periphery of the through hole 41C.

[0275] In addition, the protrusion 51C may be located at a part of the periphery of the through hole 41C.

[0276] In the example shown in Figure 8 multiple through holes 41C are provided, and accordingly, there are multiple protrusions 51C. However, preferably, all of the protrusions 51C among the multiple protrusions 51C are located at the entire periphery of the through hole 41C. It is also possible that a part of the protrusions 51C among the multiple protrusions 51C are located at the entire periphery of the through hole 41C. In this way, at least a part of the protrusions 51C among the multiple protrusions 51C can be located at the entire periphery of the through hole 41C.

[0277] The cross-sectional shape of the protrusion 51C when observing the cross-section along the thickness direction T is not particularly limited. As shown in Figure 8 and Figure 9 it may be a shape in which the distance between the inner surfaces of the protrusion 51C (the distance in the width direction W in Figure 8 and Figure 9 becomes smaller as it approaches the first inner surface 10a, or it may be a shape in which the distance between the inner surfaces of the protrusion 51C becomes larger. In addition, the cross-sectional shape of the protrusion 51C may be a shape in which the distance between the inner surfaces of the protrusion 51C is constant as it approaches the first inner surface 10a.

[0278] The end of the protrusion 51C on the side of the first inner surface 10a can be bent toward the through-hole 41C side (inside) or toward the side opposite to the through-hole 41C (outside).

[0279] In Figure 8 In the example shown, there are a plurality of protrusions 51C. However, when observing a cross-section along the thickness direction T, the cross-sectional shapes of the plurality of protrusions 51C may be the same as each other, may be different from each other, or may be partially different.

[0280] The size of the protrusion 51C is not particularly limited. For example, the dimension of the protrusion 51C in the thickness direction T may be larger than the dimension of the through-hole 41C in the plane direction (for example, the length direction L or the width direction W), may be smaller than the dimension of the through-hole 41C in the plane direction, or may be the same as the dimension of the through-hole 41C in the plane direction.

[0281] In Figure 8 In the example shown, there are a plurality of protrusions 51C. However, the sizes of the plurality of protrusions 51C may be the same as each other, may be different from each other, or may be partially different. For example, the dimensions of the plurality of protrusions 51C in the thickness direction T may be the same as each other, may be different from each other, or may be partially different.

[0282] The size, shape, arrangement, etc. of the protrusion 51C may also be different from those in Figure 8 the example shown in actual products.

[0283] As Figure 10 shown, in the first core layer 31, in addition to the first through-hole 41, a through-hole 41D that does not overlap with the second through-hole 42 described later when observed from the thickness direction T may also be provided.

[0284] As Figure 10 shown, the protrusion 51D close to the second inner surface 10b in the thickness direction T may also be located on the periphery of the through-hole 41D.

[0285] The protrusion 51D is preferably located on the entire periphery of the through-hole 41D.

[0286] In addition, the protrusion 51D may also be located on a part of the periphery of the through-hole 41D.

[0287] In Figure 10 the example shown, a plurality of through-holes 41D are provided, and accordingly, there are a plurality of protrusions 51D. However, it is preferable that all of the protrusions 51D among the plurality of protrusions 51D are located on the entire periphery of the through-hole 41D. It is also possible that a part of the protrusions 51D among the plurality of protrusions 51D are located on the entire periphery of the through-hole 41D. In this way, at least a part of the protrusions 51D among the plurality of protrusions 51D can be located on the entire periphery of the through-hole 41D.

[0288] When observing the cross-sectional shape of the protrusion 51D along the thickness direction T, the cross-sectional shape of the protrusion 51D is not particularly limited. For example, Figure 10 as shown, it can be a shape in which the distance between the inner surfaces of the protrusion 51D (the distance in the width direction W in Figure 10 ) decreases as it approaches the second inner surface 10b, or it can be a shape in which the distance between the inner surfaces of the protrusion 51D increases. In addition, the cross-sectional shape of the protrusion 51D can also be a shape in which the distance between the inner surfaces of the protrusion 51D remains constant as it approaches the second inner surface 10b.

[0289] At the end of the protrusion 51D on the side of the second inner surface 10b, it can bend toward the through-hole 41D side (inside) or bend toward the side opposite to the through-hole 41D (outside).

[0290] In Figure 10 the example shown, there are multiple protrusions 51D, but when observing the cross-section along the thickness direction T, the cross-sectional shapes of the multiple protrusions 51D can be the same as each other, can be different from each other, or can be partially different.

[0291] The size of the protrusion 51D is not particularly limited. For example, the dimension of the protrusion 51D in the thickness direction T can be greater than the dimension of the through-hole 41D in the plane direction (for example, the length direction L or the width direction W), can be smaller than the dimension of the through-hole 41D in the plane direction, or can be the same as the dimension of the through-hole 41D in the plane direction.

[0292] In Figure 10 the example shown, there are multiple protrusions 51D, but the sizes of the multiple protrusions 51D can be the same as each other, can be different from each other, or can be partially different. For example, the dimensions of the multiple protrusions 51D in the thickness direction T can be the same as each other, can be different from each other, or can be partially different.

[0293] The size, shape, arrangement, etc. of the protrusion 51D can also be different from the example Figure 10 shown in actual products.

[0294] For example, Figure 8 and Figure 9 as shown, in the second core layer 32, a second through-hole 42 is provided in the thickness direction T.

[0295] For example, Figure 8 and Figure 9 as shown, a protrusion 52 close to the first inner surface 10a in the thickness direction T is located on the periphery of the second through-hole 42.

[0296] Figure 8 and Figure 9 The other features of the second through-hole 42 and the protrusion 52 shown are the same asFigure 3 and Figure 4 the second through-hole 42 and the protrusion 52 shown are the same.

[0297] As Figure 8 and Figure 9 shown, in the second core layer 32, in addition to the second through-hole 42, a through-hole 42C that does not overlap with the first through-hole 41 when viewed in the thickness direction T may also be provided.

[0298] As Figure 8 and Figure 9 shown, the protrusion 52C close to the first inner surface 10a in the thickness direction T may also be located at the periphery of the through-hole 42C.

[0299] Other features of the protrusion 52C are the same as those of the protrusion 51C.

[0300] When viewed in the thickness direction T, the through-hole 42C may overlap with the through-hole 41C.

[0301] In addition, when viewed in the thickness direction T, the through-hole 42C may not overlap with the through-hole 41C.

[0302] Other features of the through-hole 42C are the same as those of the through-hole 41C.

[0303] As Figure 10 shown, in the second core layer 32, in addition to the second through-hole 42, a through-hole 42D that does not overlap with the first through-hole 41 when viewed in the thickness direction T may also be provided.

[0304] As Figure 10 shown, the protrusion 52D close to the second inner surface 10b in the thickness direction T may also be located at the periphery of the through-hole 42D.

[0305] As Figure 10 shown, the protrusion 52D preferably contacts the second inner surface 10b in the thickness direction T. In this case, the core 30 is supported by the protrusion 52D.

[0306] In addition, the protrusion 52D may not contact the second inner surface 10b in the thickness direction T. That is, the protrusion 52D may be separated from the second inner surface 10b in the thickness direction T.

[0307] Other features of the protrusion 52D are the same as those of the protrusion 51D.

[0308] When viewed in the thickness direction T, the through-hole 42D may overlap with the through-hole 41D.

[0309] In addition, when viewed in the thickness direction T, the through-hole 42D may not overlap with the through-hole 41D.

[0310] Other features of the through hole 42D are the same as those of the through hole 41D.

[0311] As Figure 8 , Figure 9 and Figure 10 shown, in each core layer, there are bent portions between the through holes (including the first through hole 41, the second through hole 42, etc.).

[0312] As Figure 8 and Figure 9 shown, preferably in the thickness direction T, when the distance between the end R1 on the first inner surface 10a side of the first through hole 41 and the second inner surface 10b is set as D1, the relationship A1≥D1 is satisfied. In Figure 8 and Figure 9 the example shown, the relationship A1>D1 is satisfied.

[0313] In other words, as Figure 8 and Figure 9 shown, in the thickness direction T, the end 52a on the first inner surface 10a side of the protruding portion 52 located on the periphery of the second through hole 42 is preferably located at the same height as the end R1 on the first inner surface 10a side of the first through hole 41, or at a height closer to the first inner surface 10a than the end R1 on the first inner surface 10a side of the first through hole 41. In Figure 8 and Figure 9 the example shown, in the thickness direction T, the end 52a on the first inner surface 10a side of the protruding portion 52 is located at a height closer to the first inner surface 10a than the end R1 on the first inner surface 10a side of the first through hole 41.

[0314] In the heat pipe 3, the second through hole 42 overlaps with the first through hole 41 in such a manner as to satisfy the above-mentioned distance (height) relationship. As a result, the liquid-phase working medium 20 contained in the second core layer 32, preferably the liquid-phase working medium 20 contained in the region between the second core layer 32 and the second inner surface 10b, easily passes through the second through hole 42, and then through the first through hole 41, evaporates to become the gaseous-phase working medium 20 and moves sufficiently toward the vapor flow path. As a result, in the heat pipe 3, the maximum heat transfer amount is easily increased sufficiently.

[0315] <Embodiment 4>

[0316] In the heat dissipation device according to Embodiment 4 of the present utility model, similar to the heat dissipation device according to Embodiment 2 of the present utility model, the core has a structure in which three core layers, i.e., a first core layer, a second core layer, and a third core layer, are laminated in the thickness direction.

[0317] In the heat diffusion device according to Embodiment 4 of the present utility model, different from the heat diffusion device according to Embodiment 2 of the present utility model, there is a bent portion between the through holes.

[0318] Figure 11 FIG. is a cross-sectional schematic view showing an example of a cross-section of the heat diffusion device according to Embodiment 4 of the present utility model. Figure 12 is an enlarged view showing Figure 11 a cross-sectional schematic view of a part of the heat diffusion device shown. Figure 13 FIG. is a cross-sectional schematic view showing an example of another cross-section of the heat diffusion device according to Embodiment 4 of the present utility model.

[0319] In addition, Figure 11 and Figure 13 respectively represent cross-sections at positions corresponding to Figure 8 and Figure 10 of the heat diffusion device.

[0320] In Figure 11[[END and ​ the heat sink 4 shown, the core 30 has a structure in which three core layers, namely a first core layer 31, a second core layer 32, and a third core layer 33, are stacked in the thickness direction T.

[0321] As shown in ​ and ​ in the third core layer 33, preferably, a third through hole 43 is provided in the thickness direction T.

[0322] As shown in ​ and ​ preferably, a protrusion 53 close to the first inner surface 10a in the thickness direction T is located at the periphery of the third through hole 43.

[0323] ​ and ​ the other features of the third through hole 43 and the protrusion 53 shown are the same as those of the third through hole 43 and the protrusion 53 shown in ​ and ​ respectively.

[0324] As shown in ​ and ​ in the third core layer 33, in addition to the third through hole 43, a through hole 43C may also be provided in the thickness direction T.

[0325] As shown in ​ and ​ a protrusion 53C close to the first inner surface 10a in the thickness direction T may also be located at the periphery of the through hole 43C.

[0326] The other features of the protrusion 53C are the same as those of the protrusions 51C and 52C.

[0327] When viewed from the thickness direction T, the through-hole 43C may overlap with the through-hole 41C or may overlap with the through-hole 42C.

[0328] In addition, when viewed from the thickness direction T, the through-hole 43C may not overlap with the through-hole 41C and the through-hole 42C.

[0329] Other features of the through-hole 43C are the same as those of the through-hole 41C and the through-hole 42C.

[0330] As ​ shown, in the third core layer 33, in addition to the third through-hole 43, a through-hole 43D may also be provided in the thickness direction T.

[0331] As ​ shown, a protruding portion 53D close to the second inner surface 10b in the thickness direction T may also be located on the periphery of the through-hole 43D.

[0332] As ​ shown, the protruding portion 53D preferably contacts the second inner surface 10b in the thickness direction T. In this case, the core 30 is supported by the protruding portion 53D.

[0333] In addition, the protruding portion 53D may not contact the second inner surface 10b in the thickness direction T. That is, the protruding portion 53D may be separated from the second inner surface 10b in the thickness direction T.

[0334] Other features of the protruding portion 53D are the same as those of the protruding portion 51D and the protruding portion 52D.

[0335] When viewed from the thickness direction T, the through-hole 43D may overlap with the through-hole 41D or may overlap with the through-hole 42D.

[0336] In addition, when viewed from the thickness direction T, the through-hole 43D may not overlap with the through-hole 41D and the through-hole 42D.

[0337] Other features of the through-hole 43D are the same as those of the through-hole 41D and the through-hole 42D.

[0338] As ​ 、 ​ and ​ shown, in each core layer, there are bending portions between the through-holes (including the first through-hole 41, the second through-hole 42, the third through-hole 43, etc.).

[0339] As ​ and ​As shown, preferably in the thickness direction T, when the distance between the end R2 on the first inner surface 10a side of the second through hole 42 and the second inner surface 10b is set as D2, the relationship A2≥D2 is satisfied. In ​ and ​ In the example shown, the relationship A2>D2 is satisfied.

[0340] In other words, as ​ and ​ shown, in the thickness direction T, the end 53a on the first inner surface 10a side of the protruding portion 53 at the periphery of the third through hole 43 preferably lies at the same height as the end R2 on the first inner surface 10a side of the second through hole 42, or at a height closer to the first inner surface 10a than the end R2 on the first inner surface 10a side of the second through hole 42. In ​ and ​ In the example shown, in the thickness direction T, the end 53a on the first inner surface 10a side of the protruding portion 53 lies at a height closer to the first inner surface 10a than the end R2 on the first inner surface 10a side of the second through hole 42.

[0341] In the heat pipe 4, the third through hole 43 overlaps with the second through hole 42 in such a manner as to satisfy the above distance (height) relationship. As a result, the liquid-phase working medium 20 contained in the third core layer 33, preferably the liquid-phase working medium 20 contained in the region between the third core layer 33 and the second inner surface 10b, can easily pass through the third through hole 43, the second through hole 42, and then through the first through hole 41, evaporate and change into the gaseous-phase working medium 20 and move sufficiently toward the vapor flow path. As a result, in the heat pipe 4, the maximum heat transfer amount can be easily increased sufficiently.

[0342] As ​ and ​ shown, preferably in the thickness direction T, when the distance between the end R1 on the first inner surface 10a side of the first through hole 41 and the second inner surface 10b is set as D1, the relationship A2≥D1 is satisfied. In ​ and ​ In the example shown, the relationship A2>D1 is satisfied.

[0343] In other words, as ​ and ​ shown, in the thickness direction T, the end 53a on the first inner surface 10a side of the protruding portion 53 at the periphery of the third through hole 43 preferably lies at the same height as the end R1 on the first inner surface 10a side of the first through hole 41, or at a height closer to the first inner surface 10a than the end R1 on the first inner surface 10a side of the first through hole 41. In ​ and ​In the example shown, in the thickness direction T, the end portion 53a on the first inner surface 10a side of the protrusion 53 is located at a height closer to the first inner surface 10a than the end portion R1 on the first inner surface 10a side of the first through hole 41.

[0344] In the heat pipe 4, the third through hole 43 overlaps with the second through hole 42 and further overlaps with the first through hole 41 in such a manner as to satisfy the above-described distance (height) relationship. As a result, the working medium 20 in the liquid phase contained in the third core layer 33, preferably the working medium 20 in the liquid phase contained in the region between the third core layer 33 and the second inner surface 10b, easily passes through the third through hole 43, the second through hole 42, and further through the first through hole 41, evaporates, changes into the working medium 20 in the gas phase, and sufficiently moves to the vapor flow path. As a result, in the heat pipe 4, the maximum heat transfer amount is easily increased sufficiently.

[0345] In ​ and ​ the example shown, the relationship D1 < D2 is satisfied, but the relationship D1 = D2 may be satisfied, or the relationship D1 > D2 may be satisfied. In other words, in ​ and ​ the example shown, the end portion R1 on the first inner surface 10a side of the first through hole 41 is located at a height closer to the second inner surface 10b than the end portion R2 on the first inner surface 10a side of the second through hole 42, but the end portion R1 on the first inner surface 10a side of the first through hole 41 may be located at the same height as the end portion R2 on the first inner surface 10a side of the second through hole 42, or may be located at a height closer to the first inner surface 10a than the end portion R2 on the first inner surface 10a side of the second through hole 42.

[0346] <Embodiment 5>

[0347] In the heat dissipation devices according to Embodiments 1 to 4 of the present invention, an example is shown in which a part of the inner surface of the protrusion located at the periphery of the first through hole is in contact with a part of the outer surface of the protrusion located at the periphery of the second through hole, but the entire inner surface of the protrusion located at the periphery of the first through hole may be in contact with at least a part of the outer surface of the protrusion located at the periphery of the second through hole.

[0348] In the heat dissipation device according to Embodiment 5 of the present invention, as compared with the heat dissipation device according to Embodiment 1 of the present invention, it is configured such that the entire inner surface of the protrusion located at the periphery of the first through hole is in contact with at least a part of the outer surface of the protrusion located at the periphery of the second through hole.

[0349] ​ is a cross-sectional schematic view showing an example of a cross-section of the heat dissipation device according to Embodiment 5 of the present invention. ​Is an enlarged view showing ​ A cross-sectional schematic view of a part of the heat dissipation device shown.

[0350] In addition, ​ Represents the equivalent of ​ The cross-section at the position of.

[0351] In ​ In the heat sink 5 shown, the entire inner surface of the protrusion 51 located on the periphery of the first through hole 41 is in contact with at least a part of the outer surface of the protrusion 52 located on the periphery of the second through hole 42. In ​ And ​ In the example shown, the entire inner surface of the protrusion 51 is in contact with the entire outer surface of the protrusion 52.

[0352] In the heat sink 5, the entire inner surface of the protrusion 51 is in contact with at least a part of the outer surface of the protrusion 52, whereby the first core layer 31 and the second core layer 32 are more firmly riveted by the protrusion 51 and the protrusion 52, and thus the bonding strength between the two is further improved.

[0353] In addition, in the heat sink 5, the entire inner surface of the protrusion 51 is in contact with at least a part of the outer surface of the protrusion 52, whereby it is possible to form ​ And ​ The structure in which the protrusion 51 shown is buried on the side of the second core layer 32. Therefore, in the heat sink 5, compared with the heat sink 1, the amount by which the steam flow path between the first core layer 31 and the first inner surface 10a expands and the protrusion 51 is buried on the side of the second core layer 32, so that the heat diffusivity is easily improved, and as a result, the maximum heat transfer amount is easily increased.

[0354] In addition, in the heat sink 5, compared with the heat sink 1, the dimension in the thickness direction T of the core 30 is reduced by the amount by which the protrusion 51 is buried on the side of the second core layer 32, so that the heat sink can be made thinner.

[0355] <Embodiment 6>

[0356] In the heat dissipation device according to Embodiment 6 of the present invention, it is configured such that the entire inner surface of the protrusion located on the periphery of the first through hole is in contact with at least a part of the outer surface of the protrusion located on the periphery of the second through hole, as compared with the heat dissipation device according to Embodiment 3 of the present invention.

[0357] ​ Is a cross-sectional schematic view showing an example of the cross-section of the heat dissipation device according to Embodiment 6 of the present invention. ​ Is an enlarged view showing ​ A cross-sectional schematic view of a part of the heat dissipation device shown.

[0358] In addition,​ Indicates a cross-section at a position equivalent to ​ .

[0359] In ​ the heat pipe 6 shown, the entire inner surface of the protrusion 51 located on the periphery of the first through hole 41 contacts at least a part of the outer surface of the protrusion 52 located on the periphery of the second through hole 42. In ​ and ​ the example shown, the entire inner surface of the protrusion 51 contacts a part of the outer surface of the protrusion 52.

[0360] In the heat pipe 6, the entire inner surface of the protrusion 51 contacts at least a part of the outer surface of the protrusion 52, whereby the first core layer 31 and the second core layer 32 are more firmly riveted by the protrusions 51 and 52, and thus the bonding strength between the two is further improved.

[0361] In addition, in the heat pipe 6, the entire inner surface of the protrusion 51 contacts at least a part of the outer surface of the protrusion 52, whereby it is possible to form ​ and ​ the structure in which the protrusion 51 shown is buried on the side of the second core layer 32. Therefore, in the heat pipe 6, compared with the heat pipe 3, the amount by which the steam flow path expansion protrusion 51 between the first core layer 31 and the first inner surface 10a is buried on the side of the second core layer 32, so that the heat diffusivity is easily improved, and as a result, the maximum heat transfer amount is easily increased.

[0362] In addition, in the heat pipe 6, compared with the heat pipe 3, the dimension in the thickness direction T of the core 30 is reduced by the amount by which the protrusion 51 is buried on the side of the second core layer 32, so that the heat pipe can be thinned.

[0363] <Other Embodiments>

[0364] For the heat diffusion device of the present utility model, as embodiments other than Embodiments 1 to 6, the following methods can be cited.

[0365] Regarding the heat diffusion devices of Embodiments 2 and 4 of the present utility model, it can also be configured such that the entire inner surface of the protrusion located on the periphery of the first through hole contacts at least a part of the outer surface of the protrusion located on the periphery of the second through hole.

[0366] Regarding the heat diffusion devices of Embodiments 2 and 4 of the present utility model, it can also be configured such that the entire inner surface of the protrusion located on the periphery of the second through hole contacts at least a part of the outer surface of the protrusion located on the periphery of the third through hole.

[0367] Regarding the heat diffusion device according to Embodiments 1 to 6 of the present invention (the mode in which the number of stacked core layers is 2 or 3 layers), the number of stacked core layers can also be 4 or more. That is, in the heat diffusion device of the present invention, the number of stacked core layers is not particularly limited.

[0368] As described above, in an existing heat pipe in which a plurality of core layers are stacked, particularly in the core layer far from the vapor flow path, the driving force for driving the working medium in the liquid phase is likely to become weak, so it is possible that the working medium in the liquid phase is difficult to move. The more the number of stacked core layers, the more prominent such a problem becomes, for example, it becomes prominent in the core layer far from the vapor flow path.

[0369] In contrast, according to the heat diffusion device of the present invention, even if the number of stacked core layers is increased to 2 layers, 3 layers, 4 layers, 5 layers, 6 layers, etc. within the dimension in the thickness direction of the internal space of the housing, by the same mechanism as the heat diffusion device according to Embodiments 1 to 6 of the present invention, in the core layer far from the vapor flow path, the driving force for driving the working medium in the liquid phase can also be ensured. Therefore, according to the heat diffusion device of the present invention, by increasing the number of stacked core layers, the cross-sectional area of the region where the liquid flow path penetrates the core can be increased, and accordingly, the maximum heat transfer amount can be greatly improved.

[0370] In addition, in the heat diffusion device according to Embodiments 1 to 6 of the present invention, a mode is shown in which the first core layer is located at the position closest to the first inner surface side in the thickness direction among the cores, but the first core layer may not be located at the position closest to the first inner surface side in the thickness direction among the cores. For example, at least one core layer may be further stacked on the first inner surface side of the first core layer.

[0371] In addition, in the heat diffusion device according to Embodiments 1 to 6 of the present invention, a mode is shown in which the second core layer or the third core layer is located at the position closest to the second inner surface side in the thickness direction among the cores, but the second core layer or the third core layer may not be located at the position closest to the second inner surface side in the thickness direction among the cores. For example, at least one core layer may be further stacked on the second inner surface side of the second core layer or the third core layer.

[0372] [Electronic device]

[0373] The electronic device of the present invention is characterized by including the heat diffusion device of the present invention.

[0374] Hereinafter, as an example of the electronic device of the present invention, an electronic device having the heat diffusion device according to Embodiment 1 of the present invention will be described. The same applies to the electronic device having the heat diffusion device according to other embodiments of the present invention.

[0375] ​ This is a perspective view showing an example of the electronic device of the present utility model.

[0376] ​ The illustrated electronic device 100 has a vapor chamber 1.

[0377] As ​ shown, the electronic device 100 preferably further has an electronic component 110.

[0378] As ​ shown, the electronic component 110 is preferably disposed on the outer surface of the housing 10 of the vapor chamber 1. In this case, taking the electronic component 110 as ​ the heat source HS shown, the vapor chamber 1 can function.

[0379] The electronic component 110 relative to ​ the housing 10 of the vapor chamber 1 shown can be disposed on the outer surface of the housing 10 opposite to the first inner surface 10a, here it is the outer surface of the first sheet 11, or can be disposed on the outer surface of the housing 10 opposite to the second inner surface 10b, here it is the outer surface of the second sheet 12.

[0380] The electronic component 110 can be directly disposed on the outer surface of the housing 10, or can be disposed via other components such as a highly thermally conductive adhesive, sheet, tape, etc.

[0381] When the electronic component 110 is preferably disposed on the outer surface of the housing 10, it overlaps with the evaporation portion EP when viewed from the thickness direction T.

[0382] Examples of the electronic component 110 include heat generating elements such as a central processing unit (CPU), a light emitting diode (LED), and a power semiconductor.

[0383] As ​ shown, the electronic device 100 preferably further has a device housing 120.

[0384] In ​ the example shown, the vapor chamber 1 and the electronic component 110 are disposed in the internal space of the device housing 120.

[0385] The housing 10 and the device housing 120 are preferably joined via a joining member. More specifically, the outer surface of the housing 10 and the inner surface of the device housing 120 are preferably joined via a joining member. In this case, the closeness between the housing 10 and the device housing 120 is improved.

[0386] The joining member that joins the housing 10 and the device housing 120 is preferably a heat-conductive member. In this case, it is easy for the heat from the heat source HS, here the heat from the electronic component 110, to be conducted from the housing 10 to the device housing 120. That is, the heat from the heat source HS, here the heat from the electronic component 110, is also easily diffused through the path from the housing 10 to the device housing 120.

[0387] Examples of the heat-conductive member include a heat-conductive tape, a heat-conductive adhesive, and the like.

[0388] As described above, the heat pipe 1 operates independently without external power. Furthermore, by utilizing the latent heat of vaporization and the latent heat of condensation of the working medium 20, the heat from the heat source HS, here the heat from the electronic component 110, can be diffused two-dimensionally and at high speed. As described above, by the electronic device 100 having the heat pipe 1, heat dissipation can be effectively achieved in the limited space inside the electronic device 100.

[0389] In this specification, the following content is disclosed.

[0390] <1> A heat diffusion device, characterized by comprising:

[0391] A housing having a first inner surface and a second inner surface facing each other in the thickness direction, and provided with an internal space;

[0392] A working medium enclosed in the internal space of the housing; and

[0393] A core body provided in the internal space of the housing,

[0394] The core body includes a first core layer and a second core layer adjacent to the second inner surface side of the first core layer in the thickness direction,

[0395] In the first core layer, a first through hole is provided in the thickness direction,

[0396] A second through hole is provided in the second core layer, and a protruding portion close to the first inner surface in the thickness direction is located at the periphery of the second through hole,

[0397] When viewed from the thickness direction, the second through hole overlaps with the first through hole,

[0398] In the thickness direction, when the distance between the end portion on the first inner surface side of the protruding portion located at the periphery of the second through hole and the second inner surface is set as A1, and the distance between the end portion on the second inner surface side of the first through hole and the second inner surface is set as B1, the relationship of A1≥B1 is satisfied.

[0399] <2>The thermal diffusion device according to <1>

[0400] In the first core layer, in addition to the first through-hole, through-holes that do not overlap with the second through-hole when viewed in the thickness direction are provided.

[0401] In the thickness direction, when the distance between the end on the first inner surface side of the through-hole other than the first through-hole in the first core layer and the second inner surface is set as C1, the relationship A1≥C1 is satisfied.

[0402] <3>The thermal diffusion device according to <1> or <2>

[0403] In the thickness direction, when the distance between the end on the first inner surface side of the first through-hole and the second inner surface is set as D1, the relationship A1≥D1 is satisfied.

[0404] <4>The thermal diffusion device according to any one of <1> to <3>

[0405] The protrusion close to the first inner surface in the thickness direction is located at the periphery of the first through-hole.

[0406] <5>The thermal diffusion device according to <4>

[0407] At least a part of the inner surface of the protrusion located at the periphery of the first through-hole is in contact with at least a part of the outer surface of the protrusion located at the periphery of the second through-hole.

[0408] <6>The thermal diffusion device according to <5>

[0409] The entire inner surface of the protrusion located at the periphery of the first through-hole is in contact with at least a part of the outer surface of the protrusion located at the periphery of the second through-hole.

[0410] <7>The thermal diffusion device according to any one of <1> to <6>

[0411] The first core layer is located at the position closest to the first inner surface side in the thickness direction among the cores.

[0412] The second core layer is located at the position closest to the second inner surface side in the thickness direction among the cores.

[0413] <8>The thermal diffusion device according to any one of <1> to <6>

[0414] The core further includes a third core layer, and the third core layer is adjacent to the second inner surface side of the second core layer in the thickness direction.

[0415] <9> The heat diffusion device according to <8>

[0416] A third through-hole is provided in the third core layer, and a protrusion close to the first inner surface in the thickness direction is located on the periphery of the third through-hole.

[0417] When viewed from the thickness direction, the third through-hole overlaps with the second through-hole.

[0418] In the thickness direction, when the distance between the end on the first inner surface side of the protrusion located on the periphery of the third through-hole and the second inner surface is set as A2, and the distance between the end on the second inner surface side of the second through-hole and the second inner surface is set as B2, the relationship A2≥B2 is satisfied.

[0419] <10> The heat diffusion device according to <9>

[0420] In the second core layer, in addition to the second through-hole, a through-hole that does not overlap with the third through-hole when viewed from the thickness direction is provided.

[0421] In the thickness direction, when the distance between the end on the first inner surface side of the through-hole other than the second through-hole in the second core layer and the second inner surface is set as C2, the relationship A2≥C2 is satisfied.

[0422] <11> The heat diffusion device according to <9> or <10>

[0423] In the thickness direction, when the distance between the end on the first inner surface side of the second through-hole and the second inner surface is set as D2, the relationship A2≥D2 is satisfied.

[0424] <12> The heat diffusion device according to any one of <9> to <11>

[0425] The relationship A2≥B1 is satisfied.

[0426] <13> The heat diffusion device according to <12>

[0427] In the first core layer, in addition to the first through-hole, a through-hole that does not overlap with the second through-hole when viewed from the thickness direction is provided.

[0428] In the thickness direction, when the distance between the end on the first inner surface side of the through-hole other than the first through-hole in the first core layer and the second inner surface is set as C1, the relationship A2≥C1 is satisfied.

[0429] <14> The heat diffusion device according to <12> or <13>,

[0430] When the distance between the end on the first inner surface side of the first through hole and the second inner surface in the above-mentioned thickness direction is set as D1, the relationship A2≥D1 is satisfied.

[0431] <15> The heat diffusion device according to any one of <8> to <14>,

[0432] The above-mentioned first core layer is located at the position closest to the first inner surface side in the above-mentioned core in the above-mentioned thickness direction,

[0433] The above-mentioned third core layer is located at the position closest to the second inner surface side in the above-mentioned core in the above-mentioned thickness direction.

[0434] <16> The heat diffusion device according to any one of <1> to <15>,

[0435] In the above-mentioned thickness direction, the distance between the above-mentioned core and the first inner surface is larger than the distance between the above-mentioned core and the second inner surface.

[0436] <17> An electronic device, characterized in that,

[0437] It includes the heat diffusion device according to any one of <1> to <16>.

[0438]

Industrial Applicability

[0439] The heat diffusion device of the present utility model can be used for a wide range of purposes in fields such as portable information terminals. The heat diffusion device of the present utility model can be used, for example, to reduce the temperature of heat sources such as central processing units, extend the usage time of electronic devices, and can be used in electronic devices such as smart phones, tablet terminals, notebook computers, game devices, and wearable devices.

Claims

1. A heat diffusion device, characterized in that: have: The frame has a first inner surface and a second inner surface that are opposite to each other in the thickness direction and is provided with an internal space; A working medium is sealed in the internal space of the frame; as well as A core body is arranged in the inner space of the frame body, The core includes a first core layer and a second core layer adjacent to the second inner surface side of the first core layer in the thickness direction. The first core layer is provided with a first through hole in the thickness direction. The second core layer is provided with a second through hole, and a protrusion approaching the first inner surface in the thickness direction is located at a periphery of the second through hole. When viewed from the thickness direction, the second through hole overlaps with the first through hole. In the thickness direction, when the distance between the end of the first inner surface side of the protrusion located at the periphery of the second through hole and the second inner surface is set to A1, and the distance between the end of the second inner surface side of the first through hole and the second inner surface is set to B1, the relationship A1≥B1 is satisfied.

2. The heat diffusion device according to claim 1, characterized in that: The first core layer includes, in addition to the first through hole, a through hole that does not overlap with the second through hole when viewed in the thickness direction. When a distance between an end portion of the through hole other than the first through hole of the first core layer on the first inner surface side and the second inner surface is defined as C1 in the thickness direction, a relationship of A1 ≥ C1 is satisfied.

3. The heat diffusion device according to claim 1, characterized in that: When a distance between an end portion of the first through hole on the first inner surface side and the second inner surface in the thickness direction is defined as D1, a relationship of A1 ≥ D1 is satisfied.

4. The heat diffusion device according to any one of claims 1 to 3, characterized in that: A protrusion that approaches the first inner surface in the thickness direction is located at a peripheral edge of the first through hole.

5. The heat diffusion device according to claim 4, characterized in that: At least a portion of an inner surface of the protrusion located at a peripheral edge of the first through hole contacts at least a portion of an outer surface of the protrusion located at a peripheral edge of the second through hole.

6. The heat diffusion device according to claim 5, characterized in that: The entire inner surface of the protrusion located at the periphery of the first through hole is in contact with at least a portion of the outer surface of the protrusion located at the periphery of the second through hole.

7. The heat diffusion device according to any one of claims 1 to 3, characterized in that: The first core layer is located in the core closest to the first inner surface in the thickness direction. The second core layer is located closest to the second inner surface in the thickness direction in the core.

8. The heat diffusion device according to any one of claims 1 to 3, characterized in that: The core further includes a third core layer adjacent to the second inner surface side of the second core layer in the thickness direction.

9. The heat diffusion device according to claim 8, characterized in that The third core layer is provided with a third through hole, and the protrusion approaching the first inner surface in the thickness direction is located at the periphery of the third through hole. When viewed from the thickness direction, the third through hole overlaps with the second through hole. In the thickness direction, when the distance between the end of the first inner surface side of the protrusion located at the periphery of the third through hole and the second inner surface is set to A2, and the distance between the end of the second inner surface side of the second through hole and the second inner surface is set to B2, the relationship A2≥B2 is satisfied.

10. The heat diffusion device according to claim 9, characterized in that The second core layer is provided with a through hole in addition to the second through hole, which does not overlap with the third through hole when viewed in the thickness direction. When a distance between an end portion of the through hole other than the second through hole of the second core layer on the first inner surface side and the second inner surface is defined as C2 in the thickness direction, a relationship of A2 ≥ C2 is satisfied.

11. The heat diffusion device according to claim 9, characterized in that In the thickness direction, when a distance between an end portion of the second through hole on the first inner surface side and the second inner surface is defined as D2, a relationship of A2 ≥ D2 is satisfied.

12. The heat diffusion device according to claim 9, characterized in that The relationship A2≥B1 is satisfied.

13. The heat diffusion device according to claim 12, characterized in that The first core layer includes, in addition to the first through hole, a through hole that does not overlap with the second through hole when viewed in the thickness direction. When a distance between an end portion of the through hole other than the first through hole of the first core layer on the first inner surface side and the second inner surface is defined as C1 in the thickness direction, a relationship of A2 ≥ C1 is satisfied.

14. The heat diffusion device according to claim 12, characterized in that When a distance between an end portion of the first through hole on the first inner surface side and the second inner surface in the thickness direction is defined as D1, a relationship of A2 ≥ D1 is satisfied.

15. The heat diffusion device according to claim 8, characterized in that The first core layer is located in the core closest to the first inner surface in the thickness direction. The third core layer is located closest to the second inner surface in the thickness direction in the core.

16. The heat diffusion device according to any one of claims 1 to 3, characterized in that: In the thickness direction, a distance between the core and the first inner surface is greater than a distance between the core and the second inner surface.

17. An electronic device, characterized in that: The electronic device comprises the heat diffusion device according to any one of claims 1 to 3.

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